Lamp bead support and LED lamp bead

Abstract

The utility model discloses a lamp bead support and an LED lamp bead. The lamp bead support comprises a support body, an insulation pressing sheet and a plurality of pin bonding pads. The bracket body is provided with a bowl cup part and a back part, and the plurality of pin bonding pads are arranged on the bowl cup part, penetrate through the bowl cup part and extend to the back part; and the insulating pressing sheets are connected with the bowl cup parts, and the insulating pressing sheets are located above the two adjacent pin bonding pads and are arranged close to the pin bonding pads. According to the technical scheme of the utility model, the buckling deformation of the pin bonding pads is relieved, the stability of the light-emitting chip fixed on each bonding pad is improved, and the packaging quality of the LED lamp bead is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp beads, in particular to a lamp bead bracket and an LED lamp bead. Background Art

[0002] In the prior art, LED lamp beads need to be mounted on a PCB board. LED lamp beads generally include a bracket carrier, a pin pad, and a light-emitting chip electrically connected to the pin pad. Figure 1 As shown, although the setting of the existing lamp bead bracket can basically meet the needs of mounting LED lamp beads on the PCB board, in actual applications, the various soldering pads and pin pads set on the bracket body are prone to warping and deformation due to some subsequent processing processes, such as bending and forming of the soldering pads and pin pads, thereby affecting the stability of fixing the light-emitting chip on each pad, and further affecting the packaging quality of the LED lamp beads. Utility Model Content

[0003] The purpose of the utility model is to provide a lamp bead bracket, aiming to improve the packaging quality of LED lamp beads.

[0004] To achieve this purpose, the present invention adopts the following technical solutions:

[0005] A lamp bead bracket comprises a bracket body, an insulating pressing piece and a plurality of pin pads; the bracket body has a bowl portion and a back portion, the plurality of pin pads are provided on the bowl portion and extend through the bowl portion to the back portion;

[0006] The insulating pressing piece is connected to the bowl portion, and the insulating pressing piece is located above two adjacent pin pads and is arranged close to the pin pads.

[0007] In one embodiment, the plurality of pin pads include: a positive power pad, a negative power pad, a signal output pad, a signal input pad, and a spare input pad;

[0008] The insulating pressing piece includes: a first pressing piece, a second pressing piece, a third pressing piece and a fourth pressing piece; the first pressing piece is arranged above the signal output pad and the negative power pad; the second pressing piece is arranged above the positive power pad and the signal input pad; the third pressing piece is arranged above the signal input pad and the spare input pad; the fourth pressing piece is arranged above the spare input pad and the positive power pad.

[0009] In one embodiment, the lower end surface of the bowl portion abuts against the plurality of pin pads to fix the pin pads.

[0010] In one embodiment, it includes a driver IC, at least one light-emitting chip, and the lamp bead bracket described in this application;

[0011] The driver IC is mounted on at least one of the pin pads, and the light-emitting chip is mounted on at least one of the pin pads; the driver IC, the light-emitting chip, and the pin pads are signal-connected via conductive wires 160 .

[0012] In one embodiment, the LED lamp beads are used to match the LED lamp beads in the prior art. When the position sequence of the driver IC and the light-emitting chip is the same as that of the LED lamp beads in the prior art,

[0013] The position of the pin pad on the back of the bracket body is centrally symmetrical with the position of the pin pad of the LED lamp bead in the prior art.

[0014] In one embodiment, the plurality of pin pads include a positive power pad and a negative power pad; the driver IC is mounted on the positive power pad;

[0015] The light-emitting chip includes a first color rendering chip, a second color rendering chip and a third color rendering chip; the first color rendering chip and the second color rendering chip are installed on the positive power pad; the third color rendering chip is installed on the negative power pad.

[0016] In one embodiment, the plurality of pin pads include an idle spare pad, and the idle spare pad is connected to one of the pin pads.

[0017] In one embodiment, the pin pads include and only include a positive power pad, a negative power pad, a signal output pad, a signal input pad, and a spare input pad. The number of the pin pads is less than that of the pin pads of the LED lamp beads in the prior art.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] In the technical solution of this utility model, the lamp bead holder is usually provided with multiple pin pads. The pin pads are made of metal. When the pin pads are bent from the bowl portion of the holder body to the back of the holder body, the pin pads located inside the bowl portion are often prone to warping and deformation. This technical solution alleviates the warping and deformation of the pin pads by providing an insulating pressure piece above two adjacent pin pads, thereby improving the stability of the light-emitting chip fixed to each pad and improving the packaging quality of the LED lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in this specification so as to facilitate understanding and reading by those familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the effects and objectives that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed in the present invention.

[0022] Figure 1 1a is a schematic diagram of the front structure of an LED lamp bead in the prior art, and 1b is a schematic diagram of the back structure of an LED lamp bead in the prior art;

[0023] Figure 2 This is a schematic structural diagram of an embodiment of the present utility model;

[0024] Figure 3 This is a front structural diagram of an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram of the back structure of an embodiment of the present utility model;

[0026] Figure 5 This is a structural diagram of an embodiment of the pad pin of the utility model;

[0027] Figure 6 This is a structural diagram of another embodiment of the solder pad pin of the present invention;

[0028] Figure 7 This is a structural diagram of a conventional split-type LED display screen;

[0029] Figure 8 A reference diagram of a usage state of an embodiment of the present utility model;

[0030] Figure 9 This is a structural diagram of another embodiment of the present utility model;

[0031] Figure 10 A reference diagram of a usage state of an embodiment of the present utility model;

[0032] Illustration:

[0033] Figure numerals of the prior art: 100′, LED lamp bead; 110′, bracket body; 130′, pin pad; 131′, positive power pad; 132′, negative power pad; 133′, signal output pad; 134′, signal input pad; 135′, spare input pad; 136′, no-load spare pad; 140′, driver IC; 150′, light-emitting chip; 200′, LED panel; 1000′, LED display.

[0034] The figure numbers of the technical solution of the present utility model are as follows: 100, LED lamp bead; 110, bracket body; 110a, bowl cup part; 110b, back; 120, insulating pressing piece; 121, first pressing piece; 122, second pressing piece; 123, third pressing piece; 124, fourth pressing piece; 130, pin pad; 131, positive power pad; 132, negative power pad; 133, signal output pad; 134, signal input pad; 135, spare input pad; 136, no-load spare pad; 140, driver IC; 150, light-emitting chip; 151, first color rendering chip; 152, second color rendering chip; 153, third color rendering chip; 160, conductive lead; 200, LED panel; 1000, LED display. DETAILED DESCRIPTION

[0035] In order to make the technical objectives, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0037] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0038] like Figure 1As shown, although the lamp bead bracket of the LED lamp bead 100' in the prior art can basically meet the requirements of mounting the LED lamp bead 100' on the PCB board, in actual applications, the various soldering pads 130' arranged on the bracket body 110' are prone to warping and deformation due to some subsequent processing processes, such as bending and forming processes of the soldering pads 130', thereby affecting the stability of fixing the light-emitting chip 150' on each soldering pad, and further affecting the packaging quality of the LED lamp bead 100'.

[0039] An embodiment of the utility model provides a lamp bead bracket.

[0040] See also Figure 2 、 Figure 3 and Figure 4 In one embodiment of the present invention, the lamp bead holder includes a holder body 110, an insulating pressing piece 120, and a plurality of pin pads 130; the holder body 110 has a bowl portion 110a and a back portion 110b, and the plurality of pin pads 130 are provided on the bowl portion 110a and extend through the bowl portion 110a to the back portion 110b;

[0041] The insulating pressing piece 120 is connected to the bowl portion 110 a . The insulating pressing piece 120 is located above two adjacent pin pads 130 and is disposed close to the pin pads 130 .

[0042] It is understood that in the technical solution of the present invention, the lamp bead holder is generally provided with a plurality of pin pads 130. The pin pads 130 are made of metal. When the pin pads 130 are bent from the bowl portion 110a of the holder body 110 to the back portion 110b of the holder body 110, it is usually easy to cause the pin pads 130 located inside the bowl portion 110a to warp and deform. The present technical solution alleviates the warping and deformation of the pin pads 130 by providing an insulating pressing piece 120 above two adjacent pin pads 130, thereby improving the stability of the light-emitting chip 150 fixed to each pad, and improving the packaging quality of the LED lamp bead 100.

[0043] It should also be noted that the insulating pressing piece 120 can also be fitted with the pin pad 130 to further fix the pin pad 130 .

[0044] It should also be noted that the pin pad 130 usually needs to be connected to a conductive lead 160 or an electronic device is mounted, so the insulating pressing piece 120 is usually arranged in the interval between two adjacent pin pads 130 and is located locally above the two adjacent pin pads 130.

[0045] It should also be noted that in all embodiments of the present invention, the pin pad 130 has a pad position and a pin position. The pad position of the pin pad 130 is located in the cup portion 110a of the bracket body 110, and the pad position of the pin pad 130 is used to fix the light-emitting device and for bonding wires between the devices. The above-mentioned light-emitting devices include the driver IC 140, the light-emitting chip 150, etc. The pin position of the pin pad 130 is located on the back of the bracket body 110, and the pin position of the pin pad 130 is used to electrically connect to the PCB board that powers and controls multiple LED lamp beads. It should also be noted that the pin pad 130 is made of a conductive metal material, which is usually a metal sheet such as copper foil.

[0046] Please continue reading Figure 3 and Figure 4 In a specific embodiment, the plurality of pin pads 130 include: a positive power pad 131 , a negative power pad 132 , a signal output pad 133 , a signal input pad 134 and a spare input pad 135 ;

[0047] The insulating pressing piece 120 includes: a first pressing piece 121, a second pressing piece 122, a third pressing piece 123 and a fourth pressing piece 124; the first pressing piece 121 is arranged above the signal output pad 133 and the negative power pad 132; the second pressing piece 122 is arranged above the positive power pad 131 and the signal input pad 134; the third pressing piece 123 is arranged above the signal input pad 134 and the spare input pad 135, and the fourth pressing piece 124 is arranged above the spare input pad 135 and the positive power pad 131.

[0048] It can be understood that in order to reduce the interference of the insulating pressing piece 120 when connecting the conductive lead 160 or mounting electronic devices on the pin pad 130, the first pressing piece 121, the second pressing piece 122, the third pressing piece 123 and the fourth pressing piece 124 are set to fix the pins of different functions and positions respectively.

[0049] It can also be understood that, by providing an insulating pressing sheet 120 above the positive power pad 131 and the negative power pad 132 , a short circuit between the positive and negative poles of the LED lamp bead 100 can be better avoided.

[0050] In a specific embodiment, in order to further fix the pin pads 130 of the bowl portion 110 a , the lower end surface of the bowl portion 110 a abuts against the plurality of pin pads 130 .

[0051] See also Figure 2The embodiment of the present invention further provides an LED lamp bead 100, which includes a driver IC 140, at least one light-emitting chip 150 and the lamp bead bracket as described above;

[0052] The driver IC 140 is mounted on at least one of the pin pads 130 , and the light emitting chip 150 is mounted on at least one of the pin pads 130 . The driver IC 140 , the light emitting chip 150 , and the pin pads 130 are signal-connected via conductive wires 160 .

[0053] This embodiment adopts all the features of the above-mentioned lamp bead bracket, so the beneficial effects of the LED lamp bead 100 of this embodiment will not be repeated here.

[0054] See also Figure 1 In a conventional LED lamp bead 100' in this technical field, the conventional LED lamp bead 100' includes a driver IC 140', a light-emitting chip 150', and a plurality of pin pads 130'. Typically, the number of pin pads 130' in conventional technology is five (a positive power pad 131', a negative power pad 132', a signal output pad 133', a signal input pad 134', and a spare input pad 135') or six (typically also including an unloaded spare pad 136').

[0055] See also Figure 7 Generally, in order to overcome the technical problem of insufficient voltage caused by single-ended power supply when the LED display screen 1000' is large, which in turn leads to insufficient brightness of the LED display screen 1000', those skilled in the art will easily think of setting up two LED panels 200' and connecting the two LED panels 200' together to provide bidirectional power supply, thereby alleviating the problem of insufficient voltage on the LED display screen 1000'. However, without changing the circuit design of the PCB board on which the LED lamp beads 100' are mounted, when the two LED panels 200' are powered on both ends, the position sequence of the light-emitting chips 150' will change, which in turn causes the problem of obvious color difference between the two LED panels 200'.

[0056] See also Figure 1 、 Figure 3 and Figure 8 Based on the above problem, in another embodiment of the present invention, the LED lamp bead 100 is used to be matched with the LED lamp bead 100′ in the prior art. When the position order of the driver IC 140 and the light-emitting chip 150 is the same as that of the driver IC 140′ and the light-emitting chip 150′ of the LED lamp bead 100′ in the prior art, the position of the pin pad 130 on the back 110b of the bracket body 110 is symmetrical with the center position of the pin pad 130 of the LED lamp bead 100 in the prior art.

[0057] It is understandable that, when the driver IC 140 and the light-emitting chip 150 are positioned in the same order as the driver IC 140' and the light-emitting chip 150' of the prior art LED lamp bead 100', the LED display screen 1000 obtained by assembling the two LED panels 200 will not have the color difference problem caused by the inconsistent position order of the light-emitting chip 150. Furthermore, the pin pad 130 is set at a position symmetrical to the center of the pin pad 130' of the prior art LED lamp bead 100' on the back 110b of the bracket body 110. At this time, the PCB board used for the prior art LED lamp bead 100' can be rotated 180 degrees and can also be used for the PCB board of the LED lamp bead 100, thereby achieving the universality of the PCB board and saving production and research and development costs.

[0058] Please continue reading Figure 3 In one embodiment, the plurality of pin pads 130 include a positive power pad 131 and a negative power pad 132 ; the driver IC 140 is mounted on the positive power pad 131 ;

[0059] The light-emitting chip 150 includes a first color rendering chip 151 , a second color rendering chip 152 and a third color rendering chip 153 ; the first color rendering chip 151 and the second color rendering chip 152 are mounted on the positive power pad 131 ; the third color rendering chip 153 is mounted on the negative power pad 132 .

[0060] It can be understood that installing the driver IC 140 on the positive power pad 131, the first color rendering chip 151 and the second color rendering chip 152 on the positive power pad 131, and the third color rendering chip 153 on the negative power pad 132 simplifies the layout of the conductive lead 160 and further improves the stability of the LED chip package.

[0061] Optionally, the first color rendering chip 151 , the second color rendering chip 152 , and the third color rendering chip 153 are respectively used to display one color of red light, green light, and blue light.

[0062] Optionally, in order to facilitate the installation of electronic components, the area of the positive power pad 131 and the area of the negative power pad 132 are larger.

[0063] See also Figure 4 、 Figure 5 and Figure 6, multiple pin pads 130 include the unloaded spare pad 136, and the unloaded spare pad 136 is connected to one of the pin pads 130, which can reduce the warping degree of the pin pad 130 interconnected with it and reduce the warping damage or falling of the unloaded spare pad 136 caused by the bending process.

[0064] Alternatively, as Figure 6 As shown, the idle spare pad 136 is not connected to any pin pad 130. It is understandable that Figure 4 and Figure 10 As shown, in a PCB board of the LED lamp bead 100, the signal input pad 134 needs to transmit the signal to the spare input pad 135 through the unloaded spare pad 136. When the unloaded spare pad 136 is not connected to any pin pad 130, even if the signal input pad 134 is in electrical contact with the unloaded spare pad 136, it will not affect the display effect of the display screen.

[0065] It should also be noted that if the unloaded spare pad 136 is connected to one of the pin pads 130, the surface of the PCB board used needs to be specially processed to avoid the wiring on the surface of the PCB board being connected to the signal of the unloaded spare pad 136, causing the circuit to short-circuit.

[0066] See also Figure 9 In a preferred embodiment, the pin pads 130 include only a positive power pad 131, a negative power pad 132, a signal output pad 133, a signal input pad 134, and a backup input pad 135. The number of pin pads 130 is less than that of the conventional LED lamp bead 100. This allows the LED lamp bead 100 to be distinguished from the conventional LED lamp bead 100 in terms of appearance.

[0067] It can also be understood that removing the unloaded spare pad 136 makes it more convenient to arrange the circuits of the PCB board.

[0068] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A lamp bead bracket, characterized in that: It includes a bracket body, an insulating pressing piece and a plurality of pin pads; the bracket body has a bowl portion and a back portion, and the plurality of pin pads are arranged on the bowl portion and extend through the bowl portion to the back portion; The insulating pressing piece is connected to the bowl portion, and the insulating pressing piece is located above two adjacent pin pads and is arranged close to the pin pads.

2. The lamp bead bracket according to claim 1, characterized in that: The plurality of pin pads include: a positive power pad, a negative power pad, a signal output pad, a signal input pad, and a spare input pad; The insulating pressing piece includes: a first pressing piece, a second pressing piece, a third pressing piece and a fourth pressing piece; the first pressing piece is arranged above the signal output pad and the negative power pad; the second pressing piece is arranged above the positive power pad and the signal input pad; the third pressing piece is arranged above the signal input pad and the spare input pad; the fourth pressing piece is arranged above the spare input pad and the positive power pad.

3. The lamp bead bracket according to claim 1, characterized in that: The lower end surface of the bowl portion abuts against the plurality of pin pads to fix the pin pads.

4. An LED lamp bead, characterized in that: It includes a driver IC, at least one light-emitting chip and the lamp bead bracket according to claim 1; The driver IC is mounted on at least one of the pin pads, and the light-emitting chip is mounted on at least one of the pin pads; the driver IC, the light-emitting chip, and the pin pads are connected by conductive wire signals.

5. The LED lamp bead according to claim 4, characterized in that: The LED lamp beads are used to match the LED lamp beads in the prior art. When the position sequence of the driver IC and the light-emitting chip is the same as that of the LED lamp beads in the prior art, The position of the pin pad on the back of the bracket body is centrally symmetrical with the position of the pin pad of the LED lamp bead in the prior art.

6. The LED lamp bead according to claim 4, characterized in that: The plurality of pin pads include a positive power pad and a negative power pad; the driver IC is mounted on the positive power pad; The light-emitting chip includes a first color rendering chip, a second color rendering chip and a third color rendering chip; the first color rendering chip and the second color rendering chip are installed on the positive power pad; the third color rendering chip is installed on the negative power pad.

7. The LED lamp bead according to claim 6, characterized in that: The plurality of pin pads include an unloaded spare pad connected to one of the pin pads.

8. The LED lamp bead according to claim 4, characterized in that: The pin pads include and only have a positive power pad, a negative power pad, a signal output pad, a signal input pad and a spare input pad. The number of the pin pads is less than that of the pin pads of the LED lamp beads in the prior art.

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