Heat dissipation device and container type data center cooling system

Abstract

According to the heat dissipation device and the container type data center cooling system, after cooling liquid of a liquid cooling box body enters a radiator set through a liquid return pipe, part of heat of the cooling liquid in the radiator set can be taken away through airflow generated by operation of a fan, and air cooling is achieved; and then the cooling liquid is sent into the water cooling unit for liquid cooling and then sent into the liquid cooling box body for cooling the electronic equipment in the liquid cooling box body, so that heat dissipation and cooling treatment on the cooling liquid is realized through a combined mode of air cooling and liquid cooling, and the cooling effect is improved.

Description

Technical Field

[0001] The present application relates to the technical field of data center cooling, and in particular to a heat dissipation device and a containerized data center cooling system. Background Art

[0002] Data center cooling is a key technology for ensuring the continuous and stable operation of electronic equipment within a data center. Servers, storage devices, network hardware, and other electronic equipment generate significant heat during operation. If left uncontrolled, this can lead to overheating, performance degradation, and even damage. Therefore, effective cooling measures have a significant impact on data center energy efficiency, reliability, and operating costs.

[0003] Currently, liquid cooling is usually used to cool electronic equipment in data centers. The coolant is usually cooled by a water cooling unit, but the cooling effect is not good. Utility Model Content

[0004] The purpose of this application is to provide a heat dissipation device and a container-type data center cooling system, which achieves heat dissipation and cooling treatment of the coolant through a combination of air cooling and liquid cooling, thereby improving the cooling effect.

[0005] The embodiments of the present application can be implemented as follows:

[0006] In a first aspect, the present invention provides a heat dissipation device, comprising:

[0007] Water cooling unit;

[0008] A heat exchanger group is located on the side of the water cooling unit, and the outlet of the heat exchanger group is connected to the inlet of the water cooling unit;

[0009] a fan for forming an air flow through the heat exchanger;

[0010] A liquid return pipe, the inlet of which is used to connect to the outlet of the liquid cooling box, and the outlet of which is connected to the inlet of the heat exchanger group;

[0011] A liquid outlet pipe, the inlet of the liquid outlet pipe is connected to the outlet of the water cooling unit, and the outlet of the liquid outlet pipe is used to connect to the inlet of the liquid cooling box.

[0012] In an optional embodiment, the liquid return pipe is located on a path where airflow is formed when the fan is running.

[0013] In an optional embodiment, the heat exchanger groups are provided on both sides of the water cooling unit, the fan is located above the water cooling unit, and the liquid return pipe is distributed between the water cooling unit and the fan.

[0014] In an optional embodiment, the liquid return pipe includes a liquid return main pipe and at least two liquid return branch pipes connected to the liquid return main pipe, each of the liquid return branch pipes is distributed at intervals along the length direction of the liquid return main pipe, and the outlet of each liquid return branch pipe is connected to the inlet of a heat exchanger in the heat exchanger group.

[0015] In an optional embodiment, the heat dissipation device also includes a sub-heat exchanger group located between the water cooling unit and the heat exchanger group, the outlet of the heat exchanger group is connected to the inlet of the sub-heat exchanger group, the outlet of the sub-heat exchanger group is connected to the inlet of the water cooling unit, and the airflow formed when the fan is running also passes through the sub-heat exchanger group.

[0016] In an optional embodiment, the heat dissipation device further includes a sub-fan, which is located between the sub-heat exchanger group and the fan, with the positive pressure side of the sub-fan facing the negative pressure side of the fan, and the sub-fan is used to ensure that a portion of the air flow passing through the heat exchanger group when the fan is running passes through the sub-heat exchanger group.

[0017] In an optional embodiment, the liquid return pipe is located between the positive pressure side of the sub-fan and the negative pressure side of the fan.

[0018] In an optional embodiment, the sub-heat exchanger groups are provided on both sides of the water cooling unit, the sub-fans are fixed on the sub-heat exchanger groups and are located above the water cooling unit, and the fan is located above the sub-fans.

[0019] In an optional embodiment, a delivery pipe for connecting the outlet of the sub-heat exchanger group and the inlet of the water cooling unit is located on the path of the airflow generated when the sub-fan is in operation.

[0020] In a second aspect, the present invention provides a container-type data center cooling system, comprising a container, a liquid cooling box provided in the container, and a heat dissipation device according to any one of the aforementioned embodiments, wherein the liquid cooling box is used for placing electronic equipment in the data center.

[0021] Compared with the prior art, the beneficial effects of the embodiments of the present application include, for example:

[0022] After the coolant in the liquid cooling box enters the radiator group through the return pipe, the airflow generated by the operation of the fan can take away part of the heat of the coolant in the radiator group, achieving air cooling, and then sent to the water cooling unit for liquid cooling, and then sent to the liquid cooling box to cool the electronic equipment in the liquid cooling box. In this way, the heat dissipation and cooling of the coolant is achieved through the combination of air cooling and liquid cooling, thereby improving the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 This is one of the schematic diagrams of an embodiment of the present application;

[0025] Figure 2 This is the second schematic diagram of the embodiment of the present application.

[0026] Icons: 10-container; 20-water cooling unit; 30-heat exchanger group; 40-fan; 50-liquid return pipe; 51-liquid return main pipe; 52-liquid return branch pipe; 60-sub-heat exchanger group; 70-sub-fan. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0032] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0033] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0034] Combine Figure 1 and Figure 2 The embodiment of the present application discloses a container-type data center cooling system, which includes a container 10 and a liquid cooling box and a heat dissipation device arranged in the container 10. The liquid cooling box is used to place electronic equipment in the data center, and also absorbs the heat generated by the electronic equipment during operation through the cooling liquid in the liquid cooling box.

[0035] After absorbing heat, the coolant needs to be discharged from the outlet of the liquid cooling box for heat dissipation and cooling, so that after the temperature is lowered, it can enter the inlet of the liquid cooling box again to absorb the heat of the electronic equipment, thus achieving circulating cooling.

[0036] The heat dissipation device includes a water cooling unit 20, a heat exchanger unit 30, a fan 40, a liquid return pipe 50 and a liquid outlet pipe.

[0037] The heat exchanger group 30 is located to the side of the water cooling unit 20, which can be at least one side in the width direction of the container 10 or at least one side in the length direction of the container 10, and the outlet of the heat exchanger group 30 is connected to the inlet of the water cooling unit 20. The fan 40 is used to form an airflow through the heat exchanger.

[0038] The inlet of the liquid return pipe 50 is used to connect to the outlet of the liquid cooling box, and the outlet of the liquid return pipe 50 is connected to the inlet of the heat exchanger group 30;

[0039] The inlet of the liquid outlet pipe is connected to the outlet of the water cooling unit 20 , and the outlet of the liquid outlet pipe is used to connect to the inlet of the liquid cooling box.

[0040] In this way, after the coolant in the liquid-cooled box enters the radiator group through the return liquid pipe 50, the airflow generated by the operation of the fan 40 can take away part of the heat of the coolant in the radiator group, realizing air cooling, and then sent to the water cooling unit 20 for liquid cooling, and then sent to the liquid cooling box to cool the electronic equipment in the liquid cooling box. In this way, the heat dissipation and cooling treatment of the coolant is achieved through the combination of air cooling and liquid cooling, thereby improving the cooling effect.

[0041] Of course, it is understood that, for example, in winter, only the fan 40 can be operated, and the water-cooling unit 20 can provide no cooling, with air cooling being used to dissipate heat and cool the coolant to reduce energy consumption. In warmer environments, such as summer, the fan 40 can be operated, and the water-cooling unit 20 can provide cooling, with both air and liquid cooling being used to dissipate heat and cool the coolant to provide greater cooling capacity. Alternatively, if the heat dissipation requirement for electronic equipment is low, the fan 40 can be operated alone, with air cooling used to cool the electronic equipment, or the water-cooling unit 20 can be operated alone, with liquid cooling used to cool the electronic equipment.

[0042] Optionally, the liquid return pipe 50 is located on the path of the airflow formed when the fan 40 is running, so that the airflow generated when the fan 40 is running can directly dissipate the initial heat of the coolant in the liquid return pipe 50, further reducing the temperature of the coolant passing through the liquid outlet pipe.

[0043] Specifically, there are heat exchanger groups 30 on both sides of the water-cooling unit 20. Specifically, there are heat exchanger groups 30 on both sides of the arrangement direction of each water-cooling unit in the water-cooling unit 20. The fan 40 is located above the water-cooling unit 20 and is set on the top wall of the container 10. The return pipe 50 is distributed between the water-cooling unit 20 and the fan 40. In this way, the airflow generated when the fan 40 is running can pass through the heat exchanger group 30 and the return pipe 50.

[0044] More specifically, the liquid return pipe 50 includes a liquid return main pipe 51 and at least two liquid return branch pipes 52 connected to the liquid return main pipe 51. The liquid return branch pipes 52 are spaced apart along the length of the liquid return main pipe 51. The inlet of the liquid return main pipe 51 is used to connect to the outlet of the liquid cooling box to receive the coolant. The outlet of each liquid return branch pipe 52 is connected to the inlet of a heat exchanger in the heat exchanger group 30. In this way, the liquid return pipe 50 can transport coolant to each heat exchanger in the heat exchanger group 30.

[0045] The heat dissipation device also includes a sub-heat exchanger group 60 located between the water cooling unit 20 and the heat exchanger group 30. The outlet of the heat exchanger group 30 is connected to the inlet of the sub-heat exchanger group 60, and the outlet of the sub-heat exchanger group 60 is connected to the inlet of the water cooling unit 20. The airflow formed when the fan 40 is running also passes through the sub-heat exchanger group 60. In this way, the coolant after cooling through the heat exchanger group 30 is further reduced by air cooling through the sub-heat exchanger group 60, so that the electronic equipment in the data center can be better cooled.

[0046] In addition, the heat dissipation device also includes a sub-fan 70, which is located between the sub-heat exchanger group 60 and the fan 40, with the positive pressure side of the sub-fan 70 facing the negative pressure side of the fan 40. The sub-fan 70 is used to allow a portion of the airflow passing through the heat exchanger group 30 when the fan 40 is running to pass through the sub-heat exchanger group 60, thereby achieving further cooling of the coolant after cooling through the heat exchanger group 30 through the sub-heat exchanger group 60, and then sending it to the water cooling unit 20 for cooling. The air after absorbing heat is discharged outside the container 10 through the sub-fan 70 and the fan 40 in turn.

[0047] Specifically, the liquid return pipe 50 is located between the positive pressure side of the sub-fan 70 and the negative pressure side of the fan 40, so that when the sub-fan 70 is running, a part of the airflow passing through the heat exchanger group 30 can pass through the sub-heat exchanger group 60 to further take away part of the heat of the coolant in the heat exchanger group 30.

[0048] There is at least one sub-heat exchanger group 60 on each side of the water cooling unit 20, and at least one sub-heat exchanger group 60 can also be set on one side. The sub-fan 70 is fixed on the sub-heat exchanger group 60 and is located above the water cooling unit 20. The fan 40 is located above the sub-fan 70.

[0049] The delivery pipe 80 for connecting the outlet of the sub-heat exchanger group 60 and the inlet of the water cooling unit 20 is located on the path of the airflow generated when the sub-fan 70 is running, so that the airflow can further cool the coolant and absorb heat during the process of transporting the coolant from the sub-heat exchanger group 60 to the water cooling unit 20.

[0050] In summary, the embodiments of the present application disclose a heat dissipation device and a container-type data center cooling system. After the cooling liquid in the liquid-cooled box enters the radiator group through the return liquid pipe 50, the airflow generated by the operation of the fan 40 can take away part of the heat of the coolant in the radiator group, thereby achieving air cooling, and then sent to the water cooling unit 20 for liquid cooling, and then sent to the liquid cooling box to cool the electronic equipment in the liquid cooling box. In this way, the heat dissipation and cooling treatment of the coolant is achieved through the combination of air cooling and liquid cooling, thereby improving the cooling effect.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device, characterized in that: include: Water cooling unit (20); a heat exchanger group (30) located on the side of the water cooling unit (20), wherein the outlet of the heat exchanger group (30) is connected to the inlet of the water cooling unit (20); a fan (40) for forming an air flow through the heat exchanger; a liquid return pipe (50), the inlet of the liquid return pipe (50) being used to connect to the outlet of the liquid cooling box, and the outlet of the liquid return pipe (50) being connected to the inlet of the heat exchanger group (30); A liquid outlet pipe, the inlet of the liquid outlet pipe is connected to the outlet of the water cooling unit (20), and the outlet of the liquid outlet pipe is used to connect to the inlet of the liquid cooling box.

2. The heat dissipation device according to claim 1, characterized in that: The liquid return pipe (50) is located on the path of the airflow formed when the fan (40) is in operation.

3. The heat dissipation device according to claim 2, characterized in that: The heat exchanger group (30) is provided on both sides of the water cooling unit (20), the fan (40) is located above the water cooling unit (20), and the liquid return pipe (50) is distributed between the water cooling unit (20) and the fan (40).

4. The heat dissipation device according to claim 1, wherein: The liquid return pipe (50) comprises a liquid return main pipe (51) and at least two liquid return branch pipes (52) connected to the liquid return main pipe (51). The liquid return branch pipes (52) are spaced apart along the length direction of the liquid return main pipe (51). The outlet of each liquid return branch pipe (52) is connected to the inlet of one of the heat exchangers in the heat exchanger group (30).

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat dissipation device further comprises a sub-heat exchanger group (60) located between the water cooling unit (20) and the heat exchanger group (30), the outlet of the heat exchanger group (30) being connected to the inlet of the sub-heat exchanger group (60), the outlet of the sub-heat exchanger group (60) being connected to the inlet of the water cooling unit (20), and the airflow formed when the fan (40) is in operation also passes through the sub-heat exchanger group (60).

6. The heat dissipation device according to claim 5, characterized in that: The heat dissipation device further comprises a sub-fan (70), the sub-fan (70) being located between the sub-heat exchanger group (60) and the fan (40), the positive pressure side of the sub-fan (70) facing the negative pressure side of the fan (40), and the sub-fan (70) being used to ensure that a portion of the airflow passing through the heat exchanger group (30) when the fan (40) is in operation passes through the sub-heat exchanger group (60).

7. The heat dissipation device according to claim 6, characterized in that: The liquid return pipe (50) is located between the positive pressure side of the sub-fan (70) and the negative pressure side of the fan (40).

8. The heat dissipation device according to claim 6, characterized in that: The sub-heat exchanger group (60) is provided on both sides of the water cooling unit (20), the sub-fan (70) is fixed on the sub-heat exchanger group (60) and is located above the water cooling unit (20), and the fan (40) is located above the sub-fan (70).

9. The heat dissipation device according to claim 6, wherein: A delivery pipe (80) for connecting the outlet of the sub-heat exchanger group (60) and the inlet of the water cooling unit (20) is located on the path of the airflow generated when the sub-fan (70) is in operation.

10. A containerized data center cooling system, characterized in that: The invention comprises a container (10), a liquid cooling box body arranged in the container (10), and a heat dissipation device according to any one of claims 1 to 9, wherein the liquid cooling box body is used for accommodating electronic equipment in a data center.

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