Plastic shell mold capable of rapidly dissipating heat

Abstract

The utility model discloses a plastic shell mould capable of dissipating heat quickly, which relates to the technical field of plastic moulds and comprises a base, a plastic mould is fixedly connected inside the base, and a cooling water pipe is attached to the outer surface of the plastic mould. By the adoption of the structure, the heat conduction copper plate is arranged at one end of the water tank, the heat conduction copper plate is attached to the semiconductor chilling plate, the radiator is fixed through the semiconductor chilling plate, the heat conduction copper plate can rapidly and effectively conduct out heat of cooling liquid in the water tank, and the semiconductor chilling plate absorbs the heat and releases the heat to the other side. And the radiator is responsible for dissipating the absorbed heat into the surrounding environment, the heat accumulated due to the temperature rise of the cooling liquid in the water tank can pass through the heat conduction copper plate and the semiconductor chilling plate and is finally dissipated out through the radiator, heat dissipation can be rapidly conducted on the cooling liquid, and it is ensured that the cooling liquid works efficiently to dissipate heat of the plastic mold.

Description

Technical Field

[0001] The utility model belongs to the technical field of plastic molds, and particularly relates to a plastic shell mold with rapid heat dissipation. Background Art

[0002] Plastic mold is a modular mold widely used in industrial production. It is mainly used for processes such as compression molding, extrusion molding, injection molding, blow molding and low-foaming molding. Plastic molds can process a series of plastic parts of different shapes and sizes through the coordinated changes of their male and female molds and auxiliary molding systems. After the plastic mold is completed, a cooling device is required to dissipate heat.

[0003] For example, a Chinese patent with publication number CN213166621U discloses an automobile plastic mold that can quickly dissipate heat, which relates to the field of mold technology and includes a plastic mold. A cooling fan is provided below the plastic mold, the cooling fan is fixedly connected to the top of the No. 1 rotating shaft, the lower end of the No. 1 rotating shaft is rotatably connected to the upper end of the rotating shell, the bottom end of the No. 1 rotating shaft is fixedly connected to the upper end of the motor, the lower end of the motor is fixedly connected to the inner wall of the bottom end of the rotating shell, the upper end of the No. 1 rotating shaft is fixedly connected to the No. 1 bevel gear, and the left end of the No. 1 bevel gear is meshed with the lower end of the No. 2 bevel gear.

[0004] The above-mentioned plastic mold can dissipate heat in multiple directions by swinging the cooling fan left and right while rotating to dissipate heat. The plastic mold is subjected to secondary heat dissipation through the circulating water pipe, making the entire heat dissipation more efficient and rapid. However, with the continuous use of the circulating water pipe, the internal coolant is prone to gradually heat up due to heat absorption. The current design mainly relies on the heat dissipation effect of the cooling fan on the outer surface of the circulating water pipe, while the water tank storing the coolant itself has not received sufficient heat dissipation attention. This has limited the effectiveness of the overall heat dissipation system to a certain extent, resulting in the heat dissipation effect not reaching the optimal state. Utility Model Content

[0005] In view of the problems mentioned in the background technology, the purpose of the present invention is to provide a plastic shell mold with rapid heat dissipation to solve the problems in the background technology.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] A plastic shell mold with rapid heat dissipation comprises a base, wherein the interior of the base is fixedly connected to a plastic mold, the outer surface of the plastic mold is fittedly connected to a cooling water pipe, the cooling water pipe is fixedly connected to a circulation pipe, a water tank is provided on one side of the base, both ends of the circulation pipe are fixedly connected to the water tank, one end of the water tank is fixedly connected to a water pump, one side of the circulation pipe is fixedly connected to the output end of the water pump, one end of the water tank is fixedly connected to a heat-conducting copper plate, one side of the heat-conducting copper plate is fittedly connected to a semiconductor refrigeration plate, one end of the semiconductor refrigeration plate is fixedly connected to a radiator, a fixing component is provided between the semiconductor refrigeration plate and the water tank, a stirring plate is rotatably connected to the interior of the water tank, and the stirring plate is an arc-shaped structure, one side of the stirring plate is provided with a first drive component, and one side of the first drive component is provided with a second drive component.

[0008] As a preferred technical solution, a mounting groove is provided at one end of the water tank, the heat-conducting copper plate is fixedly connected to the inside of the mounting groove, and the semiconductor refrigeration plate is installed inside the mounting groove.

[0009] As an optimal technical solution, the fixing assembly includes a fixing plate, which is fixedly connected to the two ends of the semiconductor refrigeration plate. A fixing hole is opened inside the fixing plate, and the fixing hole extends to the outside of the water tank. A fixing rod is inserted into the inside of the fixing hole. One side of the fixing rod is slidably connected to the water tank. One end of the fixing rod extending out of the water tank is fixedly connected to a rubber handle. Both ends of the water tank are fixedly connected to fixing blocks. A spring is fixedly connected to the inside of the fixing block. One end of the spring is fixedly connected to a card block, and the card block is an arc-shaped structure. The card block is movably connected to the rubber handle.

[0010] As a preferred technical solution, the first driving component includes a movable plate, which is slidably connected to the water tank through a second driving component. The top of the movable plate is fixedly connected to a first motor, the output end of the first motor is fixedly connected to a stirring shaft, and the stirring plate is fixedly connected to the outer surface of the stirring shaft.

[0011] As a preferred technical solution, the second drive assembly includes a second motor, the second motor is fixedly connected to one end of the water tank, the output end of the second motor is fixedly connected to the first gear, one side of the first gear is meshedly connected to the second gear, one side of the second gear is fixedly connected to a screw rod, a slide groove is provided on one side of the interior of the water tank, the screw rod is rotatably connected to the inside of the slide groove, one side of the movable plate is threadedly connected to the screw rod, and one side of the movable plate is slidably connected to the slide groove.

[0012] In summary, the present invention has the following beneficial effects:

[0013] First, the utility model sets a heat-conducting copper plate at one end of the water tank, which is attached to the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet fixes the radiator. The heat-conducting copper plate can quickly and effectively conduct the heat of the coolant inside the water tank. The semiconductor refrigeration sheet absorbs the heat and releases it to the other side, thereby achieving a cooling effect. The radiator is responsible for dissipating the absorbed heat to the surrounding environment. The heat accumulated in the water tank due to the temperature rise of the coolant can be dissipated through the heat-conducting copper plate and the semiconductor refrigeration sheet, and finally dissipated by the radiator, which can quickly dissipate the heat of the coolant and ensure its efficient work in dissipating heat for the plastic mold.

[0014] Second, the present invention drives the arc-shaped stirring plate to rotate through the first driving component, which can stir the coolant in the water tank and accelerate the heat dissipation. At the same time, the second driving component can drive the stirring plate to move horizontally and change the position of the stirring plate, making the stirring effect more uniform and avoiding the occurrence of local uneven cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the connection structure between the circulation pipe, water tank and cooling water pipe of the utility model;

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure of the water tank of the present utility model;

[0018] Figure 4 This utility model Figure 1 A schematic diagram of the enlarged structure at point A;

[0019] Figure 5 It is a structural schematic diagram of the fixed block of the utility model.

[0020] Figure numerals: 1. base; 2. plastic mold; 3. cooling water pipe; 4. circulation pipe; 5. water pump; 6. mounting groove; 7. heat-conducting copper plate; 8. semiconductor refrigeration plate; 9. radiator; 10. fixing assembly; 101. fixing plate; 102. fixing hole; 103. fixing rod; 104. rubber handle; 11. fixing block; 12. spring; 13. block; 14. stirring plate; 15. first drive assembly; 151. first motor; 152. stirring shaft; 153. moving plate; 16. second drive assembly; 161. second motor; 162. first gear; 163. second gear; 164. screw; 165. slide; 17. water tank. DETAILED DESCRIPTION

[0021] Example

[0022] refer to Figures 1 to 5, a plastic shell mold with rapid heat dissipation described in this embodiment includes a base 1, a plastic mold 2 is fixedly connected to the inside of the base 1, a cooling water pipe 3 is fitted on the outer surface of the plastic mold 2, a circulation pipe 4 is fixedly connected to the cooling water pipe 3, a water tank 17 is provided on one side of the base 1, both ends of the circulation pipe 4 are fixedly connected to the water tank 17, one end of the water tank 17 is fixedly connected to a water pump 5, one side of the circulation pipe 4 is fixedly connected to the output end of the water pump 5, one end of the water tank 17 is fixedly connected to a heat-conducting copper plate 7, one side of the heat-conducting copper plate 7 is fitted with a semiconductor refrigeration sheet 8, one end of the semiconductor refrigeration sheet 8 is fixedly connected to a radiator 9, a fixing component 10 is provided between the semiconductor refrigeration sheet 8 and the water tank 17, the inside of the water tank 17 The stirring plate 14 is connected to the rotating part, and the stirring plate 14 has an arc structure. A first drive component 15 is provided on one side of the stirring plate 14, and a second drive component 16 is provided on one side of the first drive component 15. Through the above arrangement, the stirring plate 14 stirs the coolant under the action of the first drive component 15 and the second drive component 16, and the heat of the coolant in the water tank 17 is absorbed by the heat-conducting copper plate 7. Due to the high thermal conductivity of copper, this process hardly causes heat retention and loss. Under the action of the semiconductor refrigeration plate 8, the heat transmitted from the heat-conducting copper plate is quickly dissipated and dissipated through the radiator 9. Therefore, the heat in the water tank 17 can be dissipated and discharged in time, thereby keeping the temperature inside the water tank 17 stable.

[0023] refer to Figure 2 A mounting groove 6 is provided at one end of the water tank 17, a heat-conducting copper plate 7 is fixedly connected to the inside of the mounting groove 6, and a semiconductor refrigeration plate 8 is installed inside the mounting groove 6; a mounting groove 6 is provided on the water tank 17 for fixing the heat-conducting copper plate 7 and for installing the semiconductor refrigeration plate 8.

[0024] refer to Figure 2 and Figure 5, the fixing assembly 10 includes a fixing plate 101, which is fixedly connected to the two ends of the semiconductor refrigeration sheet 8. A fixing hole 102 is opened inside the fixing plate 101, and the fixing hole 102 extends to the outside of the water tank 17. A fixing rod 103 is inserted into the inside of the fixing hole 102. One side of the fixing rod 103 is slidably connected to the water tank 17. One end of the fixing rod 103 extending out of the water tank 17 is fixedly connected to a rubber handle 104. Both ends of the water tank 17 are fixedly connected to a fixing block 11. A spring 12 is fixedly connected to the inside of the fixing block 11. One end of the spring 12 is fixedly connected to a card block 13, and the card block 13 is an arc-shaped structure. The card block 13 is movably connected to the rubber handle; by setting the fixing assembly 10, the fixing plate 101 is connected to both ends of the semiconductor refrigeration sheet 8 A fixing hole 102 is provided on the fixing plate 101, and the fixing rod 103 is inserted into the fixing hole 102, so that the semiconductor refrigeration plate 8 and the radiator 9 can be quickly installed on the water tank 17. A rubber handle 104 is provided to facilitate the operator to move the fixing rod 103, so that the semiconductor refrigeration plate 8 and the radiator 9 can be removed for maintenance. The rubber handle 104 plays the role of insulation and heat insulation, making the operation safer. After the rubber handle 104 is fitted with the water tank 17, the block 13 is squeezed, and the block 13 pushes the spring 12 to move in the fixing block 11. It should be added that a card hole is provided at one end of the rubber handle 104, which can cooperate with the card block 13 to fix the rubber handle 104, thereby stabilizing the position of the fixing rod 103, so that the semiconductor refrigeration plate 8 and the radiator 9 are stably installed.

[0025] refer to Figure 3-4The first driving assembly 15 includes a moving plate 153, which is slidably connected to the water tank 17 through the second driving assembly 16. The top of the moving plate 153 is fixedly connected to the first motor 151, and the output end of the first motor 151 is fixedly connected to the stirring shaft 152. The stirring plate 14 is fixedly connected to the outer surface of the stirring shaft 152. The second driving assembly 16 includes a second motor 161, which is fixedly connected to one end of the water tank 17. The output end of the second motor 161 is fixedly connected to the first gear 162. One side of the first gear 162 is meshed with the second gear 163. One side of the second gear 163 is fixedly connected to a screw rod 164. A slide groove 165 is provided on one side of the interior of the water tank 17, and the screw rod 164 rotates The movable plate 153 is movably connected to the inside of the chute 165, and one side of the movable plate 153 is threadedly connected to the screw rod 164, and one side of the movable plate 153 is slidably connected to the chute 165; by setting the first driving component 15, the first motor 151 on the movable plate 153 drives the stirring shaft 152 to rotate, and the stirring shaft 152 drives the multiple stirring plates 14 to rotate, thereby stirring the coolant in the water tank 17 and accelerating the heat dissipation. By setting the second driving component 16, the second motor 161 drives the first gear 162 to rotate, the first gear 162 rotates the second gear 163, and the second gear 163 drives the screw rod 164 to rotate, so that the movable plate 153 slides in the chute 165, which can drive the stirring plate 14 to move, so that the stirring effect is more uniform.

[0026] Principle and advantages of use: The water pump 5 draws out the coolant in the water tank 17, and the coolant enters the cooling water pipe 3 through the circulation pipe 4 to dissipate heat for the plastic mold 2. The coolant with heat then enters the water tank 17 through the circulation pipe 4. During this process, the first motor 151 drives the stirring shaft 152 to rotate, and the stirring shaft 152 drives the multiple stirring plates 14 to rotate, thereby stirring the coolant in the water tank 17 and accelerating the heat dissipation. At the same time, the second motor 161 drives the first gear 162 to rotate, the first gear 162 rotates the second gear 163, and the second gear 163 drives the screw 164 to rotate. , so that the movable plate 153 slides in the slide groove 165, driving the stirring plate 14 to move, changing its stirring position, making the stirring effect more uniform, and the heat dissipated by the coolant in the water tank 17 is absorbed by the heat-conducting copper plate 7. Due to the high thermal conductivity of copper, this process hardly causes heat retention and loss. Under the action of the semiconductor refrigeration plate 8, the heat transmitted from the heat-conducting copper plate is quickly dissipated and dissipated through the radiator 9. Therefore, the heat in the water tank 17 can be dissipated and discharged in time, thereby keeping the temperature inside the water tank 17 stable and achieving the purpose of rapid heat dissipation.

Claims

1. A plastic shell mold with rapid heat dissipation, comprising a base (1), characterized in that: The interior of the base (1) is fixedly connected to a plastic mold (2), the outer surface of the plastic mold (2) is fitted with a cooling water pipe (3), the cooling water pipe (3) is fixedly connected to a circulation pipe (4), a water tank (17) is provided on one side of the base (1), both ends of the circulation pipe (4) are fixedly connected to the water tank (17), one end of the water tank (17) is fixedly connected to a water pump (5), one side of the circulation pipe (4) is fixedly connected to the output end of the water pump (5), and one end of the water tank (17) is fixedly connected to a heat conducting A copper plate (7), one side of the heat-conducting copper plate (7) is fitted with a semiconductor refrigeration plate (8), one end of the semiconductor refrigeration plate (8) is fixedly connected to a radiator (9), a fixing component (10) is provided between the semiconductor refrigeration plate (8) and a water tank (17), the interior of the water tank (17) is rotatably connected to a stirring plate (14), and the stirring plate (14) is an arc-shaped structure, a first driving component (15) is provided on one side of the stirring plate (14), and a second driving component (16) is provided on one side of the first driving component (15).

2. The plastic shell mold with rapid heat dissipation according to claim 1, characterized in that: One end of the water tank (17) is provided with a mounting groove (6), the heat-conducting copper plate (7) is fixedly connected to the inside of the mounting groove (6), and the semiconductor refrigeration plate (8) is installed inside the mounting groove (6).

3. The plastic shell mold with rapid heat dissipation according to claim 1, characterized in that: The fixing assembly (10) includes a fixing plate (101), the fixing plate (101) is fixedly connected to both ends of the semiconductor refrigeration plate (8), a fixing hole (102) is provided inside the fixing plate (101), and the fixing hole (102) extends to the outside of the water tank (17), and a fixing rod (103) is inserted into the fixing hole (102).

4. The rapid heat dissipation plastic shell mold according to claim 3, characterized in that: One side of the fixing rod (103) is slidably connected to the water tank (17), and one end of the fixing rod (103) extending out of the water tank (17) is fixedly connected to a rubber handle (104).

5. The plastic shell mold with rapid heat dissipation according to claim 1, characterized in that: Both ends of the water tank (17) are fixedly connected to fixed blocks (11), the interior of the fixed block (11) is fixedly connected to a spring (12), one end of the spring (12) is fixedly connected to a clamping block (13), and the clamping block (13) is an arc-shaped structure. The clamping block (13) is movably connected to the rubber handle.

6. The plastic shell mold with rapid heat dissipation according to claim 1, characterized in that: The first driving assembly (15) comprises a moving plate (153), the moving plate (153) being slidably connected to the water tank (17) via the second driving assembly (16), the top end of the moving plate (153) being fixedly connected to a first motor (151), the output end of the first motor (151) being fixedly connected to a stirring shaft (152), and the stirring plate (14) being fixedly connected to the outer surface of the stirring shaft (152).

7. The plastic shell mold with rapid heat dissipation according to claim 6, characterized in that: The second driving assembly (16) includes a second motor (161), the second motor (161) is fixedly connected to one end of the water tank (17), the output end of the second motor (161) is fixedly connected to a first gear (162), one side of the first gear (162) is meshedly connected to a second gear (163), one side of the second gear (163) is fixedly connected to a screw rod (164), a chute (165) is provided on one side of the interior of the water tank (17), the screw rod (164) is rotatably connected to the interior of the chute (165), one side of the movable plate (153) is threadedly connected to the screw rod (164), and one side of the movable plate (153) is slidably connected to the chute (165).

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