Hollow flexible vacuum adsorption ring and wafer adsorption device

Abstract

The utility model relates to the technical field of semiconductor production, in particular to a hollow flexible vacuum adsorption ring and a wafer adsorption device provided with the hollow flexible vacuum adsorption ring, the hollow flexible vacuum adsorption ring comprises a body made of flexible materials, the body is of an annular structure, the middle part of the body is provided with a through circular through hole, and the hollow flexible vacuum adsorption ring is arranged in the through circular through hole. A plurality of adsorption holes are distributed in the body in an annular array around the circle center of the circular through hole, and the adsorption holes are used for being externally connected with a vacuum source and adsorbing wafers through vacuum. According to the utility model, the annular body is made of the flexible material, the adsorption holes are uniformly distributed on the body, and the adsorption of the wafer is realized through the adsorption holes, so that the stable adsorption of the wafer is ensured, and the impact force on the wafer can be effectively reduced, thereby reducing the probability of wafer fragmentation.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a hollow flexible vacuum adsorption ring and a wafer adsorption device. Background Art

[0002] Wafers are silicon wafers used to manufacture silicon semiconductor circuits. Their starting material is silicon. As semiconductors shrink in size, the requirements for wafer specifications are becoming increasingly stringent. However, due to the extreme thinness of wafers, traditional vacuum suction devices often cause wafer breakage during wafer handling, hindering smooth production. Summary of the Invention

[0003] Aiming at the problems of the prior art, the utility model provides a hollow flexible vacuum adsorption ring and a wafer adsorption device, which can reduce the occurrence of wafer breakage when picking up wafers.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] The utility model provides a hollow flexible vacuum adsorption ring, which includes a main body made of flexible material. The main body is a ring structure, and a circular through hole is provided in the middle of the main body. The main body has a plurality of adsorption holes distributed in a ring array with the center of the circular through hole. The adsorption holes are used to connect to an external vacuum source and adsorb wafers through vacuum.

[0006] Furthermore, the inner diameter of one of the adsorption holes is larger than the inner diameters of the other adsorption holes, and the inner walls on both sides of the adsorption hole with the larger inner diameter are respectively provided with limit members, and the bottom of the limit members is provided with an inclined surface;

[0007] Auxiliary adsorption holes are respectively provided on both sides of the adsorption hole with a large inner diameter.

[0008] Furthermore, there are two adsorption holes with large inner diameters, and the two adsorption holes with large inner diameters are symmetrically arranged with one diameter of the circular through hole as the symmetry axis; auxiliary adsorption holes are respectively provided on both sides of each adsorption hole with large inner diameter.

[0009] Furthermore, the ratio of the inner diameter of the adsorption hole with a large inner diameter to the inner diameter of the other adsorption holes is 1:2.5-1:4.

[0010] Furthermore, a sealing structure is provided at the bottom of the main body, and the sealing structure includes an inner sealing part and an outer sealing part. The inner sealing part is located inside the outer sealing part, and the outer side wall of the outer sealing part is recessed inward to form a positioning groove. The inner sealing part is provided with a connecting hole connected to the circular through hole.

[0011] Furthermore, the main body, the inner sealing part and the outer sealing part are integrally formed.

[0012] Furthermore, the bottom of the adsorption hole is connected to a guide hole, and the inner diameter of the guide hole gradually increases from one end connected to the adsorption hole to the other end.

[0013] The utility model also provides a wafer adsorption device, comprising the above-mentioned adsorption ring.

[0014] The beneficial effects of the utility model are as follows: the utility model adopts a flexible material to make a ring-shaped body, and has adsorption holes evenly distributed on the body. The adsorption holes are used to achieve adsorption of the wafer, which not only ensures stable adsorption of the wafer, but also can effectively reduce the impact force on the wafer, thereby reducing the probability of wafer breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of Example 1 of the present utility model.

[0016] Figure 2 This is a schematic diagram of another perspective of Example 1 of the present utility model.

[0017] Figure 3 This is a cross-sectional view of Example 1 of the present utility model.

[0018] Figure 4 The figure markings of the schematic diagram of Example 2 of the utility model are: 1-main body, 2-adsorption hole, 3-limiting member, 4-inclined surface, 5-sealing structure, 6-inner sealing part, 7-outer sealing part, 8-guide hole, 9-circular through hole, 10-auxiliary adsorption hole, 11-positioning groove, 12-vacuum flow channel. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings. The contents mentioned in the embodiments are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0020] Example 1

[0021] like Figures 1 to 3 As shown, this embodiment provides a hollow flexible vacuum adsorption ring, including a main body 1 made of flexible material, wherein the main body 1 is a ring structure, and a circular through hole 9 is provided in the middle of the main body 1. The main body 1 has a plurality of adsorption holes 2 distributed in a ring array with the center of the circular through hole 9, and the adsorption holes 2 are used to connect to an external vacuum source and adsorb wafers through vacuum.

[0022] The present invention is applied to a wafer adsorption device, which is a device for performing functions such as picking up or positioning wafers. In actual use, a sealing structure 5 is provided at the bottom of the main body 1, which is connected to an external vacuum generator through the sealing structure 5, so that the negative pressure gas of the vacuum generator can be output through the adsorption hole 2, thereby adsorbing the outer position of the wafer on the main body 1 through the adsorption hole 2. At the same time, due to the presence of the circular through hole 9, most of the position of the wafer is in a suspended state, thereby reducing the contact area between the wafer and the present invention, increasing the supporting effect, and also avoiding the phenomenon of squeezing and deforming the wafer due to the incomplete flatness of the present invention due to the reduction of the contact area.

[0023] Specifically, the main body 1 is made of a flexible material with a certain degree of softness such as injected silicone and soft glue, so that the impact force on the wafer can be reduced when the utility model comes into contact with the wafer, thereby achieving the effect of reducing the probability of wafer breakage.

[0024] In this embodiment, the inner diameter of one adsorption hole 2 is larger than the inner diameters of the other adsorption holes 2. The inner walls of the adsorption hole 2 with the larger inner diameter are provided with limit members 3 on both sides, and the bottom of the limit members 3 is provided with an inclined surface 4.

[0025] Auxiliary adsorption holes 10 are provided on both sides of the adsorption hole 2 with a large inner diameter.

[0026] The adsorption hole 2 with a larger inner diameter is mainly used for positioning. The larger inner diameter can make the adsorption effect on the wafer better. The additional auxiliary adsorption holes 10 are respectively provided on both sides of the adsorption hole 2 with a larger inner diameter to better ensure the adsorption effect on both sides of the positioning point; at the same time, the larger inner diameter can also achieve a better compensation effect, that is, when the utility model is deformed by force or expands due to temperature changes, the adsorption hole 2 with a larger inner diameter can better compensate for the volume change of this deformation / expansion.

[0027] Specifically, the ratio of the inner diameter of the adsorption hole 2 with a large inner diameter to the inner diameter of other adsorption holes 2 is 1:2.5-1:4. The size of the inner diameter ensures positioning adsorption and deformation compensation without affecting the strength of the main body 1.

[0028] In this embodiment, the sealing structure 5 includes an inner sealing part 6 and an outer sealing part 7. The inner sealing part 6 is located inside the outer sealing part 7. The outer wall of the outer sealing part 7 is recessed inward to form a positioning groove 11. The inner sealing part 6 is provided with a connecting hole connected to the circular through hole 9.

[0029] In actual use, the main body 1, inner seal 6, and outer seal 7 are integrally formed to prevent separation and maintain a sealed seal. The inner and outer seals 6 and 7 form a sealed vacuum channel 12 with the main body 1, ensuring wafer absorption. The positioning grooves 11 reduce the strength of the outer seal 7, allowing it to adapt to the location of the external vacuum generator for easier installation.

[0030] In this embodiment, the bottom of the adsorption hole 2 is connected to a guide hole 8, and the inner diameter of the guide hole 8 gradually increases from one end connected to the adsorption hole 2 to the other end. The guide hole 8 is used to guide the vacuum gas into the adsorption hole 2, and the reduction in inner diameter achieves the effect of guiding and increasing the vacuum adsorption force.

[0031] Example 2

[0032] like Figure 4 As shown, this embodiment differs from Example 1 in that: there are two adsorption holes 2 with large inner diameters, and the two adsorption holes 2 with large inner diameters are symmetrically arranged with one diameter of the circular through hole 9 as the axis of symmetry; and auxiliary adsorption holes 10 are provided on both sides of each adsorption hole 2 with large inner diameters. The provision of two adsorption holes 2 with large inner diameters improves the adsorption effect of this embodiment.

[0033] Apart from this, the other structures of this embodiment are basically the same as those of embodiment 1 and will not be described again here.

[0034] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention is disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the above-disclosed technical contents without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention, which do not depart from the content of the technical solution of the present invention, are within the scope of the technical solution of the present invention.

Claims

1. A hollow flexible vacuum adsorption ring, characterized by: It includes a main body made of flexible material, which is a ring-shaped structure. A circular through hole is set in the middle of the main body. The main body has multiple adsorption holes distributed in a ring array with the center of the circular through hole. The adsorption holes are used to connect to an external vacuum source and adsorb wafers through vacuum.

2. The hollow flexible vacuum adsorption ring according to claim 1, characterized in that: The inner diameter of one adsorption hole is larger than that of the other adsorption holes, and the inner walls of both sides of the adsorption hole with the larger inner diameter are respectively provided with limit members, and the bottom of the limit members is provided with an inclined surface; Auxiliary adsorption holes are respectively provided on both sides of the adsorption hole with a large inner diameter.

3. The hollow flexible vacuum adsorption ring according to claim 2, characterized in that: There are two adsorption holes with large inner diameters, and the two adsorption holes with large inner diameters are symmetrically arranged with one diameter of the circular through hole as the symmetry axis; auxiliary adsorption holes are respectively arranged on both sides of each adsorption hole with large inner diameter.

4. The hollow flexible vacuum adsorption ring according to claim 2, characterized in that: The ratio of the inner diameter of the adsorption hole with a large inner diameter to the inner diameter of other adsorption holes is 1:2.5-1:

4.

5. The hollow flexible vacuum adsorption ring according to claim 1, characterized in that: A sealing structure is provided at the bottom of the body, which includes an inner sealing part and an outer sealing part. The inner sealing part is located inside the outer sealing part, and the outer side wall of the outer sealing part is recessed inward to form a positioning groove. The inner sealing part is provided with a connecting hole connected to the circular through hole.

6. The hollow flexible vacuum adsorption ring according to claim 5, characterized in that: The body, the inner sealing part and the outer sealing part are integrally formed.

7. The hollow flexible vacuum adsorption ring according to claim 1, characterized in that: The bottom of the adsorption hole is connected to a guide hole, and the inner diameter of the guide hole gradually increases from one end connected to the adsorption hole to the other end.

8. A wafer adsorption device, characterized in that: The invention comprises the adsorption ring according to any one of claims 1 to 7.

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