Cooling water circulation device for high-low temperature damp-heat test chamber

Abstract

The utility model discloses a cooling water circulation device for a high-low temperature damp-heat test chamber, which comprises a high-low temperature damp-heat test chamber body, a placing frame is fixedly connected inside the high-low temperature damp-heat test chamber body, and a first S-shaped cold guide pipe is fixedly connected on the inner side of the high-low temperature damp-heat test chamber body. The refrigerating device has the beneficial effects that the semiconductor refrigerating sheet and the second cold guide plate are arranged, so that the refrigerating side of the semiconductor refrigerating sheet performs cold guide treatment on the second cold guide plate, and refrigerating liquid in the refrigerating box and cooling water in the spiral cold guide water pipe are refrigerated through the second cold guide plate; and after refrigeration, air enters the first S-shaped cold guide pipe and the second S-shaped cold guide pipe, by arranging the draught fan and the air blowing pipe, air blowing through the air blowing pipe at the output end of the draught fan is achieved, and air blowing heat dissipation treatment is conducted on the heat dissipation side of the semiconductor refrigeration piece.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling water circulation, in particular to a cooling water circulation device for a high and low temperature humidity test chamber. Background Art

[0002] High and low temperature test chambers are used for high and low temperature reliability tests of industrial products. They are used to test the performance indicators of parts of related products in the fields of electronics, electrical engineering, automobiles, motorcycles, aerospace, etc. under high and low temperature conditions, as well as high and low temperature alternating cycles. However, the circulating cooling effect of the cooling water used in existing high and low temperature and humidity test chambers is poor, and the cooling efficiency of the cooling water is not high enough, which affects the low temperature environment in the test chamber. Utility Model Content

[0003] The purpose of the present invention is to provide a cooling water circulation device for a high and low temperature humidity test chamber, so as to solve the problem in the above-mentioned background technology that the circulating cooling effect of the cooling water used in the existing high and low temperature humidity test chamber is poor, the refrigeration efficiency of the cooling water is not high enough, and the low temperature environment in the test chamber is affected.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a cooling water circulation device for a high and low temperature humidity and heat test chamber, comprising a high and low temperature humidity and heat test chamber body, the interior of the high and low temperature humidity and heat test chamber body is fixedly connected to a placement rack, the inner side of the high and low temperature humidity and heat test chamber body is fixedly connected to a No. 1 S-shaped cooling pipe, the inner side of the high and low temperature humidity and heat test chamber body is fixedly connected to a No. 2 S-shaped cooling pipe, the inner sides of the No. 1 S-shaped cooling pipe and the No. 2 S-shaped cooling pipe are both fixedly connected to a No. 1 cooling plate, one side of the high and low temperature humidity and heat test chamber body is fixedly connected to a connecting side box, a No. 2 liquid cavity is opened inside the connecting side box, one end of the No. 1 S-shaped cooling pipe and the No. 2 S-shaped cooling pipe are both connected to the No. 2 liquid cavity through a water pipe. , a No. 1 liquid cavity is provided inside the connecting side box, and the other ends of the No. 1 S-type cooling pipe and the No. 2 S-type cooling pipe are connected to the No. 1 liquid cavity through a water pipe, and one side of the connecting side box is fixedly connected to a refrigeration box, and four No. 2 cooling plates are fixedly connected to the inside of the refrigeration box at equal intervals, and the outer sides of the four No. 2 cooling plates are fixedly connected with spiral cooling water pipes, one end of the spiral cooling water pipe is connected to the No. 2 liquid cavity, and a water pump is installed inside the connecting side box, and the input end of the water pump is fixedly connected to one end of the spiral cooling water pipe, and the output end of the water pump is connected to the No. 1 liquid cavity through a water pipe, and a semiconductor refrigeration plate is installed on the top of the refrigeration box, and the cooling side of the semiconductor refrigeration plate is fixedly connected to the No. 2 cooling plate.

[0005] As a preferred solution of the present invention: a liquid inlet pipe is fixedly connected to one side of the refrigeration box, and a liquid outlet pipe is fixedly connected to one side of the refrigeration box.

[0006] As a preferred solution of the present invention: a fan is installed on one side of the high and low temperature humidity test box body, the input end of the fan is fixedly connected to an air inlet hood, and the output end of the fan is fixedly connected to a blow pipe that cooperates with the semiconductor refrigeration plate.

[0007] As a preferred solution of the present invention: a filter is fixedly connected to the top of the air inlet cover.

[0008] As a preferred solution of the present invention: a box door is installed on one side of the high and low temperature humidity test box body, and a control cabinet is provided on one side of the high and low temperature humidity test box body.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention realizes that the cooling side of the semiconductor refrigeration plate is cooled by the semiconductor refrigeration plate on the No. 2 cooling plate, and the refrigerant in the refrigeration box and the cooling water in the spiral cooling water pipe are cooled by the No. 2 cooling plate, and after cooling, they enter the No. 1 S-shaped cooling pipe and the No. 2 S-shaped cooling pipe. By setting up a fan and a blowing pipe, air is blown through the blowing pipe at the output end of the fan, and the heat dissipation side of the semiconductor refrigeration plate is subjected to blowing and heat dissipation treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the internal structure of the utility model;

[0011] Figure 2 For this utility model Figure 1 Enlarged view of point A in the middle;

[0012] Figure 3 This is a top view of the second cooling plate of the utility model;

[0013] Figure 4 This is a side view of the No. 1 S-shaped cooling tube of the utility model.

[0014] In the figure: 1. High and low temperature humidity test chamber body; 2. Chamber door; 3. Placement rack; 4. No. 1 S-type cooling pipe; 5. No. 1 cooling plate; 6. Connecting side box; 7. No. 1 liquid cavity; 8. No. 2 liquid cavity; 9. Refrigeration box; 10. No. 2 cooling plate; 11. Semiconductor refrigeration plate; 12. Spiral cooling water pipe; 13. Water pump; 14. Liquid inlet pipe; 15. Liquid outlet pipe; 16. Control cabinet; 17. No. 2 S-type cooling pipe; 18. Fan; 19. Blowing pipe; 20. Air inlet hood; 21. Filter. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] See also Figures 1 to 4 , The utility model provides a technical solution: a cooling water circulation device for a high and low temperature humidity and heat test chamber, comprising a high and low temperature humidity and heat test chamber body 1, a placing rack 3 fixedly connected to the interior of the high and low temperature humidity and heat test chamber body 1, a No. 1 S-shaped cooling pipe 4 fixedly connected to the inner side of the high and low temperature humidity and heat test chamber body 1, a No. 2 S-shaped cooling pipe 17 fixedly connected to the inner side of the high and low temperature humidity and heat test chamber body 1, a No. 1 cooling plate 5 fixedly connected to the inner sides of the No. 1 S-shaped cooling pipe 4 and the No. 2 S-shaped cooling pipe 17, a No. 1 cooling plate 5 fixedly connected to the inner sides of the No. 1 S-shaped cooling pipe 4 and the No. 2 S-shaped cooling pipe 17, a connecting side box 6 is fixedly connected to one side of the high and low temperature humidity and heat test chamber body 1, a No. 2 liquid cavity 8 is provided in the interior of the connecting side box 6, one end of the No. 1 S-shaped cooling pipe 4 and the No. 2 S-shaped cooling pipe 17 are connected to the No. 2 liquid cavity 8 through a water pipe, a No. 1 liquid cavity 7 is provided in the interior of the connecting side box 6, the No. 1 S-shaped cooling pipe 4 and the No. 2 S-shaped cooling pipe 17 are connected to the No. 2 liquid cavity 8 through a water pipe, a No. 1 liquid cavity 7 is provided in the interior of the connecting side box 6, The other end is connected to the No. 1 liquid cavity 7 through a water pipe. A refrigeration box 9 is fixedly connected to one side of the connecting side box 6. Four No. 2 cold conduction plates 10 are fixedly connected to the inside of the refrigeration box 9 at equal distances. The outer sides of the four No. 2 cold conduction plates 10 are fixedly connected with spiral cold conduction water pipes 12. One end of the spiral cold conduction water pipe 12 is connected to the No. 2 liquid cavity 8. A water pump 13 is installed inside the connecting side box 6. The input end of the water pump 13 is fixedly connected to one end of the spiral cold conduction water pipe 12. The output end of the water pump 13 is connected to the No. 1 liquid cavity 7 through a water pipe. A semiconductor refrigeration plate 11 is installed on the top of the refrigeration box 9. The cooling side of the semiconductor refrigeration plate 11 is fixedly connected to the No. 2 cold conduction plate 10. The No. 2 cold conduction plate 10 is cooled by the cooling side of the semiconductor refrigeration plate 11, and the refrigerant in the refrigeration box 9 in the spiral cold conduction water pipe 12 is cooled by the No. 2 cold conduction plate 10.

[0017] A liquid inlet pipe 14 is fixedly connected to one side of the refrigeration box 9 , and a liquid outlet pipe 15 is fixedly connected to one side of the refrigeration box 9 .

[0018] Among them, a fan 18 is installed on one side of the high and low temperature humidity test chamber body 1, the input end of the fan 18 is fixedly connected to the air inlet hood 20, and the output end of the fan 18 is fixedly connected to the blowing pipe 19 that cooperates with the semiconductor refrigeration plate 11. The fan 18 blows air to the heat dissipating side of the semiconductor refrigeration plate 11 through the blowing pipe 19 to ensure working stability.

[0019] A filter 21 is fixedly connected to the top of the air inlet cover 20 to prevent impurities in the external air from entering the fan 18.

[0020] A door 2 is installed on one side of the high and low temperature humidity test chamber body 1. Opening the door 2 facilitates placing test pieces into the high and low temperature humidity test chamber body 1. A control cabinet 16 is provided on one side of the high and low temperature humidity test chamber body 1.

[0021] Specifically, during use, when the cooling water is circulated for cooling, the water pump 13 is started, and the cooling water in the spiral cooling water pipe 12 is circulated and transported by the water pump 13, and enters the No. 1 S-type cooling pipe 4 and the No. 2 S-type cooling pipe 17 to be cooled by the No. 1 cooling plate 5, and the No. 2 cooling plate 10 is cooled by the side cooled by the semiconductor refrigeration plate 11, and the refrigerant in the refrigeration box 9 in the spiral cooling water pipe 12 is cooled by the No. 2 cooling plate 10, and the water flowing in the spiral cooling water pipe 12 is quickly cooled by the refrigerant. When the semiconductor refrigeration plate 11 is in use, the fan 18 is started, and the fan 18 blows air to the heat-dissipating side of the semiconductor refrigeration plate 11 through the blowing pipe 19 to ensure working stability.

[0022] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "two ends", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one such feature.

[0024] In the present invention, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling water circulation device for a high and low temperature humidity test chamber, comprising a high and low temperature humidity test chamber body (1), characterized in that: The interior of the high and low temperature humidity test box body (1) is fixedly connected with a placement rack (3), the interior of the high and low temperature humidity test box body (1) is fixedly connected with a No. 1 S-type cooling pipe (4), the interior of the high and low temperature humidity test box body (1) is fixedly connected with a No. 2 S-type cooling pipe (17), the interior of the No. 1 S-type cooling pipe (4) and the No. 2 S-type cooling pipe (17) are both fixedly connected with a No. 1 cooling plate (5), one side of the high and low temperature humidity test box body (1) is fixedly connected with a connecting side box (6), the interior of the connecting side box (6) is provided with a No. 2 liquid cavity (8), one end of the No. 1 S-type cooling pipe (4) and the No. 2 S-type cooling pipe (17) are both connected to the No. 2 liquid cavity (8) through a water pipe, the interior of the connecting side box (6) is provided with a No. 1 liquid cavity (7), ... No. 1 liquid cavity (7) is provided, the No. 1 S-type cooling pipe (4) and the No. 2 S-type cooling pipe (17) are both connected to the No. 2 liquid cavity (8) through a water pipe, the No. 1 liquid cavity (7) is provided, the No. 1 S-type cooling pipe (4) and the No. 2 S-type cooling pipe (17) are both connected to the No. 2 liquid cavity (8) through a water pipe, the No. 1 liquid cavity (7) is The other end of the cooling pipe (17) is connected to the No. 1 liquid cavity (7) through a water pipe. One side of the connecting side box (6) is fixedly connected to a refrigeration box (9). Four No. 2 cooling plates (10) are fixedly connected inside the refrigeration box (9) at equal intervals. The outer sides of the four No. 2 cooling plates (10) are fixedly connected to spiral cooling water pipes (12). One end of the spiral cooling water pipe (12) is connected to the No. 2 liquid cavity (8). A water pump (13) is installed inside the connecting side box (6). The input end of the water pump (13) is fixedly connected to one end of the spiral cooling water pipe (12). The output end of the water pump (13) is connected to the No. 1 liquid cavity (7) through a water pipe. A semiconductor refrigeration plate (11) is installed on the top of the refrigeration box (9). The cooling side of the semiconductor refrigeration plate (11) is fixedly connected to the No. 2 cooling plate (10).

2. The cooling water circulation device for a high and low temperature and humidity test chamber according to claim 1, characterized in that: One side of the refrigeration box (9) is fixedly connected to a liquid inlet pipe (14), and one side of the refrigeration box (9) is fixedly connected to a liquid outlet pipe (15).

3. The cooling water circulation device for a high and low temperature and humidity test chamber according to claim 1, characterized in that: A fan (18) is installed on one side of the high and low temperature humidity test box body (1), the input end of the fan (18) is fixedly connected to an air inlet cover (20), and the output end of the fan (18) is fixedly connected to a blow pipe (19) that cooperates with the semiconductor refrigeration plate (11).

4. The cooling water circulation device for a high and low temperature and humidity test chamber according to claim 3, characterized in that: A filter screen (21) is fixedly connected to the top of the air inlet cover (20).

5. The cooling water circulation device for a high and low temperature and humidity test chamber according to claim 1, characterized in that: A box door (2) is installed on one side of the high and low temperature humidity test box body (1), and a control cabinet (16) is provided on one side of the high and low temperature humidity test box body (1).

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