Electronic device and electronic apparatus
By covering the elastically deformable film stopper on the glue filling holes of the electronic device, the problem of overflow of the potting glue is solved, the glue filling step is simplified, and the rework yield and equipment reliability of the electronic device are improved.
Patent Information
- Application Number
- CN202422125044.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In the prior art, the potting glue of electronic devices is prone to overflow through the filling hole, resulting in complex molding steps, low yield rate and high difficulty in rework.
The glue filling hole is covered with a film blocking film. The film blocking film contains a valve that can be elastically deformed. When filling the rubber, the valve opens to form a channel. After filling, the sealing is restored to prevent the potting rubber from spilling out.
The glue filling process is simplified, the selectivity of the potting glue is improved, the difficulty of rework is reduced, and the yield rate and equipment reliability are improved.
Smart Images
Figure CN223207384U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic device and an electronic device. Background Art
[0002] Electronic devices include various electronic components used to implement different functions, such as printed circuit board assemblies. To improve the performance of electronic devices, for example, by increasing smoothness and avoiding frame throttling and dropped frames, these components require excellent heat dissipation. To achieve this, electronic devices include cavities filled with potting compound. This potting compound dissipates the heat generated by the electronic components during operation, thereby improving their heat dissipation capabilities.
[0003] In order to fill the cavity with potting compound, a potting hole can be opened on the cavity wall to connect the cavity interior with the cavity exterior. Then, the potting compound is poured into the cavity through the potting hole. However, the potting compound inside the cavity easily overflows through the potting hole to the outside of the cavity. Utility Model Content
[0004] In order to solve the above technical problems, the present application provides an electronic device and an electronic device. The present application is introduced from multiple aspects below, and the implementation methods and beneficial effects of the following multiple aspects can be referenced to each other.
[0005] In a first aspect, embodiments of the present application provide an electronic device. The electronic device includes a cavity, a glue injection hole, and a film barrier. The cavity is used to hold glue. The glue injection hole is formed in a cavity wall of the cavity. The film barrier covers the glue injection hole and includes at least one valve. The at least one valve is used to seal the glue injection hole. The valve is elastically deformable and is configured to form an opening when deformed toward the interior of the cavity. The opening and the glue injection hole together form a passage connecting the interior of the cavity with the exterior of the cavity.
[0006] In this way, when it is necessary to pour glue into the cavity, a force can be applied to the blocking film to deform the blocking film to form an opening to facilitate glue pouring. After the glue pouring is completed, the force applied to the blocking film can be removed to restore the blocking film to its natural state, thereby closing the glue pouring hole and preventing glue from overflowing.
[0007] In a possible implementation of the first aspect, a score line is provided on the blocking film, and the score line passes through a solid portion of the blocking film along a thickness direction of the blocking film, so as to divide the solid portion of the blocking film into at least one valve.
[0008] In the above-mentioned solution of forming the valve by providing a scoreline on the blocking film, the blocking film is a one-piece structure, which is simpler in structure and easier to install.
[0009] In a possible implementation of the first aspect, the shape of the scoreline is a cross, a crisscross, or a U-shape.
[0010] In a possible implementation of the first aspect, the film barrier includes a plurality of valves, which are independently provided and rotated around a center point of the film barrier, and two adjacent valves partially overlap.
[0011] In a possible implementation of the first aspect, the film blocking sheet is a Mylar sheet or a metal sheet.
[0012] In a possible implementation of the first aspect, the transparency of the blocking film is greater than or equal to 50%, for example, 50%, 60% or 70%, etc. In this way, the blocking film can be prevented from blocking other structures.
[0013] In a possible implementation of the first aspect, a positioning ring is provided on the electronic device. The positioning ring is located on a side of the cavity wall facing away from the cavity body and surrounds the outer periphery of the glue filling hole. The color of the positioning ring is not black.
[0014] According to an embodiment of the present application, the color of the positioning ring is not black, which makes the positioning ring easy to identify in grayscale image recognition. Specifically, the color of the surface of electronic devices is mostly black. Therefore, in grayscale image recognition, the positioning ring is brighter than the surface of the electronic device. This brightness difference will form a clear contrast, making the positioning ring recognizable. In this way, when pouring glue into the cavity, the position of the positioning ring can be identified through grayscale image recognition, and the glue filling hole can be positioned according to the position of the positioning ring, so as to reasonably set the glue filling position so that the glue can be accurately poured into the cavity through the glue filling hole.
[0015] In a possible implementation of the first aspect, the positioning ring is a metal ring, an annular diaphragm, or an annular coating.
[0016] In a possible implementation of the first aspect, the geometric center of the positioning ring overlaps with the central axis of the glue injection hole, so that the glue injection device can more accurately determine the position of the glue injection hole.
[0017] In a possible implementation of the first aspect, the positioning ring is located between the glue injection hole and the blocking film.
[0018] In a possible implementation of the first aspect, the positioning ring is located on a surface of the film blocking piece facing away from the glue filling hole.
[0019] In a possible implementation of the first aspect, the positioning ring is disposed around the outer circumference of the blocking film.
[0020] In a possible implementation of the first aspect, the electronic device includes a radio frequency circuit board, an adapter board, and a main board. The adapter board is ring-shaped, and the radio frequency circuit board and the main board are respectively arranged on opposite sides of the adapter board to jointly form a cavity.
[0021] In a second aspect, an embodiment of the present application provides an electronic device, which includes a housing and the electronic device according to the first aspect and any one of the implementations of the first aspect, wherein the electronic device is disposed on the housing.
[0022] It should be understood that the beneficial effects of the second aspect can refer to the beneficial effects of the first aspect mentioned above, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1A 1. Shows an exemplary structure 1 of an electronic device in some technical solutions;
[0024] Figure 1B Shows an exemplary structure 2 of an electronic device in some technical solutions;
[0025] Figure 1C FIG3 shows an exemplary structure 3 of an electronic device in some technical solutions;
[0026] Figure 2 A schematic diagram showing overflow of potting glue in some technical solutions is shown;
[0027] Figure 3A shows a top view of an electronic device in an embodiment of the present application;
[0028] Figure 3B It shows the electronic device in the embodiment of the present application. Figure 3A Sectional view 1 of section AA;
[0029] Figure 3C It shows the electronic device in the embodiment of the present application. Figure 3A Cross-section view of the middle AA section Figure 2 ;
[0030] Figure 4A according to Figure 3A Schematic diagram 1 showing the process of glue filling for electronic devices in an embodiment of the present application;
[0031] Figure 4B according to Figure 3A Shows the schematic diagram of the glue filling of electronic devices in the embodiment of the present application Figure 2 ;
[0032] Figure 5A 1 shows an exemplary structure 1 of a film block in some other embodiments of the present application;
[0033] Figure 5B FIG2 shows an exemplary structure 2 of the film blocking sheet in some other embodiments of the present application;
[0034] Figure 6 Shows the exemplary structure of the film block in some other embodiments of the present application;
[0035] Figure 7A A top view of a portion of the structure of an electronic device is shown;
[0036] Figure 7B Shows some structures in electronic devices Figure 7A Cross-sectional view of the middle BB section;
[0037] Figure 8 Shows exemplary arrangements of positioning rings in some other embodiments of the present application;
[0038] Figure 9 The figure shows exemplary arrangements of positioning rings in some other embodiments of the present application. DETAILED DESCRIPTION
[0039] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0040] The present application provides an electronic device that can be used in electronic devices. The electronic device can be, for example, a multi-layer or single-layer printed circuit board assembly (PCBA), a printed circuit board (PCB), or a chip, and this application does not impose specific limitations on this. The electronic device can be, for example, a mobile phone, a tablet computer, a laptop computer, a desktop computer, or a wearable device, and this application does not impose specific limitations on this.
[0041] For ease of description, a multi-layer printed circuit board assembly is used as an example of an electronic device for introduction below.
[0042] Figures 1A to 1C Shows an exemplary structure of an electronic device 1a in some technical solutions, wherein: Figure 1A The potting compound 16a is not shown. Figure 1B The potting compound 16a is shown. Figure 1C This is a top view of the electronic device 1a. To facilitate observation of the internal structure of the electronic device 1a, Figure 1C The radio frequency circuit board 11 and the adapter board 12 are not shown. Figure 1A and Figure 1B The electronic device 1a includes a radio frequency (RF) circuit board 11, a frame board 12 (FB), a mainboard 13, and a system on chip (SOC) 14 arranged in sequence along the Z direction. The Z direction is the thickness direction of the electronic device 1a.
[0043] Among them, the adapter plate 12 is similar to a frame-like structure. The adapter plate 12 is arranged on the upper surface of the main board 13 and is welded and fixed to the main board 13. The four edges of the RF circuit board 11 are overlapped on the side surface of the adapter plate 12 facing away from the main board 13 and are welded and fixed to the adapter plate 12. Thus, the RF circuit board 11, the adapter plate 12 and the main board 13 together form a cavity S1, and the lower surface of the RF circuit board 11 and the upper surface of the main board 13 are spaced from each other along the Z direction. Therefore, other electronic devices (for example, device 15) can be set on the lower surface of the RF circuit board 11 and the upper surface of the main board 13, respectively, which effectively improves the board surface utilization.
[0044] The interior of cavity S1 is filled with potting compound 16a, which conducts heat to the space on the upper surface of the motherboard 13, thereby achieving heat dissipation on the upper surface of the motherboard 13. The surface of the system-level chip 14 facing away from the motherboard 13 is covered with thermally conductive adhesive 17, which conducts heat to the space on the lower surface of the motherboard 13, thereby achieving heat dissipation on the lower surface of the motherboard 13. In other words, the potting compound 16a and the thermally conductive adhesive 17 can achieve bidirectional heat dissipation of the electronic device 1a.
[0045] To inject potting compound 16a into cavity S1, a potting hole S2 is provided on the RF circuit board 11. This hole S2 extends through the RF circuit board 11 in the Z direction, connecting the interior of cavity S1 with the exterior. A potting needle (not shown) can be inserted from the exterior of cavity S1 into cavity S1 through this hole, thereby injecting potting compound 16a into cavity S1.
[0046] It is worth noting that the above-mentioned glue-filling solution has the problem that the glue 16a easily overflows. For example, Figure 2 Schematic diagram showing overflow of the potting glue 16a in some technical solutions. Figure 2 The potting glue 16a is a glue with a low degree of curing and curing modulus (that is, a strong fluidity). When the electronic device 1a shakes or changes its orientation (for example, upside down), the potting glue 16a will overflow through the potting hole S2 to an uncontrollable area (for example, the area P1 surrounded by the dotted line).
[0047] Therefore, in some other technical solutions, the potting glue 16a is a curable glue. During the potting process, steps such as baking or static curing are required, and these steps are strictly controlled to ensure that the potting glue 16a can be completely cured.
[0048] However, this will cause the molding steps of the electronic device 1a to be more complicated, and too many control processes have non-fool-proof characteristics, which can easily lead to equipment damage, reduced yield rate and other problems due to negligence or incorrect operation. In addition, the higher the degree of solidification and curing modulus of the potting compound 16a, the more likely it is to affect the rework yield of the electronic device 1a. For example, the connection between the RF circuit board 11 and the adapter board 12 fails. At this time, it is necessary to heat the solder joints between the RF circuit board 11 and the adapter board 12 until the temperature reaches the melting point of the solder joints to melt the solder joints, and then remove the RF circuit board 11 from the adapter board 12 to facilitate subsequent re-soldering and finally complete the rework. However, if the degree of solidification and curing modulus of the potting compound 16a are high, it will increase the difficulty of separating the RF circuit board 11 and the potting compound 16a, and the RF circuit board 11 is easily damaged during the disassembly process, and the rework yield is low.
[0049] In view of this, the present application provides an electronic device, the glue filling hole of the electronic device is covered with a blocking film, and the blocking film includes at least one elastically deformable valve. In the process of the glue filling needle passing through the blocking film and extending the glue filling hole into the cavity for glue filling, pressure is applied to the valve, and the valve is deformed under the action of pressure, thereby opening to form an opening for the glue filling needle to pass through; after the glue filling needle pulls out the blocking film, the pressure applied to the valve is removed, and the valve returns to its natural state, thereby closing to seal the glue filling hole, thereby preventing the potting glue from overflowing. Compared with the above-mentioned glue filling scheme of curing the potting glue, the glue filling scheme of the present application does not require the potting glue to be cured, etc., which is conducive to simplifying the glue filling process, and the potting glue type is more selective. For example, the potting glue can be a glue with a low curing degree and curing modulus to reduce the impact on the rework yield. It is described in detail below with reference to the accompanying drawings.
[0050] Figures 3A to 3C FIG. 1 shows an exemplary structure of an electronic device 1 in an embodiment of the present application, wherein: Figure 3A shows a top view of a portion of the structure of the electronic device 1, Figure 3B and Figure 3C The electronic device 1 is shown in Figure 3A The cross-sectional view of the AA section in the figure, in which, for the convenience of observation, Figure 3A The area enclosed by the circular dotted line shows the glue filling hole S2 blocked by the blocking film 10. Figure 3B The potting compound 16 is not shown. Figure 3C The potting compound 16 is shown. Figures 3A to 3C The electronic device 1 includes a cavity S1 , a glue injection hole S2 and a blocking film 10 .
[0051] Among them, the cavity S1 is used to accommodate the potting glue 16 (as an example of glue). As mentioned above, in this embodiment, the electronic device 1 may include a radio frequency circuit board 11, an adapter board 12 and a main board 13. The radio frequency circuit board 11, the adapter board 12 and the main board 13 are arranged in sequence along the Z direction, thereby jointly forming a cavity S1. Among them, the radio frequency circuit board 11 constitutes the top cavity wall of the cavity S1, the adapter board 12 constitutes the four side cavity walls of the cavity S1, and the main board 13 constitutes the bottom cavity wall of the cavity S1. The position structure of the radio frequency circuit board 11, the adapter board 12 and the main board 13 can refer to the above description and will not be repeated here. In other embodiments, the cavity S1 can also be formed in other ways. For example, the cavity S1 can also be surrounded by other devices (for example, other circuit boards or chips). This application does not impose any restrictions on this.
[0052] The glue filling hole S2 is provided on the cavity wall of the cavity S1. For example, in this embodiment, the glue filling hole S2 can be provided on the top cavity wall of the cavity S1, that is, the glue filling hole S2 can be provided on the RF circuit board 11. In other embodiments, the glue filling hole S2 can also be provided on other cavity walls of the cavity S1, such as the surrounding side cavity walls, the bottom cavity wall, etc., and this application does not impose any restrictions on this.
[0053] The film barrier 10 covers the glue injection hole S2. The film barrier 10 includes at least one elastically deformable valve. In its deformed state, the valve opens, forming an opening. This opening and the glue injection hole S2 together form a passage connecting the interior of the cavity S1 with the exterior of the cavity S1. This passage allows potting compound 16 to be injected into the cavity S1. In its natural state, the valve closes, sealing the glue injection hole S2 and preventing the potting compound 16 from overflowing.
[0054] For ease of description, the following will be schematically introduced by taking the blocking film 10 including four valves as an example.
[0055] Continue to refer Figure 3A In this embodiment, the shape of the film block 10 is circular. A cross-shaped engraved line S3 is provided in the middle of the circular film block 10. The cross-shaped engraved line S3 is provided along the thickness direction of the film block 10 ( Figure 3A The longitudinal axis (in a direction perpendicular to the paper) penetrates the film barrier 10, thereby dividing the solid portion of the film barrier 10 into a first valve 100, a second valve 200, a third valve 300, and a fourth valve 400. The first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 are shaped like sectors, with the centers of the sectors overlapping.
[0056] Figure 4A and Figure 4B according to Figure 3A A schematic diagram of the glue filling of the electronic device 1 in the embodiment of the present application is shown, wherein, for the convenience of observation, Figure 4A and Figure 4B Only part of the structure of the electronic device 1 is shown. Figure 4A As shown, the glue injection needle 2 can abut against the blocking film 10 during the process of moving along the Z1 direction, thereby applying pressure to the first valve 100 and the second valve 200. Under the action of pressure, the first valve 100, the second valve 200, the third valve 300 and the fourth valve 400 are respectively deformed toward the inside of the cavity S1. In the deformed state, the first valve 100, the second valve 200, the third valve 300 and the fourth valve 400 are opened to form an opening (not marked). The end of the glue injection needle 2 extends from the outside of the cavity S1 into the inside of the cavity S1 through the opening and the glue injection hole S2, thereby injecting the potting glue (not shown) into the inside of the cavity S1. As shown Figure 4B As shown, after glue filling is complete, the glue filling needle 2 can be pulled out of the blocking film 10 along the Z2 direction, thereby removing the pressure applied to the first valve 100, the second valve 200, the third valve 300, and the fourth valve 400. The first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 return to their natural state through their own elasticity. In the natural state, the first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 are closed, thereby sealing the glue filling hole S2. The potting glue 16 has a certain viscosity and surface tension, so it is difficult for it to overflow through the closed first valve 100, the second valve 200, the third valve 300, and the fourth valve 400.
[0057] The above-mentioned electronic device 1 can prevent the potting glue 16 from overflowing by covering the potting hole S2 with a blocking film 10 having a one-way valve effect, and will not affect the potting needle from pouring the potting glue 16 into the cavity S1, that is, the potting glue 16 can only go in but not out. Compared with the above-mentioned potting solution for curing the potting glue 16a, the present application does not require baking or static curing and other processes during the potting process, nor does it require various types of management and control, thereby effectively simplifying the potting steps. Secondly, the potting glue 16 provided in the present application has more optional types to meet the use requirements in various application scenarios. For example, in some embodiments, the potting glue 16 can be a glue with a low degree of curing and curing modulus, thereby reducing the bonding tightness between the RF circuit board 11 and the potting glue 16, making it easier to disassemble the RF circuit board 11 for repair, thereby reducing the probability of the RF circuit board 11 being scrapped, effectively improving the repair yield, and reducing costs.
[0058] It is understood that the present application does not specifically limit the type of potting glue 16, as long as it can meet the actual use requirements. In some embodiments, the potting glue 16 can be a two-component glue (i.e., AB glue). In other alternative embodiments, the potting glue 16 can also be a single-component glue. It is also understood that the present application does not specifically limit the form of the potting glue 16, and the potting glue 16 can be pure liquid, semi-solid or pure solid.
[0059] In some embodiments, the valve is formed by scoring the film 10 .
[0060] For example, the above Figures 3A to 4B In the illustrated embodiment, four valves are formed by providing a cross-shaped score line S3 on the film barrier 10: a first valve 100 to a fourth valve 400. However, the present application is not limited thereto. In other embodiments of the present application, valves can also be formed by providing score lines of other shapes on the film barrier 10. Examples of such formations are described below with reference to the accompanying drawings.
[0061] Figure 5A and Figure 5B Several exemplary structures of the film block 10 in other embodiments of the present application are shown. Figure 5A In some implementations, a cross-shaped score line S4 can be provided on the film block 10, thereby dividing the solid portion of the film block 10 into six valves: the fifth valve 500 to the twelfth valve 1200. Figure 5B In some other implementations, a U-shaped score line S4 may be provided on the blocking film 10 , thereby dividing the solid portion of the blocking film 10 into a valve: the thirteenth valve 1300 .
[0062] In the above-mentioned solution of forming the valve by opening a score line on the blocking film 10, the blocking film 10 is a one-piece structure, which is simpler in structure and easier to install.
[0063] In other feasible solutions, the multiple valves may also be independent leaf-shaped structures, rather than being formed by marking lines on the barrier film 10. For example Figure 6 FIG. 1 shows an exemplary structure of the film block 10 in some other embodiments of the present application. Figure 6The film barrier 10 includes eight valves: the fourteenth valve 1400 to the twenty-first valve 2100. The eight valves are arranged in a rotational arrangement around the center point O of the film barrier 10. Adjacent valves partially overlap, for example, the fourteenth valve 1400 and the fifteenth valve 1500 partially overlap, thereby forming the film barrier 10. When a glue injection needle (not shown) applies pressure to the film barrier 10, the adjacent valves deform toward the interior of the cavity (not shown), separating from each other. This gradually reduces the overlap between the adjacent valves, ultimately forming an opening between the two adjacent valves for the glue injection needle to pass through.
[0064] In some embodiments of the present application, the shape of the film block 10 can be a regular shape such as a circle, rectangle, triangle, oval, etc. In some other embodiments, the shape of the film block 10 can also be an irregular shape, which is not limited in the present application.
[0065] In some embodiments of the present application, the film blocking sheet 10 may be a mylar sheet or a metal sheet.
[0066] In some implementations, when the film barrier 10 is a Mylar sheet, its material may be, for example, polyimide (PI) or polyethylene terephthalate (PET).
[0067] In some implementations, when the film blocking sheet 10 is a metal sheet, its material may be, for example, aluminum, copper, iron, or nickel.
[0068] In some embodiments of the present application, a positioning ring 18 may also be provided on the electronic device 1 . Figure 7A and Figure 7B FIG. 1 shows an exemplary structure of the positioning ring 18 in the electronic device 1 according to an embodiment of the present application, wherein: Figure 7A A top view of a portion of the structure of the electronic device 1 is shown, and the film block 10 is not shown. Figure 7B It shows the structure of part of the electronic device 1. Figure 7A The cross-sectional view is taken along the BB section, and the film stopper 10 is shown.
[0069] refer to Figure 7A and Figure 7B, the positioning ring 18 is located on the side of the cavity wall (for example, the RF circuit board 11) facing away from the cavity S1, that is, the positioning ring 18 can be observed from the outside of the electronic device 1. In addition, the positioning ring 18 is arranged around the outer periphery of the glue hole S2. The color of the positioning ring 18 is not black, for example, yellow, red, orange, etc., so that the positioning ring 18 can be easily identified in grayscale image recognition. Specifically, the color of the surface F1 of the electronic device 1 is mostly black. Therefore, in grayscale image recognition, the positioning ring 18 is brighter than the surface F1 of the electronic device 1. This brightness difference will form a clear contrast, so that the positioning ring 18 can be identified. In this way, when the glue filling equipment fills the potting glue (not shown) into the cavity S1, it can identify the position of the positioning ring 18 by grayscale image recognition, and thus locate the glue hole S2 according to the position of the positioning ring 18, so as to reasonably set the needle position of the glue filling needle so that the glue filling needle can be accurately inserted into the glue filling hole S2.
[0070] In some embodiments of the present application, the positioning ring 18 may be a metal ring. Metal has a high reflectivity, and especially under light, the metal ring surface will produce highlight areas. These areas will appear as brighter pixels in grayscale image recognition, making the positioning ring 18 easier to identify.
[0071] In some other embodiments of the present application, the positioning ring 18 may also be a non-black annular diaphragm or an annular coating formed by spraying a non-black coating, and the present application does not impose any specific limitation on this.
[0072] Continue to refer Figure 7A In some embodiments of the present application, the geometric center of the positioning ring 18 may overlap with the central axis of the glue filling hole S2, so that the glue filling device can more accurately determine the position of the glue filling hole S2.
[0073] It is understood that the position of the geometric center is different depending on the shape of the positioning ring 18. For example, the positioning ring 18 is Figure 7A In the illustrated embodiment, for a circular ring structure, its corresponding geometric center can be the center of the circular ring structure. For another example, if the positioning ring 18 is a rectangular ring structure, its corresponding geometric center can be the intersection of the diagonals of the rectangular ring structure. For another example, if the positioning ring 18 is a regular polygonal ring structure, its corresponding geometric center can be a point within the regular polygonal ring structure that is equidistant from each side.
[0074] Continue to refer Figure 7BIn some embodiments of the present application, a positioning ring 18 may be disposed between the glue injection hole S2 and the film retaining plate 10. For example, the positioning ring 18 may be a metal ring fixed to the RF circuit board 11. In another example, the positioning ring 18 may be a membrane attached to the RF circuit board 11. In another example, the positioning ring 18 may be an annular coating formed by spraying a non-black coating on the RF circuit board 11.
[0075] In some implementations, to prevent the blocking film 10 from interfering with the glue-filling device's recognition of the positioning ring 18 , the transparency of the blocking film 10 may be greater than or equal to 50%, for example, 50%, 60% or 70%.
[0076] Figure 8 FIG. 1 shows exemplary arrangements of the positioning ring 18 in some other embodiments of the present application. Figure 8 In some other embodiments of the present application, the positioning ring 18 can also be arranged around the outer periphery of the film baffle 10 to prevent the film baffle 10 from blocking the positioning ring 18, thereby ensuring that the glue filling equipment can identify the position of the positioning ring 18. The positioning ring 18 can be in the form of a metal ring, an annular diaphragm, or an annular coating formed by spraying a non-black coating on the outer periphery of the film baffle 10. For details, please refer to the above Figure 7B The relevant descriptions in the illustrated embodiments will not be repeated here one by one.
[0077] Figure 9 FIG2 shows exemplary configurations of the positioning ring 18 in some other embodiments of the present application. Figure 9 In some other embodiments of the present application, the positioning ring 18 can also be provided on the surface of the film block 10 facing away from the glue injection hole S2 to prevent the film block 10 from blocking the positioning ring 18, thereby ensuring that the glue injection device can identify the position of the positioning ring 18. The positioning ring 18 can be in the form of a metal ring, an annular diaphragm, or an annular coating formed by spraying a non-black coating on the surface of the film block 10 facing away from the glue injection hole S2. For details, please refer to the above Figure 7B The relevant descriptions in the illustrated embodiments will not be repeated here one by one.
[0078] The present application also provides an electronic device, which includes a housing and an electronic device. The electronic device is provided on the housing, and the structure of the electronic device can refer to any of the electronic devices 1 in the above embodiments, and will not be described in detail here.
[0079] The above describes the implementation methods of the present application by means of specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation methods. On the contrary, the purpose of introducing the application in conjunction with the implementation methods is to cover other options or modifications that may be extended based on the claims of the present application. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.
[0080] In the description of this application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "outside", "inside", "circumferential", "radial", "axial", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.
[0081] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "dispose," "install," "connect," and "fit" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0082] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.
Claims
1. An electronic device, characterized in that: include: a cavity, the cavity being used to contain glue; A glue injection hole is provided on the cavity wall of the cavity; A film blocking sheet, the film blocking sheet covers the glue injection hole, the film blocking sheet includes at least one valve, the at least one valve is used to close the glue injection hole, and the valve is elastically deformable, the at least one valve is used to form an opening when deformed toward the inside of the cavity, and the opening and the glue injection hole together form a channel connecting the inside of the cavity and the outside of the cavity.
2. The electronic device according to claim 1, wherein The blocking film is provided with a score line, and the score line passes through the solid part of the blocking film along the thickness direction of the blocking film, so as to divide the solid part of the blocking film into the at least one valve.
3. The electronic device according to claim 2, wherein: The shape of the engraved line is a cross, a rice shape or a U shape.
4. The electronic device according to claim 1, wherein The film baffle includes a plurality of valves, which are independently arranged and rotated around the center point of the film baffle, and two adjacent valves partially overlap.
5. The electronic device according to claim 1, wherein The film blocking sheet is a Mylar sheet or a metal sheet.
6. The electronic device according to claim 1, wherein The transparency of the blocking film is greater than or equal to 50%.
7. The electronic device according to claim 1, wherein: A positioning ring is provided on the electronic component. The positioning ring is located on a side of the cavity wall facing away from the cavity body and is arranged around the outer periphery of the glue injection hole. The color of the positioning ring is not black.
8. The electronic device according to claim 7, wherein: The positioning ring is a metal ring, an annular diaphragm or an annular coating.
9. The electronic device according to claim 7, wherein: The geometric center of the positioning ring overlaps with the central axis of the glue injection hole.
10. The electronic device according to claim 7, wherein: The positioning ring is located between the glue injection hole and the blocking film.
11. The electronic device according to claim 7, wherein: The positioning ring is located on the surface of the blocking film facing away from the glue injection hole.
12. The electronic device according to claim 7, wherein: The positioning ring is arranged around the outer periphery of the blocking film.
13. The electronic device according to claim 1, wherein: The electronic device includes a radio frequency circuit board, an adapter board and a main board. The adapter board is ring-shaped. The radio frequency circuit board and the main board are respectively arranged on opposite sides of the adapter board to jointly form the cavity.
14. An electronic device, characterized in that: The electronic device comprises a housing and the electronic device according to any one of claims 1 to 13, wherein the electronic device is arranged on the housing.