PCB wiring structure

Abstract

The utility model discloses a PCB wiring structure. The PCB wiring structure comprises a first layer board, a second layer board, a third layer board, a fourth layer board, a fifth layer board, a sixth layer board, a seventh layer board and an eighth layer board which are sequentially connected from top to bottom, through holes are formed among the first layer board, the second layer board, the third layer board and the fourth layer board, copper plating layers are arranged on the hole walls of the through holes, and copper plating layers are arranged on the copper plating layers. The copper plating layer located in the area of the third layer board is electrically connected with a surface layer circuit, through drill holes are formed among the fifth layer board, the sixth layer board, the seventh layer board and the eighth layer board, and the drill holes are communicated with the through holes. According to the utility model, the problem of lead wire residue is avoided, the residual lead wire does not need to be processed subsequently, the production cycle of the PCB is shortened, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB wiring, in particular to a PCB wiring structure. Background Art

[0002] The conventional gold finger plating method involves electroplating the gold by pulling the lead wires from the end of the finger pins. However, this method has the following disadvantages: it requires a second etching process to remove the remaining lead wires, leaving stubs for all gold finger signals. These stubs need to be processed later, resulting in a long PCB production cycle and high costs. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a PCB wiring structure.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] An embodiment of the present invention provides a PCB wiring structure, comprising: a first layer board, a second layer board, a third layer board, a fourth layer board, a fifth layer board, a sixth layer board, a seventh layer board, and an eighth layer board connected in sequence from top to bottom, wherein through holes are provided between the first layer board, the second layer board, the third layer board, and the fourth layer board, the hole walls of the through holes are provided with a copper-plated layer, the copper-plated layer located in the third layer board area is electrically connected to a surface circuit, and through drill holes are provided between the fifth layer board, the sixth layer board, the seventh layer board, and the eighth layer board, and the drill holes are communicated with the through holes.

[0006] In a specific embodiment, the through hole and the drilled hole are both circular.

[0007] In a specific embodiment, the diameter of the drilled hole is larger than that of the through hole.

[0008] In a specific embodiment, the aperture of the through hole is 8 mi l or 10 mi l or 12 mi l.

[0009] In a specific embodiment, the borehole has a diameter of 14mil-18mil.

[0010] In one embodiment, the first layer, the second layer, the third layer, the fourth layer, the fifth layer, the sixth layer, the seventh layer, and the eighth layer have the same thickness.

[0011] In a specific embodiment, the thickness of the first layer is 0.1 mm-0.3 mm.

[0012] In a specific embodiment, the seventh layer is a ground layer.

[0013] In a specific embodiment, the fourth layer board and the fifth layer board are power supply layers.

[0014] The PCB wiring structure of the present invention has the following advantages compared with the prior art: through-holes are provided between the first, second, third, and fourth layer boards, the hole walls of the through-holes are provided with a copper-plated layer, the copper-plated layer located in the third layer area is electrically connected to the surface circuit, and through-holes are provided between the fifth, sixth, seventh, and eighth layer boards, and the drilled holes are communicated with the through-holes, thereby avoiding the problem of residual leads, eliminating the need for subsequent processing of the residual leads, shortening the PCB production cycle, and reducing costs.

[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 A cross-sectional schematic diagram of the PCB wiring structure provided by the utility model;

[0018] Figure 2 This is a flow chart of the PCB wiring method provided by the utility model. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0023] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0024] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0025] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0026] See also Figure 1 As shown, the utility model discloses a specific embodiment of a PCB wiring structure, including: a first layer board 10, a second layer board 20, a third layer board 30, a fourth layer board 40, a fifth layer board 50, a sixth layer board 60, a seventh layer board 70, and an eighth layer board 80 connected in sequence from top to bottom, a through hole 90 is provided between the first layer board 10, the second layer board 20, the third layer board 30, and the fourth layer board 40, the hole wall of the through hole 90 is provided with a copper plating layer 100, the copper plating layer 100 located in the area of the third layer board 30 is electrically connected to the surface circuit, a through drill hole 110 is provided between the fifth layer board 50, the sixth layer board 60, the seventh layer board 70, and the eighth layer board 80, and the drill hole 110 is communicated with the through hole 90.

[0027] Specifically, a through hole 90 is provided between the first layer 10, the second layer 20, the third layer 30, and the fourth layer 40. The hole wall of the through hole 90 is provided with a copper-plated layer 100. The copper-plated layer 100 located in the area of the third layer 30 is electrically connected to the surface circuit. A through hole 110 is provided between the fifth layer 50, the sixth layer 60, the seventh layer 70, and the eighth layer 80. The drill hole 110 is connected to the through hole 90, avoiding the problem of residual leads. There is no need to process the residual leads later, shortening the PCB production cycle and reducing costs. In addition, the surface circuit is electrically connected to the copper-plated layer 100 in the area of the third layer 30. This layout makes wiring more flexible and the direction and position of the wires can be adjusted as needed, thereby optimizing the layout of the entire circuit board and reducing signal interference and electromagnetic radiation. In addition, a drill hole 110 connected to the through hole 90 is provided between the fifth and eighth layers 50 and 80. This design cleverly avoids the problem of lead residue that may occur during the traditional PCB manufacturing process. Lead residue not only affects the appearance quality of the circuit board, but may also have an adverse effect on the circuit performance. By connecting the drill hole 110 with the through hole 90, it can be ensured that the leads are completely removed during the manufacturing process, without the need for subsequent processing, thereby simplifying the production process. In addition, since the lead residue problem is avoided, there is no need to process the residual leads later, which greatly shortens the PCB production cycle. At the same time, the simplification of the production process also means reduced production costs, including labor costs, material costs, and equipment usage costs. In addition, through a sophisticated wiring structure and reliable electrical connections, it helps to improve the overall reliability and stability of PCB products, reduce the risk of circuit failures caused by manufacturing defects such as lead residue, and improve the service life and performance of the product.

[0028] In one embodiment, the through hole 90 and the drilled hole 110 are both circular.

[0029] Specifically, circular holes are the most common and standardized hole shape in the PCB industry. Using circular through-holes 90 and drilled holes 110 helps ensure compatibility between PCBs and other electronic components and systems. This standardized design makes it easier to connect and integrate PCBs with other circuit boards or electronic devices. Furthermore, during PCB manufacturing, the drilling process for circular holes 110 is relatively simple and easy to control. A round drill bit can maintain high precision and consistency when drilling holes 110, helping to reduce errors and scrap during production. Furthermore, the smooth edges of circular holes facilitate subsequent copper plating, soldering, and other processes. Furthermore, circular through-holes 90 and drilled holes 110 offer excellent electrical performance. They effectively provide electrical connection channels, ensuring smooth transmission of current and signals between different layers. The circular hole design also helps reduce signal interference and electromagnetic radiation, improving the overall performance of the circuit board. Circular holes also offer advantages in mechanical strength. Due to their uniformity and symmetry, circular through-holes 90 and drilled holes 110 are better able to withstand mechanical stress and impact, which is crucial for improving the durability and reliability of PCBs.

[0030] In one embodiment, the diameter of the drilled hole 110 is larger than that of the through hole 90 .

[0031] Specifically, in the initial setting, a through hole 90 is provided between the first layer 10 and the eighth layer 80, and the hole wall of the through hole 90 is provided with a copper plating layer 100. Then, a drilling hole 110 is set to cover the through hole 90 between the fifth layer 50 and the eighth layer 80 and remove the corresponding copper plating layer 100 to avoid short circuit problems during subsequent PCB use, so that the PCB can be used normally.

[0032] In one embodiment, the aperture of the through hole 90 is 8 mi l or 10 mi l or 12 mi l.

[0033] Specifically, through holes 90 of different apertures have different current carrying capacities. According to industry experience and simulation results, an aperture of 12mil can safely carry a current of about 1.2A. Although the current carrying capacity does not increase linearly with larger apertures (such as 16mil, 20mil, and even 24mil), apertures of 8mil, 10mil, and 12mil can generally meet the current carrying requirements of most conventional PCB designs. In addition, by using through holes 90 of these standard apertures, designers can more flexibly layout and connect components on the circuit board without having to customize tools or processes for specific apertures, which helps to improve design efficiency and reduce the increase in manufacturing costs that may be caused by non-standard apertures. In addition, apertures of 8mil, 10mil, and 12mil provide a good balance between manufacturing cost and performance; smaller apertures (such as 8mil) can save wiring space and reduce parasitic capacitance, making them suitable for high-speed circuit design; while larger apertures (such as 12mil) are easier to process and manufacture, and have higher current carrying capacity. Designers can choose the appropriate aperture size according to specific needs.

[0034] In one embodiment, the borehole 110 has a diameter of 14-18 mi l.

[0035] Specifically, the main purpose of drilling 110 is to cover and remove the unnecessary copper plating layer 100 in the through hole 90 between the multilayer boards. In a multilayer PCB board, the through hole 90 is used to achieve electrical connection between layers, but not all through holes 90 between layers require complete copper plating. By drilling 110 and controlling the aperture within the range of 14mil-18mil, these excess copper plating layers 100 can be accurately removed to avoid signal interference, electromagnetic radiation or short circuit problems. In addition, the aperture size of the drilling hole 110 needs to strike a balance between manufacturing cost and performance. Although a smaller aperture can save material and improve signal integrity, it will increase the difficulty and cost of drilling 110. While a larger aperture is easy to process, it may take up more wiring space and reduce signal transmission efficiency. The aperture range of 14mil-18mil is usually a more reasonable choice, which can both meet performance requirements and control manufacturing costs.

[0036] In one embodiment, the first layer board 10 , the second layer board 20 , the third layer board 30 , the fourth layer board 40 , the fifth layer board 50 , the sixth layer board 60 , the seventh layer board 70 , and the eighth layer board 80 have the same thickness.

[0037] Specifically, when all layers have the same thickness, manufacturers can use uniform process parameters and equipment to process all layers, streamlining the manufacturing process and improving production efficiency. This helps reduce production costs and mitigates quality issues that may arise from process variations. Furthermore, consistent layer thickness helps ensure consistent electrical and mechanical properties across layers. In multilayer PCBs, interlayer consistency is crucial for signal transmission, electromagnetic compatibility (EMC), and mechanical strength. Furthermore, when designing a PCB stackup, if all layers have the same thickness, designers can more easily determine the order and thickness distribution of each layer, helping to optimize the PCB's electrical performance, heat dissipation, and manufacturing costs. Furthermore, consistent layer thickness helps reduce stress concentration and mechanical failure that can occur due to interlayer thickness variations, thereby improving the PCB's reliability and service life. Furthermore, during subsequent PCB processing and assembly processes, such as punching, electroplating, and soldering, consistent thickness across all layers makes it easier to control processing accuracy and assembly quality.

[0038] In one embodiment, the thickness of the first layer 10 is 0.1 mm-0.3 mm.

[0039] Specifically, thinner board thicknesses (e.g., 0.1mm-0.3mm) allow for the placement of more components and traces within a limited space, thereby increasing PCB integration. This is particularly important for the design of miniature electronic products such as smartphones, wearables, and medical devices, which have very strict space requirements. Furthermore, thinner traces and thinner board thicknesses help reduce parasitic capacitance and inductance in signal transmission paths, reducing signal attenuation and interference, thereby improving the PCB's electrical performance. This is particularly important for the design of high-speed, high-frequency circuits. Furthermore, thinner board thicknesses generally mean shorter current transmission paths, reducing resistance and heat generation. Furthermore, thinner board thicknesses help heat dissipate more quickly into the surrounding environment, improving the PCB's heat dissipation performance. This is particularly important for high-power, high-heat-generating components. Furthermore, offering board thickness options ranging from 0.1mm to 0.3mm increases design flexibility and customization, allowing designers to select the most appropriate board thickness based on specific application requirements, component size, wiring density, and other factors.

[0040] In one embodiment, the seventh layer 70 is a ground layer.

[0041] Specifically, the ground plane provides a stable reference potential (typically 0V) for all components on the circuit board. This helps ensure that signals within the circuit are transmitted correctly, as all signals are measured based on this common reference potential. Furthermore, the ground plane effectively reduces electromagnetic interference. In high-speed, high-frequency circuits, signal changes generate electromagnetic fields that can interfere with other signals. The ground plane provides a low-impedance path, allowing these electromagnetic fields to dissipate quickly, thereby reducing interference. Furthermore, the ground plane helps improve signal integrity. In a multilayer PCB, alternating signal and ground layers can form a microstrip or stripline structure, which reduces signal attenuation and reflection during transmission, thereby improving signal transmission quality. Furthermore, in a multilayer PCB, the ground plane can significantly simplify the wiring process. Because the ground plane provides a low-impedance path across the entire layer, it reduces the number of times signal lines must cross between layers, reducing wiring complexity and cost.

[0042] In one embodiment, the fourth layer board 40 and the fifth layer board 50 are power supply layers.

[0043] Specifically, the primary function of a power layer is to provide a stable power supply to the various components on a circuit board. By designating the power layer as a dedicated layer, interference with the power signal during transmission is minimized, thereby ensuring power stability. Furthermore, the design of the power layer helps reduce power noise and interference. In a multilayer PCB, alternating power layers and ground layers form a power and ground plane. This structure provides a low-impedance power loop, reducing the propagation of power noise across the board and interference with other signal layers. Furthermore, the presence of a power layer helps improve signal integrity. Because it provides a stable power supply to components on the board, it reduces signal distortion and errors caused by power supply fluctuations. Furthermore, the power layer can serve as a shield for the signal layer, further reducing crosstalk and interference between signals. Furthermore, designating the power layer as a dedicated layer in a multilayer PCB improves routing density and flexibility. Since the power layer is not used for signal transmission, it can be placed internally on the board, providing more routing space for the signal layer, which facilitates more complex circuit designs and higher levels of integration.

[0044] The PCB wiring structure is not limited to being applied to PCBs with eight layers, but can also be used for PCBs with other numbers of layers, such as 10, 12, or 14 layers, which will not be elaborated on here.

[0045] See also Figure 2 As shown, the embodiment of the present invention provides a wiring method, comprising the following steps:

[0046] S1, setting through holes between the first layer, the second layer, the third layer, the fourth layer, the fifth layer, the sixth layer, the seventh layer, and the eighth layer, and performing copper plating on the hole walls of the through holes to obtain a copper-plated layer;

[0047] Specifically, the copper-plated layer is obtained by copper plating the hole wall of the through hole, which can be used to achieve subsequent electrical connection with the surface circuit.

[0048] S2, connect the surface circuit of the copper plated layer located in the third layer board area;

[0049] Specifically, the copper plating layer in the third layer board area is electrically connected to the surface layer circuit to restore the original signal.

[0050] S3, connecting the gold-plated lead to the copper-plated layer located in the seventh layer board area;

[0051] Specifically, by connecting gold-plated leads, a false short circuit is formed to achieve the gold plating operation of the gold finger.

[0052] S4, performing a back drilling operation on the through hole corresponding to the area between the fifth layer board, the sixth layer board, the seventh layer board, and the eighth layer board to obtain a penetrating drill hole, and the drill hole is connected to the through hole.

[0053] Specifically, the copper plating of the through holes between the fifth layer board, the sixth layer board, the seventh layer board, and the eighth layer board is removed by drilling to avoid subsequent short circuit problems so that the PCB can be used normally.

[0054] The utility model sets penetrating through holes between the first layer, the second layer, the third layer, the fourth layer, the fifth layer, the sixth layer, the seventh layer, and the eighth layer, and performs a copper plating operation on the hole walls of the through holes to obtain a copper-plated layer, then connects the copper-plated layer located in the third layer area to the surface circuit, then connects the copper-plated layer located in the seventh layer area to the gold-plated lead, and then performs a back drilling operation on the through holes corresponding to the areas between the fifth layer, the sixth layer, the seventh layer, and the eighth layer to obtain a penetrating drill hole, and the drill hole is connected to the through hole, thereby avoiding the problem of lead residue, and there is no need to process the residual lead later, thereby shortening the PCB production cycle and reducing the cost.

[0055] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A PCB wiring structure, characterized in that: include: The first layer board, the second layer board, the third layer board, the fourth layer board, the fifth layer board, the sixth layer board, the seventh layer board, and the eighth layer board are connected in sequence from top to bottom. A through hole is provided between the first layer board, the second layer board, the third layer board, and the fourth layer board. The hole wall of the through hole is provided with a copper-plated layer. The copper-plated layer located in the third layer board area is electrically connected to the surface circuit. A through drill hole is provided between the fifth layer board, the sixth layer board, the seventh layer board, and the eighth layer board, and the drill hole is connected to the through hole.

2. A PCB wiring structure according to claim 1, characterized in that: The through hole and the drill hole are both circular.

3. A PCB wiring structure according to claim 2, characterized in that: The borehole has a larger diameter than the through hole.

4. A PCB wiring structure according to claim 3, characterized in that: The through hole has a diameter of 8 mil, 10 mil or 12 mil.

5. A PCB wiring structure according to claim 3, characterized in that: The diameter of the drilled hole is 14 mil-18 mil.

6. A PCB wiring structure according to claim 1, characterized in that: The first layer board, the second layer board, the third layer board, the fourth layer board, the fifth layer board, the sixth layer board, the seventh layer board, and the eighth layer board have the same thickness.

7. A PCB wiring structure according to claim 6, characterized in that: The thickness of the first layer is 0.1 mm to 0.3 mm.

8. The PCB wiring structure according to claim 1, wherein: The seventh layer is a ground layer.

9. The PCB wiring structure according to claim 1, wherein: The fourth and fifth layers of boards are power supply layers.

Images