Semiconductor chip high-temperature-resistant packaging test device

Abstract

The utility model discloses a semiconductor chip high-temperature-resistant packaging testing device which comprises a testing table, bearing seats are fixedly installed on the two sides of the testing table, threaded rods are installed in the bearing seats through bearings, one ends of the threaded rods are fixedly connected with the output end of a servo motor, and the other ends of the threaded rods are fixedly connected with the output end of the servo motor. And the outer surface of the threaded rod is in threaded connection with a mounting block, the top end of the mounting block is fixedly connected with a placement frame, the inner wall of the placement frame is fixedly connected with a clamping block, and the clamping block is slidably connected into the placement frame. According to the semiconductor chip high-temperature-resistant packaging testing device, after testing is completed, the servo motor is started again, in the rotating process of the threaded rod, the placement frame is controlled to move, the first set of testing chips can be moved out of the testing box, the second set of to-be-tested chips enter the testing box for temperature testing, and after the first set of testing chips are pushed out of the testing box, the second set of to-be-tested chips enter the testing box for temperature testing. The cooling speed is higher, and a worker can conveniently take down the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging and testing, in particular to a high-temperature resistant packaging and testing device for semiconductor chips. Background Art

[0002] Semiconductor chip packaging and testing is an essential process step for chips to become qualified products. With the rapid advancement of the semiconductor chip industry, there are many cases where trial packaging and testing of new product performance are required, and the speed must be very high. Existing semiconductor chip high-temperature resistant packaging and testing equipment is too high when performing heat testing on the chip. If the tester directly picks up the chip, he will be burned. After the test, the tester needs to wait for the internal temperature of the device to drop before removing the chip, which reduces work efficiency and is inconvenient to use.

[0003] According to patent publication number CN211653067U, a protective semiconductor chip high-temperature resistant packaging test device is disclosed. When the test is completed, the cooling pump is started to cool the coolant in the cooling box, and then inputs it into the heat exchange tube through the second connecting pipe to exchange heat with the high temperature inside the heating box. The coolant after heat exchange returns to the cooling box through the first connecting pipe, and then enters the heat exchange tube for heat exchange after being cooled by the cooling pump, cooling the inside of the heating box. The temperature inside the heating box is effectively and rapidly cooled, so that the tester can quickly remove the chip.

[0004] However, the above patent lowers the temperature of the heating box in order to take out the chip. When the chip needs to be tested later, the temperature inside the heating box still needs to be reheated to the required temperature. The above patent has high energy consumption and cannot enable the test device to perform continuous testing, and the test efficiency is low. For this reason, we propose a semiconductor chip high-temperature resistant packaging test device. Utility Model Content

[0005] The main purpose of the utility model is to provide a semiconductor chip high temperature resistant packaging and testing device, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A semiconductor chip high-temperature resistant packaging test device includes a test bench, bearing seats are fixedly installed on both sides of the test bench, a threaded rod is installed inside the bearing seat through a bearing, one end of the threaded rod is fixedly connected to the output end of a servo motor, the outer surface of the threaded rod is threadedly connected to a mounting block, the top of the mounting block is fixedly connected to a placement frame, the inner wall of the placement frame is fixedly connected to a clamping block, and the clamping block is slidably connected to the inside of the placement frame.

[0008] In order to limit the mounting block, as a semiconductor chip high temperature resistant packaging test device of the present invention, a limiting groove is provided on the upper surface of the test table, and the mounting block is slidably connected to the interior of the limiting groove.

[0009] In order to make the test box more stable, as a semiconductor chip high temperature resistant packaging test device of the present invention, the upper surface of the test table is fixedly connected to the test box by bolts, and a heating chamber is opened inside the test box.

[0010] In order to heat the test box, as a semiconductor chip high-temperature resistant packaging test device of the present invention, a heating wire is installed inside the heating chamber, and the heating wire is electrically connected to the temperature controller through a wire, and the temperature controller is fixedly installed on the upper surface of the test bench.

[0011] In order to make the servo motor more securely installed, as a semiconductor chip high-temperature resistant packaging test device of the present invention, a motor bracket is fixedly connected to one side of the test bench, and a servo motor is fixedly connected to the upper surface of the motor bracket.

[0012] In order to facilitate opening the door, as a semiconductor chip high-temperature resistant packaging test device of the present invention, the front of the test bench is hinged with a door through a hinge, and a handle is fixedly connected to one side of the front of the door.

[0013] In order to make the device more stable, as a semiconductor chip high-temperature resistant packaging test device of the present invention, the four corners of the lower surface of the test table are fixedly connected with support legs, and the number of the support legs is four.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The semiconductor chip high-temperature resistant packaging test device is arranged by coordinating a test table, a threaded rod, a mounting block, a placement rack, a clamping block, a placement frame and a test box. When it is needed, a staff member can first place the test chip inside the placement frame, and then the staff member can start the servo motor, which drives the threaded rod to move, so that the first group of placement frames with test chips enter the test box. After the test is completed, the servo motor is started again, and the threaded rod controls the placement rack to move during rotation, so that the first group of test chips can be removed from the test box, and the second group of chips to be tested enters the test box for temperature testing. After the first group of test chips are pushed out of the test box, they cool down faster, making it easier for the staff member to remove the chips, and the test box does not need to be cooled down, so other chips can be tested. This not only saves energy, but also increases the utilization rate of the test box, and can continuously perform chip temperature measurement, thereby improving test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the isometric structure of a semiconductor chip high-temperature resistant packaging and testing device according to Example 1 of the utility model;

[0017] Figure 2 This is a rear axonometric structural diagram of a semiconductor chip high-temperature resistant packaging and testing device according to embodiment 1 of the present utility model;

[0018] Figure 3 This is a schematic cross-sectional isometric structural diagram of a semiconductor chip high-temperature resistant packaging and testing device according to Example 1 of the present utility model;

[0019] Figure 4 This is a schematic cross-sectional isometric structural diagram of a test box of a semiconductor chip high-temperature resistant packaging test device according to Example 1 of the present utility model;

[0020] Figure 5 This is a semiconductor chip high temperature resistant packaging test device according to embodiment 1 of the present invention. Figure 3 Enlarged structural diagram at point A in the middle.

[0021] In the figure: 1. Test bench; 2. Bearing seat; 3. Threaded rod; 4. Mounting block; 5. Placement rack; 6. Clamp block; 7. Placement frame; 8. Limit slot; 9. Test box; 10. Heating chamber; 11. Heating wire; 12. Temperature controller; 13. Motor bracket; 14. Box door; 15. Handle; 16. Support foot; 17. Servo motor. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] Example 1

[0024] like Figure 1-5 As shown, a semiconductor chip high-temperature resistant packaging test device includes a test bench 1, bearing seats 2 are fixedly installed on both sides of the test bench 1, a threaded rod 3 is installed inside the bearing seat 2 through a bearing, one end of the threaded rod 3 is fixedly connected to the output end of the servo motor 17, the outer surface of the threaded rod 3 is threadedly connected to a mounting block 4, the top of the mounting block 4 is fixedly connected to a placement frame 5, the inner wall of the placement frame 5 is fixedly connected to a clamping block 6, and the clamping block 6 is slidably connected to the inside of the placement frame 7.

[0025] During specific use, through the coordination between the test bench 1, threaded rod 3, mounting block 4, placement rack 5, clamping block 6, placement frame 7 and test box 9, when it is needed, the staff can first place the test chip inside the placement frame 7, and then the staff can start the servo motor 17, and the servo motor 17 drives the threaded rod 3 to move, so that the first group of placement frames 7 with test chips enter the test box 9. After the test is completed, the servo motor 17 is started again, and the threaded rod 3 controls the placement rack 5 to move during the rotation process, so that the first group of test chips can be moved out of the test box 9, and the second group of chips to be tested enters the test box 9 for temperature testing. After the first group of test chips are pushed out of the test box 9, the cooling speed is faster, which is convenient for the staff to remove the chips, and the test box 9 does not need to be cooled down, and other chips can be continued to be tested. This not only saves energy, but also has a higher utilization rate of the test box 9, and the chip temperature measurement work can be carried out continuously, and the test efficiency is higher.

[0026] In this embodiment, a limiting groove 8 is provided on the upper surface of the test bench 1 , and a mounting block 4 is slidably connected to the interior of the limiting groove 8 .

[0027] During specific use, the installation block 4 can be limited by the setting of the limiting groove 8, so that the installation block 4 is not easily offset when moving.

[0028] In this embodiment, a test box 9 is fixedly connected to the upper surface of the test bench 1 by bolts, and a heating chamber 10 is provided inside the test box 9 .

[0029] During specific use, the setting of the test box 9 can make the installation of the test box 9 more stable and more stable.

[0030] In this embodiment, a heating wire 11 is installed inside the heating chamber 10 . The heating wire 11 is electrically connected to a temperature controller 12 via a wire. The temperature controller 12 is fixedly installed on the upper surface of the test bench 1 .

[0031] During specific use, the test box 9 can be heated by setting the heating wire 11 and the temperature controller 12 to perform temperature testing on the chip.

[0032] In this embodiment, a motor bracket 13 is fixedly connected to one side of the test bench 1 , and a servo motor 17 is fixedly connected to the upper surface of the motor bracket 13 .

[0033] When in use, the servo motor 17 can be installed more firmly by setting the motor bracket 13.

[0034] In this embodiment, the front of the test bench 1 is hinged with a door 14, one side of the front of the door 14 is fixedly connected with a handle 15, and the four corners of the lower surface of the test bench 1 are fixedly connected with support legs 16, and the number of support legs 16 is four.

[0035] During specific use, the support legs 16 are provided to make the device more stable.

[0036] Working principle: When it is needed, the staff can first place the test chip inside the placement frame 7, and then start the temperature controller 12 to make the heating wire 11 start working to heat the test box 9. Then the staff can start the servo motor 17. The servo motor 17 drives the threaded rod 3 to move, so that the first group of placement frames 7 with test chips enter the test box 9. After the test is completed, the servo motor 17 is started again. During the rotation of the threaded rod 3, the placement frame 5 is controlled to move, and the first group of test chips can be removed from the test box 9. The second group of chips to be tested enters the test box 9 for temperature testing. After the first group of test chips are pushed out of the test box 9 and the chips cool down, the staff removes the chips.

[0037] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip high temperature resistant packaging test device, comprising a test bench (1), characterized in that: Bearing seats (2) are fixedly installed on both sides of the test bench (1), a threaded rod (3) is installed inside the bearing seat (2) through a bearing, one end of the threaded rod (3) is fixedly connected to the output end of the servo motor (17), the outer surface of the threaded rod (3) is threadedly connected to a mounting block (4), the top end of the mounting block (4) is fixedly connected to a placement frame (5), the inner wall of the placement frame (5) is fixedly connected to a clamping block (6), and the clamping block (6) is slidably connected to the inside of the placement frame (7).

2. The semiconductor chip high temperature resistant packaging and testing device according to claim 1, characterized in that: A limiting groove (8) is provided on the upper surface of the test bench (1), and a mounting block (4) is slidably connected inside the limiting groove (8).

3. The semiconductor chip high temperature resistant packaging and testing device according to claim 1, characterized in that: A test box (9) is fixedly connected to the upper surface of the test bench (1) via bolts, and a heating chamber (10) is provided inside the test box (9).

4. The semiconductor chip high temperature resistant packaging and testing device according to claim 3, characterized in that: A heating wire (11) is installed inside the heating chamber (10), and the heating wire (11) is electrically connected to a temperature controller (12) via a wire, and the temperature controller (12) is fixedly installed on the upper surface of the test bench (1).

5. The semiconductor chip high temperature resistant packaging and testing device according to claim 1, characterized in that: A motor bracket (13) is fixedly connected to one side of the test bench (1), and a servo motor (17) is fixedly connected to the upper surface of the motor bracket (13).

6. The semiconductor chip high temperature resistant packaging and testing device according to claim 1, characterized in that: The front of the test bench (1) is hinged with a box door (14) via a hinge, and one side of the front of the box door (14) is fixedly connected with a handle (15).

7. The semiconductor chip high temperature resistant packaging and testing device according to claim 1, characterized in that: Four corners of the lower surface of the test bench (1) are fixedly connected with support legs (16), and the number of the support legs (16) is four.

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