Testing device and testing system for electronic high-speed signals

Abstract

The utility model provides a testing device and a testing system for electronic high-speed signals, the testing device comprises a mounting plate, a first connector, a second connector and a high-speed signal de-embedding assembly, and the first connector and the second connector are connected based on a preset circuit; the first connectors are arranged on two sides of the mounting plate, are connected with to-be-tested equipment and are used for receiving to-be-tested signals and transmitting the to-be-tested signals to the corresponding second connectors through a preset circuit; the second connector is arranged on the plate surface of the mounting plate, is connected with a network analyzer, and is used for transmitting a signal to be detected to the network analyzer, so that the network analyzer detects the signal to be detected; and the high-speed signal de-embedding assembly is arranged on the plate surface of the mounting plate and is connected with the network analyzer, so that the network analyzer detects the S parameter of the preset circuit through the high-speed signal de-embedding assembly. Based on the cooperative use of the mounting plate, the connector and the high-speed signal de-embedding assembly, the error of the testing device can be accurately determined.

Description

Technical Field

[0001] The present application relates to the field of high-speed signal testing, and in particular to a testing device and a testing system for electronic high-speed signals. Background Art

[0002] Automotive electronics products have extremely high requirements for signal stability, which translates to extremely low bit error rates for high-speed signals. To ensure signal quality, highly precise testing methods are required to avoid unnecessary deviations that could lead to inaccurate testing and system risks. This is extremely difficult to achieve without test fixtures.

[0003] With current technology, it is impossible to accurately determine test fixture errors during the inspection of high-speed signals in automotive electronics, such as GMSL and in-vehicle Ethernet. Utility Model Content

[0004] Based on this, it is necessary to provide a test device and a test system for electronic high-speed signals to address the above technical problems.

[0005] In a first aspect, the present application provides a test device for electronic high-speed signals, comprising a mounting plate, a first connector, a second connector, and a high-speed signal de-embedding assembly, wherein the first connector and the second connector match and are connected based on a preset circuit;

[0006] The first connectors are provided on both sides of the mounting plate and are connected to the device under test, and are used to receive the signal under test and transmit the signal under test to the corresponding second connector through a preset circuit;

[0007] The second connector is provided on the board surface of the mounting board and is connected to the network analyzer, and is used for transmitting the signal to be measured to the network analyzer so that the network analyzer detects the signal to be measured;

[0008] The high-speed signal de-embedding component is arranged on the board surface of the mounting board and is connected to the network analyzer so that the network analyzer detects the S parameters of the preset circuit through the high-speed signal de-embedding component.

[0009] In one embodiment, a plurality of first connectors are provided on both sides of the mounting plate, and at least some of the plurality of first connectors are of different connector types.

[0010] In one embodiment, it is characterized in that each of the first connectors is matched with at least one of the second connectors;

[0011] The number of second connectors that mate with the first connector is associated with the connector type of the first connector.

[0012] In one embodiment, the high-speed signal de-embedding component includes a 2X Thru Coupon de-embedding component.

[0013] In one embodiment, the high-speed signal de-embedding assembly includes a test strip and two third connectors connected to two ends of the test strip respectively;

[0014] The two third connectors are connected to the network analyzer, and the network analyzer detects the S parameters of the preset circuit through the third connectors.

[0015] In one embodiment, the setting parameters of the test strip match the S parameters of the preset circuit.

[0016] In one embodiment, the connector type of the first connector includes at least one of a FAKRA radio frequency connector, an ETH Ethernet connector, a BNC connector, and an AEC connector.

[0017] In one embodiment, the connector type of the second connector includes at least an SMA radio frequency coaxial connector.

[0018] In a second aspect, the present application further includes an electronic high-speed signal testing system, characterized in that it includes the test device for electronic high-speed signals, a device under test, and a network analyzer, wherein the device under test includes traces or components, and the test device is connected to the device under test and the network analyzer respectively;

[0019] The testing device is used to transmit the test signal of the device under test to the network analyzer.

[0020] The above-mentioned test device and test system for electronic high-speed signals include a mounting plate, a first connector, a second connector, and a high-speed signal de-embedding component, wherein the first connector and the second connector match and are connected based on a preset circuit; the first connector is arranged on both sides of the mounting plate and is connected to the device under test, for receiving the signal under test and transmitting the signal under test to the corresponding second connector through a preset circuit; the second connector is arranged on the board surface of the mounting plate and is connected to the network analyzer, for transmitting the signal under test to the network analyzer so that the network analyzer detects the signal under test; the high-speed signal de-embedding component is arranged on the board surface of the mounting plate and is connected to the network analyzer so that the network analyzer detects the S parameters of the preset circuit through the high-speed signal de-embedding component. The above-mentioned test device and test system for electronic high-speed signals, based on the coordinated use of the mounting plate, the first connector, the second connector, and the high-speed signal de-embedding component, can accurately determine the error of the test device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 1 is a schematic structural diagram of a test device for electronic high-speed signals in one embodiment;

[0023] Figure 2 This is a schematic diagram of the connector structure of a test device for electronic high-speed signals according to one embodiment of the present utility model;

[0024] Figure 3 This is a schematic structural diagram of a high-speed signal de-embedding component according to an embodiment of the present invention;

[0025] Figure 4 This is a structural diagram of an electronic high-speed signal testing system according to an embodiment of the present invention;

[0026] Explanation of the accompanying drawings: 1. Test device; 101. Mounting plate; 102. First connector; 103. Second connector; 104. High-speed signal de-embedding component; 2. Device under test; 3. Network analyzer; 1041. Test strip; 1042. Third connector.

[0027] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate this application in detail. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0030] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intervening element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc., if there is transmission of electrical signals or data between the connected objects.

[0031] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0032] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms cannot be understood as limiting the present invention.

[0033] High-speed automotive electronic signals, including GMSL, GPS, and in-vehicle Ethernet, offer high transmission rates. GMSL supports 6 Gbps, GPS 3 Gbps, and in-vehicle Ethernet can support rates of 100 Mbps, 1000 Mbps, and higher. Existing testing methods rely on either wire bonding or point-to-point probing with high-speed probes. These introduce unknown wire bonding errors and human probing errors, resulting in inaccurate test results that fail to reflect the true performance of the link under test.

[0034] A test device for high-speed signal testing can perform frequency-domain S-parameter testing, TDR impedance testing, time-domain eye diagram testing, and the like. Specifically, in some embodiments, corresponding de-embedding can be performed based on the time-domain eye diagram test or the frequency-domain S-parameter test. In these processes, the application of de-embedding technology can remove the influence of errors in the preset circuit portion of the test device, thereby measuring the high-speed signal of the device under test itself.

[0035] See Figure 1 and Figure 4 As shown, Figure 1 1 is a schematic structural diagram of a test device 1 for electronic high-speed signals. The present embodiment provides a test device 1 for electronic high-speed signals, comprising a mounting plate 101, a first connector 102, a second connector 103, and a high-speed signal de-embedding assembly 104. The first connector 102 and the second connector 103 match and are connected based on a preset circuit.

[0036] The first connectors 102 are provided on both sides of the mounting plate 101 and are connected to the device under test 2, for receiving a signal under test and transmitting the signal under test to the corresponding second connector 103 through a preset circuit;

[0037] The second connector 103 is provided on the board surface of the mounting board 101 and is connected to the network analyzer 3, and is used to transmit the signal to be measured to the network analyzer 3, so that the network analyzer 3 detects the signal to be measured;

[0038] The high-speed signal de-embedding component 104 is disposed on the board surface of the mounting board 101 and is connected to the network analyzer 3 , so that the network analyzer 3 detects the S parameters of the preset circuit through the high-speed signal de-embedding component 104 .

[0039] Specifically, the mounting board 101 is a PCB board, and the shape, size and dimensions of the PCB board are not limited. In other embodiments, the type and size of the mounting board 101 can be determined based on actual conditions, which will not be described in detail here.

[0040] Specifically, the first connector 102 and the second connector 103 are matched with each other, that is, the first connector 102 and the second connector 103 are connected through a circuit. One first connector 102 can be connected to one second connector 103, or one first connector 102 can be connected to multiple second connectors 103. It can be determined according to actual conditions and is not listed here one by one.

[0041] Specifically, the preset circuit is a circuit adjusted based on preset parameters. The preset circuit connects the first connector 102 and the second connector 103 . The acquired signal to be tested is transmitted from the first connector 102 to the second connector 103 through the preset circuit.

[0042] S-parameters, also known as scattering parameters or transmission parameters, are important physical quantities in wireless communications that describe signal transmission and scattering characteristics. The S-parameters of a given circuit can be understood as the transmission parameters of the given circuit during signal transmission.

[0043] Specifically, the first connector 102 is arranged on both sides of the mounting board 101 for receiving high-speed signals from the device under test 2, wherein the device under test 2 may also be referred to as a DUT (device under test), which usually refers to a complete board device. In certain specific cases, the device under test 2 may also be a section of wiring or a component, which is not specifically limited here.

[0044] Specifically, the second connector 103 is arranged on the board surface of the mounting board 101 and is connected to the network analyzer 3, and is used to output and transmit the high-speed signal of the device under test 2, and transmit the signal under test to the network analyzer 3, so that the network analyzer 3 detects the signal under test.

[0045] The network analyzer 3 is a high-performance, multifunctional electronic measuring instrument. Its full name is microwave network analyzer. As a device specifically designed for measuring and analyzing microwave network parameters, it can directly measure complex scattering parameters (such as S parameters) of irreversible or reversible single-port and two-port networks.

[0046] Functions include: Wide frequency range measurement: The network analyzer can cover a wide range from lower frequencies (such as 10MHz) to high frequencies (such as 43.5GHz or higher to 67GHz), which makes it suitable for the test needs of a variety of RF and microwave applications. High precision and sensitivity: The use of advanced microwave circuit technology, high-speed digital signal processing technology and advanced calibration methods ensures that the measurement has the characteristics of high precision, high sensitivity and low noise. Multiple test modes: Supports multiple test modes, such as transmission / reflection coefficient, S parameters, power, etc. to meet different test needs. Multiple test ports: Provides a variety of test ports such as 2 ports, 3 ports, 4 ports, etc. to adapt to different test applications. Scalability: Various test functions can be expanded through optional accessories and software, such as adding test ports, frequency range or bandwidth.

[0047] Specifically, the high-speed signal de-embedding component 104, also known as the "de-embedding" component, can accurately determine the test error caused by a series of preset circuits on the test device 1 when transmitting signals. The above process can also be understood as "de-embedding", in which the corresponding test error can be calculated based on the S parameters of the test in this embodiment.

[0048] The above-mentioned testing device 1 for electronic high-speed signals includes a mounting plate 101, a first connector 102, a second connector 103, and a high-speed signal de-embedding component 104. The first connector 102 and the second connector 103 match and are connected based on a preset circuit. The first connector 102 is arranged on both sides of the mounting plate 101 and is connected to the device under test 2, and is used to receive the test signal and transmit the test signal to the corresponding second connector 103 through a preset circuit. The second connector 103 is arranged on the board surface of the mounting plate 101 and is connected to the network analyzer 3. It is used to transmit the test signal to the network analyzer 3 so that the network analyzer 3 can detect the test signal. The high-speed signal de-embedding component 104 is arranged on the board surface of the mounting plate 101 and is connected to the network analyzer 3 so that the network analyzer 3 can detect the S parameters of the preset circuit through the high-speed signal de-embedding component 104. The above-mentioned test device and test system for electronic high-speed signals can accurately determine the error of the test device based on the cooperation between the mounting plate, the first connector 102, the second connector 103 and the high-speed signal de-embedding component.

[0049] In one embodiment, a plurality of first connectors 102 are disposed on both sides of the mounting plate 101 , and at least some of the first connectors 102 are of different connector types.

[0050] Specifically, because the first connector 102 is connected to the device under test 2, there are often multiple types of devices under test 2, and each type uses a different connection interface. Therefore, at least some of the first connectors 102 are of different connector types and can adapt to different devices under test 2.

[0051] In the above embodiment, at least part of the first connectors 102 are configured to have different types of connectors, so as to achieve adaptation to a variety of different devices under test 2 .

[0052] In one embodiment, each first connector 102 is matched with at least one second connector 103 ; the number of second connectors 103 matched with the first connector 102 is associated with the connector type of the first connector 102 .

[0053] Specifically, see Figure 2 As shown, Figure 2 It is a schematic diagram of the connector structure of the test device 1 for electronic high-speed signals;

[0054] Because the first connectors 102 are of different types, the number of corresponding contacts therein is also different. The second connector 103 corresponds one-to-one to the number of contacts in the first connector 102, and can input and output signals accordingly. Therefore, each of the first connectors 102 matches at least one of the second connectors 103, and the number of second connectors 103 that match the first connector 102 is associated with the connector type of the first connector 102.

[0055] In the above embodiment, the first connector 102 and the second connector 103 are matched one-to-one, which can achieve accurate input and output of high-speed signals and improve the efficiency of signal transmission.

[0056] In one embodiment, the preset circuit includes a connecting wire for connecting the first connector 102 and at least one matching second connector 103 .

[0057] Specifically, the first connector 102 and the second connector 103 are connected through a preset circuit, wherein the test error parameters in the preset circuit can be accurately quantified, for example, S parameters can be accurately calculated, and therefore it is necessary to continuously debug the connected circuits to ultimately determine the most suitable preset circuit that can accurately determine the S parameters.

[0058] Specifically, the connecting wire refers to a circuit line, and both ends of the connecting wire are respectively connected to the first connector 102 and the second connector 103 to form a path to facilitate transmission of the signal to be tested between the first connector 102 and the second connector 103 .

[0059] It can be understood that because the first connector 102 is of different types, the number of corresponding contacts therein is also different. Therefore, the preset circuit connects the contacts of the first connector 102 and the second connector 103. The preset circuit can be used to connect the first connector 102 and at least one matching second connector 103, that is, there is a situation where one first connector 102 corresponds to multiple second connectors 103.

[0060] In the above embodiment, the first connector 102 and the matching at least one second connector 103 can be accurately connected based on the preset circuit.

[0061] In one embodiment, the high-speed signal de-embedding component 104 includes a 2X Thru Coupon de-embedding component.

[0062] Specifically, 2x-Thru de-embedding is a technique used to eliminate the effects of parasitic elements and components on the actual device under test (DUT). Using a network analyzer (such as an R&S VNA), the S-parameters of the 2x-Thru coupon can be measured. S-parameters (scattering parameters) describe the scattering or reflection characteristics of a circuit or device at a given frequency.

[0063] S-parameters, also known as scattering parameters or transmission parameters, are important physical quantities in wireless communications that describe signal transmission and scattering characteristics. The S-parameters of a 2x-Thru Coupon (test strip) can be understood as the transmission parameters of the test strip during signal transmission.

[0064] It is understandable that in other specific embodiments, the parameter type of the test strip actually measured by the network analyzer may also be determined based on actual conditions, and no specific limitation is made.

[0065] In the above embodiment, the 2X Thru Coupon de-embedding component is used to measure the error parameter S parameter, and then accurately remove the test error.

[0066] In one embodiment, see Figure 3 As shown, Figure 3 104 is a schematic structural diagram of a high-speed signal de-embedding assembly 104, wherein the high-speed signal de-embedding assembly 104 comprises a test strip 1041 and two third connectors 1042 connected to both ends of the test strip 1041 respectively;

[0067] The two third connectors 1042 are connected to the network analyzer 3 , and the network analyzer 3 detects the S parameters of the preset circuit through the third connectors 1042 .

[0068] Specifically, the S parameter of the test strip 1041 is indirectly affected and adjusted by changing its structure, material or design.

[0069] Specifically, the two third connectors 1042 are connected to the network analyzer 3 , and the two third connectors 1042 respectively input or output high-speed signals. After being connected to the network analyzer 3 , the S parameters of the preset circuit can be calculated accordingly.

[0070] Specifically, the types of the third connector 1042 mainly include SMA RF coaxial connectors. In other embodiments, the type of the third connector 1042 can also be determined based on other circumstances, which are not described in detail here. Among them, the two third connectors 1042 are respectively connected to the two ends of the test strip 1041, and can also be connected to the network analyzer 3 to form a path. The network analyzer 3 can accurately measure the S parameters of the test strip. There is a corresponding mapping relationship between the S parameters of the test strip 1041 and the S parameters of the preset circuit. It can be two times, multiple times, or the corresponding mapping relationship can be determined by looking up a table. Therefore, based on this fixed mapping relationship, after obtaining the S parameters of the test strip 1041, the S parameters of the preset circuit can be calculated accordingly.

[0071] In the above embodiment, based on the structure of the high-speed signal de-embedding component 104 , the S parameters of the test strip 1041 can be accurately determined and the S parameters of the preset circuit can be calculated accordingly.

[0072] In one embodiment, the setting parameters of the test strip 1041 match the S parameters of the preset circuit.

[0073] Specifically, the configuration parameters for test strip 1041 include the following: Structure: Modifying the length, width, shape, or connection method of test strip 1041 to change its electrical properties. Material: Using materials with different electrical conductivity, dielectric constant, or magnetic permeability to change the electrical performance of test strip 1041. Design: Optimizing the circuit design of test strip 1041, such as changing the impedance, capacitance, or inductance of the traces.

[0074] Specifically, because the test strip 1041 is an important component of the high-speed signal de-embedding component 104, and the purpose is to accurately calculate the S parameters of the preset circuit based on the corresponding relationship between the parameters of the test strip 1041 and the S parameters of the preset circuit based on the known S parameters of the test strip 1041, the two are matched. The relationship can be two-fold, multiple-fold, or a corresponding mapping relationship can be determined by looking up a table. It can be limited according to specific circumstances and is not limited here. There is a corresponding relationship between the setting parameters of the test strip 1041 and the S parameters of the test strip. By changing the setting parameters of the test strip, the S parameters of the test strip can be adjusted, and the S parameters of the test strip 1041 are adjusted to have a corresponding mapping relationship with the S parameters of the preset circuit. Then, by measuring the S parameters of the test strip, the S parameters of the preset circuit can be determined.

[0075] In the above embodiment, the setting parameters of the test strip 1041 match the S parameters of the preset circuit, and the error result of the preset circuit can be accurately determined based on the test result of the test strip.

[0076] In one embodiment, the connector type of the first connector 102 includes at least one of a FAKRA radio frequency connector, an ETH Ethernet connector, a BNC connector, and an AEC connector.

[0077] Specifically, the FAKRA RF connector, definition and usage: The FAKRA RF connector is a connector commonly used in automotive electronic systems, providing high-quality, reliable RF signal transmission. It is widely used in in-vehicle wireless communications, satellite navigation, in-car entertainment systems, and other automotive electronic devices.

[0078] ETH Connector, Definition and Usage: An Ethernet connector is a physical interface used to connect computers, network devices, and Ethernet cables. It is a key component in achieving the physical connection between computers, network devices, and Ethernet cables. Common Types: RJ-45 Connector: The most common Ethernet connector, used to connect Category 5, Category 6, or Category 7 Ethernet cables. RJ-11 Connector: Commonly used for telephone lines, but also for some low-speed Ethernet connections.

[0079] The BNC connector (Bayonet Neill-Concelman) is an RF-terminated coaxial cable connector consisting of a center pin, a jacket, and a base, used to connect coaxial cables. Types: BNC-T connector: used to connect computer network cards to network cables. BNC barrel connector: used to connect two thin cables into a longer cable. BNC cable connector: used to solder or screw onto the end of a cable. BNC terminator: used to prevent interference caused by signal reflections after reaching a cable break.

[0080] In the above embodiment, the type of the first connector 102 is accurately determined, and the first connector 102 can be adapted to various types of devices under test, with good adaptability.

[0081] In one embodiment, the connector type of the second connector 103 at least includes an SMA radio frequency coaxial connector.

[0082] Specifically, the SMA RF coaxial connector is a type of connector widely used in the RF and microwave industries. The SMA (Subminiature Type A) coaxial RF connector was developed in the 1960s as an ultra-small connector interface for RF cables with a screw-type coupling mechanism. Technical features: Impedance: The SMA RF coaxial connector has a characteristic impedance of 50Ω. Frequency range: Originally designed for DC (0Hz) to 12GHz, it has now been expanded to higher frequency variants such as 18GHz and 26.5GHz, and even higher connectors such as 27GHz are also produced. Contact method: The contact method of the SMA coaxial RF connector is internal contact, and the conductor of the cable is in close contact with the contact surface of the connector. Electrical performance: It has good RF performance, including bandwidth, impedance matching, insertion loss and durability. Among them, the insertion loss (f=GHz) is generally ≤0.04x√f dB, and the voltage standing wave ratio (VSWR) is ≤1.1+0.2xf.

[0083] Physical Characteristics: Size and Weight: SMA connectors are compact and lightweight, making them suitable for narrow bandwidth and space-constrained applications. Materials: Available in a variety of materials, including stainless steel and brass. Stainless steel versions are often used for higher durability and military / aerospace applications, while brass versions are more commonly used in commercial and telecommunications applications. Mechanical Performance: Mating cycles ≥ 500, connection torque typically ranges from 0.8 to 1.1 Nm, and coupling nut retention force ≥ 270 N.

[0084] Environmental characteristics: SMA RF coaxial connectors can operate in a wide temperature range, typically -45°C to +125°C (some high-performance versions may have a wider temperature range). They have good corrosion resistance.

[0085] In the above embodiment, the second connector 103 is determined to be an SMA radio frequency coaxial connector, which is a radio frequency connector with excellent electrical performance, high reliability and wide applicability, and can meet the needs of various high-frequency applications.

[0086] See Figure 4 As shown, Figure 4 The present invention is a structural diagram of an electronic high-speed signal testing system 4, comprising a testing device 1 for electronic high-speed signals, a device under test 2, and a network analyzer 3. The device under test 2 includes wiring or components, and the testing device 1 is connected to the device under test 2 and the network analyzer 3 respectively; the testing device 1 is used to transmit the test signal of the device under test 2 to the network analyzer 3.

[0087] Specifically, the device under test 2 includes traces or components, also known as the DUT (device under test). DUT, short for Device Under Test, refers to a key object for verification and testing in the field of electronic design. The meaning of DUT varies in different fields. For example, in semiconductor testing, DUT can refer to a specific die on a wafer or a final packaged component. In conventional electronics testing, DUT is used to represent any electronic device under test, such as the chip in a mobile phone or the entire phone.

[0088] A network analyzer is a device specifically designed to measure and analyze microwave network parameters. It can directly measure complex scattering parameters (such as S-parameters) of irreversible or reversible single-port and two-port networks. By sweeping the frequency spectrum, the instrument can reveal the amplitude, phase, and frequency characteristics of various scattering parameters. This analyzer plays a vital role in scientific research, development, and production, and is crucial for supporting the development and production of key technologies and products in the electronics, communications, aerospace, and defense sectors.

[0089] Specifically, the usage process of the above-mentioned system is as follows: the device under test 2 transmits the test signal to the electronic high-speed signal test device 1 through the connected test line (i.e., the wire), and the test device 1 then transmits the signal to the network analyzer 3. The network analyzer 3 obtains the actual test signal containing the error based on the received signal under test (i.e., the high-speed signal under test); because the error of the test device 1 can be accurately determined, therefore, based on the actual test signal and the test error determined by the test device 1, the real test signal of the device under test 2 that is more in line with reality and eliminates the influence of errors can be determined.

[0090] Specifically, see Figure 3 and Figure 4 As shown, the third connector 1042 includes two interfaces, namely an output interface and an output interface. Figure 3J710 is the input interface in the third connector, and J711 is the output interface in the third connector. Then J710 is connected to the output end of the network analyzer 3, and J711 is connected to the input end of the network analyzer 3. This ensures that a path is formed between the network analyzer 3 and the high-speed signal de-embedding component 104, ensuring that the high-speed signal can be transmitted smoothly. Based on the above path, the network analyzer 3 can obtain the S parameters of the high-speed signal de-embedding component 104, and use the obtained S parameters of the high-speed signal de-embedding component 104 as a reference to further determine the S parameters of the preset circuit, because the two are one-to-one matched. It can be understood that during use, a separate path needs to be constructed when measuring the high-speed signal de-embedding component 104, and a separate path also needs to be constructed when measuring the device under test 2, and the two paths cannot coexist at the same time. The above two paths both need to be measured separately for signal measurement, and the specific measurement sequence is not repeated here one by one.

[0091] Because in actual use, the S parameters of the high-speed signal de-embedding component 104 and the S parameters of the preset circuit are debugged, that is, the one-to-one mapping relationship between the two can be a two-fold relationship, a multiple relationship, or a corresponding mapping relationship determined by a lookup table. Therefore, after the measured high-speed signal S parameters of the device under test are obtained through testing, the S parameters of the preset circuit can be calculated based on the S parameters of the high-speed signal de-embedding component 104 obtained through testing. Once the S parameters are known, the error introduced by the preset circuit in the actual test can be determined. Based on the error introduced by the preset circuit in the actual test and the measured high-speed signal S parameters of the device under test, the actual high-speed signal S parameters of the device under test can be obtained after the error influence is removed.

[0092] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the scope of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. A test device for electronic high-speed signals, characterized in that: The device comprises a mounting plate, a first connector, a second connector and a high-speed signal de-embedding assembly, wherein the first connector and the second connector match and are connected based on a preset circuit; The first connectors are provided on both sides of the mounting plate and are connected to the device under test, and are used to receive the signal under test and transmit the signal under test to the corresponding second connector through a preset circuit; The second connector is provided on the board surface of the mounting board and is connected to the network analyzer, and is used for transmitting the signal to be measured to the network analyzer so that the network analyzer detects the signal to be measured; The high-speed signal de-embedding component is arranged on the board surface of the mounting board and is connected to the network analyzer so that the network analyzer detects the S parameters of the preset circuit through the high-speed signal de-embedding component.

2. The test device for electronic high-speed signals according to claim 1, characterized in that: A plurality of first connectors are provided on both sides of the mounting plate, and at least some of the first connectors are of different connector types.

3. The test device for electronic high-speed signals according to claim 2, characterized in that: Each of the first connectors matches at least one of the second connectors 103; The number of second connectors that mate with the first connector is associated with the connector type of the first connector.

4. The test device for electronic high-speed signals according to claim 3, characterized in that: The preset circuit includes a connecting wire for connecting the first connector and at least one matching second connector.

5. The test device for electronic high-speed signals according to claim 1, characterized in that: The high-speed signal de-embedding component includes a 2X Thru Coupon de-embedding component.

6. The test device for electronic high-speed signals according to claim 5, characterized in that: The high-speed signal de-embedding component includes a test strip and two third connectors connected to both ends of the test strip respectively; The two third connectors are connected to the network analyzer, and the network analyzer detects the S parameters of the preset circuit through the third connectors.

7. The test device for electronic high-speed signals according to claim 6, characterized in that: The setting parameters of the test strip match the S parameters of the preset circuit.

8. The test device for electronic high-speed signals according to claim 6, characterized in that: The connector type of the first connector includes at least one of a FAKRA radio frequency connector, an ETH Ethernet connector, a BNC connector, and an AEC connector.

9. The test device for electronic high-speed signals according to claim 6, characterized in that: The connector type of the second connector includes at least an SMA radio frequency coaxial connector.

10. An electronic high-speed signal testing system, characterized in that: The device comprises a test apparatus for electronic high-speed signals according to any one of claims 1 to 9, a device under test, and a network analyzer, wherein the device under test comprises traces or components, and the test apparatus is connected to the device under test and the network analyzer respectively; The testing device is used to transmit the test signal of the device under test to the network analyzer.

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