Multi-layer circuit board convenient for heat dissipation

Abstract

The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board convenient for heat dissipation, which comprises a plurality of groups of circuit boards and a combined box, the plurality of groups of circuit boards are arranged on the inner wall of the combined box through splicing assemblies, and heat dissipation mechanisms are arranged on the circuit boards and the combined box. The heat dissipation mechanism comprises a heat conduction assembly, an anti-blocking assembly, two sets of fans and a clamping assembly, the heat conduction assembly is used for rapidly conducting out heat on the circuit board, the anti-blocking assembly is used for preventing impurities from blocking an air inlet, and the clamping assembly is used for rapidly assembling and disassembling the two sets of fans and the anti-blocking assembly; the heat conduction assembly comprises a heat dissipation base installed at the bottom end of the outer wall of the circuit board. The dust-proof fan is simple in structure and convenient to operate, and can automatically drive the brush on the sweeping plate to rotate when the fan is started, so that impurities adhered to the dust-proof net are swept down, an air inlet is prevented from being blocked, the air inlet effect is ensured, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer circuit board with convenient heat dissipation. Background Art

[0002] Circuits are mainly composed of two types of materials: insulating substrates and conductors. They play the role of support, interconnection and some circuit components in electronic equipment. In addition, for some large equipment, when using circuit boards for heat dissipation, multiple circuit boards are usually stacked and used simultaneously. However, in the existing technology, multi-layer circuit boards are stacked up and down, and the airflow of the heat dissipation fan blows from bottom to top, resulting in the upper airflow having already passed through the bottom heat dissipation plate. From a temperature perspective, the heat dissipation effect is greatly reduced, resulting in uneven heat dissipation. Moreover, the airflow is blocked by the circuit board, and the airflow is not smooth, which affects the airflow and the overall heat dissipation effect.

[0003] In order to solve the above technical problems, the Chinese patent with announcement number CN220733093U in the prior art discloses a heat dissipation multi-layer circuit board that is easy to disassemble and assemble, including a mounting box, the inner wall of which is slidably connected to a plurality of circuit board mounting assemblies, the top surfaces of which are each mounted with a circuit board, the outer sides of which are each fixedly connected to a connecting rod, the edges of both side surfaces of the mounting box are rotatably connected to a plurality of hooks, which are respectively hooked to the two ends of a plurality of connecting rods, and an exhaust fan is fixedly connected to the center of the top surface of the mounting box.

[0004] Although the above-mentioned existing technical solution allows the airflow to pass evenly through the top and bottom surfaces of several circuit boards, making the airflow and airflow temperature received by each layer more evenly balanced, thereby ensuring the heat dissipation effect, when the two sets of fans are ventilating, some impurities are easily adhered to the air inlet, which requires personnel to clean in time, otherwise it will affect the heat dissipation effect. In addition, it is impossible to quickly dissipate the heat on the circuit boards, and the heat dissipation efficiency is insufficient. Utility Model Content

[0005] The purpose of the present utility model is to provide a multi-layer circuit board with convenient heat dissipation, so as to solve the problem proposed in the above background technology that when the two sets of fans are ventilating, some impurities are easily adhered to the air inlet, and personnel need to clean them in time, otherwise the heat dissipation effect will be affected, and the heat on the circuit board cannot be quickly discharged, resulting in insufficient heat dissipation efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A multi-layer circuit board with convenient heat dissipation includes multiple groups of circuit boards and a combination box. The multiple groups of circuit boards are installed on the inner wall of the combination box through splicing components. The circuit boards and the combination box are installed with a heat dissipation mechanism. The heat dissipation mechanism includes a heat conducting component, an anti-blocking component, two groups of fans and a snap-on component. The heat conducting component is used to accelerate the heat dissipation from the circuit boards. The anti-blocking component is used to prevent impurities from clogging the air inlet. The snap-on component is used to quickly assemble and disassemble the two groups of fans and the anti-blocking component. The heat conducting component includes a heat dissipation seat installed at the bottom end of the outer wall of the circuit board. A silicone heat conducting plate that adheres to one side of the circuit board is embedded in the heat dissipation seat.

[0008] As a preferred solution of the present invention, a first heat dissipation channel is opened inside the heat dissipation seat on one side of the silicone heat conductive plate, and second heat dissipation channels are opened at both ends of the top of the heat dissipation seat, and the inner sides of the first heat dissipation channel and the second heat dissipation channel are connected.

[0009] As a preferred solution of the present invention, ventilation holes are provided at both ends of the outer wall of the combination box, and the fans are installed on the inner side of the ventilation holes. One group of fans is an air intake fan, and the other group of fans is an exhaust fan. Circulation grooves are provided on both sides of the interior of the combination box, and the inner side of the circulation groove is connected to the inner side of the ventilation hole. Circulation pipes are embedded and installed on both ends of the circuit board on both sides of the inner wall of the combination box.

[0010] As a preferred solution of the present invention, the anti-blocking component includes a mounting groove opened on the outer wall of the combination box at the vent, the inner side of the mounting groove is engaged with a mounting frame, a connecting plate on one side of the inner wall of the mounting frame, one end of the connecting plate is rotatably connected to a movable block, a sweeping plate is installed on one side of the protruding end of the movable block, a dust screen is installed between the inner wall of the mounting frame and the outer wall of the connecting plate, a brush is installed on the side of the sweeping plate facing the dust screen, a convex plate is installed on the other side of the movable block, a groove engaged with the convex plate is opened at the axis center of one side of the fan, a recovery box is installed on the outer wall of the mounting frame below the dust screen, and a guide groove is opened at the port of the recovery box close to the side of the dust screen.

[0011] As a preferred solution of the present invention, the snap-on assembly includes a docking seat installed at one end of the outer side of the installation frame, the outer wall of the combination box is located on one side of the installation groove and is provided with a docking groove for snap-connecting with the docking seat, a pressure block is installed on one side of the docking seat, and the interior of the combination box is located on one side of the inner wall of the docking groove and is provided with a pressure groove for sliding connection with the pressure block.

[0012] As a preferred solution of the present invention, movable grooves are provided on both sides of the pressure groove inside the combination box, a movable plate is slidably connected to the inside of the movable groove, and a first spring is installed between both ends of one side of the movable plate and the inner wall of the movable groove.

[0013] As a preferred solution of the present invention, the inner sides of the movable groove and the pressing groove are connected, the cross section of the movable plate is L-shaped, the cross section of the pressing block is T-shaped, and the opposite ends of the two groups of movable plates and pressing blocks are provided with inclined surfaces that fit each other.

[0014] As a preferred solution of the present invention, a pull rod is installed on one side of the movable plate between the two groups of first springs, and drag grooves are provided at both ends of the top of the combination box. The pull rod is slidingly connected to the drag groove, and the end of the pull rod extending to the outside of the combination box is rotatably connected to a pull ring.

[0015] As a preferred solution of the present invention, the splicing assembly includes multiple groups of splicing seats arranged and installed on both sides of the inner wall of the combination box, and a splicing groove is opened on one side of the splicing seat, and the splicing groove is snap-connected with the heat dissipation seat.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. In the utility model, the heat conduction component is used to accelerate the heat dissipation on the circuit board, and the anti-blocking component is used to prevent impurities from blocking the air inlet. It has a simple structure and is easy to operate. When the fan is started, it can automatically drive the brush on the sweeping plate to rotate, sweeping away impurities adhered to the dustproof net to prevent blockage of the air inlet, ensuring the air intake effect and improving the heat dissipation efficiency.

[0018] 2. In the present invention, the mounting frame and the dust screen can be quickly disassembled and assembled by squeezing and buckling the snap-on assembly, making it convenient for personnel to promptly inspect and repair the dust screen and to centrally process the impurities collected inside the recycling box. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the three-dimensional structure of the circuit board and heat sink of the utility model;

[0021] Figure 3 This is a partial cross-sectional structural diagram of the utility model combination box;

[0022] Figure 4 This is a partial cross-sectional structural diagram of the heat sink of the utility model;

[0023] Figure 5 This is a schematic diagram of the partial three-dimensional structure of the anti-blocking component of the utility model;

[0024] Figure 6 This is a partial cross-sectional structural diagram of the clamping assembly of the present invention.

[0025] In the figure: 1. Circuit board; 2. Assembly box; 3. Heat sink; 4. Silicone heat conductive plate; 5. First heat dissipation channel; 6. Second heat dissipation channel; 7. Fan; 8. Mounting frame; 9. Sweep plate; 10. Brush; 11. Convex plate; 12. Connecting plate; 13. Movable block; 14. Dust screen; 15. Recovery box; 16. Docking seat; 17. Press block; 18. Movable plate; 19. First spring; 20. Inclined surface; 21. Pull rod; 22. Splicing seat; 23. Flow pipe. DETAILED DESCRIPTION

[0026] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Example

[0027] See also Figures 1-6 , the utility model provides a technical solution:

[0028] A multi-layer circuit board with convenient heat dissipation includes multiple groups of circuit boards 1 and a combination box 2. The multiple groups of circuit boards 1 are installed on the inner wall of the combination box 2 through a splicing assembly. A heat dissipation mechanism is installed on the circuit board 1 and the combination box 2. The heat dissipation mechanism includes a heat conduction component, an anti-blocking component, two groups of fans 7 and a clamping component. The heat conduction component is used to quickly extract the heat from the circuit board 1. The anti-blocking component is used to prevent impurities from blocking the air inlet. The clamping component is used to quickly assemble and disassemble the two groups of fans 7 and the anti-blocking component. The heat conduction component includes a heat dissipation seat 3 installed at the bottom end of the outer wall of the circuit board 1. The heat dissipation seat 3 is embedded with a heat dissipation seat 3. The silicone heat conducting plate 4 is attached to one side of the circuit board 1, and the splicing assembly includes multiple groups of splicing seats 22 arranged and installed on both sides of the inner wall of the combination box 2. A splicing groove is provided on one side of the splicing seat 22, and the splicing groove is snap-connected with the heat dissipation seat 3. When in use, the device can be used to accelerate the heat dissipation on the circuit board 1 through the heat conducting assembly. The anti-blocking assembly is used to prevent impurities from blocking the air inlet. It has a simple structure and is easy to operate. When the fan 7 is started, it can automatically drive the brush 10 on the sweeping plate 9 to rotate, sweeping away impurities adhered to the dustproof net 14 to prevent blockage of the air inlet, ensuring the air intake effect and improving the heat dissipation efficiency.

[0029] In this embodiment, if Figure 2 、 Figure 3 and Figure 4As shown, the interior of the heat sink 3 is located on one side of the silicone heat conducting plate 4 and is provided with a first heat dissipation channel 5. The top two ends of the heat sink 3 are provided with a second heat dissipation channel 6. The first heat dissipation channel 5 is connected to the inner side of the second heat dissipation channel 6. Ventilation holes are provided at both ends of the outer wall of the combination box 2. Fans 7 are installed on the inner side of the ventilation holes. One group of fans 7 is an air intake fan, and the other group of fans 7 is an exhaust fan. Flow grooves are provided on both sides of the interior of the combination box 2. The inner side of the flow grooves is connected to the inner side of the ventilation holes. Flow pipes 23 are embedded and installed on both sides of the inner wall of the combination box 2 at both ends of the circuit board 1. First, , start two groups of fans 7 to blow air, and the wind passes through one group of circulation slots and one row of circulation pipes 23 and blows on the top surface of the circuit board 1 and the bottom surface of the heat sink 3 to perform surface heat dissipation, while the wind on both sides can also be poured into the inside of the first heat dissipation channel 5 and the second heat dissipation channel 6. The silicone heat conductive plate 4 will quickly conduct the heat generated by the circuit board 1. At this time, the injected wind blows on one side of the silicone heat conductive plate 4 to take away the heat it absorbs, allowing the silicone heat conductive plate 4 to continue to absorb the heat generated by the circuit board 1, thereby improving the heat dissipation efficiency. The wind can enter the circulation pipe 23 and the circulation slot on the other side and be blown out through the exhaust fan 7.

[0030] In this embodiment, if Figure 1 and Figure 5 As shown, the anti-blocking component includes a mounting groove opened on the outer wall of the combination box 2 at the vent, the inner side of the mounting groove is engaged with a mounting frame 8, a connecting plate 12 on one side of the inner wall of the mounting frame 8, one end of the connecting plate 12 is rotatably connected to a movable block 13, a sweeping plate 9 is installed on one side of the protruding end of the movable block 13, a dustproof net 14 is installed between the inner wall of the mounting frame 8 and the outer wall of the connecting plate 12, a brush 10 is installed on the side of the sweeping plate 9 facing the dustproof net 14, a convex plate 11 is installed on the other side of the movable block 13, and a shaft center on one side of the fan 7 is provided with a screw thread that engages with the convex plate 11 The outer wall of the mounting frame 8 is located below the dustproof net 14 and a recovery box 15 is installed. A guide groove is provided at the port of the recovery box 15 near the side of the dustproof net 14. Then, the dustproof net 14 can intercept external impurities when the fan 7 is started. When the fan 7 is started, its axis rotates to cooperate with the convex plate 11 and the groove to drive the sweeping plate 9 to rotate around the center of the fan 7, sweeping down the impurities adhered to the surface of the dustproof net 14, and the swept impurities slide into the inner side of the recovery box 15 through the guide groove for centralized collection, preventing impurities from clogging the air inlet, thereby further ensuring the heat dissipation efficiency.

[0031] In this embodiment, if Figure 1 and Figure 6As shown, the card assembly includes a docking seat 16 installed at one end of the outer side of the mounting frame 8, the outer wall of the combined box 2 is located on one side of the mounting groove and is provided with a docking groove in which the docking seat 16 is engaged, and a pressure block 17 is installed on one side of the docking groove. The interior of the combined box 2 is located on one side of the inner wall of the docking groove and is provided with a pressure groove that is slidably connected to the pressure block 17. The interior of the combined box 2 is provided with movable grooves on both sides of the pressure groove, and a movable plate 18 is slidably connected to the inside of the movable groove. A first spring 19 is installed between the two ends of one side of the movable plate 18 and the inner wall of the movable groove. The movable groove is connected to the inner side of the pressure groove, and the movable plate 18 is slidably connected to the inner side of the movable plate 18. The cross-section of the movable plate 18 is L-shaped, and the cross-section of the pressure block 17 is T-shaped. The opposite ends of the two sets of movable plates 18 and the pressure block 17 are provided with inclined surfaces 20 that fit together. Furthermore, the docking seat 16 fits into the docking groove, allowing the pressure block 17 to enter the inner side of the pressure groove. The two ends of the pressure block 17 and the protruding ends of the movable plate 18 are abutted against each other, and the multiple sets of inclined surfaces 20 force the movable plate 18 to compress the two sets of first springs 19 to retract. After the pressure block 17 is completely pushed into the inner wall of the pressure groove, the two sets of movable plates 18 are no longer blocked and are driven to pop out by the first spring 19, abutting the protruding ends on both sides of the pressure block 17 to complete the locking.

[0032] In this embodiment, if Figure 1 and Figure 6 As shown, a pull rod 21 is installed on one side of the movable plate 18 between the two groups of first springs 19, and drag grooves are provided at both ends of the top of the combination box 2. The pull rod 21 is slidably connected to the drag groove, and the pull rod 21 extends to one end of the outside of the combination box 2 and is rotatably connected to a pull ring. Furthermore, when it is necessary to disassemble the mounting frame 8 to perform maintenance and inspection on the dustproof net 14, it is only necessary to buckle the two groups of pull rings to drive the pull rod 21 to move, and actively bring the movable plate 18 into the inside of the movable groove. At this time, the mounting frame 8 and the dustproof net 14 can be pulled out for separation.

[0033] The implementation principle of a multi-layer circuit board with convenient heat dissipation in the embodiment of the present application is as follows: two groups of fans 7 are started to blow air, and the wind passes through one group of circulation slots and one row of circulation tubes 23 and blows on the top surface of the circuit board 1 and the bottom surface of the heat sink 3 to perform surface heat dissipation, and the wind on both sides can also be poured into the inside of the first heat dissipation channel 5 and the second heat dissipation channel 6. The silicone heat conductive plate 4 will quickly conduct the heat generated by the circuit board 1. At this time, the injected wind blows on one side of the silicone heat conductive plate 4 to take away the heat it absorbs, allowing the silicone heat conductive plate 4 to continue to absorb the heat generated by the circuit board 1, thereby improving the heat dissipation efficiency. The wind can enter the circulation tube 23 and the circulation slot on the other side and be blown out through the exhaust fan 7. The dustproof net 14 can intercept external impurities when the fan 7 is started. When the fan 7 is started, its axis rotates to cooperate with the convex plate 11 and the groove to drive the sweeping plate 9 to rotate around the center of the fan 7. The two ends of the pressing block 17 and the protruding ends of the movable plate 18 are abutted against each other, and the multiple sets of inclined surfaces 20 force the movable plate 18 to press the two sets of first springs 19 to retract. After the pressing block 17 is completely pushed into the inner wall of the pressing groove, the two sets of movable plates 18 are no longer blocked and are driven to pop out by the first spring 19, and the protruding ends on both sides of the pressing block 17 are locked. When it is necessary to disassemble the mounting frame 8 to maintain and inspect the dustproof net 14, it is only necessary to buckle the two sets of pull rings to drive the pull rod 21 to move, and actively bring the movable plate 18 into the inner side of the movable groove. At this time, the mounting frame 8 and the dustproof net 14 can be pulled out for separation.

[0034] The control method of the present invention is to control through a controller. The control circuit of the controller can be implemented by simple programming by technicians in this field. The provision of power is also common knowledge in this field. Moreover, the present invention is used to protect mechanical devices, so the control method and circuit connection are no longer explained in detail in the present invention.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-layer circuit board with convenient heat dissipation, comprising a plurality of circuit boards (1) and a combination box (2), characterized in that: Multiple groups of circuit boards (1) are installed on the inner wall of the combination box (2) through a splicing assembly. A heat dissipation mechanism is installed on the circuit board (1) and the combination box (2). The heat dissipation mechanism includes a heat conduction assembly, an anti-blocking assembly, two groups of fans (7) and a snap-on assembly. The heat conduction assembly is used to quickly dissipate heat from the circuit board (1). The anti-blocking assembly is used to prevent impurities from blocking the air inlet. The snap-on assembly is used to quickly assemble and disassemble the two groups of fans (7) and the anti-blocking assembly. The heat conduction assembly includes a heat dissipation seat (3) installed at the bottom end of the outer wall of the circuit board (1). A silicone heat conduction plate (4) is embedded and installed inside the heat dissipation seat (3) and is attached to one side of the circuit board (1).

2. A multi-layer circuit board with convenient heat dissipation according to claim 1, characterized in that: A first heat dissipation channel (5) is provided on one side of the silicone heat conducting plate (4) inside the heat dissipation seat (3), and second heat dissipation channels (6) are provided at both ends of the top of the heat dissipation seat (3). The inner sides of the first heat dissipation channel (5) and the second heat dissipation channel (6) are connected.

3. A multi-layer circuit board with convenient heat dissipation according to claim 2, characterized in that: Ventilation holes are provided at both ends of the outer wall of the combination box (2), and the fans (7) are installed inside the ventilation holes, wherein one group of the fans (7) is an air intake fan and the other group of the fans (7) is an air exhaust fan. Flow grooves are provided on both sides of the interior of the combination box (2), and the inside of the flow grooves is connected to the inside of the ventilation holes. Flow pipes (23) are embedded and installed on both ends of the inner wall of the combination box (2) at the circuit board (1).

4. The multi-layer circuit board with convenient heat dissipation according to claim 3, characterized in that: The anti-blocking component includes a mounting groove provided on the outer wall of the combination box (2) at the vent, the inner side of the mounting groove is engaged with a mounting frame (8), a connecting plate (12) on one side of the inner wall of the mounting frame (8), one end of the inner side of the connecting plate (12) is rotatably connected to a movable block (13), a sweeping plate (9) is installed on one side of the protruding end of the movable block (13), a dust screen (14) is installed between the inner wall of the mounting frame (8) and the outer wall of the connecting plate (12), a brush (10) is installed on the side of the sweeping plate (9) facing the dust screen (14), a convex plate (11) is installed on the other side of the movable block (13), a groove engaged with the convex plate (11) is provided at the axis center of one side of the fan (7), a recovery box (15) is installed on the outer wall of the mounting frame (8) below the dust screen (14), and a guide groove is provided at the port of the recovery box (15) close to the side of the dust screen (14).

5. The multi-layer circuit board with convenient heat dissipation according to claim 4, characterized in that: The snap-fit assembly includes a docking seat (16) mounted on one end of the outer side of the mounting frame (8); an outer wall of the combined box (2) is provided with a docking groove on one side of the mounting groove to which the docking seat (16) is snap-connected; a pressure block (17) is installed on one side of the docking seat (16); and an inner wall of the combined box (2) is provided with a pressure groove on one side of the inner wall of the docking groove to which the pressure block (17) is slidably connected.

6. The multi-layer circuit board with convenient heat dissipation according to claim 5, characterized in that: The combination box (2) has movable grooves on both sides of the pressing groove, and a movable plate (18) is slidably connected to the inside of the movable groove. A first spring (19) is installed between the two ends of one side of the movable plate (18) and the inner wall of the movable groove.

7. The multi-layer circuit board with convenient heat dissipation according to claim 6, characterized in that: The movable groove and the inner side of the pressing groove are connected, the cross section of the movable plate (18) is L-shaped, the cross section of the pressing block (17) is T-shaped, and the opposite ends of the two groups of movable plates (18) and pressing blocks (17) are provided with inclined surfaces (20) that fit each other.

8. The multi-layer circuit board with convenient heat dissipation according to claim 7, characterized in that: A pull rod (21) is installed on one side of the movable plate (18) between the two groups of first springs (19), and drag grooves are provided at both ends of the top of the combination box (2). The pull rod (21) is slidably connected to the drag groove, and one end of the pull rod (21) extending to the outside of the combination box (2) is rotatably connected to a pull ring.

9. The multi-layer circuit board with convenient heat dissipation according to claim 8, characterized in that: The splicing assembly comprises a plurality of splicing seats (22) arranged and mounted on both sides of the inner wall of the combination box (2). A splicing groove is provided on one side of the splicing seat (22), and the splicing groove is snap-connected to the heat dissipation seat (3).

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