Liquid medium storage device used between heat source and radiator and radiating device

Abstract

The utility model relates to a liquid medium storage device used between a heat source and a radiator and a radiating device, and the liquid medium storage device is used for being arranged between the heat source and the radiator and comprises a heat source seat and an interlayer; the heat source seat is provided with a top part and a surrounding part extending downwards from the periphery of the top part, and a bare area is arranged on the top part; the interlayer is horizontally arranged on the top of the heat source seat, the interlayer is provided with an accommodating area and corresponds to the bare area, and the accommodating area is substantially equal to or smaller than the bare area; wherein the surface of the heat source is tightly matched and forced into the accommodating area through the bare area, and the radiator is attached to the interlayer, so that a liquid medium is injected between the heat source in the accommodating area and the radiator.

Description

Technical Field

[0001] The present application relates to a radiator, and in particular to a liquid medium storage device and a heat dissipation device used between a heat source and a radiator. Background Art

[0002] When attaching a heatsink like a water block to a CPU, the CPU may be deformed due to overtightening of the heatsink clamps when attaching the heatsink to the CPU. Therefore, products such as CPU anti-bend clamps are commercially available that can be attached to the CPU before the heatsink is assembled, preventing the CPU from being damaged by bending forces.

[0003] However, when the heat sink and CPU are in contact, they still need to transfer heat through a medium such as thermal paste. Current thermal media, such as liquid metal, can overflow due to gravity when the CPU motherboard is in an upright position. This can cause the heat sink and CPU to lose contact with the thermal paste, leading to CPU overheating and system thermal failure.

[0004] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied scientific theories, and finally proposed this application which has a reasonable design and effectively improves the above-mentioned deficiencies. Utility Model Content

[0005] The main purpose of this application is to provide a liquid medium storage device and a heat dissipation device for use between a heat source and a radiator, which further forms a space for accommodating the liquid medium, thereby preventing the liquid metal from overflowing from between the heat source and the radiator due to the influence of gravity and the like.

[0006] In order to achieve the above-mentioned purpose, the present application provides a liquid medium storage device for use between a heat source and a radiator, which is arranged between the heat source and the radiator and includes a heat source seat and an interlayer; the heat source seat has a top and a surrounding portion extending downward from the periphery of the top, and a bare area is provided on the top; and the interlayer is placed flat on the top of the heat source seat, the interlayer has a containing area and corresponds to the bare area, and the containing area is substantially equal to or smaller than the bare area; wherein, the surface of the heat source is tightly fitted into the containing area through the bare area, and the radiator is attached to the interlayer to provide liquid medium injection between the heat source and the radiator in the containing area.

[0007] In one embodiment, the heat source seat is a CPU anti-bending fastener.

[0008] In one embodiment, a plurality of fixing holes are provided on the top of the heat source seat, and a screw assembly is passed through each fixing hole.

[0009] In one embodiment, the interlayer is glued onto the top of the heat source seat.

[0010] In order to achieve the above-mentioned purpose, the present application provides a heat dissipation device for being arranged on a heat source; the heat dissipation device includes a heat sink, a heat dissipation clip and a liquid medium storage; the heat sink has a heat receiving part and is attached to the heat source; the heat dissipation clip is correspondingly arranged below the heat source and assembled with the heat sink; and the liquid medium storage includes a heat source seat and an interlayer; the heat source seat has a top and a surrounding part extending downward from the periphery of the top, and a bare area is provided on the top; the interlayer is placed flat on the top of the heat source seat, the interlayer has a containing area and corresponds to the bare area, and the containing area is substantially equal to or smaller than the bare area; wherein, the surface of the heat source is tightly fitted into the containing area through the bare area, and the heat receiving part of the radiator is attached to the interlayer to provide liquid medium injection between the heat source and the heat sink in the containing area.

[0011] In one embodiment, the heat sink is a heat sink with fins or a water cooling head.

[0012] In one embodiment, the heat source seat is a CPU anti-bending fastener.

[0013] In one embodiment, a plurality of fixing holes are provided on the top of the heat source seat, and a screw assembly is passed through each fixing hole.

[0014] In one embodiment, the interlayer is glued onto the top of the heat source seat.

[0015] In one embodiment, the liquid medium is liquid metal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional exploded view of the first embodiment of the present application.

[0017] Figure 2 This is a three-dimensional exploded view of the first embodiment of the present application applied to a heat source.

[0018] Figure 3 This is a perspective exploded view of the first embodiment of the present application applied to a heat dissipation device.

[0019] Figure 4 This is a three-dimensional assembly diagram of the first embodiment of the present application applied to a heat dissipation device.

[0020] Figure 5 This is a cross-sectional diagram of the first embodiment of the present application in use.

[0021] Figure 6 This is a three-dimensional exploded view of the second embodiment of the present application.

[0022] Figure 7 This is a three-dimensional exploded view of the second embodiment of the present application applied to a heat source.

[0023] Figure 8 This is a perspective exploded view of the second embodiment of the present application applied to a heat dissipation device.

[0024] Figure 9 This is a three-dimensional assembly diagram of the second embodiment of the present application applied to a heat dissipation device.

[0025] Figure 10 This is a cross-sectional diagram of the second embodiment of the present application in use.

[0026] Figure 11 This is a three-dimensional exploded view of the third embodiment of the present application.

[0027] Figure 12 This is a three-dimensional exploded view of the fourth embodiment of the present application.

[0028] Figure 13 This is a schematic diagram of an embodiment of a heat sink used for air cooling in the present application.

[0029] Description of reference numerals:

[0030] 1: Liquid medium storage;

[0031] 10: heat source seat;

[0032] 100: top;

[0033] 101: surrounding part;

[0034] 102: bare area;

[0035] 103: fixing hole;

[0036] 104: screw assembly;

[0037] 11: interlayer;

[0038] 110: Accommodation area;

[0039] 2: Radiator;

[0040] 20: heating part;

[0041] 20a: surface;

[0042] 21: positioning foot;

[0043] 22: water pump;

[0044] 3: Heat dissipation buckle;

[0045] 30:Buckle body;

[0046] 31: fixed foot;

[0047] 32: locking assembly;

[0048] 4: heat source;

[0049] 4a: surface;

[0050] 40:Substrate;

[0051] L: Liquid medium. DETAILED DESCRIPTION

[0052] In order to further disclose the features and technical contents of this application, please refer to the following detailed description and drawings of this application. However, the attached drawings are provided for reference and illustration only and are not intended to limit this application.

[0053] See also Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , which are respectively a three-dimensional exploded view of the first embodiment of the present application, a three-dimensional exploded view applied to a heat source, a three-dimensional exploded view applied to a heat dissipation device, and a three-dimensional combined view. The present application provides a liquid medium storage device and a heat dissipation device thereof between a heat source and a heat dissipation device. The liquid medium storage device 1 is used to be assembled on a heat source 4 (i.e., Figure 2 As shown, the heat source 4 can be further assembled with a heat sink 2 and a heat sink clip 3, thereby preventing deformation or bending of the heat source 4 surface and preventing the liquid medium for heat conduction between the heat source 4 and the heat sink 2 from overflowing. The liquid medium reservoir 1 includes a heat source base 10 and an interlayer 11 superimposed on the heat source base 10; wherein:

[0054] like Figure 1 and Figure 2 As shown, the heat source base 10 can be a CPU anti-bending clip, which can be applied to the heat source 4 of the "Intel" brand CPU, and has a top 100 and a surrounding portion 101 extending downward from the periphery of the top 100, so that the heat source base 10 can be placed on the heat source 4. The top 100 of the heat source base has a bare area 102. When the heat source base 10 is placed on the heat source 4, the surface 4a of the heat source 4 can pass through and protrude above the bare area 102 (i.e., Figure 5 In addition, the heat source base 10 may be provided with a plurality of fixing holes 103 on the top 100 for screwing components 104 such as screws to penetrate and fix the heat source base 10 to the substrate 40 electrically connected to the heat source 4.

[0055] As mentioned above, the interlayer 11 is placed flat on the top 100 of the above-mentioned heat source seat 10; specifically, in actual use, since the liquid medium storage 1 is arranged between the heat source 4 and the radiator 2, the interlayer 11 will also be sandwiched by the radiator 2 on the top 100 of the heat source seat 10, without the need to add any fixed structure or other equivalent technical means. However, if necessary, further additions can be made, for example, the interlayer 11 can be glued to the top 100 of the heat source seat 10 by gluing methods such as glue (not shown), but it is not limited to this. In addition, the interlayer 11 has a accommodating area 110 and corresponds to the bare area 102, and the accommodating area 110 is substantially equal to or smaller than the bare area 102, and the surface 4a of the heat source 4 is tightly fitted and forced into so that the surface 4a is located in the accommodating area 110, that is, the surface 4a of the heat source 4 does not protrude outside the accommodating area 110, and is lower than the upper surface of the interlayer 11, that is, Figure 5 shown.

[0056] like Figure 3 and Figure 4 As shown, the liquid medium storage device 1 can also be further applied to a heat dissipation device, which includes the above-mentioned heat sink 2 and heat dissipation clip 3. The heat sink 2 can be a heat sink with fins that utilizes air cooling (i.e., Figure 13 As shown), or a water-cooled head used in a liquid cooling system; in this embodiment, the radiator 2 is a water-cooled head and has a heat receiving portion 20 and a plurality of positioning legs 21 extending from the periphery of the heat receiving portion 20. The radiator 2 may further be provided with a water pump 22 and used to connect to a coolant circulation system (not shown). The heat dissipation clip 3 has a clip body 30 and a plurality of fixing legs 31 extending from the periphery of the clip body 30. A locking assembly 32 is provided on each fixing leg 31 and is locked to each positioning leg 21 and each fixing leg 31 through the above-mentioned base plate 40. The radiator can then be placed on the heat source 4, and the heat receiving portion 20 of the radiator 2 is attached to the liquid medium reservoir 1.

[0057] like Figure 5 As shown, since the surface 4a of the heat source 4 does not protrude outside the accommodating area 110 and is lower than the upper surface of the interlayer 11, a certain gap can exist between the surface 4a of the heat source 4 and the surface 20a of the heat receiving portion 20 of the radiator 2 in the accommodating area 110 of the interlayer 11, so that a liquid medium L such as liquid metal can be injected therein, thereby serving as a heat transfer medium between the heat source 4 and the radiator 2 and being effectively confined by the interlayer 11 so as not to overflow.

[0058] Furthermore, if Figures 6 to 10The figure shows an embodiment of the present application applicable to a CPU heat source 4 of the AMD brand. The main feature is that the exposed area 102 of the upper heat source base 10 and the receiving area 110 of the interlayer 11 have corresponding shapes to suit the appearance of the heat source 4 of different brands. Other features, such as the type and design of the heat sink 2 and heat dissipation clip 3, can also be adjusted to suit different brands or specifications.

[0059] In addition, if Figure 11 and Figure 12 As shown in FIG. 1 , when the present invention is applied to the "Intel" and "AMD" brands, different variations can be made to the outer shape of the interlayer 11. Since these variations do not affect the objectives and functions required by the present invention, they are only disclosed and not further described.

[0060] like Figure 13 As shown, the present invention can also be applied to aluminum extruded heat sinks or fin stack heat sinks, that is, heat sinks 2 that are cooled by air. Therefore, the present invention is not limited to the above-mentioned water cooling heads.

[0061] Therefore, by means of the above-mentioned structure, the liquid medium storage device and the heat dissipation device used between the heat source and the heat sink of the present application can be obtained.

[0062] However, the above description is only a preferred embodiment of the present application and does not limit the patent scope of the present application. Therefore, all equivalent structural changes made by using the contents of the description and drawings of this application are also included in the scope of the present application and are hereby stated.

Claims

1. A liquid medium storage device used between a heat source and a radiator, characterized in that: Used to be placed between the heat source and the radiator; The liquid medium storage device comprises: A heat source seat having a top and a surrounding portion extending downward from a periphery of the top, wherein a bare area is provided on the top; and an interlayer, placed flat on the top of the heat source seat, the interlayer having a receiving area corresponding to the bare area, and the receiving area is substantially equal to or smaller than the bare area; The surface of the heat source is tightly fitted into the accommodation area through the bare area, and the radiator is attached to the interlayer so that liquid medium can be injected between the heat source and the radiator in the accommodation area.

2. The liquid medium storage device used between a heat source and a radiator according to claim 1, characterized in that: The heat source seat is a CPU anti-bending buckle.

3. The liquid medium storage device used between a heat source and a radiator according to claim 1, characterized in that: A plurality of fixing holes are provided on the top of the heat source seat, and a screw assembly is passed through each of the fixing holes.

4. The liquid medium storage device used between a heat source and a radiator according to claim 1, wherein: The interlayer is glued onto the top of the heat source seat.

5. A heat dissipation device, characterized in that: Used to be arranged on a heat source; the heat dissipation device includes: a radiator having a heat receiving portion and attached to the heat source; A heat dissipation fastener, correspondingly provided below the heat source and assembled with the heat sink; and Liquid medium reservoir, comprising: A heat source seat having a top and a surrounding portion extending downward from a periphery of the top, wherein a bare area is provided on the top; and An interlayer is placed flat on the top of the heat source seat, the interlayer has a receiving area corresponding to the bare area, and the receiving area is substantially equal to or smaller than the bare area; The surface of the heat source is tightly fitted into the accommodating area through the bare area, and the heated portion of the radiator is attached to the interlayer so that liquid medium can be injected between the heat source and the radiator in the accommodating area.

6. The heat dissipation device according to claim 5, wherein: The radiator is a radiator with fins or a water cooling head.

7. The heat dissipation device according to claim 5, wherein: The heat source seat is a CPU anti-bending buckle.

8. The heat dissipation device according to claim 5, wherein: A plurality of fixing holes are arranged on the top of the heat source seat, and a screw assembly is passed through each of the fixing holes.

9. The heat dissipation device according to claim 5, wherein: The interlayer is glued onto the top of the heat source seat.

10. The heat dissipation device according to claim 5, wherein: The liquid medium is liquid metal.

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