LED display screen

Abstract

The utility model provides an LED display screen which comprises a display module, a heat dissipation frame and a heat conduction assembly comprising a heat conduction metal block, the display module is installed on the heat dissipation frame, and the heat conduction metal block is in contact connection with the heat dissipation frame and a lamp panel of the display module, so that heat of the lamp panel can be transmitted to the heat dissipation frame through the heat conduction metal block. And heat dissipation is carried out through the heat dissipation frame. Through the arrangement of the heat conduction assembly, a path through which the lamp panel transmits heat outwards is formed between the lamp panel of the display module and the heat dissipation frame, the heat dissipation effect of the lamp panel is improved, then the heat of the lamp panel can be rapidly transmitted to the outside of the LED display screen to reduce the temperature of the lamp panel, and the problem that the temperature of the lamp panel is too high is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display screens, in particular to an LED display screen. Background Art

[0002] Currently, with the rapid development of the LED industry, the rental of LED displays is extremely popular. At the same time, the requirements for the display effects of LED displays are getting higher and higher.

[0003] During the use of LED display screens, the thermal effect of the current will generate a lot of heat, causing the temperature of the LED light board to rise. Excessive temperature will cause the LED light board to malfunction and affect the display effect. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that the temperature of the LED lamp board is easily too high during use of the existing LED display screen.

[0005] In order to solve the above technical problems, the utility model provides an LED display screen, comprising a display module, a heat dissipation frame and a heat-conducting component; the display module is installed on the heat dissipation frame, and the display module includes a light board, and the light board is used to display graphic information; the heat-conducting component includes a heat-conducting metal block, and the heat-conducting metal block is arranged in contact between the light board and the heat dissipation frame, so that the heat of the light board can be transferred to the heat dissipation frame through the heat-conducting metal block, and dissipated to the external environment through the heat dissipation frame.

[0006] In some embodiments of the present application, the heat-conducting assembly further includes a graphene heat-conducting block, which is disposed between the heat-conducting metal block and the heat dissipation frame, and the graphene heat-conducting block is in contact with both the heat-conducting metal block and the heat dissipation frame.

[0007] In some embodiments of the present application, the heat-conducting component further includes a heat-conducting silicone sheet, which is disposed between the heat-conducting metal block and the lamp board, and is in contact with both the heat-conducting metal block and the lamp board.

[0008] In some solutions of the present application, the light board includes a display surface and a non-display surface, the display surface is used to display graphic information, and the non-display surface is arranged in contact with the thermally conductive silicone sheet.

[0009] In some solutions of the present application, the display module also includes a bottom shell and a mask, the bottom shell is connected to the heat dissipation frame, the mask is fixedly connected to the side of the bottom shell facing away from the heat dissipation frame, the light board is arranged between the mask and the bottom shell, and the display surface faces the mask.

[0010] In some solutions of the present application, a mounting hole is formed on a surface of the bottom shell facing the heat dissipation frame, and the heat-conducting metal block is embedded in the mounting hole.

[0011] In some schemes of the present application, a first hollow hole is provided on the bottom shell, a second hollow hole is provided on the mask, and a third hollow hole is provided on the light panel. The second hollow hole and the third hollow hole correspond to the positions of the first hollow hole, and external air can pass through the second hollow hole, the third hollow hole and the first hollow hole; a card slot is provided at the edge of the first hollow hole, and a buckle is provided at the edge of the second hollow hole. The buckle passes through the third hollow hole and is buckled with the card slot.

[0012] In some solutions of the present application, there are multiple display modules, and the multiple display modules are all set on the heat dissipation frame; the heat dissipation frame includes a frame and at least one reinforcing rod formed inside the frame, and the outer dimensions of the frame are adapted to the outer shape composed of all the display modules; the heat conductive component is in contact with the reinforcing rod.

[0013] In some solutions of the present application, the frame and the reinforcing rod are an integrally formed structure; and / or the heat dissipation frame is an aluminum frame, an aluminum alloy frame or a copper frame.

[0014] In some solutions of the present application, the LED display screen also includes a power supply component, which is fixed on the side of the heat dissipation frame facing away from the display module. The outer dimensions of the power supply component are smaller than the outer dimensions of the heat dissipation frame, so that at least part of the heat dissipation frame can be in direct contact with the air for heat dissipation.

[0015] In some schemes of the present application, the power supply assembly includes a power box, an adapter plate and a power supply component. The power box is fixed on the heat dissipation frame, and an accommodating cavity is formed between the power box and the heat dissipation frame. The adapter plate and the power supply component are installed in the accommodating cavity, and the adapter plate is in contact with the heat dissipation frame so that the heat of the adapter plate and the power supply component can be dissipated through the heat dissipation frame, and the power supply component is in contact with the power box so that the heat of the power supply component can be dissipated through the power box.

[0016] As can be seen from the above technical solution, the beneficial effects of the present invention are as follows: the LED display screen of the present application includes a display module, a heat dissipation frame, and a heat-conducting component including a heat-conducting metal block. The display module is mounted on the heat dissipation frame, and the heat-conducting metal block is in contact with the heat dissipation frame and the light board of the display module, so that the heat of the light board can be transferred to the heat dissipation frame through the heat-conducting metal block and dissipated through the heat dissipation frame. Among them, the provision of the heat-conducting component forms a path for the light board to transfer heat outward between the light board of the display module and the heat dissipation frame, thereby improving the heat dissipation effect of the light board, and further allowing the heat of the light board to be quickly transferred to the outside of the LED display screen to reduce the temperature of the light board, thereby avoiding the problem of the light board overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of an LED display screen in one embodiment.

[0018] Figure 2 yes Figure 1 The cross-sectional structural diagram of the LED display shown in FIG.

[0019] Figure 3 yes Figure 2 A local enlarged schematic diagram at point A.

[0020] Figure 4 yes Figure 2 A partial enlarged schematic diagram at point C.

[0021] Figure 5 This is a schematic diagram of the main structure of an LED display screen in one embodiment.

[0022] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure at BB.

[0023] Figure 7 yes Figure 6 A local enlarged schematic diagram at point D.

[0024] Figure 8 yes Figure 5 The schematic diagram of the exploded structure of the LED display is shown.

[0025] Figure 9 This is a schematic diagram of the connection structure between the thermal conductive silicone sheet and the light board.

[0026] Figure 10 It is a schematic diagram of the connection structure between the heat-conducting metal block and the bottom shell.

[0027] Figure 11 It is a schematic diagram of the connection structure between the graphene heat conductive block and the heat dissipation frame.

[0028] Figure 12This is a schematic diagram of the exploded structure of the power supply components.

[0029] The figure numbers are explained as follows: 1-display module; 11-bottom shell; 111-card slot; 12-mask; 121-clip; 13-lamp board; 131-PCB board; 132-lamp beads; 14-installation cavity; 2-heat dissipation frame; 21-frame, 22-reinforcement rod; 3-heat conductive component; 31-thermal conductive silicone sheet; 32-thermal conductive metal block; 33-graphene thermal conductive block; 4-power supply component; 41-power supply box; 42-power supply component; 43-adapter board; 44-accommodation cavity. DETAILED DESCRIPTION

[0030] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various variations in different embodiments without departing from the scope of the present invention, and that the descriptions and illustrations herein are intended to be illustrative in nature and not to limit the present invention.

[0031] In the description of this application, it should be understood that in the embodiments shown in the drawings, indications of directions or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions will also change accordingly.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0033] See Figures 1 to 7 The lamp board of the existing LED display screen has no outward heat dissipation path and mainly relies on convection with the air to achieve natural heat dissipation. The heat dissipation efficiency is low and the problem of high local temperature cannot be effectively solved. The present application proposes an LED display screen, which includes a display module 1, a heat dissipation frame 2 and a heat conducting component 3. The display module 1 is mounted on the heat dissipation frame 2. The heat conducting component 3 is in contact with the heat dissipation frame 2 and the lamp board 13 located inside the display module 1, so that a heat dissipation path is formed between the lamp board 13, the heat conducting component 3 and the heat dissipation frame 2 for the lamp board 13 to transfer heat outward, thereby improving the heat dissipation effect of the lamp board 13 and preventing the display effect of the LED display screen from being deteriorated due to the high temperature of the lamp board 13.

[0034] See Figures 7 to 9 , the display module 1 includes a base shell 11, a mask 12 and a light board 13. A cavity with an opening on one side is formed on the base shell 11, and the side of the base shell 11 facing away from the opening of the cavity is fixedly connected to the heat dissipation frame 2. The mask 12 is fixed on the base shell 11 and is located at the opening of the cavity, so that the mask 12 blocks the opening of the cavity to form an installation cavity 14 for installing the light board 13. The light board 13 is installed in the installation cavity 14, and the light board 13 is used to display graphic information. In other embodiments, the mask 12 and the base shell 11 are flat, and the light board 13 is arranged between the mask 12 and the base shell 11, so that the mask 12 and the base shell 11 respectively protect the two sides of the light board 13.

[0035] The mask 12 and the bottom shell 11 are both made of plastic structures, which have insulating properties and can also provide good protection for the lamp board 13.

[0036] Among them, the spatial size and shape of the installation cavity 14 are adapted to the size and shape of the light board 13. When the light board 13 is installed inside the installation cavity 14, the light board 13 can fit with the mask 12 and the bottom shell 11, making the overall structure of the display module 1 more compact and smaller in size, effectively reducing the overall weight and making it easier for users to carry.

[0037] exist Figure 7 In the illustrated embodiment, a plurality of through holes are provided on the mask 12 , and the positions of the through holes correspond one-to-one to the positions of the lamp beads 132 of the lamp board 13 , so that light emitted by the lamp beads 132 can pass through the through holes.

[0038] The light board 13 includes a PCB board 131, lamp beads 132 and electronic components (not shown in the figure). The PCB board 131 is fixedly installed inside the bottom shell 11. There are multiple lamp beads 132, and the multiple lamp beads 132 are spaced apart on the side surface of the PCB board 131 facing the mask. The lamp beads 132 pass through the through holes of the mask 12 so that the light emitted by the lamp beads 132 can directly illuminate the outside of the mask 12. The lamp beads 132 are the light-emitting parts of the light board 13, which can be LED lamp beads. The side of the PCB board 131 on which the lamp beads 132 are arranged forms the display surface of the light board 13. The electronic components are arranged on the side of the PCB board 131 away from the lamp beads 132, and the side of the PCB board 131 on which the electronic components are arranged forms the non-display surface of the light board 13.

[0039] The PCB board 131 is provided with a control circuit electrically connected to the lamp beads 132. The electronic components are fixed on the PCB board 131 and electrically connected to the control circuit, thereby realizing the electrical connection between the electronic components and the lamp beads 132. The electronic components can control the operation of the lamp beads 132. Among them, the electronic components are concentratedly arranged at a certain position or multiple positions on the PCB board 131. Figure 9In the embodiment shown, the electronic components are centrally arranged in the middle of the LED display screen in the horizontal direction, so that the weight of the LED display screen is relatively even on both sides in the horizontal direction. In other embodiments, the electronic components can also be centrally arranged in other positions of the LED display screen.

[0040] Specifically, when assembling the display module 1, the light board 13 is first installed on the bottom shell 11, and then potting glue is applied to the side of the PCB board 131 where the lamp beads 132 are provided. The potting glue is an insulating and waterproof material, and after the potting glue solidifies, it at least covers the electrical connection position between the lamp beads 132 and the PCB board 131, so that water droplets cannot enter the electrical connection position between the lamp beads 132 and the PCB board 131, so that the display module 1 can meet the set waterproof requirements. For example: the PCB board 131 is provided with a soldering pad for mounting the lamp beads 132, the soldering pad is exposed on the outer surface of the PCB board 131, the lamp beads 132 are mounted on the soldering pad, and the potting glue at least covers the soldering pad. The potting glue can also cover the entire outer surface of the PCB board 131. Then, the mask 12 is covered, and the mask 12 is fixedly connected to the bottom shell 11, so that the light board 13 is installed in the installation cavity 14 between the mask 12 and the bottom shell 11. Preferably, after the mask 12 is fixedly connected to the bottom shell 11 , the potting glue is in contact with the inner wall surface of the mask 12 to prevent water droplets from entering the installation cavity 14 , thereby improving the sealing performance of the display module 1 .

[0041] In one embodiment, see Figure 4 The mask 12, the bottom shell 11 and the PCB board 131 are all provided with hollow through holes. The positions of the hollow through holes on the mask 12, the bottom shell 11 and the PCB board 131 correspond one to one, so that the hollow through holes can be used for ventilation, light transmission and weight reduction, forming an LED light strip display screen, which is also called a curtain screen.

[0042] Specifically, the hollow through hole on the bottom shell 11 is a first hollow hole, and a slot 111 is provided at the edge of the first hollow hole of the bottom shell 11. The hollow through hole on the mask 12 is a second hollow hole, and the position of the second hollow hole corresponds to the first hollow hole. The mask 12 is provided with a buckle 121 at the edge of the second hollow hole. The buckle 121 extends toward the side close to the bottom shell 11. The buckle 121 passes through the PCB board 131 and snaps into the slot 111 at the edge of the first hollow hole to achieve a fixed connection between the mask 12 and the bottom shell 11. In other embodiments, the mask 12 and the bottom shell 11 can also be connected by screws or adhesive. Among them, air can pass through the second hollow hole and the first hollow hole, so that air forms convection in the first hollow hole and the second hollow hole, thereby improving the heat dissipation efficiency of the display module 1.

[0043] The hollow through hole on the PCB board 131 is the third hollow hole, and the position of the third hollow hole corresponds to the first hollow hole and the second hollow hole, so that the PCB board 131 can be installed in the installation cavity 14 formed by the bottom shell 11 and the mask 12, and pass through the buckle 121, and the display module 1 can achieve air convection at the first hollow hole, the second hollow hole and the third hollow hole.

[0044] In other embodiments, the mask 12 , the bottom shell 11 and the PCB board 131 may not be provided with hollow through holes.

[0045] Multiple display modules 1 are configured, and these multiple display modules 1 form a large-area LED display screen. By configuring multiple display modules 1, when an LED display screen with the same light output area is required, the volume of each display module 1 can be set to be smaller, thereby reducing the weight of each display module 1 and facilitating the production, transportation, and installation of the display modules 1. In other embodiments, only one display module 1 may be provided.

[0046] See Figure 1 、 Figure 6 、 Figure 7 as well as Figure 11 The heat dissipation frame 2 is fixedly connected to the outer surface of the bottom case 11 of the display module 1, thereby securing the multiple display modules 1 together. In other words, the heat dissipation frame 2 connects and supports the installation of the display modules 1. The heat dissipation frame 2 is exposed to the outer surface of the bottom case 11 and is in contact with the ambient air, allowing for rapid heat exchange between the heat dissipation frame 2 and the air, thereby improving the heat dissipation efficiency of the heat dissipation frame 2.

[0047] See Figure 1 The heat dissipation frame 2 includes a frame 21 and a reinforcing rod 22 fixed inside the frame 21. The outer dimensions of the frame 21 are adapted to the outer shape of all display modules 1, so that all display modules 1 can be laid on the frame 21 and connected to the frame 21 and the reinforcing rod 22 to achieve the fixation of the display modules 1.

[0048] The number of the reinforcing rods 22 can be set according to the connection position of the display module 1 and the stress strength requirement of the heat dissipation frame 2 .

[0049] exist Figure 11In the illustrated embodiment, three reinforcing rods 22 are provided, and the upper and lower ends of the reinforcing rods 22 are respectively connected to a set of opposite edges of the frame 21, thereby dividing the heat dissipation frame 2 into four horizontally distributed mounting positions. All display modules 1 are arranged in four columns, and the four columns are respectively arranged in the four horizontally distributed mounting positions. In other embodiments, the number of reinforcing rods 22 can also be set to 1, 2, 3, 5, or more. The reinforcing rods 22 can also divide the heat dissipation frame 2 into multiple mounting positions arranged in multiple rows or columns, or the reinforcing rods 22 can divide the heat dissipation frame 2 into multiple mounting positions arranged in multiple rows and columns.

[0050] In one embodiment, the heat dissipation frame 2 is an aluminum frame or an aluminum alloy frame. Aluminum and aluminum alloys have excellent thermal conductivity, are low cost, and are lightweight. Therefore, the heat dissipation frame 2 is preferably an aluminum frame or an aluminum alloy frame. In other embodiments, the heat dissipation frame 2 may also be a copper frame. Copper has better thermal conductivity than aluminum and aluminum alloys, but copper is more expensive.

[0051] Preferably, the frame 21 and the reinforcing rods 22 are integrally formed, eliminating the need for subsequent assembly and facilitating production. Furthermore, the contact area between the reinforcing rods 22 and the frame 21 is ensured, allowing heat from the heat dissipation frame 2 to be quickly transferred to various locations, thereby enhancing heat dissipation. In this embodiment, the frame 21 and the reinforcing rods 22 are both rod-shaped structures, which are then fixed together by riveting or welding to form the heat dissipation frame 2.

[0052] See Figure 3 、 Figures 7 to 11 The heat-conducting assembly 3 includes a heat-conducting metal block 32, a graphene heat-conducting block 33, and a heat-conducting silicone sheet 31. The heat-conducting metal block 32 passes through the bottom shell 11 and is fixedly connected to the bottom shell 11. The graphene heat-conducting block 33 is arranged between the heat-conducting metal block 32 and the heat-dissipating frame 2, and the two side surfaces of the graphene heat-conducting block 33 are respectively in contact with the heat-conducting metal block 32 and the heat-dissipating frame 2. The heat-conducting silicone sheet 31 is arranged between the heat-conducting metal block 32 and the lamp board 13, and the two side surfaces of the heat-conducting silicone sheet 31 are respectively in contact with the heat-conducting metal block 32 and the lamp board 13. This allows the heat of the lamp board 13 to be transferred to the heat-dissipating frame 2 in sequence through the heat-conducting silicone sheet 31, the heat-conducting metal block 32, and the graphene heat-conducting block 33, and then radiated into the air through the heat-dissipating frame 2, thereby achieving heat dissipation of the lamp board 13. Among them, the heat-dissipating frame 2 has a large area in contact with the external environment, which increases the area of heat radiated by the lamp board 13 to the external environment, thereby improving the heat dissipation efficiency of the lamp board 13.

[0053] A mounting hole communicating with the mounting cavity 14 is formed on the surface of the bottom shell 11 facing the heat dissipation frame 2 . The heat conductive metal block 32 is embedded in the mounting hole to achieve a fixed connection between the heat conductive metal block 32 and the bottom shell 11 .

[0054] Among them, the heat-conducting metal block 32 is an aluminum block or a copper block. Aluminum and aluminum alloys have better thermal conductivity, low cost and light weight. Therefore, the heat-conducting metal block 32 is preferably an aluminum frame or an aluminum alloy frame. In other embodiments, the heat-conducting metal block 32 can also be a copper frame. The thermal conductivity of copper is better than that of aluminum and aluminum alloy, but copper is more expensive. Among them, at least one heat-conducting metal block 32 is provided on the bottom shell 11 of each display module 1, that is, at least one path for the lamp board 13 to transfer heat to the outside is formed between each display module 1 and the heat dissipation frame 2.

[0055] In one embodiment, multiple heat-conducting metal blocks 32 can contact the same graphene heat-conducting block 33, or the graphene heat-conducting block 33 can be configured as multiple blocks, with the multiple heat-conducting metal blocks 32 corresponding one-to-one with and contacting the multiple graphene heat-conducting blocks 33. Similarly, multiple heat-conducting metal blocks 32 can contact the same heat-conducting silicone sheet 31, or the heat-conducting silicone sheet 31 can be configured as multiple blocks, with the multiple heat-conducting metal blocks 32 corresponding one-to-one with and contacting the multiple heat-conducting silicone sheets 31.

[0056] The thermally conductive silicone sheet 31 adheres to the surfaces of the PCB board 131 and electronic components, allowing it to absorb heat from the PCB board 131 and electronic components. This heat is then quickly transferred to the heat dissipation frame 2 via the thermally conductive metal block 32 and the graphene thermal block 33 for dissipation. This prevents the LED display from malfunctioning due to excessive temperature on the light board 13, which could cause power reduction. Electronic components are one of the main heat-generating components in an LED display. Due to the relatively concentrated arrangement of electronic components within the light board 13, localized high temperatures often occur, causing a bluish tint in certain areas of the light board 13, degrading the display quality. In this embodiment, the thermally conductive silicone sheet 31 contacts the surfaces of the PCB board 131 and electronic components. Due to its deformability, the thermally conductive silicone sheet 31 can simultaneously adhere to the surfaces of the PCB board 131 and electronic components, increasing the heat exchange area and improving the heat absorption efficiency of the thermally conductive silicone sheet 31. This prevents the LED display screen from having a high local temperature at the electronic components, thereby preventing the local position of the light board 13 from turning blue. In other embodiments, the thermally conductive silicone sheet 31 may also only contact the PCB board 131 or the electronic components.

[0057] The graphene heat conducting block 33 is attached to the heat dissipation frame 2, and the side facing away from the heat dissipation frame 2 is attached to the heat conducting metal block 32, so that the heat on the heat conducting metal block 32 can be transferred to the heat dissipation frame 2 through the graphene heat conducting block 33, and heat is exchanged with the air in the environment through the heat dissipation frame 2. Figure 11In the illustrated embodiment, the graphene heat-conducting block 33 is bonded to the reinforcing rod 22, so that after the heat from the light panel 13 is transferred to the reinforcing rod 22, it can be simultaneously diffused to the surrounding frame 21, thereby improving the heat dissipation effect. In other embodiments, the graphene heat-conducting block 33 can also be bonded to the frame 21, or bonded to both the reinforcing rod 22 and the frame 21.

[0058] Preferably, the graphene heat conductive block 33 is attached to the heat dissipation frame 2 using thermally conductive adhesive, and a gap is avoided between the graphene heat conductive block 33 and the heat dissipation frame 2 to increase the contact area between the graphene heat conductive block 33 and the heat dissipation frame 2 and improve the heat transfer efficiency. The graphene heat conductive block 33 and the heat conductive metal block 32 can also be bonded using thermally conductive adhesive to avoid a gap between the graphene heat conductive block 33 and the heat dissipation frame 2.

[0059] The graphene heat conductive block 33 has a high thermal conductivity, which improves the efficiency of the lamp board 13 transferring heat to the heat dissipation frame 2 through the heat conductive silicone sheet 31 , the heat conductive metal block 32 , and the graphene heat conductive block 33 .

[0060] In one embodiment, the graphene heat conducting block 33 is a graphene heat conducting sheet that can be bent to adapt to different shapes of bonding surfaces. For example, the surface of the heat dissipation frame 2 that is bonded to the graphene heat conducting block 33 can be flat or curved.

[0061] The graphene thermal block 33 is graphene thermal cotton, which is elastic, so that the graphene thermal cotton can fit with a flat or curved surface, that is, the graphene thermal block 33 and the heat dissipation frame 2 can be in a completely fitted state, thereby improving the heat transfer effect between the two.

[0062] In one embodiment, the thermally conductive assembly 3 includes only the thermally conductive metal block 32 and the graphene thermally conductive block 33; that is, the thermally conductive assembly 3 does not include the thermally conductive silicone sheet 31. In this embodiment, the thermally conductive metal block 32 contacts the heat dissipation frame 2 via the graphene thermally conductive block 33. The side of the thermally conductive metal block 32 facing away from the graphene thermally conductive block 33 contacts the lamp board 13, allowing heat from the lamp board 13 to be transferred to the heat dissipation frame 2 via the thermally conductive metal block 32 and the graphene thermally conductive block 33.

[0063] In one embodiment, the thermally conductive assembly 3 includes only a thermally conductive metal block 32 and a thermally conductive silicone sheet 31; that is, the thermally conductive assembly 3 does not include a graphene thermally conductive block 33. In this embodiment, the thermally conductive metal block 32 contacts the light board 13 via the thermally conductive silicone sheet 31. The side of the thermally conductive metal block 32 facing away from the thermally conductive silicone sheet 31 contacts the heat dissipation frame 2, allowing heat from the light board 13 to be transferred to the heat dissipation frame 2 through the thermally conductive silicone sheet 31 and the thermally conductive metal block 32.

[0064] In one embodiment, the thermal conductive component 3 only includes a thermal conductive metal block 32, and the two side surfaces of the thermal conductive metal block 32 are in contact with the lamp board 13 and the heat dissipation frame 2 respectively, so that the heat on the lamp board 13 can be directly transferred to the heat dissipation frame 2 through the thermal conductive metal block 32.

[0065] See Figure 1 、 Figure 6 、 Figure 8 as well as Figure 12 In one embodiment, the LED display screen further includes a power supply assembly 4, which is fixed to the side of the heat dissipation frame 2 facing away from the display module 1. The outer dimensions of the power supply assembly 4 are smaller than those of the heat dissipation frame 2, so that at least part of the heat dissipation frame 2 can be in direct contact with the air, so that the heat on the heat dissipation frame 2 can be directly radiated into the air to achieve heat dissipation.

[0066] The power supply assembly 4 includes a power box 41, an adapter plate 43 and a power supply unit 42. The power box 41 is fixed on the heat dissipation frame 2, and a receiving cavity 44 is formed between the power box 41 and the heat dissipation frame 2. The adapter plate 43 and the power supply unit 42 are installed in the receiving cavity 44, and the adapter plate 43 contacts the heat dissipation frame 2 so that the heat of the adapter plate 43 can be dissipated through the heat dissipation frame 2. The power supply unit 42 contacts the power box 41 so that the heat of the power supply unit 42 can be dissipated through the power box 41. Figure 1 In the embodiment shown, the power supply box 41 is fixed on the reinforcing rod 22 of the heat dissipation frame 2. In other implementations, the power supply box 41 can also be fixed on the frame 21 of the heat dissipation frame 2.

[0067] The adapter plate 43 is fixedly connected to the reinforcing rod 22 and electrically connected to the light board 13. The power supply 42 is fixed to the power box 41 and electrically connected to the adapter plate 43. The adapter plate 43 and the power supply 42 are also one of the main heat-generating components of the LED display. By fixing the adapter plate 43 to the reinforcing rod 22, the adapter plate 43 can directly transfer heat to the heat dissipation frame 2 for heat dissipation.

[0068] In one embodiment, heat dissipation fins are provided on the power box 41, the power supply component 42 is fixed on the power box 41, and at least part of the outer surface of the power supply component 42 is in contact with the power box 41, so that the heat on the power supply component 42 can be radiated into the air through the heat dissipation fins on the power box 41 to achieve heat dissipation of the power supply component 42.

[0069] In one embodiment, the power supply 42 is in contact with the adapter plate 43 , so that the heat of the power supply 42 can also be transferred to the heat dissipation frame 2 through the adapter plate 43 for heat dissipation, thereby improving the heat dissipation effect of the power supply 42 .

[0070] The LED display screen of the present application includes a display module 1, a heat dissipation frame 2, and a heat-conducting assembly 3 including a heat-conducting metal block 32. The display module is mounted on the heat dissipation frame 2. The heat-conducting metal block 32 is in contact with the heat dissipation frame 2 and the light board 13 of the display module 1, so that the heat of the light board 13 can be transferred to the heat dissipation frame 2 through the heat-conducting metal block 32 and dissipated through the heat dissipation frame 2. Particularly, the provision of the heat-conducting assembly 3 forms a path for the light board 13 of the display module 1 to transfer heat outward between the light board 13 and the heat dissipation frame 2, thereby improving the heat dissipation effect of the light board 13 and enabling the heat of the light board 13 to be quickly transferred to the outside of the LED display screen to reduce the temperature of the light board 13 and avoid the problem of the light board 13 overheating.

[0071] While the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope of the appended claims. Therefore, all changes and modifications that fall within the scope of the claims or their equivalents are intended to be covered by the appended claims.

Claims

1. An LED display screen, characterized in that: include: A display module includes a light board for displaying graphic information; a heat dissipation frame, on which the display module is mounted; The heat-conducting component includes a heat-conducting metal block, which is arranged in contact between the lamp board and the heat dissipation frame, so that the heat of the lamp board can be transferred to the heat dissipation frame through the heat-conducting metal block and dissipated to the external environment through the heat dissipation frame.

2. The LED display screen according to claim 1, characterized in that: The heat-conducting assembly further includes a graphene heat-conducting block, which is disposed between the heat-conducting metal block and the heat-dissipating frame, and the graphene heat-conducting block is in contact with both the heat-conducting metal block and the heat-dissipating frame.

3. The LED display screen according to claim 1 or 2, characterized in that: The heat-conducting component further includes a heat-conducting silicone sheet, which is arranged between the heat-conducting metal block and the lamp board, and the heat-conducting silicone sheet is in contact with both the heat-conducting metal block and the lamp board.

4. The LED display screen according to claim 3, characterized in that: The light board includes a display surface and a non-display surface, the display surface is used to display graphic information, and the non-display surface is arranged in contact with the thermally conductive silicone sheet.

5. The LED display screen according to claim 4, characterized in that: The display module also includes a bottom shell and a mask. The bottom shell is connected to the heat dissipation frame. The mask is fixedly connected to the side of the bottom shell facing away from the heat dissipation frame. The light board is arranged between the mask and the bottom shell, and the display surface faces the mask.

6. The LED display screen according to claim 5, characterized in that: A mounting hole is formed on the surface of the bottom shell facing the heat dissipation frame, and the heat-conducting metal block is embedded in the mounting hole.

7. The LED display screen according to claim 5, characterized in that: The bottom shell is provided with a first hollow hole, the mask is provided with a second hollow hole, and the light panel is provided with a third hollow hole. The second hollow hole and the third hollow hole correspond to the positions of the first hollow hole, and external air can pass through the second hollow hole, the third hollow hole and the first hollow hole. A clamping slot is provided at the edge of the first hollow hole, and a buckle is provided at the edge of the second hollow hole. The buckle passes through the third hollow hole and is buckled with the clamping slot.

8. The LED display screen according to claim 1, characterized in that: There are multiple display modules, and the multiple display modules are all arranged on the heat dissipation frame; The heat dissipation frame includes a frame and at least one reinforcing rod formed inside the frame, and the outer dimensions of the frame are adapted to the outer shape of all the display modules; The heat conducting component is in contact with the reinforcing rod.

9. The LED display screen according to claim 1, characterized in that: The LED display screen also includes a power supply component, which is fixed on the side of the heat dissipation frame away from the display module. The outer dimensions of the power supply component are smaller than the outer dimensions of the heat dissipation frame, so that at least part of the heat dissipation frame can be in direct contact with the air for heat dissipation.

10. The LED display screen according to claim 9, characterized in that: The power supply assembly includes a power box, an adapter plate and a power supply component. The power box is fixed on the heat dissipation frame, and an accommodating cavity is formed between the power box and the heat dissipation frame. The adapter plate and the power supply component are both installed in the accommodating cavity, and the adapter plate is in contact with the heat dissipation frame so that the heat of the adapter plate can be dissipated through the heat dissipation frame. The power supply component is in contact with the power box so that the heat of the power supply component can be dissipated through the power box.

Images