Plasma system and plasma array system using same

Abstract

The utility model provides a plasma system and a plasma array system using the same. The plasma system comprises at least two power supply modules, a matching network module, a plasma processing chamber and a data processing and control module, the power module is used for generating a first power signal. The power supply module is electrically connected with the matching network module and transmits at least one first power supply signal to the adaptive network module; the power supply module is electrically connected with the plasma processing chamber and is used for outputting electric energy and / or electric signals to the plasma processing chamber; and the data processing and control module is electrically connected with the power supply unit, the matching network module and the plasma processing chamber. Through the implementation of the system, the parameters of the power supply can be adjusted with the help of data, so that the product of the sputtering process and the process quality improve the final product and implementation quality by improving the effect of preventing defects (such as cracking).

Description

Technical field:

[0001] The utility model relates to a plasma system and a method for operating the plasma system. Background technology:

[0002] Plasma-based processes are used for surface coatings of glass and semiconductor components. A plasma is a collection of charged and neutral particles, such as electrons, atoms, ions, and free radicals. Plasma only exists under specific environmental conditions, which must be controlled by the equipment and plasma process. One process for coating surfaces, particularly glass and semiconductors, is sputtering. In this process, a target material is atomized by the plasma and then deposited onto the workpiece, known as the substrate.

[0003] Various defects in the substrate can occur during the sputtering process. One example is hairline cracks, also known as crazing. These are surface defects in the workpiece that extend through the substrate like cracks. Crazing is highly desirable and can lead to the rejection of the affected component due to damage. One suspected cause is the potential difference between the plasma and the earth. To reduce these problems during the ongoing process, various companies are experimenting with modifying plasma parameters. This is done by adjusting the parameters of the circuits coupling to the plasma. This includes the power supply circuit and may also include a matching network module. It is currently unclear which parameters need to be modified in what manner, and even in what combination, to reduce crazing and thus ensure the integrity of the workpiece.

[0004] For example, prior art EP3796362A1 describes a process for plasma treatment of a substrate in a plasma chamber and plasma treatment system. The plasma treatment system includes a generator with controls and a plasma chamber with electrodes and sensors. The method involves supplying power to the plasma chamber to generate plasma. Parameters associated with the plasma process are then observed. Features associated with the observed parameters are then determined. Finally, power is adjusted during the plasma process to reduce the features. Research has also shown that artificial intelligence or machine learning methods can be used to identify features or parameters. Utility model content:

[0005] The present application provides a plasma system and a plasma array system using the same.

[0006] In a first aspect, the present application provides a plasma system comprising at least two power modules, a matching network module, a plasma processing chamber, and a data processing and control module; the power modules are configured to generate a first power signal; each power module is electrically connected to a matching network module and transmits at least one first power signal to the matching network module;

[0007] The power supply modules are all electrically connected to the plasma processing chamber and are used to output electrical energy and / or electrical signals to the plasma processing chamber; the data processing and control module is electrically connected to the power supply unit, the matching network module, and the plasma processing chamber; the data processing and control module is used to collect data related to the plasma process in the form of parameters of power signals and / or process variables and / or state variables from at least two modules of the power supply unit, the matching network module, and the plasma processing chamber, and analyze and process the data, and adjust the parameters of at least two of the power supply unit, the matching network module, and the plasma processing chamber according to the processing results.

[0008] In a second aspect, the present application provides a plasma array system, comprising: a plasma system as described above;

[0009] at least two power modules for generating a power signal;

[0010] A matching network module electrically connected to the power module;

[0011] a plasma processing chamber electrically connected to the power module and the matching network module;

[0012] A data processing and control module electrically connected to the power module, the matching network module, and the plasma processing chamber;

[0013] The power module absorbs the forward power Pi and / or the reflected power Pr;

[0014] The data processing and control module is used to store data in the form of process and / or state variables in at least two of the following units:

[0015] Any or all power modules;

[0016] Matching network module;

[0017] Plasma processing chamber;

[0018] and / or a data processing and control module for recording, synchronizing, processing and analyzing and generating a parameter beam suitable for improving plasma processing results, and controlling one of the following units based on the parameter beam:

[0019] Any or all of the power modules;

[0020] Matching network module;

[0021] Plasma processing chamber.

[0022] Through the above technical solution, compared with the existing technology, the utility model has the following beneficial effects:

[0023] The parameters of the power supply are adjusted with the help of the data so that the product and process quality of the sputtering process is improved by improving the effect of preventing defects (such as cracking) to improve the quality of the final product and the implementation. Description of the drawings:

[0024] Figure 1 Showing the system module diagram of the plasma system in the embodiment of the present application

[0025] Figure 2 The operation steps of the plasma system in the embodiment of the present application are shown

[0026] Figure 3 Shows the plasma system signal transmission logic diagram in the embodiment of the present application

[0027] Figure 4 The plasma system in another embodiment of the present application is shown

[0028] Figure 5 Shows other operating steps of the plasma system of the embodiment of the present application

[0029] Figure 6 Shows the local module connection diagram of the plasma array system in the embodiment of the present application

[0030] Figure 7 Shows the module connection diagram of the control system in the embodiment of the present application. Specific implementation method:

[0031] The first embodiment of the present application discloses a plasma system 100, such as Figure 1 As shown, it includes two power modules 110 (because the two power modules have the same connection and function, Figure 1 Only one of them is released as a representative), the power supply module 110 is electrically connected to the matching network module 120, and the matching network module 120 is electrically connected to the plasma processing chamber 130. Through the connection of the above circuit system, the power supply module 110 can use the matching effect of the matching network module 120 to complete the basic power supply operation to the plasma processing chamber 130.

[0032] Further, such as Figure 1 As shown, the system also includes a data processing and control module 145, which is electrically and signal-connected to the power module 110, the matching network module 120, and the plasma processing chamber 130. The data processing and control module 145 is configured to receive and process signals from the power module 110, the matching network module 120, and the plasma processing chamber 130. The data processing and control module 145 is electrically connected to a data storage device 150, which receives and stores data from the data processing and control module 145.

[0033] In actual operation, the following methods are used to collect, analyze and control equipment data, which can improve the product and process quality of the sputtering process by preventing defects (such as cracking) and thus improve the quality of the final product and implementation.

[0034] like Figure 2 As shown, the operation steps are:

[0035] Step 11, generating a first power signal 123 and transmitting it to the matching network module 120;

[0036] Step 12: Adjust the first power signal 123 as needed.

[0037] Step 13 : Start the plasma processing chamber and run the plasma process under the power signal output by the matching network module 120 .

[0038] In step 14, the data processing and control module 145 records data and synchronizes the data generated at different times into the data storage 150. The data includes parameters of the power signal, and states and process variables of the power module 110, matching network module 120, and plasma processing chamber 130. Power signal parameters are quantities describing the power signal, particularly physical quantities such as current, power, voltage, or pulse frequency. These can be accessed from anywhere in the power module 110 or between the power module 110 and the plasma processing chamber 130. State quantities and process variables of the power module 110, matching network module 120, or plasma processing chamber 130 can be physical or chemical quantities, or other quantities related to the plasma processing process. For example, this could be the gas pressure of the plasma process. Data synchronization can be achieved by recording time data. This allows data from the power module 110, matching network module 120, and plasma processing chamber 130 to be arranged in such a way that, for example, at the start of a process, data from all parts of the plasma system can be analyzed synchronously.

[0039] For example, when the power supply module 110 is a high-frequency power supply, for example, in the high-frequency power supply module 110 , the parameters that can be recorded on the power supply unit include the forward running power Pi and the reflected power Pr.

[0040] In step 15 , the data stored in the calling data memory 150 is compared with the newly generated data in the data processing and control module 145 .

[0041] Step 16 further analyzes the data. The data can be analyzed by comparison with other data. Analysis can also be performed by comparison with a threshold value. Different quantities can also cancel each other out, for example by forming a variance. It is also conceivable that the frequency of certain values of a quantity can be used for analysis. For example, the result of a plasma process can be the quality of the processed substrate. Compared to conventionally produced substrates, substrates with fewer cracks are of higher quality. Substrates with less pressure differentials are of higher quality than substrates with relatively higher pressure differentials, such as failed transistors or pixels.

[0042] Step 17, based on the analyzed data, generates a parameter bundle. The parameter bundle is a set of control variable values for the plasma system 100, which can improve the plasma process, such as reducing damage caused by cracking. The parameter bundle is created in such a way that setting these values during process execution can improve the process. "Improvement" refers to the result of an improvement in terms of the defined requirements. In this case, avoiding, reducing the severity or mitigating the consequences of cracking may be an improvement. During the analysis process, analysis methods based on machine learning or artificial intelligence can be introduced. Methods based on machine learning or artificial intelligence can be used to synchronize, process, analyze and / or generate parameter packages. This process can be initiated by training data. This training data can be loaded from memory. The training data can also come from the same plasma system or other plasma systems, especially similar plasma systems. Training data from non-identical plasma systems can be adjusted before the training process. In addition, by checking whether improvements occur due to a set of parameters, the program can learn and improve itself, especially autonomously.

[0043] In step 18, based on the parameter bundle, the parameters of the power module 110, matching network module 120, and plasma processing chamber 130 are adjusted, and step 11 is repeated. After adjusting the parameters of each module using the parameters of the parameter bundle, the plasma process results predicted by the parameter bundle can be compared to determine if any changes have occurred. This information can be stored along with the recorded data and parameter bundle. The plasma process results can be improved through manual operator control, which can then be input via an interface. Automated inspection of the substrate can also be performed, such as through electrical or optical inspection. The results of the automated inspection can be automatically transmitted to a data processing unit. These results can also be used to determine whether the parameter bundle has achieved the intended improvements in the plasma process results.

[0044] In the process of implementing the above steps, if Figure 1 and Figure 3As shown, after the power module 110 generates the first power signal 123, the first power signal 123 is transmitted to the plasma processing chamber 130 via the matching network module 120 to power it. At the same time, the power module 110, the matching network module 120, and the plasma processing chamber 130 all generate a data stream 142 and transmit it to the data processing and control module 145. The data processing and control module 145 transmits data with the data storage 150 through the storage link 143.

[0045] In any embodiment of the present application, Figure 4 As shown, the data processing and control module 145 includes a data processing unit 140 and a control unit 141. The data processing unit 140 and the control unit 141 are electrically connected and signal connected. The data processing unit is used to connect to the data storage 150 and perform signal interaction, as well as to complete the above-mentioned steps 16 and 17. The control unit 141 is used to receive a parameter beam from the data processing unit and perform parameter adjustment control on the power supply module 110, the matching network module 120 and the plasma processing chamber 130 as shown in step 18.

[0046] Furthermore, in any embodiment of the present application, the control unit 141 includes a power controller 111 for controlling the power module 110, a network controller 121 for controlling the matching network module, and a processing chamber controller 131 for controlling the plasma processing chamber. The power controller 111, the network controller 121, and the processing chamber controller 131 can all be integrated with the modules they control.

[0047] One or more or all of the power controller 111, network controller 121, and process chamber controller 131 may be integrated into a universal controller. Regardless of whether the controller is integrated into one component, power control, adaptive network control, and plasma process chamber control may be controlled simultaneously.

[0048] In any embodiment of the present application, the data storage 150 can be located remotely from the plasma system. In addition, the data processing and control module 145 can have internal memory. This allows for temporary storage of data from the remote data storage 150, thereby reducing delays.

[0049] In any embodiment of the present application, the operation steps further include:

[0050] Step 21, recording process data. The recorded data may be the data to the power module 110, the matching network module 120, the plasma processing chamber 130, and the power signal 123. This will generate recorded process data 21a.

[0051] In step 22, the data is analyzed. In addition to the recorded process data 21a, data 26a previously stored in the data memory and the data processing and control module 145 can also be used for this purpose. The analysis may include determining correlations, artificial intelligence techniques, or other analytical methods.

[0052] Step 23: Receive the data analyzed in step 22 and derive and generate a parameter bundle.

[0053] In step 24, existing process parameters are replaced by corresponding parameters in the parameter pack, which will change the characteristics of the process.

[0054] Step 25 captures the parameter bundle and the results of implementing it. If the parameter bundle had a positive impact on the process as expected, it is saved. If a bundle that was supposed to have a positive impact missed it, it is also saved.

[0055] Step 26: store the above data 21a and obtain new data 26a.

[0056] Through the above two sets of loop operation logic, the system can continuously iterate during operation, thereby achieving better risk avoidance and crack reduction effects.

[0057] In another embodiment of the present application, a plasma array system is disclosed, which includes the above-mentioned plasma system 100. Furthermore, a plasma array system includes multiple plasma systems 100, such as Figure 6 As shown, in the plasma array system, the data storage device 150 can be connected to the data processing and control modules 145a, 145b in multiple plasma systems 100 at the same time, so as to store data acquired by multiple plasma systems, and in the operation steps, the data is assigned to multiple data processing and control modules 145a, 145b, so as to achieve a wider range of data comparison and analysis, and further enhance the beneficial effects brought by this system.

[0058] In any embodiment of the present application, the data storage 150 provides access to multiple data processing units of multiple plasma systems, in particular via a wireless connection, in particular in cloud storage. The location of the memory can be selected independently of the location of the plasma system. Cloud storage here refers to a storage device, in particular local or remote, preferably anonymous, in which results, i.e., multiple user ratings, are advantageously stored by hundreds or thousands of different users. This allows different users to contribute to the optimization of a process or system, regardless of the manufacturing location. It is recognized that the above-described method has achieved great success in correctly assigning attribution information with the highest probability, especially when reading tens of thousands, and in particular hundreds of thousands, of user reviews. Such a large amount of data is generally not available for a single production facility in a single year.

[0059] In any embodiment of the present application, the data and / or parameter package is backed up in the local data storage 150 , or the data and / or parameter package can be loaded from a central storage (particularly a cloud storage) into the local storage.

[0060] In any embodiment of the present application, Figure 7 As shown, a control system 600 is also included, which can execute instructions of one or more aspects of any device of the present invention. For example, the control system 600 can be used to implement the control unit 141, the data processing unit 140 or the data processing and control module 145. Figure 7 The components shown should be understood as examples and do not limit the scope or functionality of hardware, software, firmware, embedded logic components, or combinations of several such components to implement specific embodiments of the present invention. Some or all of the components shown may be part of the control system 600.

[0061] In any embodiment, the control system 600 includes at least one processor 601, such as a central processing unit (CPU, DSP) or a programmable logic device (PLD, FPGA). The control system 60 may also include a memory 603 and a hard disk 608, both of which communicate with each other and with other components via a bus 640. The bus 640 may also connect a display 632, one or more input devices 633, one or more output devices 634, one or more storage devices 635, and various storage media 636 to each other, and to the one or more processors 601, memory 603, and hard disk 608. All of these components may be connected directly to the bus 640 or via one or more interfaces or adapters 622, 623, 624, 625, and 626.

[0062] The control system 600 can have any suitable physical form, including but not limited to one or more integrated circuits (ICs), printed circuit boards (PCBs), handheld mobile devices, laptops or notebook computers, distributed computer systems, computing grids, or servers. The processor 601 or central processing unit (CPU) can include a cache memory unit 602 for temporary local storage of commands, data, or processor addresses. The processor 601 is configured to support the execution of instructions stored on at least one storage medium.

[0063] The memory 603 may include various components, including but not limited to random access memory components, such as RAM 604, particularly static RAM "SRAM", dynamic RAM "DRAM", etc., read-only components, such as B.ROM 605, and any combination thereof. ROM 605 may also be used to transfer data and instructions unidirectionally to the processor EN 601, and RAM 604 may also be used to transfer data and instructions bidirectionally to the processor 601.

[0064] The hard disk 608 is bidirectionally connected to the processor 601 and can be optionally connected through the memory control unit 607. The hard disk 608 provides additional storage capacity. The hard disk 608 can be used to store the operating system 609, programs 610, data 611, application programs 612, application programs, etc. Usually (but not always), the hard disk 608 is a secondary storage device (such as a hard disk) that is slower than the primary storage (such as the memory 603). For example, the hard disk 608 can also include magnetic, optical, transistorized, solid-state storage devices (for example, flash memory-based systems), or any combination of the above. Where appropriate, the hard disk 608 can be integrated into the 603 memory as virtual memory.

[0065] The bus 640 connects a large number of subsystems. The bus 640 can be any of several types of bus structures, such as a memory bus, a memory controller, a peripheral bus, a local bus, and all combinations thereof, using various bus architectures. Information and data can also be displayed via the display 632. Examples of the display 632 include, but are not limited to, a liquid crystal display (LCD), an organic liquid crystal display (OLED), a cathode ray tube (CRT), a plasma display, and any combination thereof. The display 632 can be connected to the processor 601, the memory 603, the hard disk 608, the input device 633, and other components via the bus 640.

[0066] Bus 640 can connect all of the aforementioned components to an external network, such as Cloud 630, via network interface 620. This can be a LAN, WLAN, or the like. It can also connect to other storage media, servers, printers, and display devices. It can also access telecommunications equipment and the Internet. Bus 640 can connect all of the aforementioned components to graphics control 621 and graphics interface 622, which can be connected to at least one input device 633. Bus 640 can also connect all of the aforementioned components to input interface 623, which can be connected to at least one input device 633. Input devices may include, for example, a keypad, keyboard, mouse, pen, touchscreen, and the like.

[0067] The bus 640 can connect all of the above components to an output interface 624, which can be connected to at least one output device 634. The output device 634 can have a light emitting display, an LED display, a display (such as LCD, OLED, etc.) or an interface to such a device.

[0068] A bus 640 can connect all of the above components to a memory access interface 625, which can be connected to at least one storage device 635. Bus 640 can also connect all of the above components to another memory access interface 626, which can be connected to at least one storage medium 636. Storage device 635 or storage medium 636 can be, for example, solid-state, magnetic, or optical memory, particularly non-volatile memory. The storage medium can be disconnected from the control system during operation without losing any data.

[0069] The display 632, input device 633, output device 634, storage device 635, and storage medium 636 may all be located outside the control system 600 or integrated into the control system 600. They may also be connected to the control system 600 by connecting to the Internet or other network interfaces.

[0070] By implementing any of the embodiments described in this application, the following special effects can be achieved in the plasma process:

[0071] In all embodiments, identical or functionally equivalent elements are denoted by the same reference symbols.

[0072] The described method and the described plasma system and plasma array system are used to improve difficult, non-optimal plasma processes by using digital methods to comprehensively and iteratively improve, in particular optimize, plasma process parameters. The system and / or program may also be referred to as a Digital Process Assistant (DPA).

[0073] The process for improving, and in particular optimizing, plasma processes and plasma systems can include the following steps: 1) Generator data, primarily Pi and Pr, which are faster data representing the plasma process. Most other plasma data (such as pressure or gas mixture) are usually slow and can only be determined more slowly.

[0074] 2) Observe the ignition behavior, arc behavior, impedance curve, energy input, timing behavior and other characteristics of the plasma system.

[0075] 3) Analyze, correlate, and synchronize data.

[0076] 4) Improvements, especially process improvements, determine and adjust time step, line height and slope, energy density, frequency and frequency slope, pulse frequency and width, and arc parameters.

[0077] 5) Improve the internal structure of the power supply unit, especially adjust the parameters.

[0078] 6) Send improvement suggestions to factory control department, such as time suggestions, cycle times, and power settings.

[0079] VII) Ensure all processes are synchronized with the process to confirm effectiveness and achieve further improvements.

[0080] h) Record and take into account other process parameters from the superordinate system control, such as pressure, gas mixture, coating or reduction target.

[0081] 9) Use the experience data stored in the database.

[0082] 10) Use iterations in repetitive processes or process steps to examine and further improve efficiency.

[0083] 11) Save the acquired data, improvements, and parameters in a database.

[0084] 12) Determine and recommend the recipe for the entire process.

[0085] In addition, the process and the plasma system may have the following features or functions:

[0086] 13) When processing synchronization information, process starts, process steps, repetitions and process ends are taken into account.

[0087] 14) The method can be run in parallel with the process steps. Detection, reaction and / or improvement can be performed simultaneously.

[0088] 15) Through the synchronous processing of information, targeted iterations can be applied, their results verified, and further improvements can be made.

[0089] xvi) Information from higher-level system control systems and other system components may be taken into account.

[0090] 17) Manual measurements and interventions can and / or should be reduced, especially to a minimum

[0091] 18) Its purpose is to obtain and apply significantly improved, especially optimized, process recipes.

[0092] 19) DPA can be run on the power supply unit, control panel, supplemental host or web-based.

Claims

1. A plasma system, characterized in that: It includes at least two power supply modules (110), a matching network module (120), a plasma processing chamber (130), and a data processing and control module (145); The power supply module (110) is used to generate a first power supply signal (123); The power supply modules (110) are all electrically connected to the matching network module (120) and transmit at least one of the first power supply signals (123) to the matching network module (120); The power modules (110) are electrically connected to the plasma processing chamber (130) and are used to output electrical energy and / or electrical signals to the plasma processing chamber; The data processing and control module (145) is connected to the power supply unit (110) and the matching network module (120) and the plasma processing chamber (130) are electrically connected; The data processing and control module (145) is used to obtain the data from the power supply unit (110), the matching network module Data related to the plasma process is collected in the form of parameters of power signals and / or process variables and / or state variables in at least two modules of the plasma processing chamber (130), and the data is analyzed and processed, and parameters of at least two of the power supply unit (110), the matching network module (120), and the plasma processing chamber (130) are adjusted according to the processing results.

2. The plasma system according to claim 1, wherein: The data processing and control module (145) includes a control unit (141) and a data processing unit (140).

3. The plasma system according to claim 1, wherein: The invention also includes a data storage device (150), wherein the data storage device (150) is electrically connected to the power supply unit (110), the matching network module (120), and the plasma processing chamber (130), and is used to store signals from any unit.

4. The plasma system according to claim 3, wherein: The connection between the data storage (150) and the power supply unit (110), the matching network module (120), and the plasma processing chamber (130) is achieved through a wireless connection module (143).

5. The plasma system according to any one of claims 1 to 4, characterized in that: It comprises a plurality of the power supply modules (110) and / or a plurality of the matching network modules (120).

6. A plasma array system comprising: At least one plasma system according to any one of claims 1 to 5; at least two power modules (110) for generating a power signal (123); a matching network module (120) electrically connected to the power module (110); a plasma processing chamber (130) electrically connected to the power module (110) and the matching network module (120); a data processing and control module (145) electrically connected to the power supply module (110), the matching network module (120), and the plasma processing chamber (130); Its characteristics are: The power module (110) absorbs the forward power Pi and / or the reflected power Pr; The data processing and control module (145) is used to store data in the form of process and / or state variables in at least two of the following units: Any or all of the power modules (110); Matching network module (120); Plasma processing chamber (130); and / or the data processing and control module (145) is used to record, synchronize, process and analyze and generate a parameter beam suitable for improving plasma processing results, and control one of the following units according to the parameter beam: Any or all of the power modules (110); Matching network module (120); • Plasma processing chamber (130).

7. The plasma array system according to claim 6, wherein: The invention also includes a data storage (150), wherein the data storage (150) is electrically connected to a plurality of data processing and control modules (145) of the plasma system (100) and is used for storing data and / or parameter bundles.

8. The plasma array system according to claim 7, wherein: The data storage (150) is connected to at least one of the data processing and control modules (145) via a wireless connection module (143).

9. The plasma array system according to any one of claims 6 to 8, characterized in that: The data processing and control module (145) includes a control unit (141) and a data processing unit (140).

10. The plasma array system according to claim 9, wherein: It also includes one or more of a power supply control (111), a matching network module control (121) or a plasma processing chamber control (131), which are respectively used to electrically connect to and control the power supply module (110), the matching network module (120) and the plasma processing chamber (130).

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