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53results about How to "Flexible packaging" patented technology

Capacitive micro-electromechanical system (MEMS) accelerometer and manufacturing method thereof

The invention provides a capacitive micro-electromechanical system (MEMS) accelerometer, which comprises a first silicon cover plate layer, a middle silicon layer and a second silicon cover plate layer which are arranged in sequence, wherein the middle silicon layer comprises a first silicon island and a second silicon island; the silicon islands are formed inside a silicon framework and separated from the silicon framework at intervals; the first silicon island is contacted with a metal electrode of the first silicon cover plate layer; the second silicon island is contacted with a metal electrode of the second silicon cover plate layer; the first silicon cover plate layer further comprises a first metal electrode through hole, a second metal electrode through hole and a silicon electrode through hole which are formed in a first silicon substrate; the first metal electrode through hole corresponds to the position of the first silicon island; the second metal electrode through hole corresponds to the position of the second silicon island; the silicon electrode through hole corresponds to the position of the silicon framework; and an insulating layer is arranged on the inner wall of each through hole, and each through hole is filled with metal electrically conductive material. By adopting the capacitive MEMS accelerometer, all electrodes of the accelerometer can be led out on the same silicon surface, so that wafer level bonding of the accelerometer is realized and the accelerometer can be packaged by adopting the flip chip technology.
Owner:BEIJING MXTRONICS CORP +1

Manufacturing method for hard micro-fluid chip

The invention discloses a manufacturing method for a hard micro-fluid chip. The manufacturing method comprises the following steps: preparing an upper chip and chemically bonding and packaging the upper chip under a semi-cured state with a substrate, thereby acquiring the hard micro-fluid chip. The upper chip can be prepared from epoxy resin or amino resin; when the upper chip is prepared, the heating curing temperature is 45-85 DEG C and the time is 15 minutes to 8 hours; a thermal polymerized epoxy resin material is used after the two materials of prepolymer and curing agent are mixed, the viscosity thereof after mixing is low (approximate to mineral oil viscosity), the rolling printing for a tiny structure at micron scale and even nanometer scale is convenient and the rolling precision is high; the mixture can be solidified within 40min under the temperature of 80 DEG C, the preparation time of the micro-fluid chip is shortened, the period is short, the consumption of a reagent is less and the batch production is convenient; the hard micro-fluid chip can be flexibly packaged and combined with various substrates; the packaging is independent of external high temperature and high pressure environments; and the packaging strength is high and the speed is high.
Owner:TSINGHUA UNIV +1

Preserved bean curd sauce and preparation method thereof

ActiveCN102349637AReduce wasteDon't worry about brokenFood preparationRed yeast riceAdditive ingredient
The invention discloses preserved bean curd sauce and a preparation method thereof, which belong to the food processing field. The preserved bean curd sauce consists of the following ingredients in percentage by weight: 80 to 88 percent of preserved bean curd, 5 to 10 percent of fermented soybeans, 1 to 2 percent of red yeast rice, 2 to 3 percent of soybean oil, 2 to 5 percent of salt, 1 to 3 percent of carrageenin, 0.01 to 0.1 percent of sucralose and 0 to 5 percent of flavoring. The preparation method comprises the following steps that: weighing raw materials according to the proportion, homogenizing and mixing, high-temperature sterilizing, filling and packing when the obtained product is still hot. The defective preserved bean curd with unqualified appearance in the production of block-shaped preserved bean curd is adopted to produce the preserved bean curd sauce, so the waste of the resource can be reduced, the breaking of the block-shaped preserved bean curd caused by high temperature is not worried, high-temperature sterilizing and inactivating enzyme operation is adopted; the subsequent filling production can realize the mechanization and automation, so the production efficiency can be greatly improved; and at the same time the preserved bean curd sauce is free from being subject to the packing of traditional glass bottles, the packing of a preserved bean curd sauce product can be more flexible and varied, and the requirement of modern people on portable flavoring can be satisfied.
Owner:GUANGDONG MEIWEIXIAN FLAVORING & FOOD

Packaging method of upgrade package and upgrading method thereof

The invention provides a packaging method of an upgrade package and an upgrading method thereof, and belongs to the technical field of embedded systems. The packaging method of the upgrade package andthe upgrading method thereof comprise the steps that a non-upgrade partition is preset to store upgrade progress information; according to an index n, data block size information and data block offset information from a head file are obtained; according to the data block size information and the data block offset information, a corresponding compressed data block is obtained; the data block is unzipped to obtained a first unzipped data block; according to partition name information and the index n, the first unzipped data block is written into a corresponding written-in offset address of a to-be-upgraded partition, the written-in offset address is the size of the data block corresponding to (n-x)*data block size information, x is a corresponding initial index of the data block in the to-be-upgraded partition, and the information is to be upgraded. The packaging method and upgrading method of the upgrade package have the advantages that the upgrade package can be configured, the packaging mode is flexible; after powering down the upgrade process before powering down can be continued, the upgraded data does not need to be re-upgraded, and the upgrading efficiency is improved.
Owner:AMOLOGIC (SHANGHAI) CO LTD

Preparation method of blue/purple long-distance triggered LED (Light Emitting Diode) white-light emitting illumination material

The invention belongs to the technical field of light-emitting materials and in particular relates to a preparation method of a blue / purple long-distance triggered LED (Light Emitting Diode) white-light emitting illumination material. The preparation method comprises the following steps of: mixing liquid-state polyurethane, an organic solvent and a defoaming agent, then adding florescent powder and stirring for 0.2-2 hours; and coating stirred paste onto a pretreated transparent plate and drying the transparent plate, wherein the organic solvent is butyl acetate, the defoaming agent is an organic siloxane defoaming agent, the paste is coated on the transparent plate by adopting one or more of steps, such as spin coating, dropwise coating, brush coating and spray coating, and the thickness of the coating is 0.2-0.6mm. The fluorescent powder used in the process of preparing the light emitting material by using the preparation method is not in direct contact with a chip, thereby being long in service life; the color temperature of the florescent powder can be adjusted between 3000K and 8500K; and in addition, a packaging process is simple and flexible. According to the preparation method, the use amount of the florescent powder is low, the raw material is easily available and non-toxic, and no industrial three wastes are formed in the preparation process. The light emitting material is wide in application field.
Owner:SHANGHAI NORMAL UNIVERSITY

Flip-chip bonding electrode structure of surface-type semiconductor laser device

The invention provides a flip-chip bonding electrode structure of a surface-type semiconductor laser device and belongs to the field of laser technology application. The flip-chip bonding electrode structure comprises a sapphire substrate, an epitaxial growth layer, an insulation layer, a P-type electrode, an N-type electrode, an N'-type electrode and a gold wire, wherein the N'-type electrode and the P-type electrode are equal in height and positioned on two sides of the N-type electrode respectively, and two ends of the gold wire are bonded on the N-type electrode and the N'-type electrode respectively. The flip-chip bonding electrode structure of the surface-type semiconductor laser device has the advantages that a traditional structure of the surface-type semiconductor laser device is changed, the height of the N-type electrode is increased to be as same as that of the P-type electrode through the gold wire, and accordingly, the problem of height difference between the P-type electrode and the N-type electrode of the sapphire laser device can be solved; in the same way, spacing between the P-type electrode and the N-type electrode can be increased properly, and bonding consumables of the P-type electrode and the N-type electrode can be isolated during bonding, so that short circuit possibly happening during bonding is prevented effectively.
Owner:BEIJING UNIV OF TECH

Leadless packaging structure and method of high-temperature-resistant sensor

The invention discloses a leadless packaging structure and method of a high-temperature-resistant sensor, the leadless packaging structure comprises a sensor chip, a sensor shell used for supporting the sensor chip and a metal pin arranged on the sensor shell, the metal pin is connected with a metal electrode of the sensor chip through a high-temperature-resistant conductive layer, and the metal electrode is connected with the sensor chip through a high-temperature-resistant conductive layer. And the metal electrode is externally arranged on the surface of the sensor shell or is internally arranged in the sensor shell. According to the invention, on one hand, the problem of reliability degradation and even failure of a conventional metal lead bonding packaging technology in a high-temperature environment is solved, on the other hand, the lead packaging mode is simplified, the operation is simple, the yield is high, the reliability in actual use is high, the method is suitable for batch production, the cost is low, and the cost performance is very high. Meanwhile, by selecting and simplifying packaging materials, the working stability and long-term reliability of the sensor in a high-temperature environment are improved, and the sensor chip has the advantage of being good in dynamic response characteristic by adopting flush packaging.
Owner:XI AN JIAOTONG UNIV

Anticorrosive coating production paint discharging and subpackaging device with weighing function

The invention discloses an anticorrosive coating production paint discharging and subpackaging device with the weighing function. A weighing mechanism is fixedly mounted on the middle portion of the top of a base. An oil paint box is fixedly mounted on the base through supporting frames symmetrically mounted at the left and right ends of the top of the base. A carrying plate is fixedly mounted onthe top of the weighing mechanism. Subpackaging buckets are arranged on the carrying plate. The left side face of the oil paint box is provided with a control box and a drain pipe. A drain valve is arranged on the drain pipe. The front side of the oil paint box is provided with two discharge pipes and a control panel. The control panel is located between the two discharge pipes. Each discharge pipe is provided with an intelligent valve. The control panel is provided with two start buttons electrically connected with the intelligent valves. The inner top wall and the inner bottom wall of the oil paint box are each provided with two symmetric bearing blocks. A rotary rod is rotatably connected between the upper and lower two corresponding bearing blocks. Stirring blades are fixedly mounted on the rotary rods. Heating strips are fixedly mounted on the inner walls of the left and right sides of the oil paint box correspondingly. The anticorrosive coating production paint discharging and subpackaging device with the weighing function can efficiently and accurately complete integral operation of oil paint weighing and subpackaging.
Owner:ANHUI KAILIN ADVANCED MATERIAL CO LTD

Human placenta tissue fluid injection and preparation method thereof

The invention discloses a human placenta tissue fluid injection and a preparation method of the human placenta tissue fluid injection. A placenta tissue is subjected to freeze-drying treatment and secondary pulverization to obtain placenta tissue dry powder, the problem of toxin and bacteria breeding caused by the fact that the placenta tissue is prone to deterioration in the conventional heatingand drying process is prevented, meanwhile, acid hydrolysis, centrifugal separation and the like are combined, and acid-hydrolyzed placenta tissue fluid is obtained. Compared with conventional repeated freezing, thawing, filtration and the like, the purifying efficiency is improved, further, adsorption and elution are carried out through a protein adsorption column, purer active peptide is obtained, and the purity of the active peptide is improved. The preparation method is simple in steps, easy to popularize in industry and high in application value. In addition, the protein adsorption columnis used for adsorption and elution, the content of active substances in the obtained human placenta tissue fluid is higher, use is more convenient in medical treatment, the human placenta tissue fluid can be subpackaged to prepare human placenta tissue fluid injections with different concentrations respectively, and use is more flexible and more convenient.
Owner:江西润泽药业有限公司

Heat exchanger automatic packaging machine with edge cutting function

The invention discloses a heat exchanger automatic packaging machine with an edge cutting function, and relates to the technical field of heat exchanger packaging machines. Specifically, the heat exchanger automatic packaging machine comprises a bottom disc, holding mechanisms, a mounting rod, a film winding mechanism, a film pressing mechanism and a film cutting mechanism, wherein a motor is mounted in the center of the upper surface of the bottom disc, the center of the lower surface of a rotating disc is connected with the output end of the motor, the holding mechanisms are assembled on theupper sides of stepped clamping jaws through insertion holes, the mounting rod vertically penetrates through one side of the edge of a bearing disc, the film winding mechanism is installed on the upper section of the mounting rod, the film pressing mechanism is installed on one side of the film winding mechanism, and the film cutting mechanism is assembled on the film pressing mechanism. According to the heat exchanger automatic packaging machine with the edge cutting function, the rotating disc can be driven to rotate through the motor, then heat exchangers stacked on the rotating disc can be driven to rotate, and then film roll packaging can be conducted on the heat exchangers. Convenience and rapidness are achieved, manpower and time are saved, and the packaging efficiency is improved.
Owner:WUXI JIALONG HEAT EXCHANGER

TV test tooling plate

The invention discloses a TV test tooling plate, and relates to the production and processing field of electronic products. The TV test tooling plate comprises a substrate, wherein the substrate is provided with a limiting block, and a support mechanism is arranged a preset distance away from the limiting block. The support mechanism comprises a rotating shaft, wherein the rotating shaft is connected with the substrate through a shaft pedestal, the rotating shaft can rotate around a connecting part between the rotating shaft and the shaft pedestal, two sides of the rotating shaft are provided with backup plates respectively, the backup plate and the substrate are provided with a preset angle therebetween, a supporting bar is arranged below the backup plate and connected with the backup plate through a pin shaft, the supporting rod can rotate around a connecting part between the supporting bar and the backup plate, a blocking shaft is arranged below the supporting bar, and a card seat is arranged between the blocking shaft and the substrate. The overall structure of the tooling plate is enabled to be simple through using the rotatable support mechanism, and meanwhile, the time occupied by each tooling plate in processing and placement is reduced, thereby enabling the tooling plate to be more flexible in packaging and transportation.
Owner:苏州鑫叶自动化设备系统有限公司

Transport ship cargo environment protection system

The invention discloses a transport ship cargo environment protection system. The transport ship cargo environment protection system is applied to the cargo hold of a transport ship, and includes a central cooling and heat source unit, an air supply system, and an salt mist filtering system; the salt mist filtering system comprises a salt mist filtering device and an air conditioner, central monitoring system, the central monitoring system is arranged in the cargo compartment and monitors the internal environment of the cargo compartment through each sensor to obtain monitoring information. The air supply system adopts a high-speed jet ventilation mode to supply air to the cargo compartment. The control end of the watertight air lock is integrated in a cab and/or a centralized control roomof the transport ship. The central cold and heat source unit is shared with the cabin air conditioning system. The invention can realize the control of the air salinity, can meet the transportation requirements of the goods with special sizes, can obviously improve the effective loading coefficient of the transport ship, reduce the complexity of the system, simplify the control flow of the cargocabin environment, and can obviously reduce the system energy consumption under the same temperature and humidity parameter requirements.
Owner:708TH RES INST OF CSSC

A method and apparatus for optical monitor channel processing in an optical network

A method and apparatus for optical monitor channel processing in an optical network is provided. Embodiments of the present invention relate to the field of optical communications, in particular to overhead processing techniques in optical transport networks. In one method of overhead sending, a network device generates an Optical Monitoring Channel (OSC) frame, the OSC frame includes a pluralityof overhead code block units, each overhead code block unit of the plurality of overhead code block units carries an overhead. The OSC frame carries overhead identification information for identifyingan overhead type of the overhead carried by the plurality of overhead code block units. The overhead includes an optical transmission section overhead, an optical multiplexing section overhead and anintegrated optical branch signal overhead. The network device sends the OSC frame. By adopting the overhead processing technology provided by the invention, the network equipment can extract and parse the overhead code block unit to be processed from the received OSC frame, and the overhead code block unit to be parsed is not required for transparent transmission, thereby reducing the overhead processing cycle, that is, the overhead processing delay. In addition, the overhead processing technology provided by the invention provides a flexible encapsulation and mapping mode, and has good scalability.
Owner:HUAWEI TECH CO LTD

Capacitive micro-electromechanical system (MEMS) accelerometer and manufacturing method thereof

The invention provides a capacitive micro-electromechanical system (MEMS) accelerometer, which comprises a first silicon cover plate layer, a middle silicon layer and a second silicon cover plate layer which are arranged in sequence, wherein the middle silicon layer comprises a first silicon island and a second silicon island; the silicon islands are formed inside a silicon framework and separated from the silicon framework at intervals; the first silicon island is contacted with a metal electrode of the first silicon cover plate layer; the second silicon island is contacted with a metal electrode of the second silicon cover plate layer; the first silicon cover plate layer further comprises a first metal electrode through hole, a second metal electrode through hole and a silicon electrode through hole which are formed in a first silicon substrate; the first metal electrode through hole corresponds to the position of the first silicon island; the second metal electrode through hole corresponds to the position of the second silicon island; the silicon electrode through hole corresponds to the position of the silicon framework; and an insulating layer is arranged on the inner wall of each through hole, and each through hole is filled with metal electrically conductive material. By adopting the capacitive MEMS accelerometer, all electrodes of the accelerometer can be led out on the same silicon surface, so that wafer level bonding of the accelerometer is realized and the accelerometer can be packaged by adopting the flip chip technology.
Owner:BEIJING MXTRONICS CORP +1
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