The application relates to the technical field of
silicon electrode production, and discloses a
silicon wafer cutting device and a
cutting method for
silicon electrode production. The device comprises a seat body, a
crystal holder fixing frame is slidably arranged on the seat body, a driving source for driving the
crystal holder fixing frame to ascend and descend is arranged on the seat body, and the
crystal holder fixing frame is detachably arranged on the crystal holder fixing frame. A wire roller, a collecting box and a liquid box are arranged on the seat body. The liquid box is fixed to the seat body, a liquid outlet of the liquid box is rotatably arranged with a flow guide plate, and the flow guide plate is turned over by the transmission
assembly during the descending of the crystal holder fixing frame. When the silicon
ingot is partially
cut, the flow guide plate is turned over upwards, the cooling liquid can flow out of the center of the silicon
ingot and the
cutting area, the flow guide plate can be automatically adjusted to turn over upwards after the cutting is performed for a period of time, the flow direction of the cooling liquid is adjusted, the cooling liquid can cool the center of the silicon
ingot and the cutting area, and the problem that micro-cracks are formed at the grain boundaries or defects due to uneven temperature distribution in the silicon ingot is solved.