Multi-layer cassette wafer feeding and discharging device

Abstract

The utility model provides a multilayer card plug wafer feeding and discharging device, which comprises a support frame, a sliding plate, a material box, a pressing cylinder and a photoelectric sensor, and is characterized in that the sliding plate is arranged on the support frame in a drawable manner; the sliding plate is provided with a plurality of alignment check blocks, a containing area is formed between the alignment check blocks, and the material box is arranged in the containing area and detachably connected with the sliding plate. The material box is provided with multiple layers of clamping plugs used for separating wafers, a pressing air cylinder is further arranged over the material box, and a pressing rod of the pressing air cylinder abuts against the material box. The sliding plate is further provided with a plurality of through holes, one end of the photoelectric sensor is fixedly connected with the sliding plate, and the other end penetrates through the through holes and extends below the material box. According to the utility model, the material box is provided with a plurality of layers of clamping plugs for separating wafers, so that the wafers are effectively prevented from being scratched; the photoelectric sensor is adopted to detect the number of wafers in real time, and timely replacement of the material box is effectively reminded; according to the utility model, the alignment check block and the pressing cylinder are matched to detachably fix the material box on the sliding plate, so that the material box is fixed more stably.

Description

Technical Field

[0001] The utility model relates to the field of wafer carrying devices, in particular to a multi-layer stuck wafer loading and unloading device. Background Art

[0002] With the rapid development of science and technology, the semiconductor industry has become increasingly important worldwide. In this industry, wafers are the key raw materials for manufacturing integrated circuits. During the wafer preparation process, wafer dicing is indispensable for the wafer packaging process. Before dicing, a film is applied to the back of the wafer to adhere the chip to the film, maintaining the integrity of the die during dicing and reducing problems such as chipping, displacement, and falling during dicing.

[0003] Wafers are mostly stored in material boxes. It is crucial to store them safely and make them easy to take and put before and after film lamination. The existing technology for storing wafers before and after film lamination has problems such as unstable material box fixation, failure to monitor the number of wafers in real time, and easy scratching of stored wafers. Summary of the Invention

[0004] The utility model proposes a multi-layer stuck wafer loading and unloading device to more accurately solve the above-mentioned problems of unstable material box fixation, failure to monitor the number of wafers in real time, and easy scratching of wafers before and after film lamination.

[0005] The utility model is achieved through the following technical solutions:

[0006] The utility model proposes a multi-layer stuck wafer loading and unloading device, comprising

[0007] A support frame, wherein the support frame is placed horizontally;

[0008] A sliding plate, the sliding plate being arranged on the supporting frame, the sliding plate being provided with a plurality of alignment blocks and a plurality of through holes for placing a detection device;

[0009] A material box, the material box is arranged on the sliding plate; the material box is provided with multiple layers of plugs for separating wafers;

[0010] A pressing cylinder, the pressing cylinder being arranged directly above the material box, the pressing cylinder being in contact with or away from the material box;

[0011] The detection device includes a photoelectric sensor, and the photoelectric sensor is used to detect the number of wafers.

[0012] Furthermore, the pressing cylinder includes a pressing rod, and the extension and retraction direction of the pressing rod is perpendicular to the material box.

[0013] Furthermore, one end of the pressing cylinder is fixedly connected to the support frame, and the other end is in contact with or away from the material box.

[0014] Furthermore, the alignment blocks are L-shaped, fixedly connected to the sliding plate, and respectively arranged at the corners of the material box, forming a placement area between the alignment blocks.

[0015] Furthermore, the material box is embedded in the placement area, and the material box is detachably connected to the sliding plate.

[0016] Furthermore, the plugs are arranged in parallel, and the distance between any two adjacent plugs corresponds to the thickness of the wafer.

[0017] Furthermore, the photoelectric sensor is arranged toward the material box, with one end fixedly connected to the sliding plate, and the other end vertically passes through the through hole and extends to the bottom of the material box.

[0018] Furthermore, the support frame is provided with a slide rail, the sliding plate is provided with a slider, and the slider is arranged corresponding to the slide rail.

[0019] Furthermore, the sliding plate is also provided with a handle, and the sliding plate can be pulled out and arranged on the supporting frame.

[0020] Furthermore, it also includes a switch button for pausing the loading and unloading of the wafer, and the switch button is arranged on the support frame.

[0021] Beneficial effects of the utility model:

[0022] 1. The utility model proposes that the pressing cylinder is arranged just above the material box, and the pressing rod of the pressing cylinder abuts against the material box, which can effectively prevent the material box from shaking up and down and improve the installation stability of the material box.

[0023] 2. The utility model proposes to use a photoelectric sensor to detect the number of wafers in real time, which can effectively remind you to replace the material box in time.

[0024] 3. The utility model proposes the use of multiple alignment blocks, which are respectively arranged at the corners of the material box to form a placement area. The material box is embedded in the placement area, which can effectively prevent the material box from shaking back and forth and left and right, thereby improving the installation stability of the material box.

[0025] 4. The material box proposed by the present invention is provided with multiple layers of plugs, and the distance between any adjacent plugs corresponds to the thickness of the wafer, which can separate the wafers and effectively prevent the wafers from being scratched. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is an overall structural diagram of a multi-layer stuck wafer loading and unloading device in one embodiment of the present utility model;

[0027] Figure 2 It is another angle of the whole of a multi-layer stuck wafer loading and unloading device in one embodiment of the present invention;

[0028] Figure 3 This is an overall structural diagram of the sliding plate and the material box in one embodiment of the present utility model;

[0029] Figure 4 This is a top view of the sliding plate and the material box in one embodiment of the present utility model;

[0030] Figure 5 2 is a top view of a sliding plate in one embodiment of the present invention.

[0031] Explanation of the numbers: 1. Support frame; 2. Sliding plate; 3. Material box; 4. Clamping cylinder; 5. Photoelectric sensor; 11. Slide rail; 12. Switch button; 21. Alignment block; 22. Through hole; 23. Handle; 24. Slider; 31. Plug; 41. Pressure rod. DETAILED DESCRIPTION

[0032] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention will be further described below with reference to the accompanying drawings.

[0033] Please refer to Figure 1-Figure 5 The utility model proposes a multi-layer stuck wafer loading and unloading device, including a support frame 1, a sliding plate 2, a material box 3, a pressing cylinder 4 and a photoelectric sensor 5; wherein the support frame 1 is placed horizontally; the sliding plate 2 is arranged on the support frame 1, and the sliding plate 2 is provided with a plurality of alignment blocks 21 and a plurality of through holes 22 for placing a detection device; the material box 3 is arranged on the sliding plate 2, and the material box 3 is provided with a multi-layer stuck 31 for separating wafers; the pressing cylinder 4 is arranged directly above the material box 3, and the pressing cylinder 4 is in contact with or away from the material box 3; the detection device includes a photoelectric sensor 5, and the photoelectric sensor 5 is used to detect the number of wafers.

[0034] In this embodiment, the support frame 1 is placed horizontally, and the support frame 1 is provided with an upper cavity and a lower cavity. The upper cavity is used to store wafers that have not been filmed, and the lower cavity is used to store wafers that have been filmed. The film-sticking equipment takes the wafers that have not been filmed from the upper cavity, and puts the film-sticked wafers back into the lower cavity after the equipment has pasted the film; the upper cavity and the lower cavity are both provided with sliding plates 2, the support frame 1 is provided with slide rails 11, and the sliding plate 2 is provided with sliders 24, and the sliders 24 are provided corresponding to the slide rails 11. The sliding plate 2 can be pulled out and arranged on the support frame 1, and the sliding plate 2 can be pulled out and installed and removed from one side of the support frame 1; the sliding plate 2 The movable plate 2 is provided with a plurality of alignment blocks 21, which are L-shaped and fixedly connected to the sliding plate 2. The alignment blocks 21 are respectively arranged at the corners of the material box 3 to form a placement area. The material box 3 is embedded in the placement area to effectively prevent the material box 3 from shaking back and forth and left and right. The material box 3 is provided with a multi-layer plug 31 to separate the wafers, which effectively prevents the wafers from being scratched. Baffles are provided on three sides around the material box 3. The wafers can only be taken and placed in one direction, which effectively prevents the wafers from slipping. A pressing cylinder 4 is also provided just above the material box 3. The pressing cylinder 4 is provided with a pressing rod 41. One end of the pressing cylinder 4 It is fixedly connected to the support frame 1, and the pressure rod 41 at the other end of the pressing cylinder 4 abuts against the material box 3, effectively preventing the material box 3 from shaking up and down; the cooperation of the positioning block 21 and the pressing cylinder 4 effectively and stably installs the material box 3 on the sliding plate 2; the sliding plate 2 is also provided with a plurality of through holes 22, and the photoelectric sensor 5 is provided under the sliding plate 2. One end of the photoelectric sensor 5 is fixedly connected to the sliding plate 2, and the other end passes through the through hole 22 and extends to the bottom of the material box 3. The photoelectric sensor 5 detects the number of wafers in real time. In a specific embodiment, the unfilmed wafers have been placed in the material box 3 in advance. When the wafers need to be filmed, When loading, the material box 3 is manually installed on the sliding plate 2, and the sliding plate 2 is installed in the upper cavity of the support frame 1, and then the material box 3 is pressed by the pressing cylinder 4 to complete the loading; the film-sticking equipment sends the wafers with the film into the lower cavity material box 3 for storage. When the lower cavity material box 3 is full of film-sticked wafers, it is only necessary to close the pressing cylinder 4, manually pull out the sliding plate 2 in the lower cavity, and remove the material box 3 to complete the unloading; during the entire operation of the equipment, the photoelectric sensor 5 detects the number of wafers in real time. When the unfilmed wafers are taken out and the filmed wafers are full, the photoelectric sensor 5 will issue a timely warning.

[0035] This device adopts multiple alignment blocks 21, and the alignment blocks 21 are respectively arranged at the corners of the material box 3 to form a placement area. The material box 3 is embedded in the placement area, which can effectively prevent the material box 3 from shaking back and forth and left and right, and improve the installation stability of the material box 3; this device adopts a clamping cylinder 4 arranged just above the material box 3, and the pressure rod 41 of the clamping cylinder 4 abuts against the material box 3, which can effectively prevent the material box 3 from shaking up and down, and improve the installation stability of the material box 3; this device adopts a photoelectric sensor 5 to detect the number of wafers in real time, which can effectively remind you to replace the material box 3 in time; this device's material box 3 is provided with multiple layers of plugs 31, and the distance between any adjacent plugs 31 corresponds to the thickness of the wafer, which is used to separate the wafers and can effectively prevent the wafers from being scratched.

[0036] Please refer to Figure 1-Figure 3 One end of the pressing cylinder 4 is fixedly connected to the support frame 1 , and the other end is in contact with the material box 3 . The pressing cylinder 4 includes a pressing rod 41 , and the extension direction of the pressing rod 41 is perpendicular to the material box 3 .

[0037] During specific implementation: the pressing cylinder 4 includes a cylinder shell and a pressing rod 41. The pressing cylinder 4 is located directly above the material box 3. The pressing cylinder 4 shell is fixedly connected to the support frame 1, and the extension direction of the pressing rod 41 is perpendicular to the material box 3; when the air pressure in the cylinder increases, the pressure in the cylinder is greater than the external pressure, and the pressing rod 41 will move outward under the action of pressure. At this time, the pressing rod 41 abuts against the material box 3, and the pressing rod 41 applies pressure to the material box 3, which can effectively prevent the material box 3 from shaking up and down; when the material box 3 needs to be replaced, the air pressure in the pressing cylinder 4 is controlled to be reduced, and the pressure in the cylinder is less than the external pressure. The pressing rod 41 will move inward under the action of external pressure. At this time, the material box 3 is no longer subjected to vertical force, and the material box 3 can be replaced.

[0038] Please refer to Figure 4 The alignment block 21 is L-shaped and is fixedly connected to the sliding plate 2. The alignment block 21 is respectively arranged at the corners of the material box 3 to form a placement area. The material box 3 is embedded in the placement area, and the material box 3 and the sliding plate 2 form a detachable connection.

[0039] During specific implementation: the sliding plate 2 is provided with a plurality of alignment blocks 21, and the alignment blocks 21 are fixedly connected to the sliding plate 2. In a specific embodiment, four alignment blocks 21 are provided, and the alignment blocks 21 are L-shaped, wherein the four limit blocks are not collinear, and there are two alignment blocks 21 located in a straight line, which can limit the material box 3 from moving forward and left, and the remaining two alignment blocks 21 are also located in a straight line, which can limit the material box 3 from moving backward and right; the alignment blocks 21 are correspondingly arranged to form a placement area, and the material box 3 is embedded in the placement area, which can effectively prevent the material box 3 from moving forward, backward, left and right; the material box 3 is detachably connected to the sliding plate 2.

[0040] Please refer to Figure 3 The plugs 31 are arranged in parallel in the vertical direction, and the distance between any two adjacent plugs 31 is set corresponding to the wafer.

[0041] In a specific implementation, the magazine 3 is provided with multiple layers of plugs 31, which are arranged in parallel in the vertical direction. The distance between any two adjacent plugs 31 corresponds to the thickness of the wafer. In a specific embodiment, the plugs 31 can be made of rubber. The plugs 31 can separate the wafers, effectively preventing them from being scratched, and facilitate the handling of the wafers. The distance between the plugs 31 is less than or equal to the thickness of the wafer, which, to a certain extent, applies pressure to the wafers, effectively preventing the wafers from sliding horizontally.

[0042] Please refer to Figure 2 and Figure 4 One end of the photoelectric sensor 5 is fixedly connected to the sliding plate 2 ; the other end of the photoelectric sensor 5 vertically passes through the through hole 22 and extends to the bottom of the material box 3 .

[0043] In specific implementation: the photoelectric sensor 5 is arranged under the sliding plate 2, the sliding plate 2 is provided with a through hole 22, one end of the photoelectric sensor 5 is fixedly connected to the sliding plate 2, the photoelectric sensor 5 includes a light emitting receiver, the light emitting receiver of the photoelectric sensor 5 passes through the through hole 22 and extends to the bottom of the material box 3; when the wafers without film in the material box 3 are taken out, the photoelectric sensor 5 can effectively remind you to replace the material box 3 in time to add wafers without film; when the material box 3 is full of wafers with film, the photoelectric sensor 5 can effectively remind you to replace the empty material box 3 in time.

[0044] Please refer to Figure 1 and Figure 4 The support frame 1 is provided with a slide rail 11, and the sliding plate 2 is provided with a slider 24. The slider 24 is arranged corresponding to the slide rail 11. The sliding plate 2 is also provided with a handle 23. The sliding plate 2 can be pulled out and arranged on the support frame 1.

[0045] During specific implementation: the support frame 1 is provided with a slide rail 11, the sliding plate 2 is provided with a slider 24, the slider 24 is arranged corresponding to the slide rail 11, the sliding plate 2 can be pulled out and arranged on the support frame 1, and the sliding plate 2 is installed on the bracket; the sliding plate 2 is also provided with a handle 23, and the staff can install the sliding plate 2 on the bracket through the handle 23, and can also take the sliding plate 2 out of the bracket through the handle 23.

[0046] Please refer to Figure 1 , and also includes a switch button 12 for pausing wafer loading and unloading, and the switch button 12 is arranged on the support frame 1.

[0047] In specific implementation: the upper cavity and the lower cavity of the support frame 1 are both provided with a switch button 12. When the material box 3 is to be installed or removed, the device can be paused by pressing the switch button 12.

[0048] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A multi-layer stuck wafer loading and unloading device, characterized in that: include: A support frame, wherein the support frame is placed horizontally; A sliding plate, the sliding plate being arranged on the supporting frame, the sliding plate being provided with a plurality of alignment blocks and a plurality of through holes for placing a detection device; A material box, the material box is arranged on the sliding plate; the material box is provided with multiple layers of plugs for separating wafers; A pressing cylinder, the pressing cylinder being arranged directly above the material box, the pressing cylinder being in contact with or away from the material box; The detection device includes a photoelectric sensor, and the photoelectric sensor is used to detect the number of wafers.

2. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: The pressing cylinder includes a pressing rod, and the extension and contraction direction of the pressing rod is perpendicular to the material box.

3. The multi-layer stuck wafer loading and unloading device according to claim 2, characterized in that: One end of the pressing cylinder is fixedly connected to the support frame, and the other end is in contact with or away from the material box.

4. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: The alignment blocks are L-shaped, fixedly connected to the sliding plate, and respectively arranged at the corners of the material box, with a placement area formed between the alignment blocks.

5. The multi-layer stuck wafer loading and unloading device according to claim 4, characterized in that: The material box is embedded in the placement area, and the material box is detachably connected to the sliding plate.

6. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: The plugs are arranged in parallel, and the distance between any two adjacent plugs corresponds to the thickness of the wafer.

7. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: The photoelectric sensor is arranged toward the material box, with one end fixedly connected to the sliding plate, and the other end vertically passes through the through hole and extends to the bottom of the material box.

8. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: The support frame is provided with a slide rail, and the slide plate is provided with a slider, and the slider is arranged corresponding to the slide rail.

9. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: The sliding plate is further provided with a handle, and the sliding plate can be pulled out and arranged on the supporting frame.

10. The multi-layer stuck wafer loading and unloading device according to claim 1, characterized in that: It also includes a switch button for pausing the loading and unloading of the wafer, and the switch button is arranged on the support frame.

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