Semiconductor packaging structure

Abstract

The utility model provides a semiconductor packaging structure. The semiconductor packaging structure comprises a substrate; the mounting seat is fixed on the substrate and is electrically connected with the substrate; the plastic package body packages at least part of the substrate and part of the mounting seat, and the plastic package body is provided with a first surface and a second surface which are oppositely arranged; the mounting base is located between the first surface and the second surface, the mounting base and the first surface are arranged at an interval, and a terminal connecting part is arranged at the top end, close to the first surface, of the mounting base; the plastic package body is provided with an open hole, and the open hole extends from the first surface to the terminal connecting part, so that the terminal connecting part is exposed out of the plastic package body through the open hole. And one end of the first terminal is at least partially located in the open hole and connected with the terminal connecting part, the other end of the first terminal extends out of the open hole in the direction away from the terminal connecting part, and the first terminal and the hole wall of the open hole are arranged at an interval. According to the invention, the creepage distance can be increased, so that the safety of the semiconductor package is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging structure. Background Art

[0002] The shortest distance between two conductive components along the surface of a solid insulating material is called creepage distance. The greater the creepage distance, the better the insulation between the two conductive components. To prevent sparks between components or between a component and ground, which could pose a threat to personal safety, relevant safety standards have established creepage distance requirements. With the miniaturization of semiconductor packages, such as power modules, the creepage distance between terminals is decreasing, resulting in lower semiconductor package safety. Therefore, improving semiconductor package safety has become a pressing technical issue. Utility Model Content

[0003] The present application provides a semiconductor packaging structure, which mainly solves the problem of low safety of semiconductor packages in the prior art due to insufficient creepage distance.

[0004] To solve the above technical problems, a technical solution adopted in this application is to provide a semiconductor packaging structure, including:

[0005] substrate;

[0006] A mounting base, fixed on the substrate and electrically connected to the substrate;

[0007] a plastic package body encapsulating at least a portion of the substrate and a portion of the mounting seat, the plastic package body having a first surface and a second surface disposed opposite each other; the mounting seat is located between the first surface and the second surface, and the mounting seat is spaced apart from the first surface; a terminal connection portion is provided at a top end of the mounting seat adjacent to the first surface; an opening is provided in the plastic package body, the opening extending from the first surface to the terminal connection portion, so that the terminal connection portion is exposed outside the plastic package body through the opening;

[0008] A first terminal has one end at least partially located in the opening and connected to the terminal connecting portion, and the other end extends out of the opening in a direction away from the terminal connecting portion. The first terminal is spaced apart from the hole wall of the opening.

[0009] Different from the prior art, the beneficial effect of the present application is that the conductor packaging structure provided by the present application is to dispose the mounting seat between the first surface and the second surface of the plastic package body, and to space the mounting seat from the first surface of the plastic package body, to provide an opening on the first surface of the plastic package body to expose the terminal connection portion at the top of the mounting seat, and to space the first terminal from the hole wall of the opening, so that the mounting seat can be sunken relative to the first surface of the plastic package body, and the first terminal will not contact the side wall of the opening when electrically connected to the sunken mounting seat, thereby converting a portion of the straight line in the shortest path between the first terminal and other terminals or between two adjacent first terminals along the surface of the plastic package body into a curved line, thereby increasing the length of the shortest path, that is, increasing the creepage distance, thereby improving the safety of the semiconductor package. Moreover, by providing an opening on the first surface of the plastic package body to expose the terminal connection portion at the top of the mounting seat, the first terminal can be installed after plastic packaging, which makes installation more convenient and the process simpler. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 A schematic structural diagram of a semiconductor package structure provided by an embodiment of the present application at a certain viewing angle;

[0012] Figure 2 A schematic structural diagram of a semiconductor package structure provided by an embodiment of the present application from another perspective;

[0013] Figure 3 for Figure 2 AA cross-sectional view of the semiconductor package structure shown;

[0014] Figure 4 for Figure 3 An enlarged view of a portion B in the AA cross-sectional schematic diagram of the semiconductor package structure shown;

[0015] Figure 5 for Figure 3 The schematic diagram of a local structure in the AA cross-sectional schematic diagram of the semiconductor package structure shown.

[0016] Figure 6 A schematic structural diagram of a semiconductor package structure provided in an embodiment of the present application before plastic packaging;

[0017] Figure 7 A schematic structural diagram of a semiconductor package structure after plastic packaging according to an embodiment of the present application;

[0018] Figure 8 This is a schematic structural diagram of the semiconductor package structure provided by one embodiment of the present application after the first terminal is installed. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0021] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0022] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0023] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0024] See also Figures 1 to 5 , Figure 1A schematic structural diagram of a semiconductor package structure provided by an embodiment of the present application at a certain viewing angle; Figure 2 for Figure 1 A top view of the semiconductor package structure shown;

[0025] Figure 3 for Figure 2 AA cross-sectional view of the semiconductor package structure shown; Figure 4 for Figure 3 An enlarged view of a portion B in the AA cross-sectional schematic diagram of the semiconductor package structure shown; Figure 5 for Figure 3 The schematic diagram of a local structure in the AA cross-sectional schematic diagram of the semiconductor package structure shown.

[0026] An embodiment of the present application provides a semiconductor package structure, comprising:

[0027] substrate 11;

[0028] A mounting base 12, fixed on the substrate 11 and electrically connected to the substrate 11;

[0029] A plastic package body 13 encapsulates at least a portion of the substrate 11 and a portion of the mounting seat 12. The plastic package body 13 has a first surface 131 and a second surface 132 that are oppositely disposed. The mounting seat 12 is located between the first surface 131 and the second surface 132, and the mounting seat 12 is spaced apart from the first surface 131. A terminal connecting portion 122 is provided at a top end 121 of the mounting seat 12 that is adjacent to the first surface 131. An opening 133 is provided in the plastic package body 13, extending from the first surface 131 to the terminal connecting portion 122, so that the terminal connecting portion 122 is exposed outside the plastic package body 13 through the opening 133.

[0030] One end of the first terminal 14 is at least partially located in the opening 133 and connected to the terminal connecting portion 122 , and the other end extends out of the opening 133 in a direction away from the terminal connecting portion 122 . The first terminal 14 is spaced apart from the hole wall 1331 of the opening 133 .

[0031] In the embodiment of the present application, the substrate 11 can be a ceramic copper substrate, such as an active metal brazing ceramic substrate (AMB) or a direct bond copper ceramic substrate (DBC), or other types of substrates with circuit designs, which are not limited here. The surface of the substrate 11 can be silver-plated or copper-plated or plated with a material that has better adhesion to other devices. The substrate 11 can also be connected to components such as chips, bonding wires, clips, resistors, etc., which are not limited in the embodiment of the present application.

[0032] The mounting base 12 can be used to secure the first terminal 14. The mounting base can be secured to the substrate 11 by ultrasonic welding or soldering, thereby achieving electrical connection with the substrate 11. Specifically, the mounting base 12 can have a top end 121 and a bottom end 123 disposed opposite each other, wherein the top end 121 is provided with a terminal connection portion 122, and the bottom end 123 is secured to the substrate 11 by ultrasonic welding or soldering. The number and arrangement of the mounting bases 12 on the substrate can vary depending on the circuit design, and the overall thickness of the mounting base 12 can also be adjusted based on actual needs.

[0033] The plastic encapsulation body 13 can protect the interior of the device from moisture and ensure stable mechanical properties. Specifically, the plastic encapsulation body 13 can include an epoxy resin material. The plastic encapsulation body 13 encapsulating at least a portion of the substrate 11 can include only encapsulating a portion of the substrate 11, or can include encapsulating the entire substrate 11. The first surface 131 and the second surface 132 of the plastic encapsulation body can be opposed to each other and spaced apart. The mounting seat 12 being located between the first surface 131 and the second surface 132 can mean that the mounting seat 12 is located between the first surface 131 and the second surface 132 in the first direction y from the first surface 131 to the second surface 132. The mounting seat 12 being spaced apart from the first surface 131 can mean that the mounting seat 12 is spaced apart from the first surface 131 in the first direction y. The top end 121 of the mounting seat 12 can refer to the end of the mounting seat 12 away from the substrate 11. The terminal connection portion 122 can be a connection hole, a connection groove, or a magnetic surface. The position of the opening 133 on the plastic package body 13 may correspond to the position of the terminal connection portion 122 of the mounting seat 12 . For example, the opening 133 may be located directly above or obliquely above the terminal connection portion 122 of the mounting seat 12 .

[0034] The first terminal 14 can be a signal lead-out terminal or a power terminal, which is electrically connected to the mounting base 12 by connecting to the terminal connecting portion 122. The first terminal 14 can be a pin (also known as a pin needle), specifically a solid pin (such as a piercing pin or an extrusion pin), a square pin, a fisheye pin, or other different types of pins. The length, number, and arrangement position of the first terminal 14 can vary with the design of the circuit. It should be noted that when the first terminal 14 is a pin, the mounting base 12 can be a pin holder. The number of mounting bases 12 and first terminals 14 can be the same.

[0035] The first terminal 14 can be connected to the terminal connection portion 122 by crimping or welding. The end of the first terminal 14 connected to the terminal connection portion 122 can be only partially located within the opening 133, or can be completely located within the opening 133. The first terminal 14 and the hole wall 1331 of the opening 133 are spaced apart, which means that there is a gap between the first terminal 14 and the hole wall 1331 of the opening 133, so that there is no contact between the two.

[0036] The conductor packaging structure provided by the present application is such that a mounting seat is arranged between the first surface and the second surface of a plastic package body, and the mounting seat is spaced apart from the first surface of the plastic package body, an opening is provided on the first surface of the plastic package body to expose the terminal connection portion at the top of the mounting seat, and the first terminal is spaced apart from the hole wall of the opening, so that the mounting seat can be sunken relative to the first surface of the plastic package body, and the first terminal will not contact the side wall of the opening when electrically connected to the top of the sunken mounting seat, thereby converting part of the straight line in the shortest path between the first terminal and other terminals or between two adjacent first terminals along the surface of the plastic package body into a bending line, thereby increasing the length of the shortest path, that is, increasing the creepage distance, and thus improving the safety of the semiconductor package.

[0037] Optionally, the terminal connecting portion 122 is a connecting hole, and one end of the first terminal 14 is connected to the connecting hole 122;

[0038] The aperture of the opening 133 is larger than the aperture d1 of the connecting hole.

[0039] In the embodiment of the present application, the connection hole serving as the terminal connection portion 122 may be a blind hole or a through hole. The connection hole may be a hole of various shapes, such as a circular hole, a square hole, or a special-shaped hole. One end of the first terminal 14 may be crimped, plugged, clipped, or welded into the connection hole.

[0040] The diameter of the opening 133 being larger than the diameter d1 of the connection hole may mean that the difference between the diameters of the opening 133 and the diameters d1 of the connection hole is greater than 0. This ensures that the first terminal 14 is spaced from the hole wall 1331 of the opening 133 when connected to the connection hole, and prevents the molding compound from leaking into the connection hole of the mounting base 12.

[0041] By setting the terminal connecting portion as a connecting hole and setting the aperture of the opening to be larger than the aperture of the connecting hole, the structure is simpler, which can facilitate the connection between the first terminal and the mounting seat and also facilitate manufacturing and process implementation.

[0042] Optionally, the difference between the aperture of the opening 133 and the aperture d1 of the connecting hole is greater than or equal to 2 mm;

[0043] And / or, the opening 133 is a round hole or a square hole.

[0044] In the embodiment of the present application, the difference between the aperture of the opening 133 and the aperture d1 of the connecting hole may be equal to 2 mm, or may be greater than 2 mm, for example, 3 mm, 4 mm, 5 mm or 6 mm.

[0045] By setting the difference between the aperture of the opening and the aperture of the connecting hole to be greater than or equal to 2 mm, sufficient spacing between the first terminal and the side wall of the opening can be ensured, and the plastic encapsulation material can be better prevented from leaking into the connecting hole of the mounting base.

[0046] Optionally, the connecting hole extends from the end face 1211 of the top end 121 of the mounting seat 12 in the direction toward the substrate 11, and the aperture d2 of the end portion of the opening 133 close to one end of the connecting hole is smaller than the outer diameter d3 of the end face 1211 of the top end 121 of the mounting seat 12.

[0047] In the embodiment of the present application, the connection hole may extend from the end surface 1211 of the top end 121 of the mounting base 12 toward the substrate 11 and may or may not pass through the end surface 1231 of the bottom end 123 of the mounting base 12 .

[0048] Since the connecting hole extends from the end face of the top end of the mounting seat in the direction toward the substrate, the aperture of the opening is smaller than the outer diameter of the end face of the top end of the mounting seat, so that the plastic package body can cover the outer ring portion of the end face of the top end of the mounting seat, thereby making the mounting seat more stable and not easy to fall off.

[0049] It should be noted that, in some other embodiments, the aperture of the opening 133 may also be equal to or greater than the outer diameter d3 of the end surface 1211 of the top end 121 of the mounting seat 12 .

[0050] Optionally, the opening 133 includes a first opening section 1332 close to the terminal connecting portion 122;

[0051] The aperture of the first opening section 1332 gradually increases from an end of the first opening section 1332 close to the terminal connecting portion 122 to an end of the first opening section 1332 away from the terminal connecting portion 122 .

[0052] In the embodiment of the present application, the plastic package body 13 can be formed by a mold with an independent pressing head. The independent pressing head can be used to press the terminal connection part 122 during the plastic package body molding process to form the opening 133 and prevent glue from overflowing to the terminal connection part.

[0053] Since the aperture of the first opening section gradually increases from the end of the first opening section close to the terminal connection part to the end of the first opening section away from the terminal connection part, the demolding / film removal operation after the opening is formed is easier to perform, that is, it is more convenient to demold / film.

[0054] Optionally, an angle between the hole wall of the first opening section 1332 and the extension direction of the first opening section 1332 is 5°-15°.

[0055] In the embodiment of the present application, the first opening section can extend along the first direction y, or can extend along a direction forming an acute angle with the first direction y. The hole wall of the first opening section 1332 can be arranged at an acute angle with the extension direction of the first opening section 1332. In other words, the extension direction of the hole wall of the first opening section 1332 can be arranged at an acute angle with the extension direction of the central axis of the first opening section 1332.

[0056] By setting the included angle between the hole wall of the first opening section and the extension direction of the first opening section to be 5°-15°, the demoulding / film removal can be made smoother.

[0057] Optionally, the opening 133 further includes:

[0058] The second opening section 1333 is arranged away from the terminal connecting portion 122;

[0059] The third opening section 1334 is located between the first opening section 1332 and the second opening section 1333 and connects the first opening section 1332 and the second opening section 1333;

[0060] The aperture of the third opening section 1334 is equal to the aperture of the end of the first opening section 1332 away from the terminal connecting portion 122 ; the aperture of the second opening section 1333 is larger than the aperture of the third opening section 1334 .

[0061] In the embodiment of the present application, the extension direction of the third opening section 1334 can be the same as the extension direction of the second opening section 1333, and the extension direction of the sidewall of the third opening section 1334 can be parallel to the extension direction of the third opening section 1334. The extension direction of the second opening section 1333 can be the same as the extension direction of the first opening section 1332, and the extension direction of the sidewall of the second opening section 1333 can be parallel to the extension direction of the second opening section 1333.

[0062] In the embodiment of the present application, the opening on the plastic package body 13 can be formed by a mold with an independent pressing head. The independent pressing head can be used to press the terminal connection part 122 during the molding process of the plastic package body 13 to form the opening 133 and prevent glue from overflowing onto the terminal connection part 122. Specifically, during the formation of the opening 133, the first opening section 1332 can be regarded as a demolding / film removal area, where the independent pressing head of the mold presses on the surface 1211 of the top end 121 of the mounting seat 12 to prevent glue from overflowing onto the terminal connection part 122; the third opening section 1334 can be regarded as an independent pressing head vertical lifting area, which is used to accommodate the height difference after the mounting seat 12 is fixed to the substrate 11. In other words, even if there is a certain range of height difference after the mounting seat 12 is fixed to the substrate 11, the height can be automatically compensated to prevent glue overflow; the second opening section 1333 can be regarded as the bushing imprint of the independent pressing head design.

[0063] By providing the second opening section and the third opening section, it is possible to facilitate compatibility with the height difference of the mounting base fixed to the substrate during the plastic packaging process, and to facilitate demoulding.

[0064] Optionally, the total depth of the opening 133 is greater than 0.2 mm;

[0065] and / or, the depth h1 of the first opening section 1332 is 0.5 mm to 5 mm;

[0066] And / or, the depth h3 of the third opening section 1334 is 0.1 mm-0.3 mm;

[0067] And / or, the depth h2 of the second opening section 1333 is 0.1 mm-0.3 mm.

[0068] In this embodiment of the present application, the depth of the first opening section 1332 may be greater than the depth of the third opening section 1334, and the depth of the third opening section 1334 may be greater than the depth of the second opening section 1333. The total depth of the opening 133 may refer to the depth of the opening 133 in the first direction y. The depth h1 of the first opening section 1332 may refer to the depth of the first opening section 133 in the first direction y. The depth h3 of the third opening section 1334 may refer to the depth of the third opening section 1334 in the first direction y. The depth of the second opening section 1333 may refer to the depth of the second opening section 1333 in the first direction y.

[0069] By setting the total depth of the opening to be greater than 0.2 mm, the increase in the crawler distance can be better ensured. By setting the depth of the first opening section to 0.5 mm-5 mm, a better sealing effect can be guaranteed. Since the height difference after the mounting base is fixed to the substrate is usually 0.1 mm-0.3 mm, by setting the depth of the third opening section to 0.1 mm-0.3 mm, it can be compatible with the height difference after the mounting base is fixed to the substrate in most cases. By setting the depth of the second opening section to 0.1 mm-0.3 mm, demoulding can be more convenient.

[0070] Optionally, the extension direction of the opening 133 is perpendicular to the first surface 131 , and the extension direction of the first terminal 14 is perpendicular to the first surface 131 ;

[0071] and / or,

[0072] There are multiple mounting seats 12, multiple openings 133 and multiple first terminals 14. Multiple mounting seats 12 are fixed on the substrate 11 at intervals. Multiple openings 133 are opened at intervals on the first surface 131 of the plastic package body 13. Multiple openings 133 are arranged in a one-to-one correspondence with multiple mounting seats 12. The terminal connecting portion 122 of each mounting seat 12 is exposed outside the plastic package body 13 through the corresponding opening 133. Multiple first terminals 14 are connected to multiple mounting seats 12 in a one-to-one correspondence.

[0073] In the embodiment of the present application, by setting the extension direction of the opening perpendicular to the first surface, the extension direction of the first terminal is perpendicular to the first surface, so that the first terminal can be directly led out vertically through the surface of the plastic package, thereby reducing the on-resistance, reducing the failure rate, improving product reliability, and simplifying the assembly process. It simplifies the circuit design of the substrate, reduces the product's external dimensions, and makes the first terminal free of bending, and has stronger vibration test resistance.

[0074] In the embodiment of the present application, the plurality of mounting bases 12 may be two, three, five, seven, or eight, and the specific number may be selected according to actual needs. The plurality of mounting bases 12 may be arranged in a single row or multiple rows. The positions of the plurality of openings 133 correspond one-to-one to the positions of the plurality of mounting bases 12.

[0075] One end of each first terminal 14 is at least partially located in the corresponding opening 133 and connected to the corresponding terminal connecting portion 122. The other end of each first terminal 14 can extend out of the corresponding opening 133 in a direction away from the corresponding terminal connecting portion 122. Each first terminal 14 is spaced apart from the hole wall 1331 of the corresponding opening 133.

[0076] Optionally, the substrate 11 has a top surface 111 and a bottom surface 112 oppositely disposed, the mounting seat 12 is fixed to the top surface 111 of the substrate 11, the top surface 111 of the substrate 11 is at least partially encapsulated in the plastic package 13, and the bottom surface 1121 of the substrate 11 is at least partially exposed outside the plastic package 13;

[0077] The plastic package body 13 further includes a third surface 134 connecting the first surface 131 and the second surface 132;

[0078] The semiconductor package structure further includes a second terminal 15 , one end of which is electrically connected to the substrate 11 and at least partially encapsulated in the plastic package 13 , and the other end of the second terminal 15 extends from the third surface 134 of the plastic package 13 .

[0079] In the embodiment of the present application, the top surface 111 of the substrate 11 can be the surface of the substrate 11 close to the first surface 131 of the plastic package 13 in the first direction y, and the bottom surface 112 of the substrate 11 can be the surface of the substrate 11 in the first direction y away from the first surface 131 of the plastic package 13 in the first direction y.

[0080] The top surface 111 of the substrate 11 can be located between the first surface 131 and the second surface 132 of the plastic package body 13, and can be spaced apart from the first surface 131 of the plastic package body 13 in the first direction y. The top surface 111 of the substrate 11 can be partially or completely encapsulated in the plastic package body 13. The bottom surface 112 of the substrate 11 can be partially or completely exposed outside the plastic package body 13. Specifically, the bottom surface 112 of the substrate 11 can be partially or completely exposed to the second surface 132 of the plastic package body 13. The bottom surface 112 of the substrate 11 can be coplanar or non-coplanar with the second surface 132 of the plastic package body 13. The exposed portion of the bottom surface 112 of the substrate 11 can be used for air cooling and heat dissipation, or can be used for heat dissipation by connecting to an external radiator.

[0081] The second terminal 15 can be a power terminal or a signal lead-out terminal. The first terminal 14 and the second terminal 15 can be different types of terminals. The second terminal 15 can be connected to the substrate 11 by ultrasonic welding or solder welding to achieve electrical connection with the substrate 11. Part or all of the end of the second terminal 15 electrically connected to the substrate 11 is encapsulated in the plastic package 13. The number of second terminals 15 can be one or more, for example, two, three, four or five, and this is not limited in the embodiments of the present application.

[0082] Because the bottom surface of the substrate is at least partially exposed outside the plastic package, it can serve as the heat dissipation surface of the package structure, directly contacting the outside world and improving heat dissipation efficiency. Furthermore, the provision of a second terminal facilitates the extraction of the internal circuitry outside the plastic package, facilitating connection between the package structure and external circuitry.

[0083] Optionally, part of the top surface 111 of the substrate 11 is encapsulated in the plastic package 13;

[0084] The plastic package body 13 also includes a fourth surface 135 connecting the first surface 131, the second surface 132 and the third surface 134. A notch 136 is provided at the connection between the first surface 131 and the fourth surface 135 of the plastic package body 13. The notch 136 extends from the first surface 131 to the top surface 111 of the substrate 11 and to the fourth surface 135. The notch 136 is spaced apart from the mounting seat 12, and the notch 136 is spaced apart from the second terminal 15.

[0085] In the embodiment of the present application, the shape of the notch 136 can be semicircular or semi-square, which is not limited here.

[0086] By providing a notch extending to the substrate at the connection between the first surface and the fourth surface of the plastic packaging body, the substrate can be better fitted to the mold during the plastic packaging process, thereby improving the plastic packaging quality.

[0087] Optionally, the notch 136 may be located in the middle of the connection between the fourth surface 135 and the first surface 131, or may be located at a position deviated from the middle of the connection between the fourth surface 135 and the first surface 131. When the notch 136 is located in the middle of the connection between the fourth surface 135 and the first surface 131, the force applied to the substrate 11 and the plastic encapsulation mold during bonding can be more uniform, thereby achieving a better plastic encapsulation effect.

[0088] Optionally, the plastic package body 13 includes two fourth surfaces 135 , the two fourth surfaces 135 are arranged opposite to each other, and a notch 136 is provided at the connection between each fourth surface 135 and the first surface 131 ;

[0089] The plastic package body 13 includes two third surfaces 134, which are arranged opposite to each other. The second terminal 15 extends from one of the third surfaces 134, and the opening 133 is arranged near the other third surface 134 so that the first terminal 14 extends from a position of the first surface 131 near the other third surface 1341.

[0090] In the embodiment of the present application, the two fourth surfaces 135 can be disposed opposite each other and spaced apart. The two third surfaces 134 can also be disposed opposite each other and spaced apart. By providing a notch at the junction of each of the fourth surfaces and the first surface, the bonding effect between the substrate and the mold during the molding process can be further improved, thereby further improving the molding quality.

[0091] By arranging the second terminal to extend from one of the third surfaces and the first terminal to extend from a position of the first surface close to the other third surface, the first terminal can be directly led out vertically through the surface of the plastic package, thereby reducing the on-resistance, reducing the failure rate, improving product reliability, simplifying the assembly process, simplifying the circuit design of the substrate, and reducing the product's external dimensions. The first terminal does not require a bending process and has stronger vibration test resistance. In addition, such distribution of the first and second terminals can also facilitate connection with other external devices or circuits.

[0092] Optionally, a retraction needle structure 16 is provided on the first surface of the plastic package body 13 , and the retraction needle structure 16 is spaced apart from the opening 133 .

[0093] In the embodiment of the present application, the number of the retraction pin structure 16 can be one or more, for example, two, three, or four, without limitation. The retraction pin structure 16 and the opening 133 can be disposed adjacent to opposite sides of the plastic package body 13. For example, the retraction pin structure 16 can be disposed adjacent to one of the third surfaces 134 and / or the second terminal 15, and the opening 133 can be disposed adjacent to the other third surface 134.

[0094] By setting a retraction pin structure on the first surface of the plastic package, the substrate can be better fitted with the mold during the injection molding process, which is more conducive to the formation of a high-quality plastic package and can solve the problem of warping and unqualified products after packaging, thereby improving the welding between the heat dissipation surface and the radiator when the product is used at the application end, and improving the sealing and thermal conductivity.

[0095] Optionally, ejector pin holes 17 are provided at at least two corners of the first surface 131 of the plastic package body 13 .

[0096] In the embodiment of the present application, ejector holes 17 may be provided at two, three or four corners of the first surface 131 of the plastic package body 13. The ejector holes 17 may be spaced apart from the opening 133, or spaced apart from the retracting pin structure 16.

[0097] Here, the pins are used as the first terminals and the needle holders are used as the mounting seats to illustrate the semiconductor packaging structure in the embodiment of the present application: a semiconductor packaging structure includes a substrate, 7 needle holders, 7 pins, 4 second terminals and a plastic package body, the substrate has a top surface and a bottom surface arranged opposite to each other, the structures of each needle holder are exactly the same, the 7 needle holders are arranged side by side and at intervals on the first side of the top surface of the substrate, each needle holder has a top end and a bottom end arranged opposite to each other, the bottom end of each needle holder is welded to the top surface of the substrate by ultrasonic welding or solder to achieve the fixation of the needle holder and the electrical connection between the needle holder and the substrate, the end surface of each needle holder away from the top of the substrate is provided with a connecting hole (which can be understood as a terminal connecting part), the plastic package body has a first surface and a second surface arranged opposite to each other and four side surfaces connecting the first surface and the second surface, the four side surfaces include two third surfaces arranged opposite to each other and two fourth surfaces arranged opposite to each other and at intervals, the package body covers part of the top surface of the substrate and the side surface of the substrate, the bottom surface of the substrate is completely exposed outside the plastic package body, and the bottom surface of the substrate is coplanar with the second surface of the plastic package body, the pin seat Between the substrate and the second surface, the end face of the top of the needle seat is spaced from the first surface to the second surface. The plastic seal covers the portion of the needle seat. An opening is provided at a position of the plastic seal corresponding to the connection hole. The diameter of the opening is larger than the diameter of the connection hole. The connection hole at the top of the needle seat and the end face area around the connection hole are exposed outside the plastic seal through the opening. The opening includes three hole segments. The first hole segment is the hole segment closest to the end face of the top of the needle seat. The hole segment extends along the first direction from the first surface to the second surface, and the hole diameter of the hole segment is greater than the diameter of the connection hole. The diameter of the first hole segment gradually increases from the end closest to the needle seat to the end away from the needle seat. The angle between the hole wall of the first hole segment and the first direction is between 5-15 degrees. The second hole segment is the hole segment farthest from the needle seat and extends along the first direction. The hole diameter of this hole segment is larger than that of the first hole segment and remains the same at all locations. The depth of the second hole segment is 0.1-0.3 mm. The third hole segment is an intermediate hole segment, located between and connecting the first and second hole segments. The third hole segment extends along the first direction and has a depth of 0.1-0.3 mm, the aperture of the third hole segment is equal to the aperture of the end of the first hole segment away from the needle seat and is smaller than the aperture of the second hole segment, the bottom end of each pin is pressed into the connecting hole at the top of the needle seat, and the top end of each pin extends from the corresponding opening to above the first surface of the plastic package body, the structure of the four second terminals is exactly the same, the four second terminals are arranged side by side and at intervals, and one end of each second terminal is connected to the second side of the top surface of the substrate opposite to the first side (the first side of the top surface of the substrate is the side of the top surface of the substrate close to one of the third surfaces of the plastic package body, and the second side of the top surface of the substrate is the side of the top surface of the substrate close to the other third surface of the plastic package body), each The other end of each second terminal extends from another third surface of the plastic package. A notch is provided on the edge of the first surface of the plastic package near one of the fourth surfaces. The notch extends from the first surface of the plastic package to one of the fourth surfaces and to the top surface of the substrate. A notch is also provided on the edge of the first surface of the plastic package near the other fourth surface. The notch extends from the first surface of the plastic package to the other fourth surface and to the top surface of the substrate. The two notches are spaced apart from the pins, the pin holder, the second terminal, etc. Three recessed structures are also provided on the side of the first surface of the plastic package near the second terminal. Pin holes are provided at the four corners of the first surface of the plastic package. This semiconductor packaging structure directly leads the low-current terminal of the module vertically through the surface of the plastic package by crimping or welding pins, thereby reducing on-resistance, reducing failure rate, improving product reliability, simplifying assembly process, simplifying circuit design of the ceramic substrate, reducing product size, and eliminating the need for bending of the crimped pins, thereby enhancing vibration test resistance. The pin holder is sunken into the plastic package and the plastic encapsulation structure, increasing the creepage distance between terminals and making the pin holder more stable. .

[0098] See also Figure 6-Figure 8 The process of preparing the semiconductor package structure in the embodiment of the present application can be roughly as follows: Figure 6 As shown, first, the mounting base 12, such as a needle base, with a terminal connection portion 122 at the top is welded to a substrate 11, such as a ceramic substrate such as AMB or DBC, by ultrasonic welding or soldering, and one end of the second terminal 15 is welded to the substrate 11 by ultrasonic welding or soldering; then, as shown in FIG. Figure 7 As shown, the product is sealed by a mold with a retracted pin structure and an independent pressure head structure to protect the internal structure. The surface of the molded plastic body has an opening 133 to expose the terminal connection portion 122 of the top portion of the mounting seat 12; finally, as shown Figure 8 As shown, the first terminal 14, such as a fisheye pin, is crimped or welded to a mounting seat 12, such as a needle seat, to realize the lead-out of the electrical performance of the chip functional terminal.

[0099] The embodiments of the present application utilize a method of crimping or welding the first terminal to lead the low-current terminal of the module vertically through the surface of the plastic package. This reduces on-resistance, reduces failure rate, improves product reliability, simplifies assembly process, simplifies substrate circuit design, and reduces product dimensions. The first terminal does not require a bending process, providing enhanced vibration resistance. Furthermore, the mounting base is sunken into the plastic package, increasing the creepage distance between the terminals. The plastic package also covers the portion of the top end surface of the mounting base, making the mounting base more stable.

[0100] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and scope of the appended claims are intended to be included herein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0101] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor packaging structure, characterized in that: include: substrate; A mounting base, fixed on the substrate and electrically connected to the substrate; a plastic package body encapsulating at least a portion of the substrate and a portion of the mounting seat, the plastic package body having a first surface and a second surface disposed opposite each other; the mounting seat is located between the first surface and the second surface, and the mounting seat is spaced apart from the first surface; a terminal connection portion is provided at a top end of the mounting seat adjacent to the first surface; an opening is provided in the plastic package body, the opening extending from the first surface to the terminal connection portion, so that the terminal connection portion is exposed outside the plastic package body through the opening; A first terminal has one end at least partially located in the opening and connected to the terminal connecting portion, and the other end extends out of the opening in a direction away from the terminal connecting portion. The first terminal is spaced apart from the hole wall of the opening.

2. The semiconductor package structure according to claim 1, wherein: The terminal connecting portion is a connecting hole, and one end of the first terminal is connected to the connecting hole; The aperture of the opening is larger than the aperture of the connecting hole.

3. The semiconductor package structure according to claim 2, wherein: The difference between the aperture of the opening and the aperture of the connecting hole is greater than or equal to 2 mm; And / or, the opening is a round hole or a square hole.

4. The semiconductor package structure according to claim 2, wherein: The connection hole extends from the end surface of the top end of the mounting seat in a direction toward the substrate, and the aperture of the end portion of the opening close to one end of the connection hole is smaller than the outer diameter of the end surface of the top end of the mounting seat.

5. The semiconductor package structure according to claim 1, wherein: The opening includes a first opening section adjacent to the terminal connecting portion; The aperture of the first opening section gradually increases from an end of the first opening section close to the terminal connecting portion to an end of the first opening section away from the terminal connecting portion.

6. The semiconductor package structure according to claim 5, wherein: The angle between the hole wall of the first opening section and the extension direction of the first opening section is 5°-15°.

7. The semiconductor package structure according to claim 5, wherein: The opening further comprises: a second opening section, disposed away from the terminal connecting portion; a third opening section, located between the first opening section and the second opening section, and connecting the first opening section and the second opening section; The aperture of the third opening section is equal to the aperture of the end of the first opening section away from the terminal connecting portion; the aperture of the second opening section is larger than the aperture of the third opening section.

8. The semiconductor package structure according to claim 7, wherein: The total depth of the opening is greater than 0.2 mm; and / or, the depth of the first opening section is 0.5 mm to 5 mm; And / or, the depth of the third opening section is 0.1 mm-0.3 mm; And / or, the depth of the second opening section is 0.1 mm-0.3 mm.

9. The semiconductor package structure according to claim 1, wherein: The extending direction of the opening is perpendicular to the first surface, and the extending direction of the first terminal is perpendicular to the first surface; and / or, There are multiple mounting seats, openings and first terminals. Multiple mounting seats are fixed on the substrate at intervals, and multiple openings are opened on the first surface of the plastic package body at intervals. Multiple openings are arranged in a one-to-one correspondence with multiple mounting seats. The terminal connection part of each mounting seat is exposed outside the plastic package body through the corresponding opening, and multiple first terminals are connected to multiple mounting seats in a one-to-one correspondence.

10. The semiconductor package structure according to claim 1, wherein: The substrate has a top surface and a bottom surface that are opposite to each other, the mounting seat is fixed to the top surface of the substrate, the top surface of the substrate is at least partially encapsulated in the plastic package, and the bottom surface of the substrate is at least partially exposed outside the plastic package; The plastic package body further includes a third surface connecting the first surface and the second surface; The semiconductor package structure further includes a second terminal, one end of the second terminal being electrically connected to the substrate and at least partially encapsulated in the plastic package, and the other end of the second terminal extending from the third surface of the plastic package; A portion of the top surface of the substrate is encapsulated in the plastic package; The plastic package body further includes a fourth surface connecting the first surface, the second surface, and the third surface. A notch is provided at the connection between the first surface and the fourth surface of the plastic package body. The notch extends from the first surface to the top surface of the substrate and to the fourth surface. The notch is spaced apart from the mounting seat and the notch is spaced apart from the second terminal. The plastic package body includes two fourth surfaces, the two fourth surfaces are arranged opposite to each other, and a notch is provided at the connection between each fourth surface and the first surface; The plastic package body includes two third surfaces, the two third surfaces are arranged opposite to each other, the second terminal extends from one of the third surfaces, and the opening is arranged near the other third surface so that the first terminal extends from a position of the first surface near the other third surface; The notch is located in the middle of the connection between the fourth surface and the first surface; At least two vertices of the first surface are provided with ejector pinholes.

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