Blind mating assembly with high-density radio frequency connector

Abstract

The utility model discloses a blind-mating assembly with a high-density radio frequency connector, and relates to the radio frequency component technology, and the blind-mating assembly comprises a mounting base which is internally provided with a hollow cavity structure, the bottom surface of the mounting base is provided with radio frequency connector mounting holes which are arranged in an array manner, and the radio frequency connector mounting holes are matched with SMP radio frequency connectors in shape; a plurality of groups of T / R assembly mounting holes are also formed in the middle of the radio frequency connector mounting holes in the bottom surface of the mounting base, so that a T / R assembly can be fixed through any group of T / R assembly mounting holes; the SMP radio frequency connectors are distributed in an array mode and used for being installed in the radio frequency connector installation holes in the installation base. The blind plugging assembly is used for accurately realizing multi-path blind plugging of the high-density radio frequency connector and ensuring the blind plugging precision and the connection reliability of the connector.

Description

Technical Field

[0001] The present application relates to the technical field of radio frequency components, and in particular to a blind-mate assembly with a high-density radio frequency connector. Background Art

[0002] With the development of science and technology, electronic devices are integrating more and more functions. Modules with different functions have brought more signal transmission problems. At the same time, the requirements of integration and miniaturization have also put forward higher requirements on the spatial dimensions of specific equipment. In radio frequency devices, the transmission of radio frequency signals between each unit usually relies on radio frequency connectors. Limited by the internal space of the radio frequency device and the spacing between units, the connection of most connectors is achieved by blind-mate interconnection, so as to make full use of the limited internal space, reduce the volume of the whole device, reduce the cost of cables, and improve assemblability. On the other hand, with the improvement of the integration and miniaturization of electronic equipment, the size of the radio frequency connectors that match them is getting smaller. Not only are the requirements for dimensional accuracy becoming more and more stringent, but the requirements for reliability are also higher, especially for the connection reliability of blind-mate connectors during the blind insertion process and the stability of electrical performance after insertion.

[0003] The 2-18GHz tile-type ultra-wideband integrated RF front-end features high integration, a small antenna profile, and light weight. However, the tile-type structure requires blind-mate interconnection of 256 high-density RF connectors between the antenna array and the T / R components. During installation, due to the small pinhole size of the SMP RF connector (typically approximately 0.4mm in diameter), the connector pins can easily bend or even break, damaging the connector and impacting RF front-end performance. The 2-18GHz tile-type ultra-wideband integrated RF front-end has limited internal space. As connector density increases, installation space becomes narrower, making installation of internal components and connectors difficult and installation accuracy difficult to guarantee, which can also impact RF front-end performance. Utility Model Content

[0004] The embodiment of the present application provides a blind-mating assembly with a high-density RF connector, which accurately realizes multi-way blind mating of the high-density RF connector and ensures the blind-mating accuracy and connection reliability of the connector.

[0005] An embodiment of the present application provides a blind-mate assembly having a high-density radio frequency connector, comprising:

[0006] The mounting base 1 has a hollow cavity structure inside, and an array of RF connector mounting holes 13 are provided on its bottom surface, and the RF connector mounting holes 13 match the shape of the SMP RF connector. A plurality of groups of T / R component mounting holes 12 are also provided in the middle of the RF connector mounting holes on the bottom surface of the mounting base 1, so that the T / R component 3 can be fixed through any group of T / R component mounting holes;

[0007] The first SMP RF connectors 2 are distributed in an array and are used to be installed in the RF connector mounting holes in the mounting base.

[0008] Optionally, the T / R component 3 is used to realize the signal amplification and transceiver switching functions. Any group of the T / R components 3 includes a printed circuit board 31, a silicon-based module 32, a J70A low-frequency connector 33, and a multi-channel second SMP RF connector 34, wherein the second SMP RF connector 34 is welded on the back of the printed circuit board 31, and the second SMP RF connector 34 is used to transmit RF signals.

[0009] Optionally, a mounting flange 11 is provided on the side wall of the mounting base 1 for installing and positioning the mounting base 1 and other rear-end modules, and a through hole 14 is provided on the bottom plate of the mounting base 1 corresponding to the mounting flange 11 to ensure that the installation tool contacts the mounting flange 11.

[0010] Optionally, the first SMP RF connector 2 is welded to the mounting base 1 via a solder ring.

[0011] Optionally, an SMP-KK connector 6 is further included, and the SMP-KK connector 6 is used to connect to the first SMP RF connector 2 to transmit RF signals.

[0012] Optionally, any group of the T / R components 3 is fixed by a spacer 5 .

[0013] The blind-mating assembly of the embodiment of the present application can accurately realize multi-way blind mating of high-density RF connectors, ensuring the blind-mating accuracy and connection reliability of the connectors.

[0014] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0016] Figure 1 is an exploded view of a schematic diagram of the three-dimensional structure of a blind-mate assembly according to an embodiment of the present application;

[0017] Figure 2 1 is a schematic diagram of the three-dimensional structure of the blind-mating assembly mounting base according to an embodiment of the present application;

[0018] Figure 3 is a top view of the inner surface of the bottom plate of the blind mate assembly mounting base according to an embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of the SMP RF connector welding according to an embodiment of the present application;

[0020] Figure 5 is a bottom view of the outer surface of the bottom plate of the mounting base according to an embodiment of the present application;

[0021] Figure 6 This is a schematic diagram of the assembly structure of a blind-plug component of an embodiment of the present application applied to a tile-type ultra-wideband reconfigurable integrated RF front-end in the 2-18 GHz frequency band;

[0022] Figure 7 Schematic diagram of the three-dimensional structure of the antenna array surface of an embodiment of the present application;

[0023] Figure 8 This is a schematic diagram of the SMP-KK connector insertion in an embodiment of the present application;

[0024] Figure 9 is a schematic diagram of the T / R assembly assembly according to an embodiment of the present application;

[0025] Figure 10 It is a schematic diagram of the assembly effect of an embodiment of the present application of a tile-type ultra-wideband reconfigurable integrated RF front-end applied to the 2-18 GHz frequency band.

[0026] Reference numerals:

[0027] 1. Mounting base; 2. SMP RF connector; 3. T / R assembly; 4. Antenna array; 5. T / R assembly spacer; 6. SMP-KK connector; 7. M1.6 mounting screw; 11. Mounting flange; 12. T / R assembly mounting hole; 13. Connector mounting hole; 14. Square hole; 31. Printed circuit board; 32. Silicon-based module; 33. J70A low-frequency connector; 34. SMP RF connector; 41. Antenna unit. DETAILED DESCRIPTION

[0028] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0029] An embodiment of the present application provides a blind-mate assembly with a high-density RF connector. The embodiment of the present application is illustrated using a 256-way high-density RF connector as an example. Blind-mate assemblies of RF connectors with other numbers of ways can be implemented in a similar manner, which is not described in detail in the embodiment of the present application.

[0030] like Figure 1 、 2 Shown, including:

[0031] The mounting base 1 has a hollow cavity structure inside, and an array of RF connector mounting holes 13 are arranged on its bottom surface, and the RF connector mounting holes 13 match the shape of the SMP RF connector. Multiple groups of T / R component mounting holes 12 are also provided in the middle of the RF connector mounting holes on the bottom surface of the mounting base 1, so that the T / R component 3 can be fixed through any group of T / R component mounting holes. In a specific embodiment, the mounting base has a hollow cavity structure inside, and the mounting base 1 is made of 6061 aluminum alloy with natural conductive oxidation. Figure 3 As shown, the inner surface of the bottom plate of the mounting base is provided with four groups of T / R assembly mounting holes, and the four groups of T / R assembly mounting holes are used to fix the four T / R assemblies with screws.

[0032] The first SMP RF connectors 2 are arranged in an array and are mounted to the RF connector mounting holes within the mounting base. In a specific embodiment, the inner surface of the base plate of the mounting base is provided with 256 connector mounting holes, the structure of which matches the shape of the SMP RF connectors. The 256-way SMP RF connectors are welded to the mounting base for transmitting RF signals.

[0033] The blind-mating assembly of the embodiment of the present application can accurately realize multi-way blind mating of high-density RF connectors, ensuring the blind-mating accuracy and connection reliability of the connectors.

[0034] In some embodiments, the first SMP RF connector 2 is welded to the mounting base 1 via a solder ring. Figure 4 As shown, the RF connector mounting hole 13 includes a soldering positioning surface. After positioning, the connection is fixed by soldering. In this specific example, the inner surface of the connector mounting hole where the SMP RF connector is sintered is partially gold-plated. The 256-way SMP RF connector passes through the connector mounting hole and is soldered to the mounting base using 183°C solder rings.

[0035] like Figure 5 、 6 As shown, in some embodiments, a mounting flange 11 is provided on the side wall of the mounting base 1 for installing and positioning the mounting base 1 and other rear-end modules, and a through hole 14 is provided on the bottom plate of the mounting base 1 corresponding to the mounting flange 11 to ensure that the installation tool contacts the mounting flange 11.

[0036] In a specific example, six through holes 14 are provided around the bottom plate of the mounting base 1 in a rectangular array, for example, the through holes 14 are square holes, corresponding to the positions of the six mounting flanges. During the assembly process, the mounting tool can pass through the square holes to contact the mounting flanges.

[0037] In some embodiments, the T / R component 3 is used to realize the signal amplification and transceiver switching functions. Any group of the T / R components 3 includes a printed circuit board 31, a silicon-based module 32, a J70A low-frequency connector 33, and a multi-channel second SMP RF connector 34, wherein the second SMP RF connector 34 is welded on the back of the printed circuit board 31, and the second SMP RF connector 34 is used to transmit RF signals.

[0038] In some embodiments, an SMP-KK connector 6 is further included, and the SMP-KK connector 6 is used to connect to the first SMP RF connector 2 to transmit RF signals.

[0039] In some embodiments, any group of the T / R assemblies 3 is fixed by a spacer 5 .

[0040] In a specific implementation, the antenna array is located on the back of the mounting base, and the coaxial lines of every two SMP RF connectors are fixed on one of the antenna units, and the coaxial lines of the SMP RF connectors serve as feed lines for the antenna units;

[0041] The SMP-KK connector 6 is sequentially inserted into the 256-way SMP RF connector;

[0042] The T / R assembly spacer is fixed on the back of the printed circuit board of the T / R assembly. Each T / R assembly requires four T / R assembly spacers, two on each of the left and right sides.

[0043] The T / R component is installed in the cavity of a blind-plug mounting base with a 256-way high-density RF connector, and the 64-way SMP RF connector on the T / R component is blind-plugged with the SMP RF connector at the corresponding position on the blind-plug mounting base with a 256-way high-density RF connector at the same time to realize RF signal transmission.

[0044] After a total of four T / R components are installed in the cavity of the blind-plug mounting base with a 256-way high-density RF connector, the four T / R components are fixed separately using eight M1.6 mounting screws to ensure the electrical performance stability of the T / R components after plugging.

[0045] The present application also proposes an implementation case of a blind-mating assembly of a high-density RF connector. In this example, the mounting base has a maximum external dimension of 186.9 mm × 115.7 mm × 16.8 mm, and includes a mounting base 1 and a 256-way first SMP RF connector 2.

[0046] The bottom plate thickness of the mounting base 1 is 5 mm, and the flatness tolerance grade of the inner surface of the bottom plate is IT8 or above.

[0047] See also Figure 2 A mounting flange 11 is provided on the side wall of the mounting base 1. There are six mounting flanges 11 with an outer dimension of 8mm×8mm×2mm. The six mounting flanges 11 are arranged in a rectangular array on the side wall of the mounting base 1 for installation and positioning of the mounting base 1 and other rear-end modules.

[0048] See also Figure 2 and Figure 3 The inner surface of the bottom plate of the mounting base 1 is provided with four groups of T / R component mounting holes 12. Each group of T / R component mounting holes 12 includes eight M1.6 threaded holes with a depth of 4 mm. The four T / R components 4 are fixed through the T / R component mounting holes 12 to improve the stability of the blind plug connection.

[0049] See also Figure 2 and Figure 3 The inner surface of the bottom plate of the mounting base 1 is provided with 256 connector mounting holes 13. The structure of the connector mounting holes 13 matches the appearance of the first SMP RF connector 2. The outer side of the shell of the first SMP RF connector 2 is welded to the inner wall of the connector mounting holes 13.

[0050] The relative position dimensional tolerance of each connector mounting hole 13 is guaranteed to be within ±0.05, and the perpendicularity tolerance grade of the connector mounting hole 13 relative to the inner surface of the base plate of the mounting base 1 is above IT8, meeting the SMP product requirements for axial and radial misalignment tolerance.

[0051] See also Figure 4 The first SMP RF connector 2 is a gold-plated surface device. The inner surface of the connector mounting hole 13 where the first SMP RF connector 2 is sintered is partially gold-plated. The 256-way first SMP RF connector 2 is welded to the base plate using a 183°C solder ring.

[0052] See also Figure 2 and Figure 5 Six square holes 14 are provided on the bottom plate of the mounting base 1, with an outer dimension of 8mm×8mm, arranged in a rectangular array around the bottom plate, corresponding to the positions of the six mounting flanges 11, to ensure that the installation tools can contact the mounting flanges 11 during the assembly process.

[0053] This application also proposes an implementation case of a blind-mating assembly with a high-density RF connector, see Figure 6 In this example, the blind-plug mounting base with the 256-way high-density RF connector is included, as well as a T / R component 3, an antenna array surface 4, and a T / R component pad 5.

[0054] The blind-mate process of the blind-mate mounting base with a high-density RF connector in this example is as follows:

[0055] See also Figure 6 , including 128 (16 rows×8 columns) antenna units 41 . The coaxial lines of each two-way first SMP RF connector 2 are fixed on each antenna unit 41 .

[0056] See also Figure 7 The antenna unit 41 is used to transmit and receive electromagnetic wave signals; the coaxial line of the 256-way first SMP RF connector 2 serves as a feeder of the antenna array 4 for transmitting RF signals.

[0057] See also Figure 8 , press and insert the 256-way SMP-KK connector 6 into the above-mentioned 256-way first SMP RF connector 2 in sequence, and the SMP-KK connector 6 is used to transmit RF signals; the SMP-KK connector 6 can solve the axial and radial misalignment tolerances caused by the size errors of the mounting openings on both sides, and realize the requirements of blind mating and interconnection of multiple-way first SMP RF connectors 2 at the same time.

[0058] See also Figure 9 The T / R component 3 includes a printed circuit board 31, a silicon-based module 32, a J70A low-frequency connector 33, a 64-way second SMP RF connector 34, etc. The second SMP RF connector 34 is welded on the back of the printed circuit board 31. The T / R component 3 is used to realize the signal amplification and transceiver switching functions, and the second SMP RF connector 34 is used to transmit RF signals.

[0059] See also Figure 9 In the process of installing the T / R component 3 into the above-mentioned blind-plug mounting base with 256-way high-density RF connector, it is necessary to complete the blind plugging of 64-way second SMP RF connectors 34 at the same time. The plugging is relatively laborious, and sufficient clamping force must be applied to achieve the simultaneous mating of the 64-way second SMP RF connectors 34.

[0060] In order to prevent uneven force during assembly and damage to the components, it is necessary to use the threaded hole in the middle of the T / R component spacer 5 and use the M1.6 mounting screw 15 to install the T / R component spacer 5 on the back of the printed circuit board 31 of the T / R component 3. The T / R component spacer 5 acts as a load-bearing component to disperse the force on the printed circuit board 31, thereby protecting the components on the T / R component 3.

[0061] See also Figure 10After the four T / R components 3 are installed in place, use eight M1.6 mounting screws 15 to fix the four T / R components 3 respectively to complete the entire blind plugging process and ensure the electrical performance stability of the T / R components 3 after blind plugging.

[0062] The blind-mate assembly with a high-density RF connector disclosed in this application can simultaneously achieve blind-mate connection of multiple high-density RF coaxial connectors, ensuring concentricity during insertion and preventing damage to components near the insertion interface. Furthermore, this application provides a blind-mate interconnection of the RF link between the antenna array and the T / R assembly, reducing the number of cables and ensuring the connection reliability of the blind-mate connector during insertion and the electrical performance stability after insertion, thereby improving product reliability.

[0063] It should be noted that, in the various embodiments of the present application, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0064] The serial numbers of the above embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0065] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are protected by this application.

Claims

1. A blind-mate assembly with a high-density RF connector, characterized in that: include: The mounting base (1) has a hollow cavity structure inside, and an array of RF connector mounting holes are provided on the bottom surface thereof, and the RF connector mounting holes (13) match the appearance of the SMP RF connector. A plurality of groups of T / R component mounting holes (12) are also provided in the middle of the RF connector mounting holes on the bottom surface of the mounting base (1), so that the T / R component (3) can be fixed through any group of T / R component mounting holes; The first SMP radio frequency connectors (2) are distributed in an array and are used to be installed in the radio frequency connector mounting holes in the mounting base.

2. The blind-mate assembly with a high-density RF connector according to claim 1, wherein: The T / R components (3) are used to realize signal amplification and transceiver switching functions. Any group of the T / R components (3) includes a printed circuit board (31), a silicon-based module (32), a J70A low-frequency connector (33), and a multi-channel second SMP radio frequency connector (34), wherein the second SMP radio frequency connector (34) is welded on the back of the printed circuit board (31), and the second SMP radio frequency connector (34) is used to transmit radio frequency signals.

3. The blind-mate assembly with a high-density RF connector according to claim 1, wherein: A mounting flange (11) is provided on the side wall of the mounting base (1), and a through hole (14) is provided on the bottom plate of the mounting base (1) corresponding to the mounting flange (11) to ensure that the mounting tool contacts the mounting flange (11).

4. The blind-mate assembly with a high-density RF connector according to claim 1, wherein: The first SMP radio frequency connector (2) is welded to the mounting base (1) via a solder ring.

5. The blind-mate assembly with a high-density RF connector according to claim 1, wherein: It also includes an SMP-KK connector (6), which is used to connect to the first SMP radio frequency connector (2) to transmit radio frequency signals.

6. The blind-mate assembly with a high-density RF connector according to claim 1, wherein: Any set of the T / R components (3) is fixed by a spacer (5).

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