Wafer box clamping device and material taking device

Abstract

The embodiment of the utility model provides a wafer box clamping device which is used for clamping a wafer box, supporting plates are arranged on the two sides of the wafer box respectively, the wafer box clamping device comprises a connecting rod and clamping jaws, and the clamping jaws are oppositely arranged and connected with the connecting rod; the two clamping jaws are respectively clamped with the wafer box; the first micro-motion sensors are electrically connected with the mechanical arm, mounting grooves are formed in the tops of the two clamping jaws, the total number of the mounting grooves is the same as the total number of the first micro-motion sensors, the mounting grooves and the first micro-motion sensors are in one-to-one correspondence, and the first micro-motion sensors are installed in the corresponding mounting grooves. Each supporting plate is pressed on the first micro-motion sensor on the corresponding clamping jaw, and when each first micro-motion sensor is pressed into the corresponding installation groove, the mechanical arm drives the wafer box clamping device to move. When the two supporting plates do not make contact with all the first micro-motion sensors, the two clamping jaws immediately clamp and hold the wafer box, and the risk that the wafer box falls off in the transportation process due to the fact that the placement position of the wafer box is inclined is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of wafer box clamps, and in particular to a wafer box clamp and a material removal device. Background Art

[0002] Wafer cassettes (SMIFs, wafer loading and inspection integrated devices) primarily serve to store and transport wafers in semiconductor production. Chip manufacturers use cassettes to handle and store wafers to simplify transportation and minimize the risk of contamination. Cassette grippers are specialized devices for gripping wafer cassettes. Because the cassettes contain wafers, the cassette gripper must maintain stability during the gripping process to prevent the cassettes from falling.

[0003] Existing wafer box clamps are generally provided with two clamping jaws, and a micro-sensor is installed in the middle part of the two forks of the two clamping jaws to detect whether the wafer box is clamped in place, thereby avoiding the risk of the wafer box falling off to a certain extent.

[0004] However, existing clamps cannot detect whether the wafer box is tilted, and there is a risk of slipping or vibration during the wafer box being clamped and transported, thereby causing significant economic losses. Summary of the Invention

[0005] In view of this, the purpose of the embodiments of the present application is to provide a wafer box clamp and a material removal device to solve the technical problem that the existing wafer box clamp cannot detect whether the wafer box is tilted and there is a risk of the wafer box slipping.

[0006] In a first aspect, an embodiment of the present application provides a wafer box clamper for clamping a wafer box, wherein two sides of the wafer box are respectively provided with a support plate, and the wafer box clamper includes:

[0007] A connecting rod and two clamping jaws, wherein the two clamping jaws are arranged opposite to each other and connected to the connecting rod at opposite ends, and are respectively clamped to two sides of the wafer box provided with the support plate;

[0008] At least three first micro-motion sensors, each of which is used to be electrically connected to the robotic arm, and mounting grooves are provided on the tops of the two clamps. The total number of the mounting grooves is the same as the total number of the first micro-motion sensors and corresponds one to one. The first micro-motion sensors are all installed in the corresponding mounting grooves. When the two clamps are clamped on the wafer box, each of the support plates presses on the first micro-motion sensor on the corresponding clamp, and when each of the first micro-motion sensors is in a state of being pressed into the corresponding mounting groove, the robotic arm drives the wafer box clamp to move.

[0009] In a possible embodiment, a ball head structure is provided at the end of each of the first micro-motion sensors, the ball head structure contacts the corresponding support plate, and the maximum outer diameter of the ball head structure is smaller than the minimum distance of the corresponding mounting groove notch so that it can be fully pressed into the mounting groove.

[0010] In a possible embodiment, each of the clamping jaws is provided with a positioning protrusion, and each of the support plates and the corresponding surface of the clamping jaw are provided with a groove. When each of the positioning protrusions is inserted into the corresponding groove for plug-fitting, the clamping jaw contacts the corresponding first micro-motion sensor.

[0011] In a possible embodiment, a touch component is provided at one end of each of the clamps away from the connecting rod, and the touch component includes a second micro-motion sensor. Each of the second micro-motion sensors is electrically connected to the control device of the robotic arm. When any of the second micro-motion sensors generates a micro-motion signal, the control device controls the robotic arm to stop moving.

[0012] In a possible embodiment, each of the second micro-motion sensors includes a second touch rod and a moving sleeve, the moving sleeve is arranged in the clamping claw, the second touch rod is slidably arranged in the moving sleeve, and a contact is provided at the end of the second touch rod, and the contact is used to withstand external impact.

[0013] In a possible embodiment, each of the touch components further includes a collision head, the inner side of the collision head is connected to the second trigger rod, and the outer side of the collision head is used to withstand external impact to drive the collision head to move.

[0014] In a possible embodiment, the wafer box clamper further includes an ultrasonic detection device, at least one ultrasonic detection device is provided, and at least one of the clamping jaws is provided with the ultrasonic detection device.

[0015] In a possible embodiment, the connecting rod is connected to the robotic arm via a connecting member, and the connecting member includes a first mounting flange and a second mounting flange, and a mounting surface of the first mounting flange is arranged at an angle to a mounting surface of the second mounting flange.

[0016] On the second aspect, the purpose of the embodiment of the present application is also to provide a material picking device, including the above-mentioned wafer box clamper and robotic arm, the wafer box clamper is connected to the robotic arm, the wafer box clamper is used to clamp the wafer box, the wafer box clamper includes two clamping claws, and there are support plates on both sides of the wafer box; each of the support plates is pressed on the first micro-motion sensor on the corresponding clamping claw, and when each of the first micro-motion sensors is pressed down by the support plate by at least a second set distance, the robotic arm drives the wafer box clamper to move.

[0017] In the wafer box clamp and material removal device of the embodiment of the present application, when the two pallets simultaneously contact all the first micro-motion sensors on the two clamping jaws and the corresponding first micro-motion sensors are pressed into the corresponding mounting slots, the two pallets contact the top surfaces of the corresponding clamping jaws. In this state, the placement position of the wafer box will not tilt. The triggered first micro-motion sensors send signals to the robotic arm, which then drives the wafer box clamp to move, thereby achieving stable transportation of the wafer box. When the two pallets do not contact all the first micro-motion sensors, the two clamping jaws immediately clamp and hold the wafer box tightly, reducing the risk of the wafer box falling off during transportation due to tilt in the placement position.

[0018] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 The figure shows the overall structure of a wafer box clamp provided by an embodiment of the present application.

[0021] Figure 2 Shown Figure 1 A partial enlarged view of one of the grippers.

[0022] Figure 3 Shown Figure 2 A magnified view of the touch component.

[0023] Figure 4 Shows a structural diagram of the touch component.

[0024] Figure 5 A front view of a wafer cassette holder holding a wafer cassette is shown.

[0025] Figure 6 A top view of a wafer cassette holder holding a wafer cassette is shown.

[0026] 1. Clamping jaw; 11. Mounting groove; 12. Positioning protrusion; 2. Connecting rod; 3. First micro-motion sensor; 31. First touch rod; 32. Ball head structure; 4. Second micro-motion sensor; 41. Contact; 42. Spring pin; 43. Spring; 44. Moving sleeve; 5. Retaining frame; 51. Collision head; 52. Cover plate; 6. Connecting piece; 61. First mounting flange; 62. Second mounting flange; 7. Ultrasonic detection device; 8. Wafer box; 81. Support plate; 9. Connecting rod; 10. Touch assembly. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0028] Taking into account that the existing wafer box clamp is unable to detect whether the wafer box 8 is tilted because it is only provided with a micro-motion sensor between the two claws, the wafer box clamp of the embodiment of the present application is provided with at least three first micro-motion sensors 3. The above number of first micro-motion sensors 3 are arranged on the top of the two clamps 1, so that each clamp 1 is installed with at least one first micro-motion sensor 3, and each first micro-motion sensor 3 is electrically connected to the control device of the robotic arm. A support plate 81 is provided on each side of the wafer cassette 8. When the two grippers are clamped on the two sides of the wafer cassette provided with the support plates, the bottom surface of each support plate will face the top surface of the corresponding gripper. When the two support plates simultaneously contact all the first micro-motion sensors on the two grippers and press the corresponding first micro-motion sensors 3 into the corresponding mounting slots 11, the two support plates 81 will contact the top surfaces of the corresponding grippers 1. The placement position of the wafer cassette 8 will not tilt. The triggered first micro-motion sensors 3 will send a signal to the robot arm (not shown in the figure), which will then drive the wafer cassette clamp to move, thereby achieving stable transportation of the wafer cassette 8. When the two support plates 81 do not contact all the first micro-motion sensors 3, the two grippers 1 will immediately clamp and hold the wafer cassette 8 tightly, reducing the risk of the wafer cassette 8 falling off during transportation due to tilt in the placement position.

[0029] Example 1

[0030] A wafer box clamper according to an embodiment of the present application is used to clamp a wafer box 8. A support plate 81 is provided on both sides of the wafer box 8. The wafer box clamper includes:

[0031] A connecting rod 2 and two clamping jaws 1, the two clamping jaws 1 are arranged opposite to each other and connected to the connecting rod 2 at opposite ends, and are respectively clamped to two sides of the wafer box 8 provided with a support plate 81;

[0032] At least three first micro-motion sensors 3, each first micro-motion sensor 3 is used to be electrically connected to the robotic arm, and mounting grooves 11 are provided on the tops of the two clamps 1. The total number of mounting grooves 11 is the same as the total number of first micro-motion sensors 3 and corresponds one to one. The first micro-motion sensors 3 are all installed in the corresponding mounting grooves 11. When the two clamps 1 are clamped on the wafer box 8, each support plate 81 is pressed on the first micro-motion sensor 3 on the corresponding clamp 1, and each first micro-motion sensor 3 is pressed into the corresponding mounting groove 11, and the robotic arm drives the wafer box clamp to move.

[0033] In combination with the above embodiments, Figure 5 and Figure 6 The wafer cassette 8 is typically in a cubic shape, but may also be cylindrical, conical, or the like. The following description will be based on an example in which the wafer cassette 8 is in a rectangular parallelepiped shape and there are four first micro-motion sensors 3. The two sides of the wafer cassette 8 are opposite, with two correspondingly disposed on the front and rear opposite sides of the wafer cassette 8. Two support plates 81 are disposed on the opposite sides of the wafer cassette 8 and are arranged in parallel. The two support plates 81 have the same length and thickness, and the bottoms of the two support plates 81 are located in the same plane.

[0034] Correspondingly, the two clamps 1 are arranged in parallel, and the two clamps 1 are clamped on both sides of the wafer box 8. At the same time, the bottom of each support plate 81 is pressed on the corresponding first micro-motion sensor 3, and the first micro-motion sensor 3 is pressed into the corresponding mounting groove 11. The bottom surface of each support plate 81 will be opposite to the top surface of the corresponding clamp 1. When the two support plates 81 are in contact with all the first micro-motion sensors 3 on the two clamps 1 at the same time, and the corresponding first micro-motion sensor 3 is pressed into the corresponding mounting groove 11, the two support plates 81 are in contact with the top surface of the corresponding clamps 1. The placement position of the wafer box 8 will not tilt. The triggered first micro-motion sensor 3 sends a signal to the robot arm, and the robot arm will drive the wafer box clamp to move, thereby achieving stable transportation of the wafer box 8. When the two support plates 81 are not in contact with all the first micro-motion sensors 3, the two clamps 1 immediately clamp and hold the wafer box 8 tightly, reducing the risk of the wafer box 8 falling off during transportation due to the tilt of the placement position.

[0035] In the wafer box clamp of the embodiment of the present application, each first micro-sensor 3 includes a first touch rod 31, and a ball head structure 32 is provided at the end of each first touch rod 31. The ball head structure 32 contacts the corresponding support plate 81, and the maximum outer diameter of the ball head structure 32 is smaller than the minimum distance of the corresponding mounting groove 11, so that it can be pressed into the mounting groove 11.

[0036] In combination with the above embodiments, Figure 1 As shown, each mounting slot 11 is a waist-shaped hole, and the ball head structure 32 is spherical overall. The first trigger rod 31 is located in the corresponding mounting slot 11. The ball head structure 32 is provided at the top of the first trigger rod 31. When the two support plates 81 are not in contact with the corresponding first micro-motion sensor 3, that is, when the first micro-motion sensor 3 is not under pressure, the ball head 32 is lifted from the corresponding mounting slot 11. When the support plate 81 presses against the corresponding first micro-motion sensor 3, the ball head structure 32 is pressed into the corresponding mounting slot 11, confirming that the wafer cassette 8 is properly positioned and the robot arm can drive the wafer cassette gripper to move. The triggered first micro-motion sensor 3 sends a signal to the robot arm, which drives the wafer cassette gripper to move and transport the wafer cassette 3.

[0037] In the wafer box clamp of the embodiment of the present application, a positioning protrusion 12 is provided on each clamping jaw 1, and a groove 11 is provided on the opposite surface of each support plate 81 and the corresponding clamping jaw 1. When each positioning protrusion 12 is inserted into the corresponding groove for plug-in engagement, the clamping jaw 1 contacts the corresponding first micro-motion sensor 3.

[0038] In combination with the above embodiments, Figure 1 As shown, each positioning protrusion 12 is arranged on the top of the corresponding clamping jaw 1, and each groove is arranged on the bottom of the corresponding support plate 81. The two support plates 81 are initially positioned through the grooves thereon and the positioning protrusions 12 on the corresponding clamping jaw 1 to avoid the position of the clamping jaw 1 from deviating, so as to realize rapid clamping of the wafer box 8.

[0039] Furthermore, each clamping jaw 1 can be divided into a front section, a middle section and a rear section, the mounting groove 11 is arranged at the front section and the rear end, the positioning protrusion 12 is arranged in the middle section at the middle position of the top of the clamping jaw 1, and a groove is correspondingly provided in the middle section of the bottom of each support plate 81. By positioning the positioning protrusion 12 with the middle part of the corresponding support plate 81, the connection stability between the clamping jaw 1 and the corresponding support plate 81 is enhanced.

[0040] In the wafer box clamp of the embodiment of the present application, a touch component 10 is provided at the end of each clamping jaw 1 away from the connecting rod 2, and the touch component 10 includes a second micro-motion sensor 4. Each second micro-motion sensor 4 is electrically connected to the control device of the robotic arm. When any second micro-motion sensor 4 generates a micro-motion signal, the control device controls the robotic arm to stop moving.

[0041] In combination with the above embodiments, Figure 3and Figure 4 As shown, the contact assembly 10 is located at the front end of the gripper 1. Even a small mechanical change triggers the contact assembly 10, instantly braking the rear end arm. Through the end-of-line feedback system (the contact assembly 10), the arm can be quickly and promptly stopped during operation, avoiding the risk of invasive damage to the machine or personnel.

[0042] In the wafer box clamp of the embodiment of the present application, each second micro-sensor 4 includes a second touch rod and a moving sleeve 44. The moving sleeve 44 is arranged in the clamping jaw 1. The second touch rod is slidably arranged in the moving sleeve 44. The end of the second touch rod is provided with a contact 41, which is used to withstand external impact.

[0043] In combination with the above embodiments, Figure 3 and Figure 4 As shown, when the gripper 1 is subjected to external impact, the contact 41 and the second trigger rod slide along the moving sleeve 44 at the same time, thereby triggering the second micro-motion sensor 4. After being triggered, the second micro-motion sensor 4 sends a stop signal to the robotic arm, and the robotic arm immediately stops moving, causing the risk of invasive damage to the machine and personnel.

[0044] In the wafer box clamp of the embodiment of the present application, each contact component 10 further includes: a collision head 51, the inner side of the collision head 51 is connected to the second trigger rod, and the outer side of the collision head 51 is used to withstand external impact to drive the contact 41 and the second trigger rod to move.

[0045] In combination with the above embodiments, Figure 3 and Figure 4 As shown, the touch assembly 10 as a whole is composed of a retaining frame 5, a cover plate 52 and a collision head 51. The cover plate 52 and the collision head 51 are respectively arranged at both ends of the retaining frame 5. The contact 41 is located in the retaining frame 5 and is connected to the collision head 51. The collision head 51 is an elastic material used to trigger the second micro-motion sensor 4, and only a very small mechanical change is required to immediately brake the rear end robotic arm.

[0046] The wafer box clamp of the embodiment of the present application further includes an ultrasonic detection device 7 , at least one ultrasonic detection device 7 is provided, and at least one clamping jaw 1 is provided with the ultrasonic detection device 7 .

[0047] In combination with the above embodiment, the ultrasonic detection device 7 is arranged at the front end of the clamping jaw 1 to scan the material picking area, confirm the current material status and pre-detect interference points. The ultrasonic detection device 7 can be installed on each clamping jaw 1, but considering the material cost, only one ultrasonic detection device 7 needs to be installed at the bottom of the front end of one clamping jaw 1 to achieve detection.

[0048] In the wafer box clamp of the embodiment of the present application, the connecting rod 2 is connected to the robot arm through the connecting member 6. The connecting member 6 includes a first mounting flange 61 and a second mounting flange 62. The mounting surface of the first mounting flange 61 is set at an angle to the mounting surface of the second mounting flange 62.

[0049] In combination with the above embodiments, Figure 1 As shown, the angle between the flange surfaces of the first mounting flange 61 and the second mounting flange 62 can be, for example, 90°. The two surfaces of the first mounting flange 61 and the second mounting flange 62 that are angled with each other serve as optional mounting surfaces, and the use of mounting base surfaces in different directions can effectively cope with differences in on-site environments.

[0050] Example 2

[0051] The difference from Example 1 is that in Example 1, two support plates 81 are arranged on opposite sides of the wafer box 8, and the two clamping jaws 1 are arranged to be parallel to each other, which is suitable for storage places with large space and no obstructions.

[0052] In this embodiment, two support plates 81 are positioned on adjacent sides of the wafer cassette 8, with the two support plates 81 being positioned at an angle, for example, 90°. The two clamping jaws 1 are correspondingly positioned at an angle, for example, 90°. When the wafer cassette 8 is placed at a 90° corner, two adjacent sides of the wafer cassette 8 are obscured by the wall. In this operating environment, if a wafer cassette 8 is selected with support plates 81 positioned on opposite sides, one support plate 81 will often face the wall. The clamping jaws 1 will often interfere with the wall when gripping the wafer cassette 8, requiring additional movement of the wafer cassette 8, which increases the number of work steps.

[0053] The wafer cassette holder of this embodiment corresponds to a wafer cassette 8, on which two support plates 81 are mounted on adjacent sides of the wafer cassette 8. The two clamping jaws 1 are arranged at an angle that is the same as the two support plates 81. When the wafer cassette 8 is placed in a 90° corner, the two support plates 81 will not be blocked by the wall, and the clamping jaws 1 will not interfere with the wall during the clamping process. Therefore, when locating an angled corner, a wafer cassette 8 with support plates 81 at a corresponding angle and two clamping jaws 1 at a corresponding angle can be selected, avoiding the need for additional steps and improving the clamping efficiency of the wafer cassette holder.

[0054] Based on the same concept, a material picking device corresponding to the wafer box clamp is also provided in the embodiment of the present application. Since the principle of solving the problem by the material picking device in the embodiment of the present application is similar to that of the above-mentioned wafer box clamp in the embodiment of the present application, the implementation of the material picking device can refer to the implementation of the wafer box clamp, and the repeated parts will not be repeated.

[0055] The material picking device of an embodiment of the present application includes the above-mentioned wafer box clamp and robotic arm, the wafer box clamp is connected to the robotic arm, the wafer box clamp is used to clamp the wafer box 8, the wafer box clamp 8 includes two clamping jaws 1, and support plates 81 are provided on both sides of the wafer box 8; each support plate 81 presses on the first micro-motion sensor 3 on the corresponding clamping jaw 1, and when each first micro-motion sensor 3 is pressed down by the support plate 81 by at least a second set distance, the robotic arm drives the wafer box clamp to move.

[0056] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

Claims

1. A wafer box clamper for clamping a wafer box, characterized in that: Support plates are provided on both sides of the wafer box, and the wafer box clamper includes: A connecting rod and two clamping jaws, wherein the two clamping jaws are arranged opposite to each other and connected to the connecting rod at opposite ends, and are respectively clamped to two sides of the wafer box provided with the support plate; At least three first micro-motion sensors, each of which is used to be electrically connected to the robotic arm, and mounting grooves are provided on the tops of the two clamps. The total number of the mounting grooves is the same as the total number of the first micro-motion sensors and corresponds one to one. The first micro-motion sensors are all installed in the corresponding mounting grooves. When the two clamps are clamped on the wafer box, each of the support plates presses on the first micro-motion sensor on the corresponding clamp, and when each of the first micro-motion sensors is in a state of being pressed into the corresponding mounting groove, the robotic arm drives the wafer box clamp to move.

2. The wafer box holder according to claim 1, characterized in that Each of the first micro-motion sensors is provided with a ball head structure at its end, the ball head structure contacts the corresponding support plate, and the maximum outer diameter of the ball head structure is smaller than the minimum distance of the corresponding mounting groove notch so that it can be fully pressed into the mounting groove.

3. The wafer box holder according to claim 1, wherein: Each of the clamping jaws is provided with a positioning protrusion, and each of the supporting plates is provided with a groove on the opposite surface to the corresponding clamping jaw. When each of the positioning protrusions is inserted into the corresponding groove for plug-fitting, the clamping jaw contacts the corresponding first micro-motion sensor.

4. The wafer box holder according to claim 3, characterized in that A touch component is provided at one end of each clamp away from the connecting rod, and the touch component includes a second micro-motion sensor. Each of the second micro-motion sensors is electrically connected to the control device of the robotic arm. When any of the second micro-motion sensors generates a micro-motion signal, the control device controls the robotic arm to stop moving.

5. The wafer box holder according to claim 4, characterized in that Each of the second micro-motion sensors includes a second touch rod and a moving sleeve. The moving sleeve is arranged in the clamping claw. The second touch rod is slidably arranged in the moving sleeve. A contact is provided at the end of the second touch rod. The contact is used to withstand external impact.

6. The wafer box holder according to claim 5, characterized in that Each of the touch components further includes a collision head, the inner side of the collision head is connected to the second trigger rod, and the outer side of the collision head is used to withstand external impact to drive the collision head to move.

7. The wafer box holder according to claim 6, characterized in that The wafer box clamper further includes an ultrasonic detection device. At least one ultrasonic detection device is provided, and at least one of the clamping jaws is provided with the ultrasonic detection device.

8. The wafer box holder according to claim 1, wherein: The connecting rod is connected to the robotic arm via a connecting member, wherein the connecting member includes a first mounting flange and a second mounting flange, and a mounting surface of the first mounting flange is arranged at an angle to a mounting surface of the second mounting flange.

9. A material taking device, characterized in that: The wafer box clamper and the robotic arm according to any one of claims 1 to 8 are provided, wherein the wafer box clamper is connected to the robotic arm, the wafer box clamper is used to clamp a wafer box, the wafer box clamper includes two clamping claws, and support plates are provided on both sides of the wafer box; When each of the support plates presses on the first micro-motion sensor on the corresponding clamping claw and each of the first micro-motion sensors is pressed down by the support plate by at least a second set distance, the robotic arm drives the wafer box clamp to move.

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