Image sensor and electronic device

Abstract

The utility model relates to an image sensor and electronic equipment. The image sensor comprises an image sensing chip, a rewiring substrate and an image processing chip, the rewiring substrate is located on the image sensing chip, and the image processing chip is located on the side, away from the image sensing chip, of the rewiring substrate; the rewiring substrate comprises a rewiring layer, and the image sensing chip is electrically connected with the image processing chip through the rewiring layer. According to the technical scheme, the size, the volume and the weight of the image sensor can be reduced, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to an image sensor and electronic equipment. Background Art

[0002] In related technologies, FT (Final Test) screening is an essential step in the chip packaging process. However, due to fluctuations in the upstream pixel process and color filter processing, the average color output of red, green, and blue pixels will fluctuate to a certain extent, which may lead to poor color reproduction. Furthermore, the pixel process may also cause bad pixels in the image. To address these technical issues, the following two related technologies exist:

[0003] The first is Hybrid Bonding (HB), an advanced fabrication facility (Fabrication Facility) bonding technology. Its core is to effectively connect signals by utilizing the top-to-bottom structure of a CMOS (Complementary Metal-Oxide-Semiconductor) chip and an ISP (Image Signal Processor) chip. In this process, the CMOS chip sits on the top layer, while the ISP chip sits on the bottom layer. Precise process steps ensure accurate signal transmission between the two.

[0004] However, HB technology's chip packaging structure is complex, and the overall process is relatively difficult. Each step requires precise control to ensure the performance and reliability of the final product. Furthermore, due to the numerous technical details involved and the high requirements for equipment and materials, HB technology is also relatively expensive. This includes not only initial R&D costs, but also quality control during production and subsequent maintenance costs.

[0005] The second type is an external ISP adapter board, which is often used in back-end module applications. This adapter board can perform image correction and repair functions, thereby improving image quality.

[0006] However, this technical solution requires two additional PCBs and connectors to connect the two chips. This means adding additional wiring and components to the existing PCB, which increases the size of the PCB. This, in turn, increases the volume and weight of the entire module, a disadvantage for devices that strive for lightweight and portable design. Furthermore, the increased PCB size also increases manufacturing costs. Utility Model Content

[0007] The purpose of this application is to provide an image sensor and an electronic device, which can reduce the size, volume and weight of the image sensor and reduce the manufacturing cost.

[0008] According to a first aspect of an embodiment of the present application, there is provided an image sensor, comprising: an image sensor chip, a redistribution substrate, and an image processing chip;

[0009] The redistribution substrate is located on the image sensor chip, and the image processing chip is located on a side of the redistribution substrate away from the image sensor chip;

[0010] The redistribution substrate includes a redistribution layer, and the image sensor chip is electrically connected to the image processing chip via the redistribution layer.

[0011] In one embodiment, the image sensor chip includes a photosensitive area and a non-photosensitive area, the photosensitive area is adjacent to the non-photosensitive area, and the projections of the redistribution substrate and the image processing chip on the image sensor chip are located in the non-photosensitive area.

[0012] In one embodiment, the image sensor chip further includes a first data port, a first power port, and a first control port, wherein the first data port, the first power port, and the first control port are located in the non-photosensitive area;

[0013] The redistribution layer includes a first signal line, a second signal line, and a third signal line, wherein the first signal line, the second signal line, and the third signal line are insulated from each other;

[0014] The image processing chip includes a second data port, a second power port and a second control port;

[0015] The first data port is electrically connected to the second data port via the first signal line, the first power port is electrically connected to the second power port via the second signal line, and the first control port is electrically connected to the second control port via the third signal line.

[0016] In one embodiment, the image sensor further includes a first solder ball, a second solder ball, a third solder ball, a fourth solder ball, a fifth solder ball, and a sixth solder ball;

[0017] The first signal circuit includes a first pad, a first signal line, and a second pad, wherein the first pad is located on a side of the redistribution substrate facing the image sensor chip, and the second pad is located on a side of the redistribution substrate facing away from the image sensor chip, and the first pad is electrically connected to the second pad via the first signal line;

[0018] The first data port is electrically connected to the first pad via the first solder ball, and the second pad is electrically connected to the second data port via the second solder ball;

[0019] The second signal circuit includes a third pad, a second signal line, and a fourth pad, wherein the third pad is located on a side of the redistribution substrate facing the image sensor chip, and the fourth pad is located on a side of the redistribution substrate facing away from the image sensor chip, and the third pad is electrically connected to the fourth pad via the second signal line;

[0020] The first power port is electrically connected to the third solder pad via the third solder ball, and the fourth solder pad is electrically connected to the second power port via the fourth solder ball;

[0021] The third signal circuit includes a fifth pad, a third signal line, and a sixth pad, wherein the fifth pad is located on a side of the redistribution substrate facing the image sensor chip, and the sixth pad is located on a side of the redistribution substrate facing away from the image sensor chip, and the fifth pad is electrically connected to the sixth pad via the third signal line;

[0022] The first control port is electrically connected to the fifth solder pad via the fifth solder ball, and the sixth solder pad is electrically connected to the second control port via the sixth solder ball.

[0023] In one embodiment, the image sensor further comprises a module circuit board, a supporting wall and a transparent cover;

[0024] The image sensor chip is located on the module circuit board and is electrically connected to the module circuit board;

[0025] The supporting wall is located on the module circuit board and is arranged around the image sensor chip, the redistribution substrate and the image processing chip;

[0026] The transparent cover is located on the supporting wall, and there is a gap between the transparent cover and the image processing chip.

[0027] In one embodiment, the image sensor chip includes a substrate, a first conductive member, and a circuit layer;

[0028] The substrate is located between the module circuit board and the circuit layer. A through hole is provided on the substrate. The first conductive member is located in the through hole. The circuit layer is electrically connected to the module circuit board via the first conductive member.

[0029] In one embodiment, the image sensor further includes a seventh solder ball;

[0030] The image sensor chip further includes a seventh pad, the seventh pad being located on a side of the substrate facing the module circuit board, and the first conductive member being electrically connected to the seventh pad;

[0031] The module circuit board further includes an eighth solder pad, which is located on a side of the module circuit board facing the image sensor chip, and the seventh solder pad is electrically connected to the eighth solder pad via the seventh solder ball.

[0032] In one embodiment, the image sensor further comprises metal leads;

[0033] The image processing chip includes a third data port;

[0034] The module circuit board includes a second conductive member and a high-definition multimedia interface, and the second conductive member is electrically connected to the high-definition multimedia interface;

[0035] The third data port is electrically connected to the second conductive member via the metal lead;

[0036] There is a gap between the transparent cover plate and the apex of the metal lead.

[0037] In one embodiment, the image sensor chip further includes a photosensitive element, and the photosensitive element is located in the photosensitive area.

[0038] According to a second aspect of the embodiments of the present application, there is provided an electronic device, comprising a display and the above-mentioned image sensor;

[0039] The display is electrically connected to the image processing chip.

[0040] Compared with the prior art, the beneficial effects of the present application are: since the rewiring substrate is located on the image sensor chip, the image processing chip is located on the side of the rewiring substrate away from the image sensor chip, the rewiring substrate includes a rewiring layer, and the image sensor chip is electrically connected to the image processing chip via the rewiring layer, that is, the image sensor chip, the rewiring substrate and the image processing chip are stacked in a direction perpendicular to the image sensor chip. In this way, the space occupied in the horizontal direction parallel to the image sensor chip is small, the size of the image sensor can be reduced, and thus, the manufacturing cost can be reduced. Moreover, since the electrical connection between the image sensor chip and the image processing chip can be achieved by only using a rewiring substrate provided with a rewiring layer, the volume and weight of the image sensor can be reduced. Moreover, by interconnecting the image sensor chip and the image processing chip through the rewiring substrate, the signal transmission path can be reduced and the signal transmission rate can be increased. In summary, the technical solution of the present application can reduce the size, volume and weight of the image sensor, reduce manufacturing costs, reduce the signal transmission path and increase the signal transmission rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 The figure is a schematic structural diagram of an image sensor according to an exemplary embodiment.

[0042] Figure 2 is a schematic structural diagram of an image sensor according to another exemplary embodiment.

[0043] Figure 3 The figure is a flowchart showing a method for operating an image sensor according to an exemplary embodiment.

[0044] Figure 4 The figure is a flow chart showing a method for manufacturing an image sensor according to an exemplary embodiment.

[0045] Figure 5 The figure is a schematic structural diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0046] Unless otherwise defined, the technical terms or scientific terms used in this specification and claims shall have the ordinary meaning understood by persons having ordinary skills in the technical field to which this application belongs. The specific embodiments of the present application will be described below in conjunction with the accompanying drawings. It should be pointed out that in the specific description of these embodiments, in order to provide a concise description, this specification cannot provide a detailed description of all the features of the actual embodiments. Without departing from the spirit and scope of this application, those skilled in the art may modify and replace the embodiments of the present application, and the resulting embodiments are also within the scope of protection of this application.

[0047] Related technologies employ an external ISP adapter board to achieve image processing and enhancement in back-end module applications. This approach also presents the following drawbacks: This external ISP adapter board solution can introduce signal transmission delays and noise. Because additional wiring is required to connect the two chips, signal transmission may be subject to interference and attenuation, resulting in degraded image quality. Furthermore, these additional wiring may introduce additional noise, further impacting image stability and accuracy.

[0048] In order to solve the above technical problems, the present application proposes an image sensor and electronic device, which can reduce the size, volume and weight of the image sensor, reduce manufacturing costs, reduce signal transmission paths, increase transmission rates, simplify internal wiring, reduce additional noise introduced by connecting lines, and improve image stability and accuracy.

[0049] An embodiment of the present application provides an image sensor. The image sensor can be applied to electronic devices with camera functions, such as camera devices, mobile phones, tablet computers, computers, and televisions. Figure 1 The image sensor may include: an image sensor chip 11, a redistribution substrate 12 and an image processing chip 13.

[0050] like Figure 1 As shown, the redistribution substrate 12 is positioned on the image sensor chip 11, and the image processing chip 13 is positioned on the side of the redistribution substrate 12 away from the image sensor chip 11. Specifically, the image sensor chip 11, the redistribution substrate 12, and the image processing chip 13 are stacked perpendicular to the image sensor chip 11. This minimizes the space occupied horizontally parallel to the image sensor chip 11, reducing the size of the image sensor and, consequently, manufacturing costs. Furthermore, interconnecting the image sensor chip 11 and the image processing chip 13 via the redistribution substrate 12 reduces the signal transmission path and increases the signal transmission rate.

[0051] In one embodiment, the redistribution substrate 12 includes a redistribution layer (not shown), through which the image sensor chip 11 is electrically connected to the image processing chip 13. Since the electrical connection between the image sensor chip 11 and the image processing chip 13 can be achieved using only the redistribution substrate 12 provided with the redistribution layer, the size and weight of the image sensor can be reduced, facilitating the thinning and lightening of electronic devices.

[0052] In one embodiment, Figure 1 As shown, the image sensor chip 11 may include a photosensitive area S and a non-photosensitive area N, and the photosensitive area S is adjacent to the non-photosensitive area N. A plurality of photosensitive elements arranged in an array are provided in the photosensitive area S. The plurality of photosensitive elements arranged in an array are used to collect image data. The projections of the redistribution substrate 12 and the image processing chip 13 on the image sensor chip 11 are located in the non-photosensitive area N, that is, the redistribution substrate 12 and the image processing chip 13 are located in the space above the non-photosensitive area N of the image sensor chip 11. In this way, it is possible to avoid affecting the image data collection of the image sensor chip 11.

[0053] In one embodiment, Figure 1 As shown, the image sensor chip 11 further includes a first data port 111, a first power port 112, and a first control port 113. The first data port 111 is used to output image data collected by the image sensor chip 11 and may also be referred to as an IO (input / output) port. The first power port 112 is used to output power signals. The first control port 113 is used to receive control instructions.

[0054] The first data port 111, the first power port 112, and the first control port 113 are located in the non-photosensitive area N of the image sensor chip 11. The redistribution layer may include a first signal line (not shown), a second signal line (not shown), and a third signal line (not shown), which are insulated from each other.

[0055] The image processing chip 13 may include a second data port (not shown), a second power port (not shown), and a second control port (not shown). The second data port is used to receive image data output by the image sensor chip 11 and may also be referred to as an IO (input / output) port. The second power port is used to receive power signals. The second control port is used to output control instructions.

[0056] The first data port 111 is electrically connected to the second data port via a first signal line, the first power port 112 is electrically connected to the second power port via a second signal line, and the first control port 113 is electrically connected to the second control port via a third signal line. In other words, similar ports on the image sensor chip 11 and image processing chip 13 are electrically connected to each other via the redistribution substrate 12.

[0057] In one embodiment, Figure 1 As shown, the image sensor further includes a first solder ball 21 , a second solder ball 22 , a third solder ball 23 , a fourth solder ball 24 , a fifth solder ball 25 and a sixth solder ball 26 .

[0058] In one embodiment, the first signal circuit may include a first pad (not shown), a first signal line (not shown), and a second pad (not shown). The first pad is located on the side of the redistribution substrate 12 facing the image sensor chip 11, and the second pad is located on the side of the redistribution substrate 12 facing away from the image sensor chip 11. The first pad is electrically connected to the second pad via the first signal line.

[0059] The first data port 111 is electrically connected to the first pad via the first solder ball 21, and the second pad is electrically connected to the second data port via the second solder ball 22. That is, the first data port 111 is electrically connected to the second data port via the first solder ball 21, the first pad, the first signal line, the second pad, and the second solder ball 22 in sequence.

[0060] The second signal circuit may include a third pad (not shown), a second signal line (not shown), and a fourth pad (not shown). The third pad is located on the side of the redistribution substrate 12 facing the image sensor chip 11, and the fourth pad is located on the side of the redistribution substrate 12 facing away from the image sensor chip 11. The third pad is electrically connected to the fourth pad via the second signal line.

[0061] The first power port 112 is electrically connected to the third solder pad via the third solder ball 23, and the fourth solder pad is electrically connected to the second power port via the fourth solder ball 24. That is, the first power port 112 is electrically connected to the second power port via the third solder ball 23, the third solder pad, the second signal line, the fourth solder pad, and the fourth solder ball 24 in sequence.

[0062] The third signal circuit may include a fifth solder pad (not shown), a third signal line (not shown) and a sixth solder pad (not shown). The fifth solder pad is located on the side of the redistribution substrate 12 facing the image sensor chip 11, and the sixth solder pad is located on the side of the redistribution substrate 12 facing away from the image sensor chip 11. The fifth solder pad is electrically connected to the sixth solder pad via the third signal line.

[0063] The first control port 113 is electrically connected to the fifth solder pad via the fifth solder ball 25, and the sixth solder pad is electrically connected to the second control port via the sixth solder ball 26. That is, the first control port 113 is electrically connected to the second control port via the fifth solder ball 25, the fifth solder pad, the third signal line, the sixth solder pad, and the sixth solder ball 26 in sequence.

[0064] In an embodiment of the present application, a redistribution substrate 12 is used to interconnect the first data port 111, the first power port 112, and the first control port 113 of the image sensor chip 11 with the second data port, the second power port, and the second control port of the image processing chip 13, respectively. This interconnection method can reduce the signal transmission path, increase the signal transmission rate, and reduce the size of the image sensor.

[0065] In one embodiment, Figure 1 As shown, the image sensor further includes a module circuit board 14 , a supporting wall 15 and a transparent cover 16 .

[0066] like Figure 1 As shown, the image sensor chip 11 is located on and electrically connected to the module circuit board 14. A support wall 15 is located on the module circuit board 14 and surrounds the image sensor chip 11, the redistribution substrate 12, and the image processing chip 13. A transparent cover 16 is located on the support wall 15, with a gap between the transparent cover 16 and the image processing chip 13.

[0067] In one embodiment, the image sensor chip 11 may include a substrate (not shown), a first conductive member (not shown), and a circuit layer (not shown). The substrate is positioned between the module circuit board 14 and the circuit layer. The substrate is provided with a through-hole (not shown), within which the first conductive member is positioned. The circuit layer is electrically connected to the module circuit board 14 via the first conductive member. Specifically, the image sensor chip 11 utilizes TSV (Through Silicon Via) technology to route signals and solder them to the module circuit board 14, achieving electrical connection.

[0068] In one embodiment, Figure 1As shown, the image sensor may further include a seventh solder ball 27, and the image sensor chip 11 further includes a seventh solder pad (not shown), which is located on the side of the substrate facing the module circuit board 14, and the first conductive member is electrically connected to the seventh solder pad. The module circuit board 14 further includes an eighth solder pad (not shown), which is located on the side of the module circuit board 14 facing the image sensor chip 11, and the seventh solder pad is electrically connected to the eighth solder pad via the seventh solder ball 27, that is, the circuit layer of the image sensor chip 11 is electrically connected to the module circuit board 14 via the first conductive member, the seventh solder pad, the seventh solder ball 27, and the eighth solder pad in sequence.

[0069] In one embodiment, a PLCC (Plastic Leaded Chip Carrier) package can be used with a transparent cover 16. This packaging method not only ensures the stability and durability of the image sensor, but also effectively prevents damage to the image sensor from dust and moisture, thereby extending the product's service life.

[0070] In one embodiment, the transparent cover plate 16 may be white glass with a transmittance of 95%. In other embodiments, the transmittance of the transparent cover plate 16 may be greater than 95%, for example, the transmittance of the transparent cover plate 16 may be 96%, 98% or 99%.

[0071] In one embodiment, Figure 2 As shown, the image sensor may further include metal leads 17, the image processing chip 13 includes a third data port 131, and the module circuit board 14 may include a second conductive member 141 and a High Definition Multimedia Interface (HDMI) 142. The second conductive member 141 is electrically connected to the HDMI 142, and the third data port 131 is electrically connected to the second conductive member 141 via the metal leads 17. That is, the third data port 131 is electrically connected to the HDMI 142 via the metal leads 17, the second conductive member 141, and the HDMI 142 in sequence. A gap exists between the transparent cover 16 and the vertex T of the metal leads 17.

[0072] In one embodiment, the second conductive member 141 may be a gold finger, but is not limited thereto.

[0073] In one embodiment, the metal leads 17 can be fabricated using wire bonding. Using wire bonding to tightly connect the third data port 131 of the image processing chip 13 to the high-definition multimedia interface 142 of the module circuit board 14 simplifies internal wiring and reduces the introduction of additional noise from the connection lines. It also improves image stability and accuracy, enabling lossless transmission of high-definition video signals to the display. The display is electrically connected to the high-definition multimedia interface 142.

[0074] In one embodiment, Figure 2 The working method of the image sensor shown in FIG. Figure 3 As shown, the following steps 301 to 305 may be included:

[0075] In step 301 , the image processing chip outputs a control instruction to the image sensor chip. The control instruction is used to instruct the image sensor chip to reset and perform image acquisition after the reset.

[0076] In step 302, the image sensor chip is reset after receiving the control instruction and performs image acquisition after the reset. That is, the image sensor chip performs initialization work after receiving the control instruction to achieve reset.

[0077] Step 303: The image sensor chip outputs the collected image data to the image processing chip through the first data port.

[0078] Step 304: The image processing chip processes the received image data to obtain processed image data.

[0079] In this step, the image processing chip 13 can detect abnormal pixel regions in the received image data and perform correction processing on the detected abnormal pixel regions to obtain corrected image data. For example, when it is detected that the pixel average value of a certain pixel region is less than a specified pixel value, the pixel value of each pixel in the pixel region is set to the specified pixel value to implement correction processing.

[0080] In one embodiment, the image processing chip 13 is integrated with various image processing algorithms, which can perform various image processing on the received image data to enhance the visual effect of the image. For example, the image processing chip 13 can implement one or more of the following functions:

[0081] (1) Image preprocessing: including denoising, bad pixel correction, lens shading correction, color interpolation, etc. to improve image quality.

[0082] (2) White balance and color correction: Adjust the white balance of the image to ensure accurate color reproduction under different lighting conditions.

[0083] (3) Autofocus: Achieve fast and accurate focusing by analyzing image data.

[0084] (4) Exposure control: Adjust the exposure parameters to ensure that the image is not overexposed or underexposed.

[0085] (5) Image compression: compressing the original image data into JPEG or other formats for storage or transmission.

[0086] (6) Image post-processing: including sharpening, contrast enhancement, color saturation adjustment, etc., to improve the visual effect of the image.

[0087] In step 305 , the image processing chip outputs the processed image data to the high-definition multimedia interface through the third data port 131 .

[0088] In one embodiment, Figure 2 The method for preparing the image sensor shown in FIG. Figure 4 As shown, the following steps 401 to 404 may be included:

[0089] Step 401: soldering the image sensor chip to the module circuit board, wherein the image sensor chip is electrically connected to the module circuit board.

[0090] In this step, TSV technology can be used to prepare a through hole on the substrate of the image sensor chip 11, and a first conductive member can be prepared in the through hole to lead out the signal and solder it on the module circuit board 14 to achieve electrical connection with the module circuit board 14.

[0091] Step 402: electrically connect the image processing chip and the image sensor chip via a redistribution substrate.

[0092] In this step, the second data port, second power port and second control port of the image processing chip 13 can be electrically connected to the first data port 111, first power port 112 and first control port 113 of the image sensor chip respectively through the redistribution substrate 12.

[0093] Step 403: Use metal wires to electrically connect the third data port 131 of the image processing chip to the high-definition multimedia interface of the module circuit board.

[0094] In this step, the third data port 131 of the image processing chip 13 and the high-definition multimedia interface 142 of the module circuit board 14 may be electrically connected by wire bonding.

[0095] Step 404: Prepare a supporting wall on the module circuit board and cover the transparent cover on the supporting wall to complete the package, wherein the supporting wall surrounds the image sensor chip, the redistribution substrate and the image processing chip, and there is a gap between the transparent cover and the vertices of the metal leads.

[0096] In this step, a PLCC packaging method can be used, and a transparent cover 16 can be added, which not only ensures the stability and durability of the image sensor, but also effectively prevents dust and moisture from damaging the image sensor, thereby extending the service life of the product.

[0097] Another embodiment of the present application provides an electronic device. Figure 5The electronic device may include a display 51 and an image sensor of any of the above embodiments, and the display 51 is electrically connected to the image processing chip 13.

[0098] In one embodiment, the image sensor may further include metal leads 17, the image processing chip 13 may include a third data port 131, and the module circuit board 14 may include a second conductive member 141 and a high-definition multimedia interface 142. The second conductive member 141 is electrically connected to the high-definition multimedia interface 142, and the third data port 131 is electrically connected to the second conductive member 141 via the metal leads 17. That is, the third data port 131 is electrically connected to the high-definition multimedia interface 142 via the metal leads 17 and the second conductive member 141 in sequence. The display 51 is electrically connected to the high-definition multimedia interface 142.

[0099] In one embodiment, the second conductive member 141 may be a gold finger, but is not limited thereto.

[0100] In one embodiment, the metal leads 17 can be fabricated using wire bonding. Using wire bonding to tightly connect the third data port 131 of the image processing chip 13 to the high-definition multimedia interface 142 of the module circuit board 14 simplifies internal wiring and reduces the introduction of additional noise from the connection lines. It also improves image stability and accuracy, enabling lossless transmission of high-definition video signals to the display.

[0101] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0102] The above description of the embodiments is intended to facilitate understanding and application of the present application by those skilled in the art. It will be apparent that those skilled in the art can readily make various modifications to these embodiments and apply the general principles described herein to other embodiments without expending any creative effort. Therefore, the present application is not limited to the embodiments described herein, and improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.

Claims

1. An image sensor, characterized in that: include: Image sensor chip, redistribution substrate and image processing chip; The redistribution substrate is located on the image sensor chip, and the image processing chip is located on a side of the redistribution substrate away from the image sensor chip; The redistribution substrate includes a redistribution layer, and the image sensor chip is electrically connected to the image processing chip via the redistribution layer.

2. The image sensor according to claim 1, wherein The image sensor chip includes a photosensitive area and a non-photosensitive area. The photosensitive area is adjacent to the non-photosensitive area. The projections of the redistribution substrate and the image processing chip on the image sensor chip are located in the non-photosensitive area.

3. The image sensor according to claim 2, wherein: The image sensor chip further includes a first data port, a first power port, and a first control port, wherein the first data port, the first power port, and the first control port are located in the non-photosensitive area; The redistribution layer includes a first signal line, a second signal line, and a third signal line, wherein the first signal line, the second signal line, and the third signal line are insulated from each other; The image processing chip includes a second data port, a second power port and a second control port; The first data port is electrically connected to the second data port via the first signal line, the first power port is electrically connected to the second power port via the second signal line, and the first control port is electrically connected to the second control port via the third signal line.

4. The image sensor according to claim 3, wherein It also includes a first solder ball, a second solder ball, a third solder ball, a fourth solder ball, a fifth solder ball, and a sixth solder ball; The first signal circuit includes a first pad, a first signal line, and a second pad, wherein the first pad is located on a side of the redistribution substrate facing the image sensor chip, and the second pad is located on a side of the redistribution substrate facing away from the image sensor chip, and the first pad is electrically connected to the second pad via the first signal line; The first data port is electrically connected to the first pad via the first solder ball, and the second pad is electrically connected to the second data port via the second solder ball; The second signal circuit includes a third pad, a second signal line, and a fourth pad, wherein the third pad is located on a side of the redistribution substrate facing the image sensor chip, and the fourth pad is located on a side of the redistribution substrate facing away from the image sensor chip, and the third pad is electrically connected to the fourth pad via the second signal line; The first power port is electrically connected to the third solder pad via the third solder ball, and the fourth solder pad is electrically connected to the second power port via the fourth solder ball; The third signal circuit includes a fifth pad, a third signal line, and a sixth pad, wherein the fifth pad is located on a side of the redistribution substrate facing the image sensor chip, and the sixth pad is located on a side of the redistribution substrate facing away from the image sensor chip, and the fifth pad is electrically connected to the sixth pad via the third signal line; The first control port is electrically connected to the fifth solder pad via the fifth solder ball, and the sixth solder pad is electrically connected to the second control port via the sixth solder ball.

5. The image sensor according to claim 1, wherein It also includes a module circuit board, a supporting wall and a transparent cover; The image sensor chip is located on the module circuit board and is electrically connected to the module circuit board; The supporting wall is located on the module circuit board and is arranged around the image sensor chip, the redistribution substrate and the image processing chip; The transparent cover is located on the supporting wall, and there is a gap between the transparent cover and the image processing chip.

6. The image sensor according to claim 5, wherein: The image sensor chip includes a substrate, a first conductive member and a circuit layer; The substrate is located between the module circuit board and the circuit layer. A through hole is provided on the substrate. The first conductive member is located in the through hole. The circuit layer is electrically connected to the module circuit board via the first conductive member.

7. The image sensor according to claim 6, wherein: Also included is the seventh tin ball; The image sensor chip further includes a seventh pad, the seventh pad being located on a side of the substrate facing the module circuit board, and the first conductive member being electrically connected to the seventh pad; The module circuit board further includes an eighth solder pad, which is located on a side of the module circuit board facing the image sensor chip, and the seventh solder pad is electrically connected to the eighth solder pad via the seventh solder ball.

8. The image sensor according to claim 5, wherein: Also included are metal leads; The image processing chip includes a third data port; The module circuit board includes a second conductive member and a high-definition multimedia interface, and the second conductive member is electrically connected to the high-definition multimedia interface; The third data port is electrically connected to the second conductive member via the metal lead; There is a gap between the transparent cover plate and the apex of the metal lead.

9. The image sensor according to claim 2, wherein: The image sensor chip further includes a photosensitive element, and the photosensitive element is located in the photosensitive area.

10. An electronic device, characterized in that: comprising a display and an image sensor according to any one of claims 1 to 9; The display is electrically connected to the image processing chip.

Images