Sealing and pressurizing cleaning tank of full-automatic wafer tank type cleaning machine
Through the design of the sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine, the combination of upper and lower spray pipes and motor-driven rubber rollers is adopted to solve the problem of incomplete cleaning of silicon electrodes, achieving efficient and automated cleaning effects, and improving cleaning accuracy and equipment adaptability.
Patent Information
- Application Number
- CN202422439004.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The existing silicon electrodes have poor cleaning effect, particles are prone to residual on the electrode surface, and small breathable holes are difficult to clean, and there is no independent nozzle on the reverse side to clean the cleaning effect.
A fully automatic wafer tank cleaning machine sealed pressurized cleaning tank is designed, and the upper and lower spray pipes are used to clean simultaneously, combining high-pressure water flow and motor-driven rubber rollers to achieve synchronous cleaning on both sides and tiny void penetration, reducing manual flips and enhancing the cleaning effect.
The comprehensive and deep cleaning of silicon electrodes is achieved, cleaning efficiency and accuracy is improved, manual intervention is reduced, the precision structure of silicon electrodes is protected, and maintenance costs and operation difficulty is reduced.
Smart Images
Figure CN223250033U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field related to silicon electrode cleaning equipment, and in particular relates to a sealed pressurized cleaning tank of a full-automatic wafer tank cleaning machine. Background Art
[0002] A fully automated wafer tank cleaner is a type of equipment specifically designed for cleaning wafers during semiconductor manufacturing. This type of cleaning machine typically consists of one or more sealed cleaning tanks that hold the wafers and perform cleaning operations within a closed environment. Using specialized chemical solutions and physical cleaning methods such as ultrasonic vibrations or rotating brushes, the cleaner removes particles, organic matter, and other contaminants from the wafer surface.
[0003] The existing silicon electrode cleaning effect is poor, particles are easily retained on the electrode surface, and due to the influence of liquid tension, the small air holes in the middle of the electrode are difficult to clean. In addition, there is no independent nozzle for cleaning the back of the existing silicon electrode, and the cleaning effect is poor. Utility Model Content
[0004] The purpose of the utility model is to provide a sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine to solve the problems raised in the above background technology, such as the poor cleaning effect of the existing silicon electrode, the easy residue of particles on the surface of the electrode, and the difficulty in cleaning the small air holes in the middle of the electrode due to the influence of liquid tension, and the lack of an independent nozzle for cleaning the back of the existing silicon electrode, resulting in poor cleaning effect.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine, comprising a tooling body and a mounting seat provided at a lower middle position of the tooling body;
[0006] A silicon electrode body is provided at the middle inner position of the mounting seat, a plurality of fixtures are provided at the upper outer position of the mounting seat, upper spray pipes are provided at the left and right ends of the upper side of the fixture body respectively, a lower exhaust port is provided at the right position of the right front outer side of the fixture body, an upper liquid discharge port is provided at the left position of the right front outer side of the fixture body, and a bypass liquid level is provided at the lower position of the right front outer side of the fixture body;
[0007] Electrode fixtures are respectively provided at the four inner corners of the tooling body, and the tooling body is powered by connecting to an external power source;
[0008] A connecting plate is provided at the connection position of the tooling body and the two upper spray pipes, a fixing seat is provided at the outer position of the lower side of the tooling body, a sealing ring is provided at the connection position of the lower side of the tooling body and the mounting seat, and bottom quick-discharge ports are provided at the left and right ends of the lower side of the mounting seat. Limiting blocks are respectively provided at the four corners of the connection between the mounting seat and the lower side of the tooling body, and conductivity is provided on the middle inner side of the mounting seat. Two bottom quick-discharge ports are provided on the lower side of the mounting seat;
[0009] The front and rear ends of the right side of the tool body are provided with upper liquid inlets connected to the two upper spray pipes;
[0010] Lower spray pipes are respectively provided at the front and rear ends of the middle of the lower side of the mounting seat;
[0011] Two motor seats are respectively provided at the upper ends of the mounting seat where the silicon electrode body is located, a micro motor is provided at the lower side of the motor seat, a driving wheel is connected to the lower side of the micro motor, rubber rollers are provided at the upper and lower ends of one side of the driving wheel, and a connecting shaft is provided at the middle position of the two rubber rollers.
[0012] Preferably, the motor base is connected to the mounting base by means of bolts, and the micro motor is connected to the motor base by means of bolts.
[0013] Preferably, the driving wheel and the micro motor are engaged and connected, and the micro motor can drive the driving wheel to rotate.
[0014] Preferably, the two rubber rollers are connected to the connecting shaft by an inlay connection, and the upper and lower sides of the connecting shaft are connected to the mounting seat by a sleeve connection respectively.
[0015] Preferably, the connecting shaft can rotate on the mounting seat, and the two rubber rollers are in close contact with the silicon electrode body and the driving wheel respectively.
[0016] Preferably, four rolling balls are provided at the contact point between the mounting seat and the lower side of the silicon electrode body, and the four rolling balls are connected to the mounting seat respectively through a movable connection.
[0017] Compared with the prior art, the present invention provides a fully automatic wafer tank cleaning machine with a sealed pressurized cleaning tank, which has the following beneficial effects:
[0018] 1. The arrangement of upper and lower spray pipes in the present invention has the following advantages:
[0019] Double-sided simultaneous cleaning: The setting of the lower spray pipe realizes the direct cleaning of the lower side of the silicon electrode body. Working together with the upper spray pipe, there is no need to turn over, which greatly improves the cleaning efficiency. At the same time, it ensures the comprehensiveness of cleaning and avoids the inefficient process of manual turning after traditional single-sided cleaning.
[0020] Penetrate tiny gaps
[0021] High-pressure water flow technology: The spray head connected by the upper spray pipe and the lower spray pipe sprays high-pressure water flow, which can effectively overcome the surface tension of water droplets and directly penetrate into the tiny gaps of the silicon electrode body, solving the problem of inability to deeply clean due to the influence of water droplet tension, and ensuring the depth and thoroughness of cleaning.
[0022] Improve cleaning accuracy
[0023] Precise positioning cleaning: The use of high-pressure water flow can more accurately locate tiny gaps, reduce cleaning dead corners, and improve cleaning accuracy and effectiveness. This is especially important in high-precision semiconductor manufacturing.
[0024] Reduce manual intervention
[0025] Automated cleaning process: Through the combination of the lower spray pipe and high-pressure water flow, automated cleaning is achieved, reducing the need for manual turning and manual cleaning, reducing labor costs, and also reducing errors caused by manual operation.
[0026] Improve product quality
[0027] Reducing residual impurities: A comprehensive and in-depth cleaning method can effectively remove impurities on the surface of the silicon electrode body and in tiny gaps, improving the purity and quality of the final product.
[0028] Adaptability and flexibility
[0029] Multi-scenario application: This design is not only suitable for cleaning silicon electrodes, but its comprehensive cleaning and high-pressure water flow characteristics also make it suitable for cleaning workpieces of more materials and shapes, improving the adaptability and flexibility of the equipment.
[0030] 2. The utility model has the following advantages through the arrangement of the motor base, micro motor, driving wheel, connecting shaft and rubber roller:
[0031] Enhance cleaning effect and efficiency
[0032] All-round cleaning: The motor drives the rubber roller to rub and clean the periphery of the silicon electrode body, while driving the silicon electrode body to rotate on the ball, ensuring that the cleaning liquid can evenly cover the surface of the silicon electrode body, achieving all-round cleaning and removing impurities in hard-to-reach areas.
[0033] Protecting the silicon electrode body
[0034] Reduce damage risk: Four balls support the silicon electrode body, reducing the direct contact area, avoiding hard contact and damaging the silicon electrode surface, and protecting its delicate structure from physical damage.
[0035] Reduce maintenance costs and operating difficulty
[0036] Simplified maintenance process: The use of balls and rubber rollers reduces direct wear parts, lowering maintenance and replacement costs. At the same time, automated operation simplifies the operation process, reduces operational difficulty, and reduces the skill requirements of operators. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0038] Figure 1 This is a schematic diagram of a sealed pressurized cleaning tank structure of a fully automatic wafer tank cleaning machine proposed in the present invention;
[0039] Figure 2 This is a structural schematic diagram of the sealed pressurized cleaning tank of the fully automatic wafer tank cleaning machine proposed in the present invention from a mid-bottom perspective;
[0040] Figure 3 This is a schematic diagram of the structure of the sealed pressurized cleaning tank of the fully automatic wafer tank cleaning machine proposed in the utility model from the front side;
[0041] Figure 4 This is a schematic diagram of the structure of the connection between the silicon electrode and the rubber roller in the motor seat proposed in the utility model;
[0042] Figure 5 The utility model proposes Figure 4 Schematic diagram of the structure after the circular area is enlarged;
[0043] In the figure: 1. Upper spray pipe; 2. Sealing ring; 3. Lower exhaust port; 4. Upper drain port; 5. Bypass liquid level; 6. Motor seat; 7. Conductivity; 8. Lower spray pipe; 9. Fixing seat; 10. Upper liquid inlet; 11. Limit block; 12. Electrode tooling; 13. Tooling fixture; 14. Silicon electrode body; 15. Connecting plate; 16. Bottom quick drain port; 17. Mounting seat; 18. Rubber roller; 19. Connecting shaft; 20. Driving wheel; 21. Micro motor; 22. Rolling ball; 23. Tooling body. DETAILED DESCRIPTION
[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0045] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0046] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0047] See also Figure 1-5 The utility model provides a sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine, comprising a tooling body 23 and a mounting seat 17 arranged at a lower middle position of the tooling body 23;
[0048] A silicon electrode body 14 is provided at the middle inner position of the mounting seat 17, a plurality of fixtures 13 are provided at the upper outer position of the mounting seat 17, upper spray pipes 1 are provided at the left and right ends of the upper side of the fixture body 23, a lower exhaust port 3 is provided at the right position of the right front outer side of the fixture body 23, an upper liquid discharge port 4 is provided at the left position of the right front outer side of the fixture body 23, and a bypass liquid level 5 is provided at the lower position of the right front outer side of the fixture body 23;
[0049] Electrode fixtures 12 are respectively provided at the four inner corners of the fixture body 23, and the fixture body 23 is powered by connecting to an external power source;
[0050] A connecting plate 15 is provided at the connection position of the tooling body 23 and the two upper spray pipes 1, a fixing seat 9 is provided at the outer position of the lower side of the tooling body 23, a sealing ring 2 is provided at the connection position of the lower side of the tooling body 23 and the mounting seat 17, and a bottom quick discharge port 16 is provided at the left and right ends of the lower side of the mounting seat 17. Limiting blocks 11 are respectively provided at the four corners of the lower connection between the mounting seat 17 and the tooling body 23. A conductivity 7 is provided on the middle inner side of the mounting seat 17, and two bottom quick discharge ports 16 are provided on the lower side of the mounting seat 17;
[0051] The front and rear ends of the right side of the tooling body 23 are provided with upper liquid inlets 10 connected to the two upper spray pipes 1;
[0052] The lower spray pipes 8 are respectively provided at the front and rear ends of the lower middle side of the mounting base 17;
[0053] Two motor seats 6 are respectively provided at the upper ends of the mounting seat 17 where the silicon electrode body 14 is located, a micro motor 21 is provided at the lower side of the motor seat 6, a driving wheel 20 is connected to the lower side of the micro motor 21, and rubber rollers 18 are provided at the upper and lower ends of one side of the driving wheel 20, and a connecting shaft 19 is provided in the middle position of the two rubber rollers 18.
[0054] In this embodiment, the operating principle and steps of the sealed pressurized cleaning tank of the fully automatic wafer tank cleaning machine
[0055] How it works
[0056] The fully automatic wafer tank cleaning machine achieves efficient and precise cleaning of the silicon electrode body 14 through the integrated tooling body 23, spray system, drainage system, sealing and pressurization system, and motor drive system. Its core principles are as follows:
[0057] Sealing and pressurization: The sealing of the cleaning tank is ensured by the sealing ring 2, and combined with the pressurizing equipment, the cleaning liquid can more effectively penetrate the surface and micropores of the silicon electrode body 14 under the pressurized state, thereby improving the cleaning efficiency.
[0058] Spraying and draining: The upper spray pipe 1 and the lower spray pipe 8 spray cleaning liquid to cover the upper and lower surfaces of the silicon electrode body 14; the cleaned liquid is discharged through the lower exhaust port 3 and the bottom quick drain port 16 to ensure that the cleaning liquid is updated and avoid secondary contamination.
[0059] Conductivity monitoring: Conductivity 7 monitors the cleanliness of the cleaning fluid in real time to ensure the quality of the cleaning fluid and thus guarantee the cleaning effect.
[0060] Motor drive and cleaning: The micro motor 21 drives the driving wheel 20 and the rubber roller 18 to rotate. The rubber roller 18 contacts the silicon electrode body 14, removes surface impurities through physical friction, and drives the silicon electrode body 14 to rotate in the tooling body 23.
[0061] Fixture and limit: The fixture 13 and the limit block 11 fix the position of the silicon electrode body 14 to ensure stability and safety during the cleaning process.
[0062] Ball assistance: The four balls 22 reduce direct contact between the silicon electrode body 14 and the mounting seat 17, reduce friction, protect the surface of the silicon electrode body 14 from damage, and play a role in smooth movement during the rotation of the silicon electrode body 14.
[0063] How to use
[0064] Preparation stage:
[0065] Check whether the tool body 23, spray pipe, drain port, motor base 6, micro motor 21 and all connecting parts are intact.
[0066] The silicon electrode body 14 to be cleaned is placed on the mounting seat 17 , ensuring that the four rolling balls 22 are evenly distributed on the lower side of the contact surface.
[0067] Positioning and sealing:
[0068] The silicon electrode body 14 is fixed by a fixture 13 , and accurate positioning is further ensured by a limit block 11 .
[0069] Check the sealing ring 2 to ensure there is no leakage and form a sealed environment for the cleaning tank.
[0070] Pressurization and spraying:
[0071] The micro motor 21 is started, and the driving wheel 20 and the rubber roller 18 begin to rotate, thereby physically cleaning the silicon electrode body 14 .
[0072] Open the upper spray pipe 1 and the lower spray pipe 8 to spray the cleaning liquid, and the conductivity 7 monitors the quality of the cleaning liquid in real time.
[0073] Drainage and circulation:
[0074] The cleaning liquid is discharged through the lower exhaust port 3 and the bottom quick discharge port 16 to keep the cleaning liquid fresh and avoid contamination.
[0075] Repeat the spraying and draining process as needed until the cleaning standard is reached.
[0076] Cleaning completion and unloading:
[0077] Close all systems, wait for the cleaning fluid to be completely discharged, and stop the micro motor 21.
[0078] Release the fixture 13 and carefully take out the cleaned silicon electrode body 14.
[0079] Maintenance and inspection:
[0080] Clean any remaining cleaning fluid and check if the equipment requires maintenance or parts replacement.
[0081] Prepare for the next cleaning cycle.
[0082] Through the above principles and steps, the fully automatic wafer tank cleaning machine achieves efficient, safe and automated cleaning of the silicon electrode body 14, ensuring the cleaning quality during the semiconductor production process.
[0083] like Figure 1-5 As shown, the motor seat 6 is connected to the mounting seat 17 by a bolt connection method, the micro motor 21 is connected to the motor seat 6 by a bolt connection method, the driving wheel 20 and the micro motor 21 are connected in an inlay connection method, and the micro motor 21 can drive the driving wheel 20 to rotate, and the two rubber rollers 18 are connected to the connecting shaft 19 by an inlay connection method, and the upper and lower sides of the connecting shaft 19 are respectively connected to the mounting seat 17 by a sleeve connection method, and the connecting shaft 19 can rotate on the mounting seat 17, and the two rubber rollers 18 are in close contact with the silicon electrode body 14 and the driving wheel 20 respectively. Four balls 22 are provided at the contact point between the mounting seat 17 and the lower side of the silicon electrode body 14, and the four balls 22 are respectively connected to the mounting seat 17 by a movable connection method.
[0084] Preferably, the operator can grab the silicon electrode onto the mounting seat 17 through an external mechanical claw and place its four corners on the four balls 22 to ensure that it can rotate on the balls 22. Then, when the tooling body is performing a cleaning operation, the micro motor 21 on the lower side of the motor seat 6 is started to drive the driving wheel 20 to rotate, and the driving wheel 20 drives the two rubber rollers 18 to rotate on the tooling body using the connecting shaft 19. When the rubber roller 18 rotates, it can friction clean the periphery of the silicon electrode body 14 and drive the silicon electrode body 14 to rotate on the four balls 22, so as to better cooperate with the spray heads in the upper spray pipe 1 and the lower spray pipe 8 to spray cleaning liquid for all-round cleaning operations.
[0085] Preferably, the new lower spray pipe 8 arranged on the lower side can effectively clean the lower side of the silicon electrode body 14, effectively solving the problem that in the current cleaning tooling, only the upper side of the silicon electrode body 14 can be cleaned, and it needs to be turned over for cleaning after cleaning, which is inefficient. In addition, the high-pressure water flow sprayed from the spray heads connected to the upper spray pipe 1 and the lower spray pipe 8 can effectively enter the tiny gaps in the silicon electrode body 14, preventing the problem of water droplet tension from preventing water from penetrating.
[0086] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A sealed pressurized cleaning tank for a fully automatic wafer tank cleaning machine, comprising a tooling body (23) and a mounting seat (17) disposed at a lower middle position of the tooling body (23); A silicon electrode body (14) is provided at the middle inner position of the mounting seat (17), a plurality of fixtures (13) are provided at the upper outer position of the mounting seat (17), upper spray pipes (1) are provided at the left and right ends of the upper side of the fixture body (23), a lower air exhaust port (3) is provided at the right position of the right front outer side of the fixture body (23), an upper liquid discharge port (4) is provided at the left position of the right front outer side of the fixture body (23), and a bypass liquid level (5) is provided at the lower position of the right front outer side of the fixture body (23); Electrode fixtures (12) are respectively provided at the four inner corners of the fixture body (23), and the fixture body (23) is powered by connecting to an external power source; A connecting plate (15) is provided at the connection position between the tooling body (23) and the two upper spray pipes (1), a fixing seat (9) is provided at the outer position of the lower side of the tooling body (23), a sealing ring (2) is provided at the connection position between the lower side of the tooling body (23) and the mounting seat (17), bottom quick discharge ports (16) are provided at the left and right ends of the lower side of the mounting seat (17), limiting blocks (11) are respectively provided at the four corners of the lower side of the mounting seat (17) and the tooling body (23), a conductivity (7) is provided on the middle inner side of the mounting seat (17), and two bottom quick discharge ports (16) are provided on the lower side of the mounting seat (17); The front and rear ends of the right side of the tool body (23) are provided with upper liquid inlets (10) communicating with the two upper spray pipes (1); Its characteristics are: Lower spray pipes (8) are respectively provided at the front and rear ends of the middle of the lower side of the mounting seat (17); Two motor seats (6) are respectively provided at the upper ends of the mounting seat (17) where the silicon electrode body (14) is located, a micro motor (21) is provided at the lower side of the motor seat (6), a driving wheel (20) is connected at the lower side of the micro motor (21), rubber rollers (18) are provided at the upper and lower ends of one side of the driving wheel (20), and a connecting shaft (19) is provided at the middle position of the two rubber rollers (18).
2. The sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine according to claim 1, characterized in that: The motor base (6) is connected to the mounting base (17) by means of bolt connection, and the micro motor (21) is connected to the motor base (6) by means of bolt connection.
3. The sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine according to claim 2, characterized in that: The driving wheel (20) and the micro motor (21) are in an embedded connection, and the micro motor (21) can drive the driving wheel (20) to rotate.
4. The sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine according to claim 3, characterized in that: The two rubber rollers (18) are connected to a connecting shaft (19) by an inlay connection mode, and the upper and lower sides of the connecting shaft (19) are connected to a mounting seat (17) by a sleeve connection mode respectively.
5. The sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine according to claim 4, characterized in that: The connecting shaft (19) can rotate on the mounting seat (17), and the two rubber rollers (18) are in close contact with the silicon electrode body (14) and the driving wheel (20) respectively.
6. The sealed pressurized cleaning tank of a fully automatic wafer tank cleaning machine according to claim 5, characterized in that: Four rolling balls (22) are provided at the contact point between the mounting seat (17) and the lower side of the silicon electrode body (14), and the four rolling balls (22) are respectively connected to the mounting seat (17) through a movable connection mode.