Black PC (Polycarbonate) composite PI (Polyimide) grid adhesive tape for bonding electronic equipment

Abstract

The utility model relates to the technical field of pressure-sensitive adhesive, in particular to a black PC (polycarbonate) composite PI (polyimide) grid adhesive tape for bonding electronic equipment. The adhesive tape comprises a base material layer, wherein a first adhesive layer, a thin film layer, a second adhesive layer and a release layer are sequentially attached to the base material layer. Wherein the release layer is a grid release film. According to the black PC grid adhesive tape, the grid structure of the black PC grid adhesive tape is adopted, the weight of the adhesive tape is reduced while the strength is guaranteed, the adhesive tape is convenient to carry, the grid release layer is a silicone oil release film, the exhaust performance of the adhesive tape is improved due to the grid shape of the adhesive layer, and the adhesive tape has a good release effect; and the adhesive tape is easy to uncover without adhesive residues, so that the use convenience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure-sensitive adhesives, in particular to a black PC composite PI grid adhesive tape used for bonding electronic equipment. Background Art

[0002] PC film is polycarbonate film, which is an amorphous, odorless, non-toxic, thermoplastic engineering plastic with excellent physical and mechanical properties, especially excellent impact resistance, high tensile strength, flexural strength and compressive strength; small creep and dimensional stability; good heat resistance and low temperature resistance, with stable mechanical properties, dimensional stability, electrical properties and flame retardancy in a wide temperature range, and can be used for a long time at -60 to 120°C; no obvious melting point, and it is in a molten state at 220-230°C.

[0003] As a special engineering material, PI film and polyimide film have been fully recognized for their outstanding characteristics in performance and synthesis, whether as structural materials or as functional materials. Their huge application prospects have been fully recognized. They are called "problem solvers" and it is believed that "without polyimide, there would be no today's microelectronics technology."

[0004] Among the numerous polymer materials, only six are individually listed in the Chemical Abstracts Directory (Chemical Abstracts Directory), and polyimide is one of them. This demonstrates the immense technological and commercial significance of polyimides. The rise and rapid development of the IT, flat panel display, and photovoltaic industries has inevitably driven the development of related supporting materials and increased market demand. Electronic engineering (electronic-grade) polyimide film, a key material for printed circuit boards, integrated circuits, flat panel displays, solar cells, and electronic tags, is playing an increasingly crucial role in these electronic product applications.

[0005] Existing PC tapes are widely used in the manufacturing process of electronic devices, but they have problems such as insufficient bonding strength, poor temperature resistance, or poor air discharge (easy bulging during bonding).

[0006] In order to solve the above problems, the utility model provides a black PC composite PI grid tape for bonding electronic devices. Utility Model Content

[0007] The purpose of the utility model is to provide a black PC composite PI grid tape for bonding electronic devices to solve the problems raised in the above background technology.

[0008] In order to solve the above technical problems, the utility model provides the following technical solutions: a method for preparing a black PC composite PI grid tape, comprising sequentially bonding a substrate layer, a first adhesive layer, a film layer, a second adhesive layer and a release layer;

[0009] The release layer is a grid release film;

[0010] The substrate layer is a black polycarbonate film.

[0011] More optimally, the grid release film is a silicone oil release film, and a grid-shaped texture is provided on the surface of the grid release film.

[0012] More optimally, the grid texture of the grid release film is a rhombus, a triangle, a regular quadrilateral, a regular pentagon or a regular hexagon.

[0013] More optimally, when the grid texture is a rhombus or a regular quadrilateral, the side length is 0.5 mm.

[0014] More optimally, the film layer is a PI film.

[0015] More optimally, the first adhesive layer is a modified acrylic pressure-sensitive adhesive layer, which is used to bond the substrate layer and the film layer.

[0016] More optimally, the second adhesive layer is a modified acrylic pressure-sensitive adhesive layer, which is bonded to the film layer and is used to stick the tape to the surface of the object.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0018] (1) The adhesive tape prepared in the present invention has excellent air-venting and adhesion properties, and can reduce the generation of bubbles and wrinkles when pasting on a large area;

[0019] (2) In the present invention, the adhesive tape comprises a black PC substrate, a PI substrate, an adhesive layer and a grid release layer. The black PC layer has high strength and good temperature resistance, which can effectively enhance the overall strength of the tape. The adhesive layer is arranged on one side of the black PC layer and is used to stick the tape on the desired surface of an object. The grid release layer covers the adhesive layer and plays the role of giving the adhesive layer a grid shape and protecting the adhesive layer. It can be easily peeled off when in use.

[0020] (3) In the present invention, the adhesive layer adopts a high-temperature resistant and highly viscous adhesive to ensure that the tape can still maintain good adhesive performance in a high-temperature environment;

[0021] (4) The grid release layer is a silicone oil release film, which has a shape of 0.5mm×0.5mm diamond grid release film. It has a good release effect and better bubble removal performance. It is easy to peel off without any adhesive residue, so that the entire tape has excellent bonding strength and good air exhaust performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0023] Figure 1 Schematic diagram of the structure of black PC composite PI grid single-sided adhesive.

[0024] Among them, 1. Black PC base layer; 2. Adhesive layer; 3. PI base layer; 4. Adhesive layer; 5. Grid release film layer. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Example 1: A black PC composite PI mesh tape for bonding electronic devices comprises a substrate layer, to which a first adhesive layer, a film layer, a second adhesive layer, and a release layer are sequentially laminated. The release layer is a mesh release film. The substrate layer is a black polycarbonate film, i.e., PC film.

[0027] Black PC film has high strength and good temperature resistance, which can effectively enhance the overall strength of the tape. At the same time, the use of black PC film can make the tape black as a whole, giving it a better masking effect, making it suitable for bonding electronic products that require aesthetics.

[0028] The mesh release film used is a silicone release film with a grid-shaped texture on its surface. The grid-shaped texture can be a polygonal shape such as a rhombus, triangle, regular quadrilateral, regular pentagon, or regular hexagon. When the grid texture is a rhombus or regular quadrilateral, its side length is 0.5 x 0.5 mm.

[0029] The grid release layer covers the adhesive layer, which plays the role of giving the adhesive layer a grid shape and protecting the adhesive layer; in addition, the grid structure of the grid release film increases the air venting property of the tape and also has a good release effect.

[0030] The film layer used in the utility model is a PI film. The first adhesive layer and the second adhesive layer both use modified acrylic pressure-sensitive adhesive, which improves the adhesive strength and aging resistance of the tape.

[0031] The preparation of a black PC composite PI grid tape for bonding electronic devices includes the following steps:

[0032] S1. Preparation of black PC base layer: The polycarbonate material is extruded into a film through an extruder, and then stretched through a stretching device. The stretched film is heat-set to ensure dimensional stability and excellent performance.

[0033] S2. Adhesive Layer Coating: A high-performance pressure-sensitive adhesive is evenly applied to the steel strip side of the PI substrate. The coating thickness is adjusted according to actual needs. The adhesive layer is dried to remove the solvent and achieve optimal adhesion.

[0034] S3. Bonding the adhesive layer to the PC composite PI base layer: Evenly apply high-performance pressure-sensitive adhesive on the grid release surface of the grid release film and adhere it to the PC composite PI base layer under pressure.

[0035] S4. Curing: Place the bonded products in an oven for curing at 48°C / 24 hours to allow the adhesive layer and the PC composite PI base layer to bond better together to form a black PC composite PI grid single-sided adhesive with strong bonding strength and strong air-dissipation.

[0036] The adhesive tape prepared in the utility model has a grid structure of a black PC grid tape that reduces the weight of the tape while ensuring strength, making it easy to carry and use. The grid release layer is a silicone oil release film, which gives the adhesive layer a grid shape that improves the exhaust performance of the tape, has a good release effect, is easy to peel off without adhesive residue, and improves the convenience of use.

[0037] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A black PC composite PI mesh tape for bonding electronic devices, characterized by: It comprises a substrate layer, a first adhesive layer, a film layer, a second adhesive layer and a release layer which are bonded together in sequence; The release layer is a grid release film; The substrate layer is a black polycarbonate film.

2. The black PC composite PI mesh tape for bonding electronic devices according to claim 1, characterized in that: The grid release film is a silicone oil release film, and a grid-shaped texture is provided on the surface of the grid release film.

3. The black PC composite PI mesh tape for bonding electronic devices according to claim 1, characterized in that: The grid texture of the grid release film is a rhombus, a triangle, a regular quadrilateral, a regular pentagon or a regular hexagon.

4. The black PC composite PI mesh tape for bonding electronic devices according to claim 3, characterized in that: When the grid texture of the grid release film is a rhombus or a regular quadrilateral, the side length is 0.5 mm.

5. The black PC composite PI mesh tape for bonding electronic devices according to claim 1, characterized in that: The film layer is a PI film.

6. The black PC composite PI mesh tape for bonding electronic devices according to claim 1, characterized in that: The first adhesive layer is a modified acrylic pressure-sensitive adhesive layer, which is used to bond the substrate layer and the film layer.

7. The black PC composite PI mesh tape for bonding electronic devices according to claim 1, characterized in that: The second adhesive layer is a modified acrylic pressure-sensitive adhesive layer, which is adhered to the film layer and is used to stick the tape on the surface of the object to be stuck.

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