The invention provides a capacitive micro-electromechanical
system (MEMS)
accelerometer, which comprises a first
silicon cover plate layer, a middle
silicon layer and a second
silicon cover plate layer which are arranged in sequence, wherein the middle silicon layer comprises a first silicon island and a second silicon island; the silicon islands are formed inside a silicon framework and separated from the silicon framework at intervals; the first silicon island is contacted with a
metal electrode of the first silicon cover plate layer; the second silicon island is contacted with a
metal electrode of the second silicon cover plate layer; the first silicon cover plate layer further comprises a first
metal electrode through hole, a second metal electrode through hole and a
silicon electrode through hole which are formed in a first silicon substrate; the first metal electrode through hole corresponds to the position of the first silicon island; the second metal electrode through hole corresponds to the position of the second silicon island; the
silicon electrode through hole corresponds to the position of the silicon framework; and an insulating layer is arranged on the inner wall of each through hole, and each through hole is filled with metal
electrically conductive material. By adopting the capacitive MEMS
accelerometer, all electrodes of the
accelerometer can be led out on the same silicon surface, so that
wafer level bonding of the accelerometer is realized and the accelerometer can be packaged by adopting the
flip chip technology.