Novel mechanism for preventing high-temperature laser etching dust from bonding

Abstract

The utility model discloses a novel mechanism for preventing high-temperature laser etching dust from bonding, which belongs to the technical field of metal piece laser etching dust cleaning and comprises a base, a sealing shell is arranged at the upper end of the base, a product placing table is arranged in the middle of the upper end of the base, a product positioning plate is arranged in the middle of the sealing shell, and a sealing plate is arranged in the middle of the product positioning plate. The water-cooling heat dissipation assembly is arranged, the bottom of a product makes contact with the upper ends of the heat dissipation pieces, the heat dissipation pieces conduct heat and conduct heat of the product, the heat is absorbed through cooling liquid in the water-cooling groove, heat accumulation is avoided, the semiconductor refrigeration pieces conduct refrigeration, and the temperature of the cooling liquid in the water-cooling groove is lowered; heat generated by the semiconductor chilling plate is dissipated through the heat dissipation pipe and then discharged from the heat dissipation opening, the heat insulation coating prevents the heat in the heat dissipation pipe from being transferred to the product, and the situation that the product is bonded with dust due to the fact that the laser etching temperature is too high is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser engraving dust cleaning for metal parts, and particularly relates to a novel high-temperature resistant laser engraving dust bonding mechanism. Background Art

[0002] Precision metal structural parts are widely used in smart terminal products. Usually, it is necessary to laser engrave QR codes, logos, conductive bits, etc. on the inner surface of these metal structural parts.

[0003] Chinese patent application number 202221417527.0 discloses a high-temperature resistant laser engraving dust bonding device, comprising a sealed box, the side end of which is connected to a negative pressure air inlet pipe, a product placement table provided inside the sealed box, and a laser engraving processing port provided on the upper end surface of the sealed box, located directly above the product placement table. The product placement table is provided inside the sealed box connected to the negative pressure air inlet pipe. When the product is laser engraved, room temperature air is used to quickly cool the product to prevent laser engraving dust from adhering to the product surface due to overheating of the laser engraving temperature. At the same time, negative pressure is used to absorb dust in the air and dust not adhering to the product surface, thereby removing dust generated by laser engraving, improving production efficiency, increasing the yield rate of laser engraving, and reducing the labor intensity of workers.

[0004] The above-mentioned patent has the following problems when in use: the heat dissipation structure is single, the heat dissipation effect is poor, which affects the laser engraving effect; at the same time, the fixing and installation between the sealing plate and the product positioning plate is troublesome, time-consuming and labor-intensive, and affects the use. Utility Model Content

[0005] In order to solve the problems raised in the above background technology, the utility model provides a novel high-temperature resistant laser engraving dust bonding mechanism, which has the characteristics of good heat dissipation effect and detachable sealing plate and product positioning plate.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new type of high-temperature resistant laser engraving dust bonding mechanism, comprising a base, a sealing shell is provided at the upper end of the base, a product placement table is provided in the middle of the upper end of the base, a product positioning plate is provided in the middle of the sealing shell, a sealing plate is provided in the middle of the product positioning plate, a water-cooled heat dissipation component is provided in the middle of the product placement table, product placement pads are provided around the upper end of the product placement table, heat dissipation ports are provided on both sides of the sealing shell, fixing components are provided on both sides of the sealing plate, pin holes are provided on both sides of the middle groove of the product positioning plate, and negative pressure air intake pipes are provided on the sides of the base and the sealing shell.

[0007] Preferably, the water-cooled heat dissipation component includes a water-cooling trough, a heat sink and heat dissipation holes, wherein a water-cooling trough is provided inside the product placement table, a heat sink is provided at the upper end of the water-cooling trough, a plurality of heat dissipation holes are provided on the surface of the heat sink, and the upper end of the heat sink is flush with the product placement pad.

[0008] Preferably, the water-cooled heat dissipation component also includes a mounting groove, a heat dissipation pipe and a semiconductor refrigeration plate, wherein a mounting groove is provided at the bottom of the product placement table, a semiconductor refrigeration plate is provided in the middle of the mounting groove, and heat dissipation pipes are provided on both sides of the mounting groove.

[0009] Preferably, the surface of the heat dissipation pipe is provided with a heat insulation coating, and the side of the heat dissipation pipe is in close contact with the heat dissipation port.

[0010] Preferably, the fixing assembly includes a movable groove, a handle, a fixing pin and a return spring, wherein movable grooves are provided on both sides of the sealing plate, a return spring is provided inside the movable groove, the side of the return spring is connected to the fixing pin, and a handle is provided on the upper end of the fixing pin near the side of the return spring.

[0011] Preferably, the fixing pin is always inserted into the pin hole under the elastic force of the return spring.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The utility model is provided with a water-cooled heat dissipation component. The bottom of the product contacts the upper end of the heat sink. The heat sink conducts heat and conducts the heat of the product. The heat is absorbed by the coolant in the water-cooling tank to avoid heat accumulation. The semiconductor refrigeration chip cools down the coolant temperature in the water-cooling tank to ensure that the heat sink continues to cool the product. The heat generated by the semiconductor refrigeration chip is dissipated through the heat dissipation pipe and then discharged from the heat dissipation port. The heat insulation coating prevents the heat in the heat dissipation pipe from being transferred to the product, thus preventing the product from being adhered to dust due to overheating of the laser engraving temperature.

[0014] 2. The utility model is provided with a fixing assembly. Pull the handle to retract the fixing pin into the movable groove, compress the reset spring, and place the sealing plate in the middle of the product positioning plate. Then release the handle, and the fixing pin moves back under the elastic force of the reset spring. The fixing pin is inserted into the pin hole, thereby realizing quick installation of the sealing plate, saving time and effort, and being convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the water cooling and heat dissipation component of the utility model;

[0017] Figure 3 This is a schematic diagram of the position structure of the semiconductor refrigeration plate of the utility model;

[0018] Figure 4 This is a schematic diagram of the fixing assembly structure of the utility model;

[0019] In the figure: 1. Sealing plate; 2. Fixing assembly; 21. Movable groove; 22. Handle; 23. Fixing pin; 24. Return spring; 3. Pin hole; 4. Product positioning plate; 5. Sealing shell; 6. Base; 7. Negative pressure air inlet pipe; 8. Product placement table; 9. Water-cooled heat dissipation assembly; 91. Water-cooling tank; 92. Heat sink; 93. Mounting slot; 94. Heat dissipation pipe; 95. Heat dissipation hole; 96. Semiconductor refrigeration plate; 97. Thermal insulation coating; 10. Heat dissipation port; 11. Product placement pad. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1

[0022] See also Figure 1-4 The utility model provides the following technical solutions: a new type of high-temperature resistant laser engraving dust bonding mechanism, comprising a base 6, a sealing shell 5 is provided on the upper end of the base 6, a product placement platform 8 is provided in the middle of the upper end of the base 6, a product positioning plate 4 is provided in the middle of the sealing shell 5, a sealing plate 1 is provided in the middle of the product positioning plate 4, a water-cooled heat dissipation component 9 is provided in the middle of the product placement platform 8, a product placement pad 11 is provided around the upper end of the product placement platform 8, heat dissipation ports 10 are provided on both sides of the sealing shell 5, fixing components 2 are provided on both sides of the sealing plate 1, pin holes 3 are provided on both sides of the middle groove of the product positioning plate 4, and negative pressure air intake pipes 7 are provided on the sides of the base 6 and the sealing shell 5.

[0023] Specifically, the water-cooled heat dissipation component 9 includes a water-cooling tank 91, a heat sink 92 and heat dissipation holes 95, wherein a water-cooling tank 91 is provided inside the product placement table 8, a heat sink 92 is provided at the upper end of the water-cooling tank 91, a surface of the heat sink 92 is provided with a plurality of heat dissipation holes 95, and the upper end of the heat sink 92 is flush with the product placement pad 11.

[0024] By adopting the above technical solution, the bottom of the product contacts the upper end of the heat sink 92, and the heat sink 92 conducts heat, transferring the heat of the product to the coolant in the water-cooling tank 91 to avoid heat accumulation.

[0025] Specifically, the water-cooled heat dissipation component 9 also includes a mounting groove 93, a heat dissipation pipe 94 and a semiconductor refrigeration plate 96, wherein a mounting groove 93 is provided at the bottom of the product placement table 8, a semiconductor refrigeration plate 96 is provided in the middle of the mounting groove 93, and heat dissipation pipes 94 are provided on both sides of the mounting groove 93.

[0026] By adopting the above technical solution, the semiconductor refrigeration plate 96 cools down, reducing the temperature of the coolant in the water-cooling tank 91, ensuring that the heat sink 92 continues to cool the product. The heat generated by the semiconductor refrigeration plate 96 is dissipated through the heat dissipation pipe 94 and then discharged from the heat dissipation port 10.

[0027] Specifically, a heat-insulating coating 97 is provided on the surface of the heat-dissipating pipe 94 , and the side of the heat-dissipating pipe 94 is in close contact with the heat-dissipating port 10 .

[0028] By adopting the above technical solution, the heat-insulating coating 97 prevents the heat in the heat pipe 94 from being transferred to the product, thereby ensuring the heat dissipation effect.

[0029] When this embodiment is used, the product will be placed on the product placement pad 11, and then the protective pad and the sealing plate 1 will be placed on top and fixed. The bottom of the product will contact the upper end of the heat sink 92, and the product will be processed through the laser carving processing port in the middle of the sealing plate 1. While the laser carving is being performed, the negative pressure air intake pipe 7 will continuously suck air into the interior of the sealing shell 5, so that the heat, dust, etc. generated during the laser carving will be sucked to the outside of the sealing shell 5 by the negative pressure air intake pipe 7. The heat sink 92 will conduct heat and transfer the heat of the product to the coolant in the water-cooling tank 91 to avoid heat accumulation. The semiconductor refrigeration sheet 96 will cool down and reduce the temperature of the coolant in the water-cooling tank 91, ensuring that the heat sink 92 will continue to cool the product. The heat generated by the semiconductor refrigeration sheet 96 will be dissipated through the heat pipe 94 and then discharged from the heat dissipation port 10. The thermal insulation coating 97 will prevent the heat in the heat pipe 94 from being transferred to the product, and will prevent the product from being adhered to dust due to overheating of the laser carving temperature.

[0030] Example 1

[0031] The difference between this embodiment and embodiment 1 is that the fixing assembly 2 includes a movable groove 21, a handle 22, a fixing pin 23 and a return spring 24, wherein movable grooves 21 are provided on both sides of the sealing plate 1, a return spring 24 is provided inside the movable groove 21, the side of the return spring 24 is connected to the fixing pin 23, and a handle 22 is provided on the upper end of the fixing pin 23 near the side of the return spring 24.

[0032] By adopting the above technical solution, the handle 22 is pulled to retract the fixing pin 23 into the movable groove 21, the return spring 24 is compressed, and the sealing plate 1 is placed in the middle of the product positioning plate 4. Then, the handle 22 is released, and the fixing pin 23 moves back under the elastic force of the return spring 24. The fixing pin 23 is inserted into the pin hole 3, thereby achieving quick installation and saving time and effort.

[0033] Specifically, the fixing pin 23 is always inserted into the pin hole 3 under the elastic force of the return spring 24 .

[0034] By adopting the above technical solution, the fixing pin 23 is inserted into the pin hole 3 under the elastic force of the return spring 24, so that quick installation is achieved and the fixing pin 23 is prevented from falling off easily.

[0035] When using this embodiment, the product is placed on the product placement pad 11, and then a protective pad is placed on top. The handle 22 is pulled to retract the fixing pin 23 into the movable groove 21, and the return spring 24 is compressed. After the sealing plate 1 is placed in the middle of the product positioning plate 4, the handle 22 is released, and the fixing pin 23 moves back under the elastic force of the return spring 24. The fixing pin 23 is inserted into the pin hole 3, which realizes quick installation, saves time and effort, and is convenient to use.

[0036] The working principle and use process of the present invention: When the present invention is used, the product will be placed on the product placement pad 11, and then a protective pad will be placed on top. The handle 22 will be pulled to retract the fixing pin 23 into the movable groove 21, and the return spring 24 will be compressed. After the sealing plate 1 is placed in the middle of the product positioning plate 4, the handle 22 will be released, and the fixing pin 23 will move back under the elastic force of the return spring 24. The fixing pin 23 will be inserted into the pin hole 3 to achieve quick installation. The bottom of the product will contact the upper end of the heat sink 92, and the product will be processed through the laser engraving processing port in the middle of the sealing plate 1. While the laser engraving is being performed, negative pressure air is taken in. The tube 7 continuously sucks air into the interior of the sealed shell 5, so that the heat, dust, etc. generated during laser engraving are sucked to the outside of the sealed shell 5 by the negative pressure air inlet pipe 7. The heat sink 92 conducts heat and transfers the heat of the product, which is absorbed by the coolant in the water-cooling tank 91 to avoid heat accumulation. The semiconductor refrigeration plate 96 cools down the coolant temperature in the water-cooling tank 91 to ensure that the heat sink 92 continues to cool the product. The heat generated by the semiconductor refrigeration plate 96 is dissipated through the heat dissipation pipe 94 and then discharged from the heat dissipation port 10. The thermal insulation coating 97 prevents the heat in the heat dissipation pipe 94 from being transferred to the product, thereby preventing the product from sticking to dust due to overheating of the laser engraving temperature.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel high-temperature resistant laser engraving dust bonding mechanism, comprising a base (6), a sealing shell (5) provided at the upper end of the base (6), a product placement platform (8) provided in the middle of the upper end of the base (6), a product positioning plate (4) provided in the middle of the sealing shell (5), and a sealing plate (1) provided in the middle of the product positioning plate (4), characterized in that: A water-cooled heat dissipation component (9) is provided in the middle of the product placement table (8), a product placement pad (11) is provided around the upper end of the product placement table (8), heat dissipation ports (10) are provided on both sides of the sealing shell (5), fixing components (2) are provided on both sides of the sealing plate (1), pin holes (3) are provided on both sides of the middle groove of the product positioning plate (4), and negative pressure air intake pipes (7) are provided on the sides of the base (6) and the sealing shell (5).

2. The novel high-temperature resistant laser engraving dust bonding mechanism according to claim 1 is characterized by: The water-cooling heat dissipation component (9) includes a water-cooling trough (91), a heat sink (92) and heat dissipation holes (95), wherein the product placement table (8) is provided with a water-cooling trough (91), a heat sink (92) is provided at the upper end of the water-cooling trough (91), a surface of the heat sink (92) is provided with a plurality of heat dissipation holes (95), and the upper end of the heat sink (92) is flush with the product placement pad (11).

3. The novel high-temperature resistant laser engraving dust bonding mechanism according to claim 2 is characterized by: The water-cooled heat dissipation component (9) further comprises a mounting groove (93), a heat dissipation pipe (94) and a semiconductor cooling plate (96), wherein the mounting groove (93) is provided at the bottom of the product placement table (8), a semiconductor cooling plate (96) is provided in the middle of the mounting groove (93), and heat dissipation pipes (94) are provided on both sides of the mounting groove (93).

4. The novel high-temperature resistant laser engraving dust bonding mechanism according to claim 3 is characterized by: The surface of the heat dissipation pipe (94) is provided with a heat insulation coating (97), and the side of the heat dissipation pipe (94) is in close contact with the heat dissipation port (10).

5. The novel high-temperature resistant laser engraving dust bonding mechanism according to claim 1 is characterized in that: The fixing assembly (2) comprises a movable groove (21), a handle (22), a fixing pin (23) and a return spring (24), wherein the sealing plate (1) is provided with movable grooves (21) on both sides, a return spring (24) is provided inside the movable groove (21), the side of the return spring (24) is connected to the fixing pin (23), and the upper end of the fixing pin (23) is provided with a handle (22) near the return spring (24).

6. The novel high-temperature resistant laser engraving dust bonding mechanism according to claim 5 is characterized by: The fixing pin (23) is always inserted into the pin hole (3) under the elastic force of the return spring (24).

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