Slicing device with positioning function

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a slicing device with a positioning function, which comprises a fixed base, the fixed base is fixedly connected with a first fixed frame, the first fixed frame is provided with a first chute, the first chute is internally connected with a sliding block in a sliding manner, the sliding block is fixedly connected with a first driving motor, and the first driving motor is connected with a second driving motor. The output end of the first driving motor is fixedly connected with a rotating shaft, the rotating shaft is fixedly connected with a gear, the gear is meshed with a rack, and the rotating shaft is rotationally connected with a first fixing block. According to the utility model, by adjusting the position of the laser cutting head, an optimal cutting path can be selected, errors and waste in the slicing process are reduced, the material utilization rate is improved, the slicing flexibility is greatly improved, a semiconductor can be fixed and clamped, and the slicing quality can be possibly influenced by vibration generated in the processing process; vibration can be effectively reduced by fixing and clamping the semiconductor, and the stability and precision of slicing processing are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a slicing device with a positioning function. Background Art

[0002] In the field of semiconductor processing, with the continuous advancement of technology and the increasing complexity of integrated circuits, the requirements for processing accuracy and efficiency have become increasingly stringent. As a core component of information technology, the manufacturing process of semiconductor chips involves multiple complex and precise links, among which slicing is a crucial step.

[0003] The existing technology has the following shortcomings: traditional slicing devices are often unable to adjust the position of the laser cutting head during slicing, unable to optimize the cutting path, reducing material utilization, reducing slicing flexibility, and unable to effectively fix and clamp the semiconductor, thereby reducing the stability and accuracy of the slicing. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a slicing device with a positioning function.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: a slicing device with a positioning function, including a fixed base, the fixed base is fixedly connected to a first fixed frame, the first fixed frame is provided with a first slide groove, a sliding block is slidably connected in the first slide groove, the sliding block is fixedly connected to a first driving motor, the output end of the first driving motor is fixedly connected to a rotating shaft, the rotating shaft is fixedly connected to a gear, the gear is meshed with a rack, the rotating shaft is rotatably connected to the first fixed block, the first fixed block is fixedly connected to the second slide groove, the fixed base is fixedly connected to the second fixed frame, the second fixed frame is provided with a slider, and the slider is slidably connected to the second slide groove.

[0006] As a further description of the above technical solution:

[0007] The first fixed block is fixedly connected to the third fixed bracket, the third fixed bracket is fixedly connected to the second fixed block, the second fixed block is fixedly connected to the second drive motor, the output end of the second drive motor is fixedly connected to the second threaded rod, the second threaded rod is threadedly connected to the threaded block, the threaded block is slidably connected to the fixed column, and the threaded block is provided with a laser cutting head.

[0008] As a further description of the above technical solution:

[0009] The fixed base is rotatably connected to a first threaded rod, the first threaded rod is fixedly connected to a knob, the first threaded rod is threadedly connected to a threaded sleeve, the threaded sleeve is fixedly connected to a fixed splint, the fixed splint is fixedly connected to a telescopic column, and the telescopic column is fixedly connected to the fixed base.

[0010] As a further description of the above technical solution:

[0011] The fixed base is fixedly connected to a fixed plate, the fixed plate is fixedly connected to a hydraulic telescopic rod, and the hydraulic telescopic rod is fixedly connected to a placement plate.

[0012] As a further description of the above technical solution:

[0013] The third fixing frame is fixedly connected to the sliding block, the fixed base is fixedly connected to the fixed legs, and the rack is fixedly connected to the first fixing frame.

[0014] As a further description of the above technical solution:

[0015] The second threaded rod is rotatably connected to the second fixed block, and the fixed column is fixedly connected to the second fixed block.

[0016] As a further description of the above technical solution:

[0017] The knobs are provided in four groups, the threaded sleeves are provided in four groups, and the fixing splints are provided in four groups.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, the first drive motor drives the rotating shaft to rotate, so that the laser cutting head below moves left and right to adjust the position of the slice. The second drive motor drives the second threaded rod to rotate, thereby driving the laser cutting head below to move back and forth to adjust the position of the slice. By adjusting the position of the laser cutting head, the best cutting path can be selected, which reduces errors and waste in the slicing process, improves material utilization, and greatly improves slicing flexibility.

[0020] 2. In the present invention, the first threaded rod is driven to rotate by rotating the knob, and the rotation of the first threaded rod drives the threaded sleeve to move inward, thereby driving the fixed clamping plate to move inward to fix and clamp the semiconductor. The vibration generated during the processing may affect the slicing quality. Fixing and clamping the semiconductor can effectively reduce vibration and improve the stability and accuracy of the slicing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a slicing device with a positioning function proposed by the utility model;

[0022] Figure 2 This is a schematic diagram of the partial explosion structure of a slicing device with positioning function proposed in this utility model Figure 1 ;

[0023] Figure 3 This is a schematic diagram of the partial explosion structure of a slicing device with positioning function proposed in this utility model Figure 2 ;

[0024] Figure 4 This is a schematic diagram of the partial structure of a slicing device with positioning function proposed by the utility model Figure 1 ;

[0025] Figure 5 This is a schematic diagram of the partial structure of a slicing device with positioning function proposed by the utility model Figure 2 ;

[0026] Figure 6 This is a schematic diagram of the partial explosion structure of a slicing device with positioning function proposed in this utility model Figure 3 .

[0027] Legend:

[0028] 1. Fixed base; 2. Fixed legs; 3. Fixed plate; 4. Hydraulic telescopic rod; 5. Placement plate; 6. First threaded rod; 7. Knob; 8. Threaded sleeve; 9. Fixed splint; 10. Telescopic column; 11. First fixed frame; 12. First slide; 13. Sliding block; 14. First drive motor; 15. Rotating shaft; 16. Gear; 17. Rack; 18. First fixed block; 19. Second fixed frame; 20. Sliding block; 21. Second slide; 22. Third fixed frame; 23. Second fixed block; 24. Second drive motor; 25. Second threaded rod; 26. Threaded block; 27. Fixed column; 28. Laser cutting head. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Reference Figures 1-6The utility model provides an embodiment of a slicing device with a positioning function, comprising a fixed base 1, the fixed base 1 is fixedly connected to a first fixed frame 11, the first fixed frame 11 is provided with a first slide groove 12, the first slide groove 12 is slidably connected with a sliding block 13, the sliding block 13 is fixedly connected to a first driving motor 14, the output end of the first driving motor 14 is fixedly connected to a rotating shaft 15, the rotating shaft 15 is fixedly connected to a gear 16, the gear 16 is meshed with a rack 17, the rotating shaft 15 is rotatably connected to a first fixed block 18, the first fixed block 18 is fixedly connected to a second slide groove 21, the fixed base 1 is fixedly connected to a second fixed frame 19, the second fixed frame 19 is provided with a slider 20, the slider 20 is slidably connected with a second slide groove 21, the first threaded rod 6 is rotated by rotating the knob 7, the first threaded rod 6 is rotated to drive the threaded sleeve 8 to move inward, thereby driving the fixed clamping plate 9 to move inward to fix and clamp the semiconductor, the vibration generated during the processing may affect the slicing quality, and fixing and clamping the semiconductor can effectively reduce vibration and improve the stability and accuracy of the slicing process.

[0031] The first fixed block 18 is fixedly connected to the third fixed frame 22, the third fixed frame 22 is fixedly connected to the second fixed block 23, the second fixed block 23 is fixedly connected to the second drive motor 24, the output end of the second drive motor 24 is fixedly connected to the second threaded rod 25, the second threaded rod 25 is threadedly connected to the threaded block 26, the threaded block 26 is slidably connected to the fixed column 27, the threaded block 26 is provided with a laser cutting head 28, the fixed base 1 is rotatably connected to the first threaded rod 6, the first threaded rod 6 is fixedly connected to the knob 7, the first threaded rod 6 is threadedly connected to the threaded sleeve 8, the threaded sleeve 8 is fixedly connected to the fixed splint 9, the fixed splint 9 is fixedly connected to the telescopic column 10, the telescopic column 10 is fixedly connected to the fixed base 1, the fixed base 1 is fixedly connected to the fixed plate 3, the fixed plate 3 is fixedly connected to the liquid The telescopic rod 4 is pressed, the hydraulic telescopic rod 4 is fixedly connected to the placement plate 5, the third fixed frame 22 is fixedly connected to the sliding block 13, the fixed base 1 is fixedly connected to the fixed leg 2, the rack 17 is fixedly connected to the first fixed frame 11, the second threaded rod 25 is rotatably connected to the second fixed block 23, the fixed column 27 is fixedly connected to the second fixed block 23, the knob 7 is provided with four groups, the threaded sleeve 8 is provided with four groups, and the fixed splint 9 is provided with four groups. The first threaded rod 6 is rotated by rotating the knob 7, and the first threaded rod 6 is rotated to drive the threaded sleeve 8 to move inward, thereby driving the fixed splint 9 to move inward to fix and clamp the semiconductor. The vibration generated during the processing may affect the quality of the slicing. Fixed clamping the semiconductor can effectively reduce vibration and improve the stability and accuracy of the slicing process.

[0032] Working principle: First, when performing semiconductor processing and slicing, the semiconductor is placed on the placement plate 5, and the hydraulic telescopic rod 4 is started. The hydraulic telescopic rod 4 drives the placement plate 5 to move upward, and then the semiconductor on the placement plate 5 is moved upward to adjust the height, so that the height of the semiconductor can be adjusted according to the thickness of the semiconductor, so that the semiconductor is at a suitable slicing height. Then, the knob 7 is manually turned, and the rotation of the knob 7 drives the first threaded rod 6 to rotate. The rotation of the first threaded rod 6 drives the threaded sleeve 8 to move inward, thereby driving the fixed clamping plate 9 to move inward to fix and clamp the semiconductor. The vibration generated during the processing may affect the slicing quality. Fixing and clamping the semiconductor can effectively reduce vibration and improve the stability and accuracy of the slicing process. Then, the first drive motor 14 is started, and the first drive motor 14 drives The rotating shaft 15 is driven to rotate, and the rotation of the rotating shaft 15 drives the gear 16 to rotate, and the gear 16 rotates and moves on the rack 17, thereby driving the sliding block 13 to slide in the first slide groove 12, and then driving the second slide groove 21 on the first fixed block 18 to slide in the slider 20, so that the laser cutting head 28 below moves left and right to adjust the position of the slice, and then, start the second drive motor 24, the second drive motor 24 drives the second threaded rod 25 to rotate, and the second threaded rod 25 rotates to drive the threaded block 26 to slide on the fixed column 27, thereby driving the laser cutting head 28 below to move back and forth to adjust the position of the slice. By adjusting the position of the laser cutting head 28, the best cutting path can be selected, the error and waste in the slicing process can be reduced, the material utilization rate can be improved, and the slicing flexibility is greatly improved.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A slicing device with a positioning function, comprising a fixed base (1), characterized in that: The fixed base (1) is fixedly connected to a first fixed frame (11), the first fixed frame (11) is provided with a first slide groove (12), a sliding block (13) is slidably connected in the first slide groove (12), the sliding block (13) is fixedly connected to a first driving motor (14), the output end of the first driving motor (14) is fixedly connected to a rotating shaft (15), the rotating shaft (15) is fixedly connected to a gear (16), the gear (16) is meshed with a rack (17), the rotating shaft (15) is rotatably connected to a first fixed block (18), the first fixed block (18) is fixedly connected to a second slide groove (21), the fixed base (1) is fixedly connected to a second fixed frame (19), the second fixed frame (19) is provided with a slider (20), and the slider (20) is slidably connected to the second slide groove (21).

2. The slicing device with positioning function according to claim 1, characterized in that: The first fixed block (18) is fixedly connected to a third fixed frame (22), the third fixed frame (22) is fixedly connected to a second fixed block (23), the second fixed block (23) is fixedly connected to a second drive motor (24), the output end of the second drive motor (24) is fixedly connected to a second threaded rod (25), the second threaded rod (25) is threadedly connected to a threaded block (26), the threaded block (26) is slidably connected to a fixed column (27), and a laser cutting head (28) is provided on the threaded block (26).

3. The slicing device with positioning function according to claim 2, characterized in that: The fixed base (1) is rotatably connected to a first threaded rod (6), the first threaded rod (6) is fixedly connected to a knob (7), the first threaded rod (6) is threadedly connected to a threaded sleeve (8), the threaded sleeve (8) is fixedly connected to a fixed clamping plate (9), the fixed clamping plate (9) is fixedly connected to a telescopic column (10), and the telescopic column (10) is fixedly connected to the fixed base (1).

4. The slicing device with positioning function according to claim 3, characterized in that: The fixed base (1) is fixedly connected to a fixed plate (3), the fixed plate (3) is fixedly connected to a hydraulic telescopic rod (4), and the hydraulic telescopic rod (4) is fixedly connected to a placement plate (5).

5. The slicing device with positioning function according to claim 4, characterized in that: The third fixed frame (22) is fixedly connected to the sliding block (13), the fixed base (1) is fixedly connected to the fixed legs (2), and the rack (17) is fixedly connected to the first fixed frame (11).

6. The slicing device with positioning function according to claim 5, characterized in that: The second threaded rod (25) is rotatably connected to the second fixed block (23), and the fixed column (27) is fixedly connected to the second fixed block (23).

7. The slicing device with positioning function according to claim 6, characterized in that: The knobs (7) are provided in four groups, the threaded sleeves (8) are provided in four groups, and the fixing clamps (9) are provided in four groups.

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