Wafer damage-free cleaning device
By introducing a clamping block and a threaded rod structure driven by servo motor into the wafer cleaning device, the problem of slippage damage during the wafer cleaning process is solved, and the damage-free wafer cleaning effect is achieved.
Patent Information
- Application Number
- CN202422128503.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-08-30
AI Technical Summary
During the cleaning process of existing wafer-free cleaning devices, the wafer is prone to slip off due to unsealed positioning, resulting in damage.
A structure including a clamping block, a servo motor, a threaded rod and a screw sleeve is designed. The servo motor drives the threaded rod to rotate, so that the screw sleeve can be spiraled, thereby driving the clamping block to clamp and position the wafer. Combined with the rotation of the electric telescopic rod and the cleaning table, the wafer is damaged-free cleaning.
It realizes effective positioning of the wafer during the cleaning process, avoids slippage damage, and ensures damage-free effect in the cleaning process.
Smart Images
Figure CN223218289U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer cleaning, in particular to a device for cleaning wafers without causing damage. Background Art
[0002] A wafer refers to a silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. In the wafer manufacturing process, the wafer needs to be cleaned before and after key processes such as photolithography, etching and deposition to remove chemical impurities contaminated by the wafer and reduce the defect rate. The wafer is usually cleaned using a wafer non-destructive cleaning device.
[0003] When a common wafer damage-free cleaning device cleans a wafer, the wafer is placed on a cleaning table, and then the wafer is cleaned by a liquid spraying device. The wafer rotates rapidly on the cleaning table, and the liquid attached to the wafer is thrown off under the action of centrifugal force, thereby completing the damage-free cleaning of the wafer. The common cleaning table for placing wafers is usually formed by a fixed support column array, which has no clamping and positioning effect on the wafer. If the wafer damage-free cleaning device is accidentally hit, it may cause the wafer to slip from the cleaning table, thereby causing damage to the wafer. Therefore, a wafer damage-free cleaning device is proposed to address the above problem. Utility Model Content
[0004] The purpose of the present invention is to provide a wafer cleaning device without damaging the wafer, so as to solve the problems raised in the above background technology.
[0005] To achieve the above objectives, the present invention provides the following technical solutions:
[0006] The control device of claim 1, wherein the control device is to be mounted on a wheelchair of the control machine and the control device is to be mounted on a wheelchair of the control machine. The control device is to be mounted on a wheelchair of the control machine. The control device is to be mounted on a wheelchair of the control machine.
[0007] Preferably, the waste liquid collection shell is sleeved on the outside of the operating seat, the sealing gasket is in contact with the operating seat, and the protective sleeve is sleeved on the outside of the cleaning table.
[0008] Preferably, the liquid medicine spraying device is arranged on one side of the electric telescopic rod, the operating seat is arranged between a group of electric telescopic rods, the motor is installed inside the operating seat, the end of the output shaft of the motor is fixedly connected to the cleaning table, and the servo motor is arranged on one side of the cleaning table.
[0009] Preferably, the first positioning block is fixedly connected to the cleaning table, and the second positioning block is fixedly connected to the cleaning table.
[0010] Preferably, there are two clamping blocks, which are symmetrically arranged, one side of the clamping block is arc-shaped, and one side of the arc-shaped clamping block is fixedly connected to an arc-shaped protective pad.
[0011] Preferably, the controller is electrically connected to the liquid medicine spraying device, the controller is electrically connected to the electric telescopic rod, the controller is electrically connected to the electric motor, and the controller is electrically connected to the servo motor.
[0012] Compared with the prior art, the beneficial effects of the present invention are:
[0013] In the utility model, through the structure composed of the clamping block, servo motor, threaded rod, screw sleeve and first connecting block, the rotating shaft of the servo motor will drive the threaded rod to rotate, and the rotation of the threaded rod will cause the screw sleeve to spiral with it, so that the clamping block moves, thereby clamping and positioning the wafer through the clamping block, so that the wafer can be clamped and positioned when the wafer is cleaned without damage by the wafer cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of the utility model;
[0015] Figure 2 For this utility model Figure 1 Schematic diagram of the structure at A;
[0016] Figure 3 This is a schematic diagram of the installation structure of the clamping block of the utility model;
[0017] Figure 4 This is a structural diagram of the guide rod of the utility model;
[0018] Figure 5 This is a structural diagram of the first connecting block of the utility model;
[0019] Figure 6 This is a structural diagram of the second connecting block of the utility model;
[0020] Figure 7 This is a structural diagram of the waste liquid collection shell of the utility model.
[0021] In the figure: 1. Liquid spraying device; 2. Electric telescopic rod; 3. Operating seat; 4. Electric motor; 5. Cleaning table; 6. Servo motor; 7. Threaded rod; 8. Screw sleeve; 9. First connecting block; 10. First positioning block; 11. Clamping block; 12. Protective pad; 13. Second connecting block; 14. Guide rod; 15. Second positioning block; 16. Waste liquid collection shell; 17. Leakage hole; 18. Protective cover; 19. Sealing pad; 20. Controller. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0023] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0024] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.
[0025] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.
[0026] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.
[0027] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.
[0028] See also Figure 1-7 , the utility model provides a technical solution:
[0029] A device for cleaning wafers without damaging them, comprising a liquid spraying device 1, an electric telescopic rod 2, an operating seat 3, an electric motor 4, a cleaning table 5, and a servo motor 6, characterized in that: the end of the output shaft of the servo motor 6 is fixedly connected to a threaded rod 7, the outer side of the threaded rod 7 is rotatably connected to a first positioning block 10 for positioning it, the outer side of the threaded rod 7 is spirally connected to a screw sleeve 8, the outer side of the screw sleeve 8 is fixedly connected to a first connecting block 9, the upper end surface of the first connecting block 9 is fixedly connected to a clamping block 11 that is the same as the one for clamping and positioning the wafer, and the clamping block The lower end face of 11 is fixedly connected to a second connecting block 13, the inner side of the second connecting block 13 is slidably connected to a guide rod 14, both ends of the guide rod 14 are fixedly connected to a second positioning block 15, one end of the electric telescopic rod 2 is fixedly connected to a sealing gasket 19, the upper end face of the sealing gasket 19 is fixedly connected to a waste liquid collection shell 16, a plurality of leakage holes 17 of equal size are provided on the inner side of the waste liquid collection shell 16, a protective cover 18 is fixedly connected to the upper end face of the waste liquid collection shell 16, and a controller 20 is installed on the outside of the liquid spraying device 1.
[0030] The waste liquid collection shell 16 is sleeved on the outside of the operating seat 3, the sealing gasket 19 is fitted with the operating seat 3, and the protective cover 18 is sleeved on the outside of the cleaning table 5. This arrangement makes it possible to collect the used cleaning liquid through the waste liquid collection shell 16; the liquid spraying device 1 is arranged on one side of the electric telescopic rod 2, the operating seat 3 is arranged between a group of electric telescopic rods 2, the motor 4 is installed inside the operating seat 3, the output shaft end of the motor 4 is fixedly connected to the cleaning table 5, and the servo motor 6 is arranged on one side of the cleaning table 5. This arrangement makes it possible to position the liquid spraying device 1, the electric telescopic rod 2, the operating seat 3, the motor 4, the cleaning table 5 and the servo motor 6; the first positioning block 10 is fixedly connected to the cleaning table 5, and the second positioning block 15 is fixedly connected to the cleaning table 5. This arrangement makes it possible to position the liquid spraying device 1, the electric telescopic rod 2, the operating seat 3, the motor 4, the cleaning table 5 and the servo motor 6; The cleaning table 5 can drive the first positioning block 10 and the second positioning block 15 to rotate, thereby driving the clamping block 11 to rotate; there are two clamping blocks 11, and the clamping blocks 11 are symmetrically arranged. One side of the clamping block 11 is arranged in an arc shape, and the arc-shaped side of the clamping block 11 is fixedly connected to an arc-shaped protective pad 12. This arrangement makes it possible to position wafers of different sizes, and the protective pad 12 can protect the wafers to a certain extent; the controller 20 is electrically connected to the liquid spraying device 1, the controller 20 is electrically connected to the electric telescopic rod 2, the controller 20 is electrically connected to the motor 4, and the controller 20 is electrically connected to the servo motor 6. This arrangement enables the controller 20 to control the use of the liquid spraying device 1, the electric telescopic rod 2, the motor 4 and the servo motor 6.
[0031] Working process: All electrical appliances in the present invention are provided with an external power supply. When the wafer non-damage cleaning device is to be used for non-damage cleaning of the wafer, the wafer is placed between the protective pads 12 of the clamping block 11, and the servo motor 6 is started through the controller 20. The rotating shaft of the servo motor 6 drives the threaded rod 7 to rotate relative to the first positioning block 10. The rotation of the threaded rod 7 causes the screw sleeve 8 to spiral with it, and the screw sleeve 8 moves with the first connecting block 9, and the first connecting block 9 drives the clamping block 11 to move. Because the second connecting block 13 fixed at the bottom of the clamping block 11 is limited by the guide rod 14, the clamping block 11 will only slide relative to the guide rod 14 and will not rotate. The guide rod 14 is installed through the second positioning block 15, so that the wafer is clamped and positioned by the clamping block 11, the servo motor 6 is turned off, and then the electric telescopic rod 2 is started through the controller 20. The electric telescopic rod 2 The sealing gasket 19, the waste liquid collection shell 16 and the protective sleeve 18 are pushed to move so that the protective sleeve 18 can be completely fitted on the outside of the cleaning table 5, thus completing the placement of the wafer. The liquid spraying device 1 is then controlled by the controller 20 to clean the wafer. At the same time, the motor 4 installed on the inner side of the operating seat 3 is started by the controller 20. The motor 4 drives the cleaning table 5 to rotate, and the cleaning table 5 drives the first positioning block 10 and the second positioning block 15 to rotate. The first positioning block 10 and the second positioning block 15 drive the clamping block 11 to rotate, and the clamping block 11 drives the wafer to rotate. Under the action of centrifugal force, the liquid attached to the wafer is thrown off, thereby completing the damage-free cleaning of the wafer. The thrown-off liquid will be blocked by the protective sleeve 18, and then slide along the inner wall of the protective sleeve 18 toward the waste liquid collection shell 16, and then be collected in the waste liquid collection shell 16 through the leak hole 17.
[0032] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A wafer non-damage cleaning device, comprising a liquid spraying device (1), an electric telescopic rod (2), an operating seat (3), an electric motor (4), a cleaning table (5) and a servo motor (6), characterized in that: The output shaft end of the servo motor (6) is fixedly connected to a threaded rod (7), the outer side of the threaded rod (7) is rotatably connected to a first positioning block (10) for positioning the threaded rod (7), the outer side of the threaded rod (7) is spirally connected to a screw sleeve (8), the outer side of the screw sleeve (8) is fixedly connected to a first connecting block (9), the upper end face of the first connecting block (9) is fixedly connected to a clamping block (11) that is the same as the one for clamping and positioning the wafer, the lower end face of the clamping block (11) is fixedly connected to a second connecting block (13), the second connecting block (13) is fixedly connected to the lower end face of the clamping block (11). A guide rod (14) is slidably connected to the inner side, and the two ends of the guide rod (14) are fixedly connected to a second positioning block (15). One end of the electric telescopic rod (2) is fixedly connected to a sealing gasket (19), and the upper end surface of the sealing gasket (19) is fixedly connected to a waste liquid collection shell (16). The inner side of the waste liquid collection shell (16) is provided with a plurality of leakage holes (17) of equal size. The upper end surface of the waste liquid collection shell (16) is fixedly connected to a protective cover (18). A controller (20) is installed on the outer side of the liquid spraying device (1).
2. The wafer non-damage cleaning device according to claim 1, characterized in that: The waste liquid collection shell (16) is sleeved on the outside of the operating seat (3), the sealing gasket (19) is in contact with the operating seat (3), and the protective sleeve (18) is sleeved on the outside of the cleaning table (5).
3. The wafer non-damage cleaning device according to claim 1, characterized in that: The liquid medicine spraying device (1) is arranged on one side of an electric telescopic rod (2), the operating seat (3) is arranged between a group of electric telescopic rods (2), the motor (4) is installed inside the operating seat (3), the output shaft end of the motor (4) is fixedly connected to the cleaning table (5), and the servo motor (6) is arranged on one side of the cleaning table (5).
4. The wafer non-damage cleaning device according to claim 1, characterized in that: The first positioning block (10) is fixedly connected to the cleaning table (5), and the second positioning block (15) is fixedly connected to the cleaning table (5).
5. The wafer non-damage cleaning device according to claim 1, characterized in that: There are two clamping blocks (11) in total. The clamping blocks (11) are symmetrically arranged. One side of the clamping block (11) is arranged in an arc shape. The arc-shaped side of the clamping block (11) is fixedly connected to a protective pad (12) arranged in an arc shape.
6. The wafer non-damage cleaning device according to claim 1, characterized in that: The controller (20) is electrically connected to the liquid medicine spraying device (1), the controller (20) is electrically connected to the electric telescopic rod (2), the controller (20) is electrically connected to the electric motor (4), and the controller (20) is electrically connected to the servo motor (6).