Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Packaging method of upgrade package and upgrading method thereof

An upgrade package and technology to be upgraded, applied in the packaging and upgrade fields of upgrade packages, can solve problems such as low efficiency, and achieve the effects of reducing upgrade time, improving upgrade efficiency, and reducing volume

Active Publication Date: 2018-06-15
AMOLOGIC (SHANGHAI) CO LTD
View PDF8 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The power-down protection of the current upgrade can only guarantee that the upgrade will not change after power-off, but compared to the upgrade efficiency, the last upgrade cannot be continued after power-on again, and the efficiency is relatively low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging method of upgrade package and upgrading method thereof
  • Packaging method of upgrade package and upgrading method thereof
  • Packaging method of upgrade package and upgrading method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] It should be noted that, in the case of no conflict, the following technical solutions and technical features can be combined with each other.

[0039] The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing:

[0040] Such as figure 1 As shown, a packaging method of an upgrade package, the above-mentioned upgrade package includes a header file and a data file, and it is characterized in that the above-mentioned packaging method includes:

[0041] Step S1, obtaining the configuration file corresponding to the upgrade package to be packaged, and parsing the configuration file to obtain configuration information and at least one partition image;

[0042] Step S2, according to the above configuration information, split each of the above-mentioned partition images, so that each of the above-mentioned partition images is split into multiple data blocks;

[0043] Step S3. According to the above configuration i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging method of an upgrade package and an upgrading method thereof, and belongs to the technical field of embedded systems. The packaging method of the upgrade package andthe upgrading method thereof comprise the steps that a non-upgrade partition is preset to store upgrade progress information; according to an index n, data block size information and data block offset information from a head file are obtained; according to the data block size information and the data block offset information, a corresponding compressed data block is obtained; the data block is unzipped to obtained a first unzipped data block; according to partition name information and the index n, the first unzipped data block is written into a corresponding written-in offset address of a to-be-upgraded partition, the written-in offset address is the size of the data block corresponding to (n-x)*data block size information, x is a corresponding initial index of the data block in the to-be-upgraded partition, and the information is to be upgraded. The packaging method and upgrading method of the upgrade package have the advantages that the upgrade package can be configured, the packaging mode is flexible; after powering down the upgrade process before powering down can be continued, the upgraded data does not need to be re-upgraded, and the upgrading efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of embedded systems, in particular to a packaging method of an upgrade package and an upgrade method. Background technique [0002] The current upgrade modules of embedded systems are all equipped with the function of upgrade power-down protection, which can ensure that the system can start normally or continue to upgrade when the power is turned on again after power failure during the upgrade process. [0003] For example, in an existing power-failure protection method, the specific process is to judge whether there is a power-failure in the upgrading process, and if so, it will not enter the system that may be damaged, so as to achieve the effect of power-failure unchanged brick. In another existing power-failure protection method, it is mainly reflected in the hardware layer. When abnormal power-failure occurs, it is powered by a battery to save the unsaved data in the memory to a non-volatile storage med...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F8/65G06F8/71
CPCG06F8/65G06F8/71
Inventor 喻志刚
Owner AMOLOGIC (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com