Display panel and display device

By introducing partitions and limiting parts into the Micro-LED display panel, the problem of high short circuit risk after the Micro-LED size is reduced is solved, and the preparation yield and reliability of the display panel are improved.

CN223207472UActive Publication Date: 2025-08-08CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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Patent Information

Application Number
CN202422356341.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-26
Publication Date
2025-08-08
Estimated Expiration
2034-09-26

AI Technical Summary

Technical Problem

As the size of Micro-LED is reduced, short circuits are prone to occur when the Micro-LED is connected to the driver backplane, which affects the preparation yield of the display panel.

Method used

The partition part is introduced into the display panel, and the partition part is arranged layered by a plurality of sub-layers to prevent the first electrical connection part from contacting the second electrical connection part, reduce the risk of short circuit, and support the light emitting device through the limiting part and the bearing surface to improve the accuracy and reliability of the preparation process.

Benefits of technology

It effectively reduces the risk of short circuit in the Micro-LED display panel during the preparation process and the damage to the conductive film layer in the etched substrate, and improves the preparation yield of the display panel.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a display panel and a display device. The display panel comprises a substrate, a first conductive layer, a second conductive layer and a light emitting device. The first conductive layer is arranged on one side of the substrate and comprises a first electric contact part and a second electric contact part which are arranged at an interval. The second conductive layer is arranged on the side, away from the substrate, of the first conductive layer and comprises a first electric connection part and a second electric connection part. The light-emitting device is arranged on the substrate and comprises a first electrode and a second electrode, the first electrode is electrically connected with the first electric contact part through the first electric connection part, and the second electrode is electrically connected with the second electric contact part through the second electric connection part. Wherein a partition part is arranged between the first electric connection part and the second electric connection part, the partition part comprises a plurality of sub-layers which are arranged in a stacked mode, and at least one of the first electric contact part and the second electric contact part forms part of the sub-layers. The preparation yield of the display panel can be improved.
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Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a display panel and a display device. Background Art

[0002] As indoor display application technology continues to improve, the current display application products can no longer fully meet market application needs. There are still some defects in various aspects that prevent them from breaking through technological development. However, LED (Light-Emitting Diode) full-color display screens have overcome many of the defects of these products and have become the first choice for indoor and outdoor large-screen displays, such as command centers, outdoor advertising screens, conference centers, etc.

[0003] Small-pitch sub-millimeter light-emitting diode (Mini LED) and micro-light-emitting diode (Micro-LED) direct displays are gradually being developed and entering the market. With the development of the times, people's requirements for display quality are gradually increasing, and the pitch is getting smaller and smaller. Consequently, the size of LEDs must be gradually reduced. Conventional Mini LED sizes are gradually unable to meet these requirements. When LED size is reduced to a certain extent, improving the production yield of LEDs has become a research direction in display panel technology. Utility Model Content

[0004] Embodiments of the present application provide a display panel and a display device, which can improve the manufacturing yield of the display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel. The display panel includes a substrate, a first conductive layer, a second conductive layer, and a light-emitting device. The first conductive layer is arranged on one side of the substrate and includes a first electrical contact portion and a second electrical contact portion arranged at intervals. The second conductive layer is arranged on a side of the first conductive layer away from the substrate and includes a first electrical connection portion and a second electrical connection portion. The light-emitting device is arranged on the substrate, and the light-emitting device includes a first electrode and a second electrode, the first electrode is electrically connected to the first electrical contact portion through the first electrical connection portion, and the second electrode is electrically connected to the second electrical contact portion through the second electrical connection portion. A partition portion is provided between the first electrical connection portion and the second electrical connection portion, and the partition portion includes a plurality of sublayers arranged in a stacked manner, and at least one of the first electrical contact portion and the second electrical contact portion forms a partial sublayer.

[0006] In some embodiments, a side of the partition portion facing away from the substrate is in contact with a surface of a side of the light-emitting device facing the substrate.

[0007] In some embodiments, the plurality of sublayers include a first sublayer, a second sublayer, and a third sublayer, the second sublayer being disposed on a side of the first sublayer facing away from the substrate, the third sublayer at least partially covering the second sublayer, and at least one of the first electrical contact portion and the second electrical contact portion extending along the first sublayer to form the second sublayer;

[0008] In some embodiments, a side of the third sublayer facing away from the substrate is in contact with a surface of the light-emitting device facing the substrate.

[0009] In some embodiments, the second sub-layer includes a first sub-portion and a second sub-portion, the first sub-portion is connected to the first electrical contact portion, the second sub-portion is connected to the second electrical contact portion, the third sub-layer covers the first sub-portion, and at least one of the second sub-portions is facing away from the side of the substrate.

[0010] In some embodiments, the first sub-portion and the second sub-portion are spaced apart, and the third sub-layer covers a portion of the first sub-layer that faces away from the substrate and is not covered by the first sub-portion and the second sub-portion.

[0011] In some embodiments, the third sublayer includes a first covering portion and a second covering portion, the first covering portion covers at least one of the first sub-portion and the second sub-portion, the second covering portion is the portion of the first sublayer facing away from the substrate and not covered by the first sub-portion and the second sub-portion, and the distance between the side of the first covering portion facing away from the substrate and the substrate is greater than the distance between the side of the second covering portion facing away from the substrate and the substrate.

[0012] In some embodiments, the partition portion includes a first sub-partition portion, a second sub-partition portion, and a groove located between the first sub-partition portion and the second sub-partition portion, the first sub-partition portion and the second sub-partition portion are both arranged in contact with the surface of the light-emitting device facing the substrate, and the first sub-partition portion and the second sub-partition portion both include the first sub-layer, the second sub-layer, and the third sub-layer.

[0013] In some embodiments, the substrate further includes a limiting portion, which is arranged around the light-emitting device, and the distance between the side surface of the limiting portion facing away from the substrate and the substrate is greater than the distance between the side surface of the partition portion facing away from the substrate and the substrate.

[0014] In some embodiments, the limiting portion includes a multi-layer structure stacked together, and at least one of the first electrical contact portion and the second electrical contact portion forms a portion of the layer structure.

[0015] In some embodiments, the layer structure includes a first layer structure, a second layer structure and a third layer structure, the second layer structure is arranged on the side of the first layer structure facing away from the substrate, the third layer structure at least covers a portion of the second layer structure, and at least one of the first electrical contact portion and the second electrical contact portion extends along the first layer structure to form the second layer structure.

[0016] In some embodiments, a supporting surface is provided on the side of the first structure layer, the second structure layer, and the third structure layer facing away from the substrate, and a portion of the surface of the light-emitting device is overlapped with the supporting surface.

[0017] In a second aspect, an embodiment of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0018] Embodiments of the present application provide a display panel and a display device, wherein the display panel includes a substrate, a first conductive layer, a second conductive layer, and a light-emitting device. A first electrode of the light-emitting device is electrically connected to a first electrical contact portion via a first electrical connection portion, and a second electrode is electrically connected to a second electrical contact portion via a second electrical connection portion. A partition portion is provided between the first electrical connection portion and the second electrical connection portion. The partition portion can reduce the risk of contact between the first electrical connection portion and the second electrical connection portion, thereby causing a short circuit. Furthermore, one or both of the first electrical contact portion and the second electrical contact portion are used to form a portion of the partition portion, thereby reducing the risk of etching material of the first conductive layer etching the conductive film layer within the substrate during the patterning process, thereby improving the manufacturing yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 is a schematic diagram of a top view of a display panel provided in an embodiment of the present application;

[0021] Figure 2 yes Figure 1 Schematic diagram of the enlarged structure of P;

[0022] Figure 3 yes Figure 2 A schematic diagram of a cross-sectional structure of AA;

[0023] Figure 4 yes Figure 2 Another cross-sectional structural diagram of AA;

[0024] Figure 5 yes Figure 2Another cross-sectional structural diagram of AA;

[0025] Figure 6 yes Figure 2 Another cross-sectional structural diagram of AA;

[0026] Figure 7 yes Figure 2 Another cross-sectional structural diagram of AA;

[0027] Figure 8 1 is a schematic diagram of a top view of a display device provided in an embodiment of the present application.

[0028] Marking Description:

[0029] 100. Display panel; 200. Display device;

[0030] 10. Substrate;

[0031] 20. First conductive layer; 21. First electrical contact portion; 211. First body portion; 212. First extension portion; 213. Third extension portion; 22. Second electrical contact portion; 221. Second body portion; 222. Second extension portion; 223. Fourth extension portion;

[0032] 30. Second conductive layer; 31. First electrical connection portion; 32. Second electrical connection portion;

[0033] 40. Light-emitting device; 41. First electrode; 42. Second electrode;

[0034] 50. Partitioning portion; 51. First sublayer; 52. Second sublayer; 521. First subsection; 522. Second subsection; 53. Third sublayer; 531. First covering portion; 532. Second covering portion; 54. First sub-partitioning portion; 55. Second sub-partitioning portion; 56. Groove;

[0035] 60. Limiting portion; 61. First layer structure; 62. Second layer structure; 63. Third layer structure; 64. Bearing surface. DETAILED DESCRIPTION

[0036] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0037] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0038] Micro-LEDs offer advantages such as small size, energy efficiency, a wide color gamut, and long lifespan. With the maturation of manufacturing processes and falling prices, the number of Micro-LED-related products has increased significantly in recent years. However, as LED size decreases, the distance between the positive and negative electrodes of Micro-LEDs decreases, making them more susceptible to short circuits when connected to the driver backplane, thus affecting the yield rate of display panel production.

[0039] Figure 1 This is a schematic diagram of a top view of the structure of a display panel provided in an embodiment of the present application. Figure 2 yes Figure 1 Schematic diagram of the enlarged structure of P. Figure 3 yes Figure 2 Schematic diagram of a cross-sectional structure of AA.

[0040] In view of this, first of all, please refer to Figures 1 to 3 The embodiment of the present application provides a display panel 100. The display panel 100 includes a substrate 10, a first conductive layer 20, a second conductive layer 30, and a light-emitting device 40. The first conductive layer 20 is provided on one side of the substrate 10 and includes a first electrical contact portion 21 and a second electrical contact portion 22 that are spaced apart. The second conductive layer 30 is provided on the side of the first conductive layer 20 that is away from the substrate 10 and includes a first electrical connection portion 31 and a second electrical connection portion 32. The light-emitting device 40 is provided on the substrate 10, and the light-emitting device 40 includes a first electrode 41 and a second electrode 42. The first electrode 41 is electrically connected to the first electrical contact portion 21 through the first electrical connection portion 31, and the second electrode 42 is electrically connected to the second electrical contact portion 22 through the second electrical connection portion 32. A partition portion 50 is provided between the first electrical connection portion 31 and the second electrical connection portion 32. The partition portion 50 includes a plurality of sub-layers that are stacked, and at least one of the first electrical contact portion 21 and the second electrical contact portion 22 forms a partial sub-layer.

[0041] Optionally, the substrate 10 includes, but is not limited to, a PCB (Printed Circuit Board) substrate, a TFT (Thin Film Transistor) glass substrate, an FPC (Flexible Printed Circuit) substrate, and the like. Optionally, the substrate 10 may include a drive circuit. The light-emitting device 40 is electrically connected to the drive circuit via the second conductive layer 30 and the first conductive layer 20. The drive circuit is capable of driving the light-emitting device 40 to emit light.

[0042] The light-emitting device 40 can be configured in various ways. For example, the light-emitting device 40 can be a Micro-LED or MiniLED. The color of the light-emitting device 40 can be configured in various ways. When the light-emitting device 40 is used to implement the display function of the display panel 100, the light-emitting device 40 can include a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit. When the light-emitting device 40 is used as a backlight source for the display panel 100, the light-emitting device 40 can function as a light source and emit white light.

[0043] Optionally, the display panel 100 further includes an encapsulation layer, and the encapsulation layer is used to encapsulate the light-emitting device 40 .

[0044] Optionally, a plurality of light emitting accommodating areas are provided on the substrate 10, each of which is provided with a first electrical contact portion 21 and a second electrical contact portion 22, and each light emitting accommodating area can accommodate one or more light emitting devices 40. Optionally, the plurality of light emitting accommodating areas are arranged in an array.

[0045] Optionally, the orthographic projection of the first electrical connection portion 31 on the substrate 10 is located within the orthographic projection of the first electrical contact portion 21 on the substrate 10 .

[0046] Optionally, the orthographic projection of the second electrical connection portion 32 on the substrate 10 is located within the orthographic projection of the second electrical contact portion 22 on the substrate 10 .

[0047] Optionally, the material of the first electrical connection portion 31 and the second electrical connection portion 32 includes tin (Sn).

[0048] Optionally, the material of the first conductive layer 20 and the material of the second conductive layer 30 may be different, or they may be the same.

[0049] Optionally, one of the first electrode 41 and the second electrode 42 is a positive electrode, and the other is a negative electrode. For example, the first electrode 41 is a positive electrode, and the second electrode 42 is a negative electrode.

[0050] Optionally, the light emitting device 40 may include a lower surface, where the lower surface is a surface of the light emitting device 40 facing the substrate 10 , and the first electrode 41 and the second electrode 42 are disposed on the lower surface.

[0051] Optionally, the partition portion 50 may be disposed in contact with the lower surface of the light emitting device 40 . Alternatively, a gap may be provided between the partition portion 50 and the lower surface of the light emitting device 40 .

[0052] An embodiment of the present application provides a display panel 100. The display panel 100 includes a substrate 10, a first conductive layer 20, a second conductive layer 30, and a light-emitting device 40. The first electrode 41 of the light-emitting device 40 is electrically connected to the first electrical contact portion 21 through the first electrical connection portion 31, and the second electrode 42 is electrically connected to the second electrical contact portion 22 through the second electrical connection portion 32. A partition portion 50 is provided between the first electrical connection portion 31 and the second electrical connection portion 32. The partition portion 50 can prevent the first electrical connection portion 31 from contacting the second electrical connection portion 32, thereby preventing the risk of a short circuit. In addition, one or both of the first electrical contact portion 21 and the second electrical contact portion 22 form a portion of the partition portion 50 by extending to the location of the partition portion 50, which helps to reduce the risk of the etching material of the first conductive layer 20 etching the driving circuit in the substrate 10 during the patterning process, thereby improving the production yield of the display panel 100.

[0053] Figure 4 yes Figure 2 Another cross-sectional structural diagram of AA. Figure 5 yes Figure 2 Another cross-sectional structural diagram of AA.

[0054] In some optional embodiments, see Figures 3 to 5 The side of the partition portion 50 facing away from the substrate 10 is in contact with the surface of the light emitting device facing the substrate 10 .

[0055] Exemplarily, the side of the partition portion 50 facing away from the substrate 10 can be the top surface of the partition portion 50, and the surface of the light-emitting device facing the substrate 10 can be the lower surface of the light-emitting device. The top surface of the partition portion 50 and the lower surface of the light-emitting device are arranged in contact with each other, so that the top surface of the partition portion 50 can support the light-emitting device, thereby reducing the possibility of the light-emitting device being offset during the welding process with the substrate 10 and improving the production yield.

[0056] In some optional embodiments, see Figures 3 to 5 The multiple sublayers include a first sublayer 51, a second sublayer 52 and a third sublayer 53. The second sublayer 52 is arranged on the side of the first sublayer 51 facing away from the substrate 10. The third sublayer 53 at least covers a portion of the second sublayer 52. At least one of the first electrical contact portion 21 and the second electrical contact portion 22 extends to the side of the first sublayer 51 facing away from the substrate 10 to form the second sublayer 52.

[0057] Optionally, the first sublayer 51, the second sublayer 52 and the third sublayer 53 can be three sublayers with the same thickness; or, the thickness of the first sublayer 51 is greater than the thickness of the second sublayer 52, thereby reducing the preparation material of the second sublayer 52, reducing the manufacturing cost of the second sublayer 52, and increasing the overall thickness of the partition portion 50; or, the thickness of the third sublayer 53 is greater than the thickness of the second sublayer 52, so that the third sublayer 53 can protect the conductive layer in the second sublayer 52 and reduce the possibility of water vapor corroding the conductive layer in the second sublayer 52.

[0058] Optionally, the first electrical contact portion 21 may include a first main portion 211 and a first extension portion 212. The first main portion 211 is electrically connected to the first electrical connection portion 31, and the first extension portion 212 is electrically connected to the first main portion 211. The first extension portion 212 extends to a side of the first sub-layer 51 facing away from the substrate 10, so that the first extension portion 212 forms the second sub-layer 52. Optionally, the first sub-layer 51 protrudes from a surface of the first main portion 211 facing away from the substrate 10 in a direction away from the substrate 10. The first extension portion 212 is located on the side of the first sub-layer 51 facing away from the substrate 10. The distance between the first extension portion 212 and the substrate 10 is greater than the distance between the first main portion 211 and the substrate 10.

[0059] Optionally, the second electrical contact portion 22 may include a second main portion 221 and a second extension portion 222. The second main portion 221 is electrically connected to the second electrical connection portion 32, the second extension portion 222 is electrically connected to the second main portion 221, and the second extension portion 222 extends to a side of the first sub-layer 51 facing away from the substrate 10, so that the second extension portion 222 forms a second sub-layer 52. Optionally, the second sub-layer 52 protrudes from a surface of the second main portion 221 facing away from the substrate 10, the second extension portion 222 is located on the side of the second sub-layer 52 facing away from the substrate 10, and the distance between the second extension portion 222 and the substrate 10 is greater than the distance between the second main portion 221 and the substrate 10.

[0060] Optionally, a side surface of the first extending portion 212 facing away from the substrate 10 and a side surface of the second extending portion 222 facing away from the substrate 10 may be flush.

[0061] In some embodiments, a side of the third sub-layer 53 facing away from the substrate is in contact with a surface of the light-emitting device 40 facing the substrate 10 .

[0062] In some embodiments, as Figure 4 As shown, a portion of the first electrical contact portion 21 (the first extension portion 212) extends to the side of the first sub-layer 51 facing away from the substrate 10 to form the second sub-layer 52. In other embodiments, such as Figure 5As shown, a portion of the second electrical contact portion 22 (the second extension portion 222) extends to the side of the first sub-layer 51 facing away from the substrate 10 to form the second sub-layer 52. In some other embodiments, such as Figure 3 As shown, a portion of the first electrical contact portion 21 (the first extension portion 212) and a portion of the second electrical contact portion 22 (the second extension portion 222) both extend to the side of the first sub-layer 51 facing away from the substrate 10 to form the second sub-layer 52. It can be understood that Figure 4 and Figure 5 The second sub-layer 52 is formed by a portion of the first electrical contact portion 21 (eg Figure 4 as shown) or formed by a portion of the second electrical contact portion 22 (as shown Figure 5 As shown). The second sub-layer 52 may only cover a portion of the surface of the first sub-layer 51 facing away from the substrate 10, and the third sub-layer 53 covers the area of the surface of the first sub-layer 51 facing away from the substrate 10 that is not covered by the second sub-layer 52, thereby reducing the possibility of a short circuit between the first electrical contact portion 21 and the second electrical contact portion 22. For example, as Figure 4 As shown, the first extension portion 212 of the first electrical contact portion 21 covers a portion of the surface of the first sub-layer 51 on the side facing away from the substrate 10, and a portion of the third sub-layer 53 covers the area of the surface of the first sub-layer 51 on the side facing away from the substrate 10 that is not covered by the first extension portion 212, so that the first extension portion 212 and the second electrical contact portion 22 are isolated by the third sub-layer 53, thereby reducing the possibility of a short circuit between the first extension portion 212 and the second electrical contact portion 22. Figure 5 As shown, the second extension portion 222 of the second electrical contact portion 22 covers a portion of the surface of the first sub-layer 51 on the side facing away from the substrate 10, and a portion of the third sub-layer 53 covers an area of the surface of the first sub-layer 51 on the side facing away from the substrate 10 that is not covered by the second extension portion 222, so that the second extension portion 222 and the first electrical contact portion 21 are isolated from each other by the third sub-layer 53, thereby reducing the possibility of a short circuit between the second extension portion 222 and the first electrical contact portion 21.

[0063] In these optional embodiments, the first conductive layer 20 is formed into the second sublayer 52 of the partition portion 50, so that the third sublayer 53 can protect the first conductive layer 20 to reduce the corrosion of the first conductive layer 20 by water vapor. At the same time, the first sublayer 51 protects the first conductive layer 20 and the conductive film layer in the substrate 10, thereby reducing the risk of damage to the driving circuit in the substrate 10 due to over-engraving of the first conductive layer 20 during the preparation process.

[0064] In some optional embodiments, see Figure 3The second sub-layer 52 includes a first sub-portion 521 and a second sub-portion 522. The first sub-portion 521 is connected to the first electrical contact portion 21, and the second sub-portion 522 is connected to the second electrical contact portion 22. The third sub-layer 53 covers the first sub-portion 521. At least one of the second sub-portion 522 faces away from the side of the substrate 10.

[0065] In some embodiments, a portion of the first electrical contact portion 21 (the first extension portion 212) extends to the side of the first sub-layer 51 facing away from the substrate 10 to form a first sub-portion 521 of the second sub-layer 52. A portion of the second electrical contact portion 22 (the second extension portion 222) extends to the side of the first sub-layer 51 facing away from the substrate 10 to form a second sub-portion 522 of the second sub-layer 52.

[0066] Optionally, the third sublayer 53 may cover only the side of the first subsection 521 facing away from the substrate 10. Alternatively, the third sublayer 53 may cover only the side of the second subsection 522 facing away from the substrate 10. Alternatively, both the side of the first subsection 521 facing away from the substrate 10 and the side of the second subsection 522 facing away from the substrate 10 are covered by the third sublayer 53.

[0067] In some embodiments, the first sub-section 521 and the second sub-section 522 are spaced apart, and the third sub-layer 53 covers the portion of the first sub-layer 51 facing away from the substrate 10 and not covered by the first sub-section 521 and the second sub-section 522, so as to further improve the reliability of the mutual insulation between the first sub-section 521 and the second sub-section 522.

[0068] In some optional embodiments, see Figure 3 The third sub-layer 53 includes a first covering portion 531 and a second covering portion 532. The first covering portion 531 covers at least one of the first sub-portion 521 and the second sub-portion 522. The second covering portion 532 covers the portion of the first sub-layer 51 that is facing away from the substrate 10 and is not covered by the first sub-portion 521 and the second sub-portion 522. The distance between the side of the first covering portion 531 facing away from the substrate 10 and the substrate 10 is greater than the distance between the side of the second covering portion 532 facing away from the substrate 10 and the substrate 10.

[0069] Illustratively, the first covering portion 531 includes two first covering portions 531, one covering portion 531 covering a side of the first sub-portion 521 facing away from the substrate 10, and the other covering portion 531 covering a side of the second sub-portion 522 facing away from the substrate 10. Alternatively, the first covering portion 531 covers only a side of the first sub-portion 521 facing away from the substrate 10. Alternatively, the first covering portion 531 covers only a side of the second sub-portion 522 facing away from the substrate 10.

[0070] Exemplarily, the first sub-portion 521 and the second sub-portion 522 of the second sub-layer 52 are spaced apart, and the surface of the first sub-layer 51 facing away from the substrate 10 is exposed in the spaced area between the first sub-portion 521 and the second sub-portion 522, and the second covering portion 532 covers the spaced area between the first sub-portion 521 and the second sub-portion 522.

[0071] Optionally, the first covering portion 531 and the second covering portion 532 may be connected.

[0072] Optionally, the first covering portion 531 is disposed in contact with the lower surface of the light emitting device 40 , and a gap is provided between the second covering portion 532 and the lower surface of the light emitting device 40 .

[0073] Optionally, the thickness of the first covering portion 531 and the thickness of the second covering portion 532 may be the same.

[0074] In these optional embodiments, the first covering portion 531 can support the light emitting device, thereby reducing the possibility of the light emitting device being tilted during the transfer process.

[0075] Figure 6 yes Figure 2 Another cross-sectional structural diagram of AA.

[0076] In some optional embodiments, see Figure 6 The partition portion 50 includes a first sub-partition portion 54, a second sub-partition portion 55, and a groove 56 located between the first sub-partition portion 54 and the second sub-partition portion 55. The first sub-partition portion 54 and the second sub-partition portion 55 are both arranged in contact with the surface of the light-emitting device 40 facing the substrate 10, and the first sub-partition portion 54 and the second sub-partition portion 55 both include a first sub-layer 51, a second sub-layer 52 and a third sub-layer 53.

[0077] It is understood that the first sub-partition portion 54 and the second sub-partition portion 55 are located between the same light-emitting device 40 and the substrate 10. The bottom surface of the groove 56 between the first sub-partition portion 54 and the second sub-partition portion 55 can be the surface of the substrate 10. Alternatively, the bottom surface of the groove 56 can also be the surface of a sublayer in the partition portion 50, for example, the bottom surface of the groove 56 can be the surface of the first sublayer 51.

[0078] Optionally, a side surface of the first sub-partition portion 54 facing away from the substrate 10 and a side surface of the second sub-partition portion 55 facing away from the substrate 10 are arranged flush.

[0079] Optionally, the third sublayer 53 in the first sub-partitioning portion 54 may be an undercut structure, for example, the cross-section of the third sublayer 53 may be T-shaped. The second sublayer 52 is located on a side of the third sublayer 53 facing the first electrical connection portion 31 .

[0080] Optionally, the third sublayer 53 in the second sub-partitioning portion 55 may be an undercut structure, for example, the cross-section of the third sublayer 53 may be T-shaped. The second sublayer 52 is located on a side of the third sublayer 53 facing the second electrical connection portion 32 .

[0081] In these optional embodiments, the first sub-partition portion 54 and the second sub-partition portion 55 can support the light-emitting device 40, thereby reducing the possibility of the light-emitting device 40 tilting during the transfer process. The groove 56 can reduce the possibility that the material of the second conductive layer 30 overflows into the groove 56 due to operational errors during the preparation process of the second conductive layer 30, thereby causing a short circuit between the first electrical contact portion 21 and the second electrical contact portion 22.

[0082] In some optional embodiments, the material of the first sublayer 51 is an inorganic material, and the material of the third sublayer 53 is an organic material. The material selected for the first sublayer 51 can increase the overall height of the partition portion 50 while reducing the manufacturing cost of the partition portion 50. The material selected for the third sublayer 53 can reduce the possibility of the first electrical contact portion 21 and the second electrical contact portion 22 being corroded by water vapor, and reduce the possibility of the conductive materials in the first electrical contact portion 21 and the second electrical contact portion 22 being close to each other, thereby causing a short circuit between the first electrical contact portion 21 and the second electrical contact portion 22.

[0083] Optionally, the material of the first sub-layer 51 is silicon nitride or silicon oxide.

[0084] Optionally, the material of the third sub-layer 53 is polyimide.

[0085] Optionally, the material of the second sub-layer 52 is copper.

[0086] In some optional embodiments, see Figure 6 The substrate 10 further includes a limiting portion 60, which is arranged around the light-emitting device 40. The distance between the side surface of the limiting portion 60 facing away from the substrate 10 and the substrate 10 is greater than the distance between the side surface of the partition portion 50 facing away from the substrate 10 and the substrate 10.

[0087] Optionally, the limiting portion 60 is provided to protrude from the second conductive layer 30 in a direction away from the substrate 10 .

[0088] Optionally, the orthographic projection shape of the limiting portion 60 on the substrate 10 may be a continuous closed shape; of course, it may also be a plurality of sub-portions arranged at intervals.

[0089] Optionally, the orthographic projection shape of the light emitting accommodating area on the substrate 10 and the orthographic projection shape of the limiting portion 60 on the substrate 10 may be similar.

[0090] Optionally, the orthographic projection shape of the light emitting device 40 on the substrate 10 and the orthographic projection shape of the limiting portion 60 on the substrate 10 may be similar.

[0091] Optionally, the cross-sectional area of the limiting portion 60 perpendicular to the thickness direction of the substrate 10 may gradually decrease in a direction away from the substrate 10. For example, the cross-sectional shape of the limiting portion 60 is trapezoidal, triangular or other shapes.

[0092] Optionally, the light-emitting device 40 may further include a side surface and an upper surface. The upper surface of the light-emitting device 40 is the surface of the light-emitting device 40 facing away from the substrate 10, and the side surface is the surface between the upper surface and the lower surface. A gap may be provided between the stopper 60 and the side surface; alternatively, the stopper 60 may be disposed in contact with at least a portion of the side surface.

[0093] In these optional embodiments, through the above-mentioned settings, the limiting portion 60 can play a guiding role in the transfer process of the light-emitting device 40, which is beneficial to reducing the accuracy of the transfer process of the light-emitting device 40. The limiting portion 60 can also reduce the possibility of the light-emitting device 40 being tilted, and reduce the risk of the second conductive layer 30 overflowing and causing a short circuit between adjacent light-emitting devices 40.

[0094] In some optional embodiments, see Figure 6 The limiting portion 60 includes a multi-layer structure stacked together, and at least one of the first electrical contact portion 21 and the second electrical contact portion 22 forms a partial layer structure.

[0095] Optionally, the limiting portion 60 may include a two-layer structure, and at least one of the first electrical contact portion 21 and the second electrical contact portion 22 may form one of the layer structures. The limiting portion 60 may also include a layer structure with more than two layers, and at least one of the first electrical contact portion 21 and the second electrical contact portion 22 may form a layer structure located in the middle. For example, if the limiting portion 60 includes a three-layer structure, at least one of the first electrical contact portion 21 and the second electrical contact portion 22 may form a second layer structure located in the middle; if the limiting portion 60 includes a four-layer structure, at least one of the first electrical contact portion 21 and the second electrical contact portion 22 may form a third layer structure located in the middle.

[0096] In these optional embodiments, by setting the limiting portion 60 as a multi-layer structure, it is helpful to simplify the manufacturing difficulty of the limiting portion 60 and reduce the manufacturing cost of the limiting portion 60. In addition, the first electrical contact portion 21 and the second electrical contact portion 22 extend to the side of the partial layer structure facing away from the substrate 10 to further reduce the possibility of the first electrical contact portion 21 and the second electrical contact portion 22 being damaged in the driving circuit in the substrate 10 due to over-engraving during the preparation process.

[0097] In some optional embodiments, see Figure 6The layer structure includes a first layer structure 61, a second layer structure 62 and a third layer structure 63. The second layer structure is arranged on the side of the first layer structure facing away from the substrate. The third layer structure at least covers a portion of the second layer structure. At least one of the first electrical contact portion 21 and the second electrical contact portion 22 extends along the first layer structure 61 to form the second layer structure 62.

[0098] Optionally, the first layer structure 61, the second layer structure 62 and the third layer structure 63 can be a three-layer structure with the same thickness; or, the thickness of the first layer structure 61 is greater than the thickness of the second layer structure 62, thereby reducing the preparation material of the second layer structure 62, reducing the manufacturing cost of the second layer structure 62, and increasing the overall thickness of the limiting portion 60; or, the thickness of the third layer structure 63 is greater than the thickness of the second layer structure 62, so that the third layer structure 63 can protect the conductive layer in the second layer structure 62 and reduce the possibility of water vapor corroding the conductive layer in the second layer structure 62.

[0099] Optionally, the first electrical contact portion 21 may include a first body portion 211 and a third extension portion 213. The first body portion 211 is electrically connected to the first electrical connection portion 31, and the third extension portion 213 is electrically connected to the first body portion 211. The third extension portion 213 extends to a side of the first layer structure 61 facing away from the substrate 10, so that the third extension portion 213 forms a second layer structure 62. The first layer structure 61 protrudes from a surface of the first body portion 211 facing away from the substrate 10, and the third extension portion 213 is located on the side of the first layer structure 61 facing away from the substrate 10. The distance between the third extension portion 213 and the substrate 10 is greater than the distance between the first body portion 211 and the substrate 10.

[0100] Optionally, the second electrical contact portion 22 may include a second body portion 221 and a fourth extension portion 223. The second body portion 221 and the fourth electrical contact portion are electrically connected. The fourth extension portion 223 is electrically connected to the second body portion 221. The fourth extension portion 223 extends to a side of the second layer structure 62 facing away from the substrate 10, so that the fourth extension portion 223 forms a second layer structure 62. The second layer structure 62 protrudes from a surface of the second body portion 221 facing away from the substrate 10. The fourth extension portion 223 is located on the side of the second layer structure 62 facing away from the substrate 10. The distance between the fourth extension portion 223 and the substrate 10 is greater than the distance between the second body portion 221 and the substrate 10.

[0101] Optionally, a side surface of the third extending portion 213 facing away from the substrate 10 and a side surface of the fourth extending portion 223 facing away from the substrate 10 may be flush.

[0102] Optionally, a side surface of the first extending portion 212 facing away from the substrate 10 and a side surface of the third extending portion 213 facing away from the substrate 10 may be flush.

[0103] Optionally, a side surface of the second extending portion 222 facing away from the substrate 10 and a side surface of the fourth extending portion 223 facing away from the substrate 10 may be flush.

[0104] In some embodiments, a portion of the first electrical contact portion 21 (the third extension portion 213) extends to the side of the first layer structure 61 facing away from the substrate 10 to form the second layer structure 62. In other embodiments, a portion of the second electrical contact portion 22 (the fourth extension portion 223) extends to the side of the first layer structure 61 facing away from the substrate 10 to form the second layer structure 62. In still other embodiments, a portion of the first electrical contact portion 21 (the third extension portion 213) and a portion of the second electrical contact portion 22 (the fourth extension portion 223) both extend to the side of the first layer structure 61 facing away from the substrate 10 to form the second layer structure 62.

[0105] In these optional embodiments, the first conductive layer 20 is formed into a second layer structure 62 of a limiting portion 60 so that the third layer structure 63 can protect the first conductive layer 20 to reduce the erosion of the first conductive layer 20 by water vapor. At the same time, the first layer structure 61 protects the first conductive layer 20 and the conductive film layer in the substrate 10, thereby reducing the risk of damage to the driving circuit in the substrate 10 due to over-engraving during the preparation process of the first conductive layer 20.

[0106] Figure 7 yes Figure 2 Another cross-sectional structural diagram of AA.

[0107] In some optional embodiments, see Figure 7 A supporting surface 64 is provided on the side of the first layer structure 61 , the second layer structure 62 and the third layer structure 63 facing away from the substrate 10 , and a portion of the surface of the light emitting device 40 is overlapped with the supporting surface 64 .

[0108] Optionally, the surface where the carrying surface 64 is located may be parallel to the surface where the substrate 10 is located; or, the surface where the carrying surface 64 is located may intersect with the surface where the substrate 10 is located.

[0109] Optionally, the carrying surface 64 and the surface of the first covering portion facing away from the substrate 10 are flush with each other.

[0110] In these optional embodiments, the supporting surface 64 can support the light-emitting device 40 to further improve the supporting effect of the light-emitting device 40 , thereby reducing the possibility of the light-emitting device 40 tilting.

[0111] In some optional embodiments, see Figure 7 The distance between the side surface of the limiting portion 60 facing away from the substrate 10 and the substrate 10 is greater than the distance between the side surface of the second conductive layer 30 facing away from the substrate 10 and the substrate 10, further reducing the risk of overflow of the second conductive layer 30 causing a short circuit in adjacent light-emitting devices 40.

[0112] like Figure 8 As shown, in the second aspect, the embodiment of the present application provides a display device 200, which includes the display panel 100 of any of the above-mentioned embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel 100 of any of the above-mentioned embodiments, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 100 of any of the above-mentioned embodiments, which will not be repeated here.

[0113] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the scope of protection of this application.

Claims

1. A display panel, characterized in that: include: substrate; a first conductive layer, disposed on one side of the substrate and comprising a first electrical contact portion and a second electrical contact portion spaced apart; a second conductive layer, disposed on a side of the first conductive layer facing away from the substrate and comprising a first electrical connection portion and a second electrical connection portion; a light-emitting device disposed on the substrate, the light-emitting device comprising a first electrode and a second electrode, the first electrode being electrically connected to the first electrical contact portion via the first electrical connection portion, and the second electrode being electrically connected to the second electrical contact portion via the second electrical connection portion; A partition portion is provided between the first electrical connection portion and the second electrical connection portion, the partition portion includes a plurality of stacked sub-layers, and at least one of the first electrical contact portion and the second electrical contact portion forms part of the sub-layer.

2. The display panel according to claim 1, wherein: The side of the partition portion facing away from the substrate is in contact with the surface of the light emitting device facing the substrate.

3. The display panel according to claim 1, wherein: The plurality of sublayers include a first sublayer, a second sublayer, and a third sublayer, wherein the second sublayer is disposed on a side of the first sublayer facing away from the substrate, the third sublayer at least partially covers the second sublayer, and at least one of the first electrical contact portion and the second electrical contact portion extends along the first sublayer to form the second sublayer; Preferably, a side of the third sublayer facing away from the substrate is arranged in contact with a surface of a side of the light-emitting device facing the substrate.

4. The display panel according to claim 3, wherein: The second sub-layer includes a first sub-portion and a second sub-portion, the first sub-portion is connected to the first electrical contact portion, the second sub-portion is connected to the second electrical contact portion, the third sub-layer covers the first sub-portion, and at least one of the second sub-portions faces away from the side of the substrate; Preferably, the first sub-portion and the second sub-portion are spaced apart, and the third sub-layer covers a portion of the first sub-layer facing away from the substrate and not covered by the first sub-portion and the second sub-portion.

5. The display panel according to claim 4, wherein: The third sublayer includes a first covering portion and a second covering portion, the first covering portion covers at least one of the first subportion and the second subportion, the second covering portion covers the portion of the first sublayer facing away from the substrate and not covered by the first subportion and the second subportion, and the distance between the side of the first covering portion facing away from the substrate and the substrate is greater than the distance between the side of the second covering portion facing away from the substrate and the substrate.

6. The display panel according to claim 4, wherein: The partition portion includes a first sub-partition portion, a second sub-partition portion, and a groove located between the first sub-partition portion and the second sub-partition portion. The first sub-partition portion and the second sub-partition portion are both arranged in contact with the surface of the light-emitting device facing the substrate, and the first sub-partition portion and the second sub-partition portion both include the first sub-layer, the second sub-layer, and the third sub-layer.

7. The display panel according to claim 1, wherein: The substrate further includes a limiting portion, which is arranged around the light emitting device. The distance between the substrate and a surface of the limiting portion facing away from the substrate is greater than the distance between the substrate and a surface of the partition portion facing away from the substrate.

8. The display panel according to claim 7, wherein: The limiting portion includes a multi-layer structure that is stacked, and at least one of the first electrical contact portion and the second electrical contact portion forms a portion of the layer structure.

9. The display panel according to claim 8, wherein: The layer structure includes a first layer structure, a second layer structure, and a third layer structure, wherein the second layer structure is arranged on a side of the first layer structure facing away from the substrate, the third layer structure at least partially covers the second layer structure, and at least one of the first electrical contact portion and the second electrical contact portion extends along the first layer structure to form the second layer structure; Preferably, a carrying surface is provided on the side of the first layer structure, the second layer structure and the third layer structure facing away from the substrate, and a part of the surface of the light-emitting device is overlapped with the carrying surface.

10. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 9.

Citation Information

Cited By

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    WO2026067151A1