Electronic device

Abstract

The utility model discloses an electronic device. The electronic equipment comprises a frame body assembly which comprises a metal frame and a plastic part which are connected with each other; the fingerprint module comprises a first circuit board and a fingerprint chip which are connected with each other, the fingerprint chip is used for acquiring fingerprint information, the fingerprint chip is arranged at one end, close to the metal frame, of the first circuit board, and the fingerprint module is connected with the metal frame through the plastic part in an injection molding manner.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the increasing popularity of full-screen devices, setting and installing fingerprint recognition devices on the sides of electronic devices (referred to as side fingerprint recognition devices for short) have been used.

[0003] In the related art, the fingerprint module is installed in the middle frame and then fixed by a pin. The middle frame needs to be slotted to accommodate the pin and the fingerprint module, which will cause the sealing performance of the device to deteriorate. In addition, during the assembly and maintenance process, the pin is prone to breakage, resulting in insufficient reliability of the fingerprint module. In addition, due to processing errors or material deformation, the fingerprint module is prone to shaking relative to the middle frame, affecting the user experience. Utility Model Content

[0004] An embodiment of the present application provides an electronic device that can solve the problems in the prior art of the fingerprint module being unable to stably connect to the frame assembly, the low reliability of the fingerprint module, and the reduction in the sealing performance of the device due to the grooves in the frame assembly.

[0005] An embodiment of the present application provides an electronic device, comprising: a frame assembly, including a metal frame and a plastic portion connected to each other; a fingerprint module, including a first circuit board and a fingerprint chip connected to each other, the fingerprint chip being used to obtain fingerprint information, the fingerprint chip being arranged at one end of the first circuit board close to the metal frame, and the fingerprint module being injection-molded connected to the metal frame through the plastic portion.

[0006] In the electronic device provided in the embodiment of the present application, the electronic device includes a frame assembly and a fingerprint module, the frame assembly includes a metal frame and a plastic part connected to each other, the fingerprint module includes a first circuit board and a fingerprint chip connected to each other, the fingerprint chip is arranged at one end of the first circuit board close to the metal frame so that the fingerprint chip can obtain the user's fingerprint information, and the fingerprint module is injection-molded with the plastic part and the metal frame to maintain a stable connection between the fingerprint module and the frame assembly.

[0007] Therefore, in the embodiment of the present application, the fingerprint module and the metal frame are injection-molded together through the plastic part, which improves the problem of the assembly gap between the frame component and the fingerprint module affecting the sealing performance of the device. The injection-molded connection between the fingerprint module and the metal frame helps to improve the stability of the fingerprint module, improves the problem of the fingerprint module shaking relative to the frame component affecting the user experience, and improves the reliability of the fingerprint module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application;

[0010] Figure 2 This is a schematic structural diagram of a fingerprint module of an electronic device in some embodiments of the present application;

[0011] Figure 3 An exploded view of a portion of the structure of an electronic device according to some embodiments of the present application;

[0012] Figure 4 A schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application;

[0013] Figure 5 An exploded view of a portion of the structure of an electronic device according to some embodiments of the present application;

[0014] Figure 6 This is a partial structural diagram of the frame assembly of an electronic device according to some embodiments of the present application.

[0015] Description of Figure Numbers:

[0016] 100. Electronic equipment;

[0017] 110. Frame assembly; 111. Metal frame; 112. Plastic portion; 113. Fixing plate; 1111. Opening; 1112. Groove; 114. Plastic part; 115. Antenna radiator;

[0018] 120, fingerprint module; 121, first circuit board; 122, fingerprint chip; 123, elastic member; 124, thermal insulation layer;

[0019] 130. Pressing module; 131. Switch element; 132. Second circuit board. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0021] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0022] In the description of this application, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "center", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0024] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application; Figure 2 This is a schematic structural diagram of a fingerprint module of an electronic device according to some embodiments of the present application.

[0025] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides an electronic device 100, which includes a frame assembly 110 and a fingerprint module 120. The frame assembly 110 includes a metal frame 111 and a plastic part 112 that are connected to each other; the fingerprint module 120 includes a first circuit board 121 and a fingerprint chip 122 that are connected to each other. The fingerprint chip 122 is used to obtain fingerprint information. The fingerprint chip 122 is arranged at one end of the first circuit board 121 close to the metal frame 111, and the fingerprint module 120 is connected to the metal frame 111 through injection molding of the plastic part 112.

[0026] In the electronic device 100 provided in the embodiment of the present application, the electronic device 100 includes a frame assembly 110 and a fingerprint module 120. The frame assembly 110 includes a metal frame 111 and a plastic part 112 connected to each other. The fingerprint module 120 includes a first circuit board 121 and a fingerprint chip 122 connected to each other. The fingerprint chip 122 is arranged at one end of the first circuit board 121 close to the metal frame 111 so that the fingerprint chip 122 can obtain the user's fingerprint information. The fingerprint module 120 is injection-molded with the plastic part 112 and the metal frame 111 to ensure that the fingerprint module 120 and the frame assembly 110 maintain a stable connection. The fingerprint module 120 and the metal frame 111 are injection-molded together through the plastic part 112 to improve the problem of the assembly gap between the frame component 110 and the fingerprint module 120 affecting the sealing performance of the device. The injection-molded connection between the fingerprint module 120 and the metal frame 111 helps to improve the stability of the fingerprint module 120, improves the problem of the fingerprint module 120 shaking relative to the frame component 110 affecting the user experience, and improves the reliability of the fingerprint module 120.

[0027] The frame assembly 110 is used to house and mount the functional components of the electronic device 100, such as circuit boards, batteries, and buttons. The frame assembly 110 typically includes a fixing plate 113, with a metal frame 111 surrounding the fixing plate 113. The first circuit board 121 and the battery are mounted on the fixing plate 113. The metal frame 111 is welded to the fixing plate 113 or integrally formed with the fixing plate 113. The metal frame 111 can be made of aluminum alloy, stainless steel, copper alloy, or other materials.

[0028] The plastic portion 112 is filled on the metal frame 111 by nano-injection molding. The plastic portion 112 can be polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyamide (PA), polyphthalamide (PPA), or other types of resin.

[0029] The fingerprint module 120 includes a first circuit board 121 and a fingerprint chip 122. The fingerprint chip 122 is electrically connected to the first circuit board 121. The fingerprint chip 122 is a chip with embedded fingerprint recognition technology that enables fingerprint image acquisition, feature extraction, and feature comparison. The fingerprint chip 122 is connected to the device's mainboard via the first circuit board 121. Optionally, the first circuit board 121 is a flexible circuit board to simplify installation of the fingerprint module 120 and the frame assembly 110.

[0030] Specifically, the fingerprint module 120 and the metal frame 111 are first processed separately, and then the two are injection molded into one body to improve the connection reliability between the fingerprint module 120 and the frame assembly 110, improve the shaking problem of the fingerprint module 120, and enhance the sealing performance of the frame assembly 110.

[0031] The fingerprint chip 122 is arranged at one end of the first circuit board 121 close to the metal frame 111, and the fingerprint chip 122 is fixed to one side of the inner surface of the metal frame 111. The fingerprint chip 122 is adhered to the inner surface of the metal frame 111, or the fingerprint chip 122 and the metal frame 111 are arranged at intervals, and the fingerprint chip 122 is fixed to the inner surface of the metal frame 111 through the plastic part 112; or, an opening is provided on the metal frame 111, and the fingerprint chip 122 is exposed from the opening. Since the plastic part 112 is filled between the fingerprint chip 122 and the hole wall of the opening, the opening in the metal frame 111 will not affect the sealing performance of the metal frame 111; or a groove 1112 is processed on the metal frame 111, and the groove 1112 and the fingerprint chip 122 are arranged correspondingly, and the groove 1112 is used to indicate the position of the fingerprint chip 122.

[0032] In some embodiments, as Figure 1 and Figure 2 As shown, the fingerprint module 120 further includes a heat insulation layer 124 , which covers at least a portion of the outer surface of the first circuit board 121 .

[0033] In these embodiments, the fingerprint module 120 further includes a thermal insulation layer 124 covering at least a portion of the outer surface of the first circuit board 121. The thermal insulation layer 124 isolates the first circuit board 121 from the high temperatures encountered during injection molding, thereby reducing the risk of damage to the first circuit board 121 and improving the reliability of the fingerprint module 120. The thickness of the thermal insulation layer 124 can be flexibly designed.

[0034] First, a heat insulation layer 124 is provided on the outer surface of the first circuit board 121 , and then the fingerprint module 120 and the metal frame 111 are injection-molded and connected as one body.

[0035] Optionally, the heat insulating layer 124 is a high temperature resistant resin layer. Exemplarily, the heat insulating layer 124 is made of silicone resin, polyimide, polytetrafluoroethylene, polyphenylene ether, polyphenylene sulfide, polyetheretherketone, bismaleimide, furan resin and cyanate resin.

[0036] Optionally, the heat insulation layer 124 covers the entire outer surface of the first circuit board 121 to reduce the risk of high temperature damage to the first circuit board 121 during injection molding and improve the reliability of the fingerprint module 120.

[0037] See also Figure 3 , Figure 3This is an exploded view of a partial structure of an electronic device according to some embodiments of the present application.

[0038] In some embodiments, as Figure 3 As shown, an opening 1111 is provided through the metal frame 111, and the fingerprint module 120 further includes an elastic member 123, which is provided in the opening 1111. The elastic member 123 is connected to the fingerprint chip 122, and at least part of the elastic member 123 is provided on the side of the fingerprint chip 122 away from the first circuit board 121.

[0039] In these embodiments, an opening 1111 is provided through the metal frame 111, and the elastic member 123 is provided in the opening 1111. The elastic member 123 is connected to the fingerprint chip 122. The opening 1111 and the elastic member 123 are used to indicate the position of the fingerprint chip 122 for user convenience. At the same time, at least part of the elastic member 123 is provided on the side of the fingerprint chip 122 away from the first circuit board 121. The elastic member 123 not only protects the fingerprint chip 122, but also improves the operating feel of the fingerprint chip 122, thereby enhancing the user experience.

[0040] The shape and size of the opening 1111 on the metal frame 111 can be flexibly designed. For example, the positive projection of the fingerprint chip 122 on the metal frame 111 is located in the opening 1111, and the elastic member 123 is exposed in the opening 1111. When the user touches the elastic member 123, the fingerprint chip 122 can obtain fingerprint information; or the shape of the opening 1111 matches the shape of the fingerprint chip 122. For example, if the fingerprint chip 122 is rectangular, the opening 1111 is a rectangular opening 1111; or the area of the opening 1111 is similar to the area of the fingerprint chip 122, so as to reduce the size of the opening 1111 on the metal frame 111 and improve the structural strength of the metal frame 111.

[0041] The elastic member 123 is made of soft rubber. For example, the elastic member 123 is TPU (Thermoplastic polyurethanes).

[0042] The fingerprint chip 122 is attached to the side surface of the elastic member 123 facing the first circuit board 121, reducing the difficulty of assembling the fingerprint chip 122 and the elastic member 123, or the fingerprint chip 122 is located inside the elastic member 123, increasing the contact area between the fingerprint chip 122 and the elastic member 123 and improving the connection strength between the two.

[0043] The elastic member 123 is bonded to the inner wall of the opening 1111 , or the elastic member 123 and the metal frame 111 are integrally connected by injection molding.

[0044] In some embodiments, as Figure 3As shown, the electronic device 100 also includes a pressing module 130, which is connected to the frame assembly 110. The pressing module 130 includes a switch component 131 and a second circuit board 132. The switch component 131 is connected to one end of the second circuit board 132 facing the elastic component 123. The switch component 131 and the elastic component 123 are in contact with each other. The elastic component 123 is elastically deformable in the extension direction of the opening 1111. The switch component 131 is reciprocatingly deformable in the extension direction of the opening 1111. The elastic component 123 is used to drive the switch component 131 to deform.

[0045] In these embodiments, the electronic device 100 also includes a pressing module 130, which is connected to the frame assembly 110 to maintain the stability of the pressing module 130. The pressing module 130 includes a switch component 131 and a second circuit board 132. The switch component 131 is connected to one end of the second circuit board 132 facing the elastic component 123. The switch component 131 and the elastic component 123 are in abutment with each other. The elastic component 123 is elastically deformable in the extension direction of the opening 1111. By pressing the elastic component 123, the elastic component 123 is deformed to apply pressure to the switch component 131, causing the switch component 131 to deform to realize different functions of the electronic device 100. There is no need to open additional holes in the metal frame 111 to accommodate the pressing module 130, thereby improving the structural strength of the frame assembly 110.

[0046] The switch element 131 is a PET sheet containing a metal spring or pot piece, and is used as a switch on the second circuit board 132. The switch element 131 acts as a touch-sensitive switch between the elastic element 123 and the second circuit board 132.

[0047] For example, when pressed by the elastic member 123, the center point of the metal spring of the switch member 131 is concave and contacts the circuit on the second circuit board 132, thereby forming a loop; when the elastic member 123 is pressed again, the center point of the metal spring of the switch member 131 is lifted up and separated from the circuit of the second circuit board 132, thereby achieving a circuit break.

[0048] Optionally, the pressing module 130 can serve as an on / off key of the electronic device 100 , and the on / off key is used to control the electronic device 100 to switch between an on state and an off state.

[0049] Optionally, the second circuit board 132 is a main board, or the switch element 131 is connected to the device main board through the second circuit board 132, so that the switch element 131 can control the change of the device state.

[0050] Optionally, the pressing module 130 and the frame assembly 110 are connected by bonding with double-sided tape. For example, the second circuit board 132 is bonded to the frame module.

[0051] Optionally, the fingerprint chip 122 and the switch element 131 are spaced apart to avoid the problem that the fingerprint chip 122 and the switch element 131 are squeezed and damaged by each other during the pressing process of the elastic member 123.

[0052] Optionally, a side surface of the elastic member 123 facing away from the first circuit board 121 is flush with an outer surface of the metal frame 111 to facilitate a user to press the elastic member 123 .

[0053] In some embodiments, as Figure 3 As shown, the fingerprint chip 122 is disposed in the elastic member 123 .

[0054] In these embodiments, the fingerprint chip 122 is disposed in the elastic member 123 to increase the contact area between the fingerprint chip 122 and the elastic member 123 and enhance the connection reliability between the fingerprint chip 122 and the elastic member 123 .

[0055] Specifically, the fingerprint chip 122 is connected to the first circuit board 121 , and then the elastic member 123 is wrapped around the outside of the fingerprint chip 122 to form the fingerprint module 120 . The fingerprint module 120 and the metal frame 111 are connected together by injection molding through the plastic part 112 .

[0056] The orthographic projection area of the fingerprint chip 122 on the metal frame 111 is much larger than the orthographic projection area of the first circuit board 121 on the metal frame 111. The switch component 131 abuts against the side surface of the elastic component 123 facing the second circuit board 132. When the fingerprint chip 122 is enclosed in the elastic component 123, the switch component 131 only needs to avoid the first circuit board 121. The switch component 131 has a larger arrangement area on the side surface of the elastic component 123 facing the second circuit board 132, and the difficulty of matching the switch component 131 and the elastic component 123 is reduced.

[0057] In some embodiments, as Figure 1 and Figure 3 As shown, the elastic member 123 is connected to the plastic portion 112 and the metal frame 111 by injection molding.

[0058] In these embodiments, the elastic member 123 is connected to the plastic portion 112 and the metal frame 111 by injection molding, which can not only improve the connection reliability between the plastic portion 112 and the metal frame 111 , but also improve the sealing performance of the frame assembly 110 .

[0059] Specifically, the fingerprint chip 122 is connected to the first circuit board 121, and then the elastic member 123 is wrapped around the outside of the fingerprint chip 122 to form the fingerprint module 120. The fingerprint module 120 and the metal frame 111 are injection-molded together through the plastic part 112, and the elastic member 123 and the metal frame 111 are injection-molded together.

[0060] Optionally, the elastic member 123 and the metal frame 111 are bonded to each other to enhance the bonding strength between the elastic member 123 and the metal frame 111 .

[0061] In some embodiments, as Figure 3 As shown, at least a portion of the metal frame 111 constitutes an antenna radiator 115 , at least two antenna radiators 115 are arranged at intervals, and the opening 1111 is provided on one antenna radiator 115 .

[0062] In these embodiments, the opening 1111 is provided on an antenna radiator 115 , and the fingerprint module 120 is provided at the opening 1111 . The fingerprint module 120 becomes a part of the antenna radiator 115 . The fingerprint module 120 does not interfere with the antenna radiator 115 , thereby improving the antenna performance of the device.

[0063] In the related art, the fingerprint module 120 is provided with reinforcing steel sheets and metal pins, which may interfere with the antenna. However, in the embodiment of the present application, the fingerprint module 120 and the antenna radiator 115 are injection molded as a whole, and there is no need to provide reinforcing steel sheets and metal pins. This can increase the antenna clearance area and improve antenna performance.

[0064] See also Figure 4 and Figure 5 , Figure 4 A schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application; Figure 5 This is an exploded view of a partial structure of an electronic device according to some embodiments of the present application.

[0065] In some embodiments, as Figure 4 and Figure 5 As shown, the fingerprint chip 122 is attached to the inner surface of the metal frame 111 .

[0066] In these embodiments, the fingerprint chip 122 is attached to the inner surface of the metal frame 111 , eliminating the need to provide a through hole for the fingerprint module 120 on the metal frame 111 , thereby improving the sealing performance of the frame assembly 110 .

[0067] Figure 4 The position of the fingerprint chip 122 is shown by a dotted line.

[0068] In the related art, it is necessary to set a through hole on the metal frame 111 to install and fix the fingerprint module 120 through this through hole. However, in the embodiment of the present application, the fingerprint module 120 is directly connected to the frame assembly 110 by injection molding, so there is no need to set a through hole on the metal frame 111 to install the fingerprint module 120. This can not only improve the structural strength of the metal frame 111, but also help to improve the sealing performance of the frame assembly 110.

[0069] Optionally, an indicator area is provided on the outer surface of the metal frame 111. The projection of the fingerprint chip 122 on the metal frame 111 is located within the indicator area, and the indicator area is used to indicate the location of the fingerprint chip 122. The surface within the indicator area is set to a different color from other areas, or the surface roughness within the indicator area is different from that of other areas to distinguish the indicator area. For example, the surface within the indicator area can be provided with stickers of different colors.

[0070] In some embodiments, as Figure 4 and Figure 5 As shown, a groove 1112 is provided on the outer surface of the metal frame 111 , and at least a portion of the orthographic projection of the fingerprint chip 122 on the metal frame 111 overlaps with the groove 1112 .

[0071] In these embodiments, a groove 1112 is provided on the outer surface of the metal frame 111, and at least part of the positive projection of the fingerprint chip 122 on the metal frame 111 coincides with the groove 1112. The groove 1112 is used to indicate the position of the fingerprint chip 122 for user convenience; and the thickness of the metal frame 111 at the fingerprint chip 122 is reduced, which helps to improve the sensitivity of the fingerprint module 120.

[0072] The outer surface of the metal frame 111 is provided with a groove 1112 . When a user presses on the surface of the groove 1112 , the fingerprint module 120 recognizes the user's fingerprint information.

[0073] Optionally, the groove 1112 is milled out in the metal frame 111 by machining.

[0074] Optionally, the shape and size of the groove 1112 match the fingerprint chip 122 to reduce the area of the groove 1112 and improve the structural strength of the metal frame 111. The depth of the groove 1112 can be designed by yourself.

[0075] See also Figure 6 , Figure 6 This is a partial structural diagram of the frame assembly of an electronic device according to some embodiments of the present application.

[0076] In some embodiments, as Figure 5 and Figure 6 As shown, the frame assembly 110 further includes a plastic member 114 , which is filled in the groove 1112 .

[0077] In these embodiments, the frame assembly 110 further includes a plastic member 114 . The plastic member 114 fills the groove 1112 , so that the user can obtain a good experience when using the fingerprint module 120 .

[0078] Optionally, the plastic part 114 may be TPU colloid or silicone colloid.

[0079] Optionally, the shape of the plastic part 114 matches the shape of the groove 1112 , and the plastic part 114 fills the entire groove 1112 .

[0080] Optionally, a through hole is formed at the bottom of the groove 1112. After the frame assembly 110 and the fingerprint module 120 are injection-molded together, part of the plastic part 112 flows through the through hole to form a plastic part 114 in the groove 1112; or the plastic part 114 is bonded or clamped in the groove 1112 of the metal frame 111.

[0081] The electronic device 100 in the embodiment of the present application includes but is not limited to a mobile phone, a personal digital assistant (PDA), a tablet computer, a laptop computer, a television, a driving recorder, and other devices.

[0082] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: A frame assembly, comprising a metal frame and a plastic portion connected to each other; The fingerprint module includes a first circuit board and a fingerprint chip connected to each other. The fingerprint chip is used to obtain fingerprint information. The fingerprint chip is arranged at one end of the first circuit board close to the metal frame. The fingerprint module is connected to the metal frame through injection molding of the plastic part.

2. The electronic device according to claim 1, wherein The fingerprint module further includes a heat insulation layer, which covers at least a portion of the outer surface of the first circuit board.

3. The electronic device according to claim 1, wherein An opening is provided through the metal frame, and the fingerprint module further includes an elastic member connected to the fingerprint chip. The elastic member is provided in the opening, and at least part of the elastic member is provided on a side of the fingerprint chip facing away from the first circuit board.

4. The electronic device according to claim 3, wherein: The electronic device also includes a pressing module, which is connected to the frame assembly. The pressing module includes a switch component and a second circuit board. The switch component is connected to one end of the second circuit board facing the elastic component. The switch component and the elastic component are in abutment with each other. The elastic component is elastically deformable in the direction in which the opening extends. The switch component is reciprocatingly deformable in the direction in which the opening extends. The elastic component is used to drive the switch component to deform.

5. The electronic device according to claim 3, wherein: The fingerprint chip is arranged in the elastic member.

6. The electronic device according to claim 3, wherein: The elastic member is connected to the metal frame through injection molding of the plastic portion.

7. The electronic device according to claim 3, wherein: At least a portion of the metal frame constitutes an antenna radiator, at least two of the antenna radiators are arranged at intervals, and the opening is arranged on one of the antenna radiators.

8. The electronic device according to claim 1, wherein: The fingerprint chip is attached to the inner surface of the metal frame.

9. The electronic device according to claim 8, wherein: A groove is provided on the outer surface of the metal frame, and at least a portion of the orthographic projection of the fingerprint chip on the metal frame coincides with the groove.

10. The electronic device according to claim 9, characterized in that The frame assembly further includes a plastic part, and the plastic part is filled in the groove.

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