High-power LED light source COB integrated packaging structure

Abstract

The utility model relates to the technical field of LED packaging, in particular to a high-power LED light source COB (chip on board) integrated packaging structure, which comprises a PCB (printed circuit board), a metal substrate, an LED chip and a packaging adhesive layer, a mounting groove is arranged on the PCB, a plurality of reflecting layers are arranged in the mounting groove, and each reflecting layer comprises a first reflecting surface and a second reflecting surface which are connected with each other. Therefore, light rays emitted by the LED chip are divided into two parts, one part of the light rays directly reach the packaging adhesive layer from the position over the LED chip and then are diffused to the outside through the packaging adhesive layer, and after the other part of the light rays are emitted from the LED chip, the light rays are reflected by one or two of the first reflecting surface and the second reflecting surface which are located on the side edge of the LED chip for multiple times, and then are diffused to the outside through the packaging adhesive layer. And the two parts of light rays compensate for each other, so that the problem of shadow between bright spot halo and a light source due to the fact that the light rays cannot be emitted from the interval between the adjacent LED chips can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a COB integrated packaging structure for a high-power LED light source. Background Art

[0002] COB is a packaging technology that attaches LED chips directly to a PCB using adhesive or solder, and then achieves electrical connection between the chip and PCB through wire bonding. To protect the LED chips, a recessed cavity is typically provided during packaging. COB technology is primarily used for high-power, multi-LED chip arrays. Compared to SMT, it significantly increases package power density and reduces thermal resistance.

[0003] At present, the power of a single LED chip cannot meet the luminous requirements of a high-power LED light source. Usually, multiple LED chips are set up and packaged through COB technology. The existing high-power LED light source COB integrated packaging structure has gaps between adjacent LED chips, and the light emitted by a single LED chip is mainly concentrated directly above the LED chip. There are dark areas between adjacent LED chips, resulting in the packaged light source appearing to have many bright spots, halos, and shadows between the light sources, affecting the display effect. Utility Model Content

[0004] Based on the technical problems existing in the above-mentioned prior art, the utility model provides a high-power LED light source COB integrated packaging structure, which can reduce the shadow between the bright spot halo and the light source and improve the display effect.

[0005] The technical solution adopted by the utility model to solve its technical problems is: to provide a high-power LED light source COB integrated packaging structure, including a PCB board and a metal substrate and LED chip arranged on the PCB board, and an encapsulation glue layer arranged above the LED chip, the metal substrate and the LED chip are electrically connected to each other, the encapsulation glue layer is connected to the PCB board, the PCB board is provided with a mounting groove for mounting the LED chip, the mounting groove is provided with a plurality of reflective layers, the plurality of reflective layers are symmetrically distributed about the central axis of the LED chip, the reflective layer includes a first reflective surface and a second reflective surface connected to each other, the first reflective surface and the second reflective surface form a certain angle between them, when light is emitted from the LED chip, it can be diverged through the encapsulation glue layer or reflected by the first reflective surface and / or the second reflective surface to the encapsulation glue layer for divergence.

[0006] Furthermore, the included angle between the first reflecting surface and the second reflecting surface is 120°.

[0007] Furthermore, the first reflecting surface and the second reflecting surface are both arranged at an inclination.

[0008] Furthermore, the first reflecting surface is located above the second reflecting surface, and the top of the first reflecting surface is higher than the top of the LED chip.

[0009] Furthermore, a plurality of heat dissipation holes are provided at the bottom end of the PCB board.

[0010] Furthermore, phosphor is provided in the encapsulation adhesive layer.

[0011] Furthermore, the phosphor is yellow phosphor, or doped yellow phosphor and red phosphor, or doped green phosphor and red phosphor.

[0012] Furthermore, the metal substrate is a copper substrate or an aluminum substrate.

[0013] Furthermore, the metal substrate and the PCB board are connected by gluing.

[0014] Furthermore, the high-power LED light source COB integrated packaging structure further includes a diffusion layer disposed on the packaging adhesive layer. The diffusion layer is located below the packaging adhesive layer, and a plurality of diffusion particles are disposed in the diffusion layer.

[0015] The beneficial effects of the present utility model are as follows: a high-power LED light source COB integrated packaging structure is provided, comprising a PCB board and a metal substrate and an LED chip arranged on the PCB board, and an encapsulation adhesive layer arranged above the LED chip, wherein the metal substrate and the LED chip are electrically connected to each other, the encapsulation adhesive layer is connected to the PCB board, a mounting groove for mounting the LED chip is provided on the PCB board, a plurality of reflective layers are provided in the mounting groove, the plurality of reflective layers are symmetrically distributed about the central axis of the LED chip, the reflective layer comprises a first reflective surface and a second reflective surface connected to each other, a certain angle is formed between the first reflective surface and the second reflective surface, and when light is emitted from the LED chip, it can be diverged through the encapsulation adhesive layer or reflected by the first reflective surface and / or the second reflective surface to the encapsulation adhesive layer for divergence. Thus, the light emitted by the LED chip is divided into two parts. One part of the light goes directly from the top of the LED chip to the encapsulation layer, and then diverges to the outside through the encapsulation layer. The other part of the light is emitted from the LED chip, first reflected multiple times by one or both of the first reflection surface and the second reflection surface located on the side of the LED chip, and then reflected onto the encapsulation layer to diverge. The two parts of light complement each other, thereby reducing the problem of shadows between bright spots and halos caused by the gaps between adjacent LED chips that cannot emit light. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] In the picture: Figure 1 This is a cross-sectional view of a high-power LED light source COB integrated packaging structure provided by the utility model;

[0018] Figure 2 for Figure 1 The light path diagram from the LED chip to the diffusion layer in the COB integrated packaging structure of the high-power LED light source is shown.

[0019] Explanation of the accompanying reference numerals: 100, high-power LED light source COB integrated packaging structure; 10, PCB board; 11, mounting groove; 12, reflective layer; 121, first reflective surface; 122, second reflective surface; 13, heat dissipation hole; 20, metal substrate; 30, LED chip; 31, pin one; 32, pin two; 40, packaging glue layer; 50, diffusion layer. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention is now described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basics of the present invention in an illustrative manner, and therefore only shows the structures related to the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] Please refer to Figure 1-2 A high-power LED light source COB integrated package structure 100 includes a PCB board 10, a metal substrate 20 and an LED chip 30 disposed on the PCB board 10, and an encapsulation adhesive layer 40 disposed above the LED chip 30. The metal substrate 20 and the LED chip 30 are electrically connected, and the encapsulation adhesive layer 40 and the metal substrate 20 are both bonded to the PCB board 10. The metal substrate 20 is a copper substrate or an aluminum substrate. Furthermore, in this embodiment, the metal substrate 20 is a copper substrate.

[0022] The PCB board 10 is provided with a plurality of mounting grooves 11 for mounting the LED chips 30 . A plurality of reflective layers 12 are provided in the mounting grooves 11 . The plurality of reflective layers 12 are symmetrically distributed about the central axis of the LED chip 30 .

[0023] Furthermore, the distance between the tops of the two reflective layers 12 symmetrically distributed about the central axis of the LED chip 30 is set so as not to block the top surface of the LED chip 30. The reflective layer 12 includes a continuous first reflective surface 121 and a second reflective surface 122. There is a certain angle between the first reflective surface 121 and the second reflective surface 122. Specifically, in this embodiment, the angle between the first reflective surface 121 and the second reflective surface 122 is 120°. The first reflective surface 121 and the second reflective surface 122 are both inclined. The first reflective surface 121 is located above the second reflective surface 122, and the top of the first reflective surface 121 is higher than the top of the LED chip 30. When light is emitted from the LED chip 30, it can be diffused through the encapsulation layer 40 or reflected by the first reflective surface 121 and / or the second reflective surface 122 to the encapsulation layer 40 for diffusion.

[0024] The bottom end of the PCB board 10 is provided with a plurality of heat dissipation holes 13. Specifically, in this embodiment, the heat dissipation holes 13 and the mounting grooves 11 are provided correspondingly.

[0025] The LED chip 30 is provided with a first pin 31 and a second pin 32, both of which are electrically connected to the metal substrate 20 via solder. Specifically, in this embodiment, the electrodes corresponding to the first pin 31 and the second pin 32 are opposite. If the first pin 31 is the positive electrode pin, the second pin 32 is the negative electrode pin; if the first pin 31 is the negative electrode pin, the second pin 32 is the positive electrode pin.

[0026] Phosphor is provided in the encapsulation layer 40. Specifically, in this embodiment, the phosphor is yellow phosphor. It is understandable that in other embodiments not shown, the phosphor may also be doped yellow phosphor and red phosphor, or doped green phosphor and red phosphor.

[0027] The high-power LED light source COB integrated package structure 100 also includes a diffusion layer 50 disposed on the encapsulation adhesive layer 40. The diffusion layer 50 is located below the encapsulation adhesive layer 40 and is connected to the PCB board 10. The diffusion layer 50 is provided with a plurality of diffusion particles. The diffusion particles and phosphor are not shown in the accompanying drawings of this embodiment.

[0028] Specifically, in this embodiment, the diffusion layer 50 and the PCB board 10 are bonded together. The diffusion layer 50 is made of a composite of polycarbonate and polymethyl methacrylate. Optionally, the diffusion particles are made of polystyrene microspheres, polymethyl methacrylate, or silicone microspheres. In this embodiment, the diffusion particles are made of polystyrene microspheres. Optionally, the distance between the diffusion particles is 1 to 5 microns. The diffusion particle concentration within a single diffusion layer 50 is set to 1%.

[0029] Please refer to Figure 2The light emitted by the LED chip 30 is divided into two parts. One part of the light goes directly from the top of the LED chip 30 to the encapsulation layer 40, and then diverges to the outside through the encapsulation layer 40. The other part of the light is emitted from the LED chip 30, is first reflected multiple times by one or both of the first reflection surface 121 and the second reflection surface 122 located on the side of the LED chip 30, and then is reflected on the encapsulation layer 40 to diverge.

[0030] It can be understood that in some other embodiments, after the light reflected by the first reflection surface 121 and the second reflection surface 122 is emitted from the LED chip 30, it can be reflected from the first reflection surface 121 to the diffusion layer 50, and then diffused to the outside through the diffusion layer 50 and the packaging glue layer 40.

[0031] In some other embodiments, after the light reflected by the first reflective surface 121 and the second reflective surface 122 is emitted from the LED chip 30, it can be reflected from the second reflective surface 122 to the diffusion layer 50, and then diffused to the outside through the diffusion layer 50 and the encapsulation layer 40.

[0032] In some other embodiments, after the light reflected by the first reflection surface 121 and the second reflection surface 122 is emitted from the LED chip 30, it can be reflected from the first reflection surface 121 to the second reflection surface 122 located in the same plane, and then reflected to the first reflection surface 121 located on the other side of the LED chip 30, and then reflected from the first reflection surface 121 to the diffusion layer 50, and then diverged to the outside through the diffusion layer 50 and the packaging glue layer 40.

[0033] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0034] It should be understood that the terms "length", "width", "up", "down", "front and back", "left and right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] The above description is based on the ideal embodiment of the present invention. Based on the above description, relevant personnel can make various changes and modifications without departing from the scope of the present invention. The technical scope of this utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A high-power LED light source COB integrated packaging structure, characterized by: The invention comprises a PCB board, a metal substrate and an LED chip arranged on the PCB board, and an encapsulation layer arranged above the LED chip. The metal substrate and the LED chip are electrically connected to each other, the encapsulation layer is connected to the PCB board, a mounting groove for mounting the LED chip is provided on the PCB board, and a plurality of reflective layers are provided in the mounting groove. The plurality of reflective layers are symmetrically distributed about the central axis of the LED chip. The reflective layer includes a first reflective surface and a second reflective surface connected to each other. The first reflective surface and the second reflective surface form a certain angle between them. When light is emitted from the LED chip, it can be diverged through the encapsulation layer or reflected by the first reflective surface and / or the second reflective surface to be diverged on the encapsulation layer.

2. The high-power LED light source COB integrated packaging structure according to claim 1, characterized in that: The included angle between the first reflecting surface and the second reflecting surface is 120°.

3. The high-power LED light source COB integrated packaging structure according to claim 2, characterized in that: The first reflecting surface and the second reflecting surface are both arranged at an inclination.

4. The high-power LED light source COB integrated packaging structure according to claim 3, characterized in that: The first reflecting surface is located above the second reflecting surface, and the top of the first reflecting surface is higher than the top of the LED chip.

5. The high-power LED light source COB integrated packaging structure according to claim 4, characterized in that: A plurality of heat dissipation holes are provided at the bottom end of the PCB board.

6. The high-power LED light source COB integrated packaging structure according to claim 1, characterized in that: Phosphor is arranged in the packaging adhesive layer.

7. The high-power LED light source COB integrated packaging structure according to claim 6, characterized in that: The phosphor is yellow phosphor, or doped yellow phosphor and red phosphor, or doped green phosphor and red phosphor.

8. The high-power LED light source COB integrated packaging structure according to claim 1, characterized in that: The metal substrate is a copper substrate or an aluminum substrate.

9. The high-power LED light source COB integrated packaging structure according to claim 8, characterized in that: The metal substrate and the PCB board are connected by gluing.

10. The high-power LED light source COB integrated packaging structure according to claim 1, characterized in that: The high-power LED light source COB integrated packaging structure further includes a diffusion layer arranged on the packaging adhesive layer. The diffusion layer is located below the packaging adhesive layer, and a plurality of diffusion particles are arranged in the diffusion layer.

Images