Sensor element and image display device including the same

Abstract

The utility model provides a sensor element and an image display device comprising the same. The sensor element includes: a sensing electrode; the wire is connected with the sensing electrode; an antenna unit including a radiator and a signal pad; and a circuit board including a core layer, a first signal wiring disposed on one surface of the core layer and bonded to the signal pad, a second signal wiring disposed on the other surface of the core layer, and a via structure penetrating the core layer and electrically connecting the first signal wiring and the second signal wiring, the via structure is disposed between the signal pad and the trace in a planar direction.

Description

Technical Field

[0001] The utility model relates to a sensor element and an image display device comprising the same. Background Art

[0002] Recently, with the development of the information society, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are combined with image display devices and implemented in the form of smartphones, for example. In this case, an antenna can be combined with the image display device to perform a communication function.

[0003] Recently, with the recent evolution of mobile communication technology, for example, an antenna for performing communication in a high frequency or ultra-high frequency band corresponding to 3G to 5G is necessarily incorporated into the image display device.

[0004] On the other hand, electronic devices are being developed that combine a touch panel or touch sensor, which serves as an input device that enables a user to input user commands by selecting indicated content displayed on a screen with a hand or an object, with an image display device to simultaneously realize an image display function and an information input function. For example, as disclosed in Korean Patent Publication No. 2014-0092366, a touch screen panel that combines a touch sensor with a variety of image display devices is being developed.

[0005] When mounting the antenna structure and the touch sensing electrodes together within the limited size and design of the image display device, the gain characteristics of the antenna may be reduced due to mutual signal interference, and the resolution of the touch sensor may also be degraded.

[0006] For example, Korean Patent Laid-Open No. 2003-0095557 discloses an antenna structure built into a portable terminal, but fails to consider compatibility with other electrical components such as a touch sensor. Utility Model Content

[0007] An object of the present invention is to provide a sensor element with improved signal transmission and reception reliability and efficiency.

[0008] An object of the present invention is to provide an image display device including a sensor element with improved signal transmission and reception reliability and efficiency.

[0009] In order to solve the above-mentioned problems, according to one aspect of the present invention, a sensor element is provided, comprising: a sensing electrode; a trace connected to the sensing electrode; an antenna unit comprising a radiator and a signal pad; and a circuit board comprising a core layer, a first signal wiring arranged on one side of the core layer and connected to the signal pad, a second signal wiring arranged on the other side of the core layer, and a through-hole structure passing through the core layer and electrically connecting the first signal wiring and the second signal wiring, wherein the through-hole structure is arranged between the signal pad and the trace in a planar direction.

[0010] The sensing electrodes include first sensing electrodes arranged along a column direction and second sensing electrodes arranged along a row direction.

[0011] The sensing electrodes include a plurality of first sensing electrode columns, each of which includes a first sensing electrode, and the wiring includes a column wiring connected to each of the plurality of first sensing electrode columns.

[0012] The plurality of first sensing electrode columns include: an antenna-sensing electrode column including a groove in a shape for inserting the radiator; and a basic sensing electrode column other than the antenna-sensing electrode column.

[0013] The groove is formed at one end of the antenna-sensing electrode column, and the column wiring extends from the other end of the antenna-sensing electrode column.

[0014] The column routing includes a first column routing extending from the other end of the antenna-sensing electrode column and a second column routing extending from one end of the basic sensing electrode column, and the other end of the antenna-sensing electrode column and the one end of the basic sensing electrode column are facing each other in the column direction.

[0015] The sensing electrodes include a plurality of second sensing electrode rows, each of which includes a second sensing electrode, and the wiring includes a wiring connected to each of the plurality of second sensing electrode rows.

[0016] The running lines include a first running line extending from one end of the second sensing electrode row and a second running line extending from the other end of the second sensing electrode row.

[0017] The sensing electrode and the antenna unit are configured on the same layer.

[0018] The antenna unit and the trace are arranged on the same layer.

[0019] Wherein, the antenna unit further includes a transmission line connecting the radiator and the signal pad.

[0020] The second signal wiring and the routing are separated in the thickness direction via the core layer.

[0021] The sensor element further includes a touch sensor pad connected to one end of the wiring, and the other end of the wiring is connected to the sensing electrode.

[0022] According to another aspect of the present invention, an image display device is provided, comprising: a display panel; and the above-mentioned sensor element.

[0023] The effects of the utility model are as follows.

[0024] According to the embodiment of the present invention, the radiator and the sensing electrode are arranged together in the active area of the sensor element, thereby improving space efficiency.

[0025] In an exemplary embodiment, a first signal wiring connected to the antenna unit and a second signal wiring arranged at a different level from the first signal wiring can be connected via a through-hole structure of a circuit board. The through-hole structure can be arranged in a planar direction between the signal pad of the antenna unit and the trace. Accordingly, the signal of the antenna unit can be transmitted via the second signal wiring that is separated from the trace in the thickness direction across the core layer of the circuit board. Therefore, interference or disturbance between the sensing signal transmitted through the trace and the antenna signal transmitted through the signal wiring can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 and Figure 2 A schematic plan view and a cross-sectional view respectively show a sensor element according to an exemplary embodiment.

[0027] Figure 3 and Figure 4 They are respectively a schematic plan view and a cross-sectional view illustrating an image display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0028] An embodiment of the present invention provides a sensor element including an antenna unit and a sensing electrode, and also provides an image display device including the sensor element.

[0029] The antenna unit may be, for example, a microstrip patch antenna fabricated in the form of a transparent film. A sensor element including the antenna unit may be used, for example, in a communication device for high-frequency or ultra-high-frequency (e.g., 3G, 4G, 5G, or higher) mobile communications. However, the use of the sensor element is not limited to image display devices; the sensor element may also be applied to various structures such as vehicles, household appliances, and buildings.

[0030] The following describes embodiments of the present invention in more detail with reference to the accompanying drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the above-mentioned contents of the present invention, further understand the function of the technical concept of the present invention. Therefore, the present invention should not be limited to the matters described in such drawings.

[0031] The terms "first", "second", "one side", "the other side", "one end", "the other end", "top surface", "bottom surface", "upper part", "lower part", "column direction", "row direction", etc. used in this specification do not limit the absolute position or order, but are used as relative meanings to distinguish different components or parts from each other.

[0032] Figure 1 and Figure 2 Schematic plan view and cross-sectional view respectively show the sensor element of an exemplary embodiment. For example, Figure 2 It is along Figure 1 A cross-sectional view taken along the thickness direction along the II' line.

[0033] Reference Figure 1 and Figure 2 The sensor element may include a substrate layer 100 , and sensing electrodes 110 , 120 , traces 130 , 140 , and an antenna unit 200 disposed on the substrate layer 100 . The antenna unit 200 may include a radiator 210 and a signal pad 230 .

[0034] The substrate layer 100 may include a support layer, an interlayer insulating layer, or a film-type substrate for forming the sensing electrodes 110, 120, the traces 130, 140, and the antenna unit 200. For example, the substrate layer 100 may be provided as a dielectric layer of the antenna unit 200.

[0035] For example, the substrate layer 100 may include a transparent resin film, which includes: polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, polyolefins with a ring system or norbornene structure, and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. These can be used alone or in combination of two or more.

[0036] In some embodiments, the substrate layer 100 may include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0037] In some embodiments, the base material layer 100 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0038] In one embodiment, the substrate layer 100 may be provided as a substantially single layer.

[0039] In one embodiment, the substrate layer 100 may include a multilayer structure of at least two layers. For example, the substrate layer 100 may include a substrate layer and a dielectric layer, and may include an adhesive layer located between the lower substrate and the dielectric layer.

[0040] The substrate layer 100 can form an impedance or inductance for the antenna unit 200 to adjust the frequency band that the antenna unit 200 can drive or sense. In some embodiments, the dielectric constant of the substrate layer 100 can be adjusted to a range of approximately 1.5 to 12. When the dielectric constant exceeds approximately 12, the driving frequency is excessively reduced, and driving in a high frequency band may not be achieved.

[0041] In one embodiment, a ground layer (not shown) is disposed below the bottom surface of the base layer 100 .

[0042] In one embodiment, a conductive component of an image display device or a display panel to which the sensor element is applied may be provided as the ground layer.

[0043] For example, the conductive member may include electrodes or wirings such as gate electrodes, source / drain electrodes, pixel electrodes, common electrodes, data lines, scan lines, etc. included in a thin film transistor (TFT) array panel.

[0044] In one embodiment, a metal component such as a SUS plate provided on the rear surface portion of the image display device, a sensor component such as a digitizer, a heat sink, etc. may be provided as the ground layer.

[0045] The upper surface of the substrate layer 100 includes an active area AA including the drive and sense electrodes 110 and 120 and the radiator 210, and a peripheral area PA including the configuration traces 130 and 140, the signal pads 230, and the touch sensor pads 150. For example, the peripheral area PA can be defined as the area surrounding the active area AA. For example, the peripheral area PA can be defined as the area surrounding the active area AA.

[0046] In an exemplary embodiment, the sensing electrodes 110 and 120 may include first sensing electrodes 110 arranged in a column direction and second sensing electrodes 120 arranged in a row direction. For example, the first sensing electrodes 110 and the second sensing electrodes 120 may be arranged in a direction intersecting each other. In one embodiment, the first sensing electrodes 110 and the second sensing electrodes 120 may be configured on the same layer.

[0047] The term “column direction” used in this specification may refer to a length direction of the sensor element and / or the core layer 310 .

[0048] The term “row direction” used in this specification may refer to a width direction of the sensor elements and / or the core layer 310 .

[0049] In some embodiments, first sensing electrodes 110 may be connected along the column direction via connection portions 115. Connection portions 115 are integrally connected to first sensing electrodes 110 and may be formed as a substantially single component with first sensing electrodes 110.

[0050] In some embodiments, the sensing electrodes 110 and 120 may include a plurality of first sensing electrode columns, each of which includes a first sensing electrode 110. For example, the plurality of first sensing electrodes 110 may be connected by a connecting portion 115 to define a first sensing electrode column extending along the column direction. For example, the plurality of first sensing electrode columns may be arranged along the row direction.

[0051] In some embodiments, each second sensing electrode 120 may have an island pattern shape spaced apart from each other. Second sensing electrodes 120 adjacent to each other in the row direction may be electrically connected via a bridge electrode 125. For example, a pair of adjacent second sensing electrodes 120 separated by a connection portion 115 may be electrically connected via a bridge electrode 125.

[0052] In some embodiments, the sensing electrodes 110 and 120 may include a plurality of second sensing electrode rows, each of which includes a second sensing electrode 120. For example, the plurality of second sensing electrodes 120 may be connected by a bridge electrode 125 to define a second sensing electrode row extending along the row direction. For example, the plurality of second sensing electrode rows may be arranged along the column direction.

[0053] For example, an insulating layer covering the sensing electrodes 110 and 120 may be formed, and the bridge electrode 125 may penetrate the insulating layer to connect the adjacent second sensing electrodes 120. For example, the bridge electrode 125 may be formed on a different layer from the sensing electrodes 110 and 120.

[0054] The first sensing electrodes 110 and the second sensing electrodes 120 may be provided together as a touch sensor. The position and sensitivity of the touch may be sensed by the first sensing electrode columns and the second sensing electrode rows, converted into signals, and transmitted to the touch sensor driver IC chip.

[0055] Although Figure 1 The diagram shows that each of the sensing electrodes 110 and 120 has a diamond pattern shape, but the shape of the sensing electrodes 110 and 120 can be appropriately changed in consideration of pattern density and compatibility with the optical characteristics of the image display device. According to one embodiment, the sensing electrodes 110 and 120 can also be formed to have a wavy outline.

[0056] Although Figure 1 The diagram shows that the column-direction sensing electrodes are integrally connected via a connecting portion, and the row-direction sensing electrodes are connected via a bridging electrode, but the column direction and the row direction are used relatively to refer to two directions intersecting each other and are not intended to limit specific directions.

[0057] In addition, for Figure 1 For ease of illustration, only a portion of the number of first sensing electrode columns and second sensing electrode rows, as well as the number of sensing electrodes therein, are shown and may be expanded according to the area of the active area AA.

[0058] In an exemplary embodiment, the traces 130 and 140 may be connected to the sensing electrodes 110 and 120. For example, the traces 130 and 140 may branch from the first sensing electrode column and the second sensing electrode row and extend over the peripheral area PA.

[0059] The traces 130 , 140 may include a column trace 130 connected to each of the plurality of first sensing electrode columns.

[0060] In some embodiments, the plurality of first sensing electrode columns may include: an antenna-sensing electrode column 112 including a groove 117 shaped to insert the radiator 210; and a basic sensing electrode column 114 other than the antenna-sensing electrode column 112. Accordingly, by arranging the radiator 210 and the sensing electrodes 110 and 120 together in the active area AA, space efficiency can be improved.

[0061] For example, the groove 117 may be formed such that the first sensing electrode 110 adjacent to the radiator 210 is recessed along the upper and side contours of the radiator 210. The radiator 210 may be configured to be inserted into the groove 117.

[0062] For example, the first sensing electrode 110 adjacent to the radiator 210 may be arranged to be spaced apart from the radiator 210 .

[0063] For example, a plurality of antenna units 200 adjacent to each other in the row direction may form an antenna unit array. Figure 1 In the embodiment, two antenna units 200 are arranged adjacent to each other in the row direction, but two to six antenna units 200 can be arranged spaced apart in the row direction. According to one embodiment, four antenna units 200 can be arranged adjacent to each other in the row direction to form an antenna unit array.

[0064] In some embodiments, the distance between the center points of adjacent radiators 210 in the row direction may be 80% to 120% of the distance between the center points of adjacent first sensing electrodes 110 in the row direction. In one embodiment, the distance may be 100%. Accordingly, even if the antenna unit 200 and sensing electrodes 110 and 120 are repeatedly configured, stable sensing performance and a regular radiation pattern can be achieved.

[0065] In some embodiments, a groove 117 is formed in one end 112 a of the antenna-sensing electrode column 112 , and the column trace 130 may branch and extend from the other end 112 b of the antenna-sensing electrode column 112 .

[0066] In some embodiments, column traces 130 may include a first column trace 132 extending from the other end 112b of antenna-sensing electrode column 112, and a second column trace 134 extending from one end 114a of primary sensing electrode column 114. For example, the other end 112b of antenna-sensing electrode column 112 may face the one end 114a of primary sensing electrode column 114 in the column direction. Accordingly, while ensuring space for radiator 210 to be positioned within active area AA, signals can be smoothly transmitted and received between first sensing electrode columns 112 and 114.

[0067] According to one embodiment, the first row of traces 132 may extend from the upper end of the antenna-sensing electrode column 112 , and the second row of traces 134 may extend from the lower end of the basic sensing electrode column 114 .

[0068] In some embodiments, the traces 130 , 140 may include a trace 140 connected to each of the plurality of second sensing electrode rows.

[0069] In some embodiments, the running lines 140 may include a first running line 142 extending from one end of the second sensing electrode row, and a second running line 144 extending from the other end of the second sensing electrode row.

[0070] According to one embodiment, the first running line 142 and the second running line 144 may be connected to two ends of a second sensing electrode row, respectively. Accordingly, the second sensing electrode row is double-routed, thereby improving sensing performance.

[0071] In some embodiments, the antenna unit 200 may include a radiator 210 , a signal pad 230 , and a transmission line 220 connecting the radiator 210 and the signal pad 230 .

[0072] For example, the radiator 210 may have a polygonal plate shape.

[0073] For example, the transmission line 220 may have a smaller width than the radiator 210 and be connected to one end portion or one side of the radiator 210. The radiator 210 and the transmission line 220 may be formed as a single member integrally connected to each other.

[0074] The target resonant frequency of the antenna unit 200 can be adjusted according to the shape and size of the radiator 210. For example, the radiator 210 can be designed to radiate in 3G, 4G, 5G, or higher high-frequency / ultra-high-frequency bands. For example, the radiator 210 can achieve radiation bands above approximately 0.5 GHz, above approximately 1 GHz, above approximately 10 GHz, above approximately 20 GHz, above approximately 30 GHz, or above approximately 40 GHz.

[0075] The signal pad 230 may be configured at the end portion of the transmission line 220. The signal pad 230 may be a single component that is substantially integrated with the transmission line 220. In this case, the end portion of the transmission line 220 may be provided as the signal pad 230.

[0076] The sensing electrodes 110, 120, traces 130, 140, and / or the antenna unit 200 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), or an alloy containing at least one of these. These may be used alone or in combination of two or more.

[0077] In one embodiment, to achieve low resistance and fine line width, the sensing electrodes 110, 120, traces 130, 140 and / or the antenna unit 200 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0078] In some embodiments, the sensing electrodes 110 , 120 , traces 130 , 140 and / or the antenna unit 200 may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx).

[0079] In some embodiments, the sensing electrodes 110, 120, traces 130, 140, and / or antenna unit 200 may include a stacked structure of a transparent conductive oxide layer and a metal layer, such as a two-layer structure of a transparent conductive oxide layer and a metal layer, or a three-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, while the metal layer improves flexibility, signal transmission speed can be increased by reducing resistance, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0080] The sensing electrodes 110, 120, traces 130, 140 and / or antenna unit 200 may include a blackened portion. Accordingly, the reflectivity on the surface of the sensing electrodes 110, 120, traces 130, 140 and / or antenna unit 200 may be reduced, thereby reducing light reflection that makes the pattern visible.

[0081] In one embodiment, the surface of the metal layer included in the sensing electrodes 110, 120, traces 130, 140, and / or antenna unit 200 can be converted into a metal oxide or metal sulfide to form a black layer. In one embodiment, a black layer such as a black material coating or plating can be formed on the sensing electrodes 110, 120, traces 130, 140, and / or antenna unit 200 or the metal layer. The black material or plating can include silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or an oxide, sulfide, alloy containing at least one of these.

[0082] The composition and thickness of the blackened layer can be adjusted in consideration of the reflectivity reduction effect and antenna radiation characteristics.

[0083] In one embodiment, the sensing electrodes 110 , 120 and the radiator 210 may include a mesh structure, and accordingly, the sensing electrodes 110 , 120 and the radiator 210 may be prevented from being visible to the user in the active area AA.

[0084] In one embodiment, at least a portion of the transmission line 220 and the signal pad 230 may include a solid structure. Accordingly, an increase in resistance due to bonding at the connection portion between the antenna unit 200 and the circuit board 300 may be suppressed, and power supply efficiency may be improved.

[0085] In one embodiment, the sensing electrodes 110 and 120 and / or the radiator 210 may include a solid structure, thereby improving sensing sensitivity and radiation performance.

[0086] In some embodiments, the sensing electrodes 110 and 120 and the antenna unit 200 may be formed on the same layer. For example, the sensing electrodes 110 and 120 and the radiator 210 may be patterned on the same layer to have a mesh structure. This can simplify the process and improve the connection reliability of the sensing electrodes 110 and 120 and the radiator 210.

[0087] In some embodiments, the antenna unit 200 and the traces 130 and 140 can be formed on the same layer. For example, when the sensing electrodes 110 and 120 include a transparent conductive oxide and the bridge electrode 125 includes a transparent conductive oxide or a metal, the antenna unit 200, the traces 130 and 140, and the bridge electrode 125 can be patterned on the same layer. This can simplify the process.

[0088] For example, the circuit board 300 and the antenna unit 200 may be electrically connected through the signal pad 230. The signal pad 230 may be disposed in a first bonding area BA1 where the circuit board 300 and the antenna unit 200 are bonded.

[0089] In an exemplary embodiment, the circuit board 300 may include a core layer 310, a first signal wiring 320 disposed on one side of the core layer 310, and a second signal wiring 330 disposed on the other side of the core layer 310. In one embodiment, the circuit board 300 may include flexible printed circuit boards (FPCBs).

[0090] For example, the core layer 310 may include a flexible resin such as polyimide resin, MPI (Modified Polyimide), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. In one embodiment, the core layer 310 may include polyimide resin or MPI.

[0091] The first signal wiring 320 can be bonded to the signal pad 230 of the antenna unit 200 at the first bonding area BA1. For example, one end of the first signal wiring 320 can be bonded to the signal pad 230 to connect the radiator 210 and the first signal wiring 320. Accordingly, signal transmission and reception and / or power supply can be performed between the antenna driver IC chip of the circuit board 300 and the antenna unit 200.

[0092] like Figure 2 As shown, the sensor element may further include a conductive intermediate structure 250 disposed between the signal pad 230 and the circuit board 300 in the first bonding area BA1. For example, the signal pad 230 and the first signal wiring 320 may be bonded / joined to each other via the conductive intermediate structure 250. For example, in the first bonding area BA1, the signal pad 230, the conductive intermediate structure 250, and the first signal wiring 320 may be in contact or stacked in sequence.

[0093] For example, the conductive intermediate structure 250 may be attached to the signal pad 230. Thereafter, one end portion of the first signal wiring 320 may be bonded to the signal pad 230 through a heating / pressurizing process.

[0094] In one embodiment, the conductive intermediate structure 250 may include an anisotropic conductive film (ACF).

[0095] In an exemplary embodiment, the circuit board 300 may include a via structure 340 that passes through the core layer 310 and electrically connects the first signal wiring 320 and the second signal wiring 330 .

[0096] For example, the first signal wiring 320 may extend below the bottom surface of the core layer 310 and be adjacent to the traces 130 and 140 in the thickness direction. For example, the second signal wiring 330 may extend on the top surface of the core layer 310 and be spaced apart from the traces 130 and 140 in the thickness direction across the core layer 310.

[0097] The through-hole structure 340 can be arranged in a planar direction between the signal pad 230 and the traces 130 and 140. Accordingly, in the region where the circuit board 300 and the traces 130 and 140 overlap in a planar direction, the signal of the antenna unit 200 can be transmitted via the second signal wiring 330, which is arranged relatively far away from the traces 130 and 140. This prevents interference or disturbance between the sensing signal transmitted through the traces 130 and 140 and the antenna signal transmitted through the signal wiring 320 and 330. Consequently, the stability and driving reliability of the antenna unit 200 and the sensing electrodes 110 and 120 can be improved.

[0098] The term “in a plane direction” in this specification may refer to “in a plane view of the sensor element (e.g., Figure 1 )” and / or “when the sensor element is viewed from a top view”.

[0099] For example, when the via structure 340 is projected onto the same plane as the signal pad 230 and the traces 130 and 140 , the via structure 340 may be disposed between the signal pad 230 and the traces 130 and 140 along the column direction.

[0100] For example, when the core layer 310 is projected onto the same plane as the signal pad 230 and the traces 130 and 140, a via hole may be formed in the region between the signal pad 230 and the traces 130 and 140 of the core layer 310. The via structure 340 may be formed by filling the via hole with the aforementioned metal and / or material.

[0101] The first signal wiring 320 , the second signal wiring 330 , and the via structure 340 may include the aforementioned metal and / or alloy.

[0102] In one embodiment, the first signal wiring 320 , the second signal wiring 330 , and the through-hole structure 340 may be integrally formed using substantially the same material.

[0103] In some embodiments, the sensor element may further include a touch sensor pad 150 connected to one end of the traces 130 , 140 . The other end of the traces 130 , 140 may be connected to the sensing electrodes 110 , 120 .

[0104] Touch sensor pads 150 can be disposed in the second bonding area BA2. Touch sensor pads 150 can be electrically connected to a touch circuit board (not shown) in the second bonding area BA2. Accordingly, signals sensed by sensing electrodes 110 and 120 can be transmitted to the touch sensor driver IC chip via traces 130 and 140, touch sensor pads 150, and the touch circuit board.

[0105] For example, the touch circuit board and the touch sensor pads 150 may be connected by a method substantially the same as / similar to the bonding of the circuit board 300 and the signal pads 230 .

[0106] In some embodiments, the touch circuit board and the circuit board 300 can be connected to the periphery of the same surface of the substrate layer 100. For example, they can be bonded to the lower portion of the substrate layer 100 of the touch circuit board and the circuit board 300, respectively. This can reduce the distance between the touch circuit board and the touch sensor driver IC chip, and the distance between the circuit board 300 and the antenna driver IC chip. This improves space efficiency and signal efficiency.

[0107] Figure 3 and Figure 4 They are respectively a schematic plan view and a cross-sectional view illustrating an image display device according to an exemplary embodiment.

[0108] Figure 3 The front surface or window surface of the image display device 400 is shown. The front surface of the image display device 400 may include a display area 430 (DA) and a non-display area 440 (NDA). The non-display area 440 may correspond to a light shielding portion or a frame portion of the image display device 400, for example.

[0109] The sensor element of the exemplary embodiment may be disposed toward the front surface of the image display device 400 , for example, may be disposed on a display panel.

[0110] In some embodiments, the sensor element may be attached to the display panel in the form of a film.

[0111] In some embodiments, sensor elements may be formed on the display area 430 and the non-display area 440 of the image display device 400 .

[0112] In some embodiments, the active area AA of the sensor element may overlap with the display area 430. In one embodiment, the sensing electrodes 110, 120 and / or the radiator 210 may at least partially overlap with the display area 430.

[0113] In some embodiments, the peripheral area PA of the sensor element may overlap the non-display area 440. The traces 130, 140 and / or the signal pad 230 may at least partially overlap the non-display area 440. For example, a portion of the sensor element having a solid structure may overlap the non-display area 440.

[0114] The sensor element can be powered or driven by the circuit board 300 and the touch circuit board. Figure 4 In the figure, the touch circuit board is omitted for ease of explanation.

[0115] The antenna driving IC chip 350 can be mounted on the circuit board 300. Figure 4 As shown, an intermediate circuit board 360 such as a rigid printed circuit board may be disposed between the circuit board 300 and the antenna driver IC chip 350. In one embodiment, the antenna driver IC chip 350 may be directly mounted on the circuit board 300.

[0116] The touch sensor driver IC chip can be mounted on the touch circuit board. For example, an intermediate circuit board 360 can be disposed between the touch circuit board and the touch sensor driver IC chip. For example, the antenna driver IC chip 350 and the touch sensor driver IC chip can be disposed on the same intermediate circuit board 360. In this case, the circuit board 300 and the touch circuit board can be connected together to a single intermediate circuit board 360.

[0117] Reference Figure 4 The image display device 400 may include a display panel 410 and the above-mentioned sensor element configured on the display panel 410.

[0118] According to an exemplary embodiment, the display panel 410 may further include an optical layer 420. For example, the optical layer 420 may be a polarizing layer including a polarizer or a polarizing plate.

[0119] The circuit board 300 and the touch circuit board (e.g., a flexible printed circuit board) can be bent along the side curved contour of the display panel 410, for example, and be arranged on the back portion of the image display device 400, and can extend toward the intermediate circuit board 360 (e.g., a main board) on which the antenna driver IC chip 350 and the touch sensor driver IC chip are mounted.

[0120] The circuit board 300 and the intermediate circuit board 360 are joined or connected to each other through a connector, so that power supply to the antenna unit 200 and antenna driving control can be performed through the antenna driving IC chip 350 .

[0121] The touch circuit board and the intermediate circuit board 360 are joined or connected to each other through a connector, so that power supply to the sensing electrodes 110 and 120 and touch signal transmission can be performed by the touch sensor driver IC chip.

Claims

1. A sensor element, characterized in that: include: sensing electrodes; a wiring connected to the sensing electrode; An antenna unit comprising a radiator and a signal pad; as well as A circuit board comprising a core layer, a first signal wiring arranged on one side of the core layer and bonded to the signal pad, a second signal wiring arranged on the other side of the core layer, and a through-hole structure penetrating the core layer and electrically connecting the first signal wiring and the second signal wiring. The through-hole structure is arranged between the signal pad and the trace in a planar direction.

2. The sensor element according to claim 1, characterized in that The sensing electrodes include first sensing electrodes arranged along a column direction and second sensing electrodes arranged along a row direction.

3. The sensor element according to claim 2, characterized in that The sensing electrodes include a plurality of first sensing electrode columns, each of which includes a first sensing electrode. The traces include a column trace connected to each of the plurality of first sensing electrode columns.

4. The sensor element according to claim 3, characterized in that The plurality of first sensing electrode columns include: an antenna-sensing electrode array including a groove shaped to be inserted into the radiator; and A basic sensing electrode column other than the antenna-sensing electrode column.

5. The sensor element according to claim 4, characterized in that The groove is formed at one end of the antenna-sensing electrode column, and the column trace extends from the other end of the antenna-sensing electrode column.

6. The sensor element according to claim 5, characterized in that The column traces include a first column trace extending from the other end of the antenna-sensing electrode column and a second column trace extending from one end of the basic sensing electrode column. The other end of the antenna-sensing electrode column and the one end of the basic sensing electrode column face each other in the column direction.

7. The sensor element according to claim 2, characterized in that The sensing electrodes include a plurality of second sensing electrode rows, each of which includes a second sensing electrode. The routing lines include a routing line connected to each of the plurality of second sensing electrode rows.

8. The sensor element according to claim 7, characterized in that The running lines include a first running line extending from one end of the second sensing electrode row and a second running line extending from the other end of the second sensing electrode row.

9. The sensor element according to claim 1, wherein The sensing electrode and the antenna unit are configured on the same layer.

10. The sensor element according to claim 1, wherein The antenna unit and the trace are arranged on the same layer.

11. The sensor element according to claim 1, wherein The antenna unit further includes a transmission line connecting the radiator and the signal pad.

12. The sensor element according to claim 1, wherein The second signal wiring and the routing are spaced apart in a thickness direction via the core layer.

13. The sensor element according to claim 1, wherein Also includes: A touch sensor pad connected to one end of the trace, The other end of the wiring is connected to the sensing electrode.

14. An image display device, characterized in that: include: Display panel; as well as The sensor element according to claim 1.

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