Circuit board structure

Abstract

The utility model provides a circuit board structure, and relates to the technical field of circuit boards. The structure comprises a circuit board body, at least two resistance-capacitance devices and at least four signal wires, the circuit board body is provided with at least two signal holes, at least two backflow ground holes and at least two bonding pad assemblies, each bonding pad assembly comprises at least two bonding pads which are arranged in sequence, the same resistance-capacitance device is correspondingly connected with two adjacent bonding pads in the same bonding pad assembly, the signal wire is correspondingly connected with the bonding pads connected with the resistance-capacitance device, and the signal wire is connected with the signal wire. The through bonding pad assembly and the signal hole are both located between the at least two backflow ground holes. The quality and stability of signal transmission can be enhanced through the signal hole, the backflow ground hole provides a plurality of backflow paths, in high-speed signal transmission and high-frequency application, signal delay and distortion are reduced, the signal quality is improved, the device is suitable for high-speed signal transmission, such as 32Gbps, and the bonding pad assembly, the signal hole and the backflow ground hole are compact in layout structure, small in occupied space and high in reliability. And the high-density arrangement requirement is met.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board structure. Background Art

[0002] A printed circuit board (PCB) is a thin board with integrated circuits and other electronic components, used as a carrier for the electrical interconnection of electronic devices. Co-layout (also known as circuit sharing) in PCBs means that two or more components can be placed in the same location during wiring to achieve different functions. For example, pin reuse is inevitable in board design.

[0003] In existing technology, taking CPU motherboard design as an example, a set of x8 CPU signals needs to be supplied to different PCIE slots in different application scenarios. To achieve similar functional reuse, the schematic design requires connecting a pin to different resistor and capacitor components. During PCB layout, a co-lay design is required to reserve the reuse position, set up a signal hole and a return ground hole, and connect the resistor and capacitor components to different functional modules through BOM control, thus achieving pin reuse.

[0004] However, existing co-lay designs have low signal rates, are susceptible to interference, are prone to signal distortion, have difficulty controlling impedance, and occupy a large wiring space. For applications with high layout density and rates of 32Gbps and above, the signal quality is poor. Utility Model Content

[0005] The present application provides a circuit board structure to solve the technical problems of the existing co-lay design, such as low signal rate, easy signal interference, easy signal distortion, poor signal quality and large wiring space occupation.

[0006] An embodiment of the present application provides a circuit board structure, including: a circuit board body, at least two resistor and capacitor components, and at least four signal traces; at least two signal holes, at least two return ground holes, and at least two solder pad assemblies are provided on the circuit board body, the solder pad assembly includes at least two solder pads arranged in sequence, the same resistor and capacitor component is connected to two adjacent solder pads in the same solder pad assembly, the signal traces are connected to the solder pads connected to the resistor and capacitor components, and the solder pad assembly and the signal hole are both located between the at least two return ground holes.

[0007] In a possible implementation, in the circuit board structure provided by the embodiment of the present application, each signal hole is located between two adjacent pad assemblies.

[0008] In a possible implementation, the circuit board structure provided in the embodiment of the present application has a signal hole pad provided on the circuit board, and the signal hole passes through the signal hole pad.

[0009] In one possible implementation, the circuit board structure provided by the embodiment of the present application has a signal hole pad covering the pad. The signal hole pad is disposed on the pad. This shortens the distance between the signal hole and the resistor and capacitor components or the return ground hole, thereby reducing the space occupied by the layout.

[0010] In a possible implementation, in the circuit board structure provided by an embodiment of the present application, the center of the signal hole is located on the axis of the pad.

[0011] In a possible implementation, in the circuit board structure provided by the embodiment of the present application, at least four return ground holes are provided, and each signal hole corresponds to at least two return ground holes.

[0012] In one possible implementation, the circuit board structure provided in the embodiment of the present application includes a resistor and capacitor device as a packaged device. For example, the device package is smaller in size, which reduces the space occupied by the circuit board and is suitable for high-density layout.

[0013] In one possible implementation, the circuit board structure provided by the embodiment of the present application has a spacing between the signal hole and the return ground hole of 1 mil to 1 mil. The spacing between the signal hole and the return ground hole can be adjusted to make the layout compact.

[0014] In one possible implementation, the circuit board structure provided in the embodiments of the present application has circular or oval pads. The circular or oval pads provide more uniform heat distribution, helping to reduce thermal stress and welding defects during the soldering process. Furthermore, the pads have smoother edges, reducing the risk of short circuits caused by sharp edges.

[0015] In a possible implementation, in the circuit board structure provided by an embodiment of the present application, the center of the signal hole and the center of the corresponding pad are on the same straight line, and at least two return holes are symmetrical along the straight line.

[0016] The present application provides a circuit board structure, which is provided with a circuit board body, at least two resistor and capacitor components, and at least four signal traces; at least two signal holes, at least two return ground holes and at least two pad assemblies are provided on the circuit board body, and the pad assembly includes at least two pads arranged in sequence, and the same resistor and capacitor component is connected to two adjacent pads in the same pad assembly, and the signal traces are connected to the pads connected to the resistor and capacitor components. The pad assembly and the signal hole are both located between the at least two return ground holes, so that the overall layout structure is compact, the signal hole can enhance the quality and stability of signal transmission, and the return ground hole provides multiple return paths, which reduces signal delay and distortion in high-speed signal transmission and high-frequency applications, and improves signal quality. Therefore, the circuit board structure is convenient for controlling impedance, reducing return loss, reducing signal delay and distortion, and is suitable for high-speed signal transmission, such as 32Gbps, and the layout structure of the pad assembly, signal hole and return ground hole is compact, takes up little space, and is suitable for high-density arrangement requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] Figure 1 A schematic diagram of the structure of a circuit board provided in an embodiment of the present application;

[0019] Figure 2 for Figure 1 Schematic diagram of the structure in which the signal hole is punched on the reuse pad.

[0020] Description of reference numerals:

[0021] 100 resistor and capacitor components;

[0022] 200-signal hole; 210-signal hole pad;

[0023] 300-backflow hole;

[0024] 400-signal routing;

[0025] 500-pad component; 510-pad.

[0026] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0027] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0028] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0029] It should be noted that phrases such as "one embodiment," "an embodiment," "exemplary embodiments," and "some embodiments" in this specification may indicate embodiments that may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not.

[0030] Generally speaking, terms should be understood, at least in part, based on the context in which they are used. For example, as used herein, the term "one or more" can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a" or "an" can also be understood to convey either singular or plural usage, depending at least in part on the context.

[0031] The following specific embodiments are used to describe in detail the technical solution of the present application and how the technical solution of the present application solves the above technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0032] A printed circuit board (PCB) is a thin board used to house integrated circuits and other electronic components. It serves as a carrier for the electrical connections between electronic devices. The co-layout structure in a PCB, also known as circuit sharing, means that two or more components can be placed in the same location during wiring to achieve different functions. For example, pin reuse is inevitable in board design.

[0033] In the prior art, taking the CPU motherboard design as an example, a set of x8 signals of the CPU needs to be supplied to different PCIE slots in different application scenarios. In order to achieve similar functional reuse, a certain pin needs to be connected to different resistor and capacitor devices during schematic design, and a co-lay design needs to be performed during PCB layout to reserve a reuse position. Through BOM control of the resistor and capacitor devices, they are connected to different functional modules to achieve pin reuse. The existing co-lay structure has a large N / PSkew (Chinese name, the delay deviation of the positive and negative signals), which is about 1.5ps+, that is, the time skew between the differential signal lines exceeds 1.5 picoseconds, resulting in poor signal quality and easy distortion, especially limiting high-speed applications of 32Gbps and above. In addition, the co-lay design has low signal rate, the signal is easily interfered with, the signal is easily distorted, the impedance is difficult to control, and it occupies a large wiring space. For application scenarios with high layout density and rates of 32Gbps and above, the signal quality is poor.

[0034] In response to the above technical problems, an embodiment of the present application provides a circuit board structure, comprising: a circuit board body, at least two resistor and capacitor components, and at least four signal traces; at least two signal holes, at least two return ground holes, and at least two pad assemblies are provided on the circuit board body, the pad assembly includes at least two pads arranged in sequence, the same resistor and capacitor component is connected to two adjacent pads in the same pad assembly, and the signal traces are connected to the pads connected to the resistor and capacitor components. By locating the pad assembly and the signal hole between the at least two return ground holes, the overall layout structure is compact, the signal hole can enhance the quality and stability of signal transmission, and the return ground hole provides multiple return paths, which reduces signal delay and distortion in high-speed signal transmission and high-frequency applications, and improves signal quality. Therefore, the circuit board structure is convenient for controlling impedance, reducing return loss, reducing signal delay and distortion, and is suitable for high-speed signal transmission, such as 32Gbps, and the layout structure of the pad assembly, signal hole, and return ground hole is compact, occupies little space, and is suitable for high-density arrangement requirements.

[0035] The following will be combined with the Figures 1 to 2 The circuit board structure of the present application is described with reference to specific embodiments. Figure 1 A schematic diagram of the structure of a circuit board provided in an embodiment of the present application; Figure 2 for Figure 1 Schematic diagram of the structure in which the signal hole is punched on the reuse pad.

[0036] An embodiment of the present application provides a circuit board structure, including: a circuit board body, at least two resistor-capacitor components 100, and at least four signal traces 400; the circuit board body is provided with at least two signal holes 200, at least two return ground holes 300, and at least two pad assemblies 500, the pad assembly 500 including at least two pads 510 arranged in sequence, the same resistor-capacitor component 100 correspondingly connected to two adjacent pads 510 in the same pad assembly 500, the signal traces 400 correspondingly connected to the pads 510 connected to the resistor-capacitor components 100, and the pad assembly 500 and the signal hole 200 are both located between the at least two return ground holes 300.

[0037] Specifically, at least two resistor-capacitor components 100 are provided on the circuit board. The interior of each resistor-capacitor component assembly 100 is symmetrical along a reference line. A solder resist pad assembly 500 includes at least two solder pads 510. Each solder resist pad assembly 500 includes two solder pads 510. A resistor-capacitor component 100 is connected to both solder pads 510, and a signal trace 400 is connected to both solder pads 510, thereby implementing a signal transmission method.

[0038] There are two pad assemblies 500, which are arranged opposite each other. When each pad assembly 500 has three pads 510 arranged in sequence, corresponding functional reuse can be achieved. For ease of description, the pads 510 in each pad assembly 500 are named, in sequence, as a first RC pad, a multiplexing pad, and a second RC pad. There are two signal holes 200, and the center of each signal hole 200 is aligned with the center of each multiplexing pad, and the pad assembly 500 is symmetrically arranged along this line.

[0039] The four signal lines 400 include an input line and an output line that transmit the same signal with the same phase, and an input line and an output line that transmit the same signal with the opposite phase, for a total of four lines. For ease of description, the input line and the output line that transmit the same signal with the same phase are named the first differential line, and the input line and the output line that transmit the same signal with the opposite phase are named the second differential line, that is, the first differential line and the second differential line transmit the same signal, and the amplitudes of the transmitted signals are the same but the phases are opposite. Compared with the traditional single signal line signal transmission, since the first differential line and the second differential line are arranged relative to each other and the signal amplitudes are the same, the amplitudes of the coupled electromagnetic fields between the first differential line and the second differential line and the ground line are the same, and the phases of the signals of the first differential line and the second differential line are opposite, so that the electromagnetic fields cancel each other out, thereby reducing electromagnetic interference.

[0040] The same resistor-capacitor device 100 is connected to two adjacent pads 510 in the same pad assembly 500, and the signal trace 400 is connected to the pads 510 connected to the resistor-capacitor device 100. For the convenience of describing the three pads 510 arranged sequentially in the pad assembly 500, in one signal transmission mode, the resistor-capacitor device 100 is soldered to the first resistor-capacitor pad and the multiplexing pad, and the first differential line and the second differential line are both connected to the respective first resistor-capacitor pad and the multiplexing pad to transmit signals to the resistor-capacitor device 100. In another signal transmission mode, the resistor-capacitor device 100 is soldered to the second resistor-capacitor pad and the multiplexing pad, and the first differential line and the second differential line are both connected to the respective second resistor-capacitor pad and the multiplexing pad to transmit signals to the resistor-capacitor device 100.

[0041] The pad assembly 500 and signal via 200 are both located between at least two return ground vias 300. The signal vias 200 enhance the quality and stability of signal transmission. Furthermore, the return ground vias provide multiple return paths, reducing signal delay and distortion and improving signal quality in high-speed signal transmission and high-frequency applications. Furthermore, the pad assembly 500, signal via 200, and return ground vias 300 are compactly arranged, occupying minimal space and suitable for high-density layout requirements.

[0042] It should be noted that the first differential line and the second differential line are parallel and symmetrical lines, and can be arc-shaped lines or 45-degree lines, and this application does not impose any restrictions on this. The lengths of the first differential line and the second differential line are equal. The equal-length symmetrical setting of the first differential line and the second differential line can reduce the delay difference of the signal. When the length difference of the signal transmission line is large, there is a difference in the arrival time of the signal on the transmission line, which may cause phase mismatch, thereby causing mutual interference and crosstalk. Equal-length matching can effectively suppress this interference and ensure that the differential signals arrive at the receiving end at the same time.

[0043] In a possible implementation, in the circuit board structure provided by the embodiment of the present application, each signal hole 200 is located between two adjacent pad assemblies 500 .

[0044] For example, there are two signal holes 200, and return ground holes 300 are provided on both sides of the signal hole 200. A first differential line corresponds to one signal hole 200, and a second differential line corresponds to another signal hole 200. The two signal holes 200 are located between the first differential line and the second differential line. One group of return ground holes 300 is located on one side of the first differential line, and the other group of return ground holes 300 is located on one side of the second differential line. A group of return ground holes 300 includes at least two ground holes.

[0045] It can be understood that the signal hole 200 can reduce the crosstalk generated in the signal transmission path on the one hand. The signal hole 200 allows any one of the first differential line or the second differential line to pass through the ground plane, effectively isolating the differential signal routing from other signals or interference sources, thereby improving the integrity of the signal. On the other hand, the signal hole 200 can also help balance the reflection and delay of the signal and enhance the anti-interference ability of the signal, especially being widely used in high-speed signal transmission.

[0046] In one possible implementation, the circuit board structure provided in an embodiment of the present application has a signal hole pad 210 provided on the circuit board body, and the signal hole 200 passes through the signal hole pad 210. Specifically, the signal hole pad 210 is provided on the circuit board body, and the signal hole 200 passes through the signal hole pad 210 and is connected to the circuit board body. The signal hole pad 210 facilitates the placement of the signal hole 200 at a certain position on the circuit board. For example, the signal hole pad 210 is provided between two adjacent pad assemblies 500, making full use of the distance between the pad assemblies 500. Alternatively, the signal hole pad 210 overlaps or coincides with the pad 510.

[0047] In one possible implementation, in the circuit board structure provided by the embodiment of the present application, the signal hole pad 210 covers the pad 510. The signal hole pad 210 is disposed on the pad 510. This shortens the distance between the signal hole and the resistor and capacitor device 100 or the return ground hole 300, thereby reducing the space occupied by the layout.

[0048] The signal hole 200 can be set on one side of the pad 510, that is, in the form of a non-hole in the pad. The signal is routed out from the pad 510 and then to the signal hole 200. The use of the non-hole in the pad form can prevent the solder paste from being sucked into the through hole during the reflow process, which can prevent the failure of soldering between the pad and the component due to insufficient solder.

[0049] The signal vias 200 can be disposed on the pads 510, i.e., in a via-in-pad format, by placing the signal vias 200 on the pads 510, thereby shortening the spacing and reducing the space occupied by the layout. For example, two signal vias 200 are disposed on two corresponding pads 510, one signal via 200 being connected to the pad 510 via a first differential line, and the other signal via 200 being connected to the other pad 510 via a second differential line.

[0050] Among them, in the circuit board structure provided by the embodiment of the present application, the center of the signal hole 200 is located on the axis of the pad 510. That is, the center of the signal hole 200 is aligned with the axis of the pad 510. For example, when each pad assembly 500 has three pads 510 arranged in sequence, the center of the signal hole 200 is aligned with the axis of the second pad 510, and the centers of the three pads 510 and the center of the signal hole 200 are on the same straight line. For the sake of convenience, this straight line is named the first straight line. The center of the signal hole 200 is on the same straight line as the center of the return hole 300. For the sake of convenience, this straight line is named the second straight line, and the first straight line and the second straight line are perpendicular to each other. The pad assembly 500 is symmetrical along the first straight line and the second straight line respectively. This symmetrical structure has a reasonable and simple layout and is convenient for subsequent maintenance and troubleshooting.

[0051] In a possible implementation, in the circuit board structure provided by the embodiment of the present application, at least four return ground holes 300 are provided, and each signal hole 200 corresponds to at least two return ground holes 300 .

[0052] It is understandable that two return ground holes 300 are set on one side of the signal hole 200. The return ground hole 300 provides a low-impedance path for the current to return to the ground terminal of the power supply, which helps to reduce interference and noise on the signal path. In particular, in high-speed digital and analog circuits, the return ground hole 300 helps to maintain signal integrity. In addition, the return ground hole 300 provides multiple return paths, which reduces signal delay and distortion in high-speed signal transmission and high-frequency applications. The heat generated by the circuit board can also be dissipated through the return ground hole 300, thereby improving the heat dissipation effect of the circuit board. Since the heat is dissipated through the return ground hole 300, the return ground hole 300 can be used as a reference to detect abnormalities in the circuit board in a timely manner based on temperature changes. Moreover, as the number of return ground holes 300 increases, the impedance is better.

[0053] In one possible implementation, in the circuit board structure provided by the embodiment of the present application, the resistor and capacitor device 100 is a packaged device. For example, a 0201 device package is smaller in size, which reduces the space occupied by the circuit board and is suitable for high-density layout.

[0054] It should be noted that the resistor and capacitor device 100 is a packaged device. For example, the co-lay resistor and capacitor device in the embodiment of the present application is a 0201 package, which is suitable for smaller devices compared to the 0402 package or the 0603 package. For example, the corresponding dimensions of the 0201 package resistor are 0.6mm in length, 0.3mm in width, and 0.23mm in height. It should be noted that the 0201 package is smaller than the 0402 package size. For example, the area of 10 0201s arranged together is about 1.3 times that of 0402. Co-lay resistor and capacitor devices are arranged more densely to reduce the size of the circuit board. The 0201 device package is smaller in size, which reduces the space occupied by the circuit board and is suitable for high-density layout.

[0055] In one possible implementation, the circuit board structure provided by the embodiment of the present application has a spacing between the signal hole and the return ground hole of 25 mil to 30 mil. The spacing between the signal hole 200 and the return ground hole 300 can be adjusted to make the layout compact.

[0056] The spacing between signal hole 200 and return ground hole 300 is 25 to 30 mils. For example, the spacing between the center axis of signal hole 200 and the center of return ground hole 300 is 25 mils. Alternatively, the spacing between the center axis of signal hole 200 and the center of return ground hole 300 is 27 mils. Alternatively, the spacing between the center axis of signal hole 200 and the center of return ground hole 300 is 28 mils. Alternatively, the spacing between the center axis of signal hole 200 and the center of return ground hole 300 is 30 mils. By adjusting the spacing between signal hole 200 and return ground hole 300, the layout is compact and compatible with high-density circuit board structures.

[0057] In one possible implementation, the circuit board structure provided in the embodiment of the present application has a circular or oval pad 510. The circular or oval pad provides more uniform heat distribution, helping to reduce thermal stress and welding defects during the soldering process. Furthermore, the pad has smoother edges, reducing the risk of short circuits caused by sharp edges.

[0058] In a specific implementation, there are two pad assemblies 500, which are arranged relatively on the circuit board. Each pad assembly 500 has three pads 510 arranged in sequence. For the convenience of description, the pads 510 are named in sequence as the first RC pad, the multiplexing pad, and the second RC pad. The first RC pad, the multiplexing pad, and the second RC pad can all be circular. Or the first RC pad, the multiplexing pad, and the second RC pad can all be elliptical. Or, the first RC pad and the second RC pad are circular, and the multiplexing pad is elliptical, or the first RC pad and the second RC pad are elliptical, and the multiplexing pad is circular. Of course, the pads 510 can also be other shapes, such as polygons, according to actual use requirements, and the embodiments of the present application are not limited to this.

[0059] Circular or oval pads provide more uniform heat distribution, helping to reduce thermal stress and welding defects during the soldering process. The pads also have smoother edges, reducing the risk of short circuits caused by sharp edges. Furthermore, the symmetry of circular pads improves soldering quality.

[0060] In a possible implementation, in the circuit board structure provided by the embodiment of the present application, the center of the signal hole 200 and the center of the corresponding pad 510 are on the same straight line, and at least two return holes 300 are symmetrical along the straight line.

[0061] In a specific implementation, there are two signal holes 200, with the center of each signal hole 200 and the center of the pad 510 aligned in a straight line. At least two return ground holes 300 are provided between each signal hole 200, i.e., there are four return ground holes 300. Adjacent return ground holes 300 are symmetrical along a straight line. This symmetrical layout makes the circuit board layout more compact, improves space utilization, and reduces crosstalk and latency differences between signal transmissions. The return ground holes 300 provide multiple return paths, reducing signal delay and distortion and improving signal quality in high-speed signal transmission and high-frequency applications.

[0062] It should be noted that the signal hole 200, the first RC pad, the second RC pad, the RC component 100 and the two return ground holes 300 corresponding to the first differential line are all one-to-one corresponding and symmetrical with the signal hole 200, the first RC pad, the second RC pad, the RC component 100 and the two return ground holes 300 corresponding to the second differential line.

[0063] It should be readily understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0064] Additionally, spatially relative terms, such as "below," "beneath," "beneath," "above," and the like, may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be in other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board structure, characterized in that: include: A circuit board body, at least two resistor and capacitor components (100), and at least four signal traces (400); At least two signal holes (200), at least two reflow holes (300) and at least two pad assemblies (500) are provided on the circuit board body. The pad assembly (500) includes at least two pads (510) arranged in sequence. The same resistor and capacitor component (100) is correspondingly connected to two adjacent pads (510) in the same pad assembly (500). The signal trace (400) is correspondingly connected to the pad (510) connected to the resistor and capacitor component (100). The pad assembly (500) and the signal hole (200) are both located between the at least two reflow holes (300).

2. The circuit board structure according to claim 1, wherein: Each signal hole (200) is located between two adjacent pad components (500).

3. The circuit board structure according to claim 2, wherein: A signal hole pad (210) is provided on the circuit board body, and the signal hole (200) passes through the signal hole pad (210).

4. The circuit board structure according to claim 3, wherein: The signal hole pad (210) covers the pad (510).

5. The circuit board structure according to claim 4, characterized in that: The center of the signal hole (200) is located on the axis of the pad (510).

6. The circuit board structure according to any one of claims 1 to 5, characterized in that: At least four return ground holes (300) are provided, and each of the signal holes (200) corresponds to at least two return ground holes (300).

7. The circuit board structure according to any one of claims 1 to 5, characterized in that: The resistor and capacitor device (100) is a packaged device.

8. The circuit board structure according to any one of claims 1 to 5, characterized in that: The distance between the signal hole (200) and the return ground hole (300) is 25 mil to 30 mil.

9. The circuit board structure according to claim 8, characterized in that: The pad (510) is circular or elliptical.

10. The circuit board structure according to any one of claims 1 to 5, characterized in that: The center of the signal hole (200) and the center of the corresponding pad (510) are on the same straight line.

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