Heating and sealing device for reflow soldering machine

Abstract

The utility model relates to a heating sealing device for a reflow soldering machine. According to the heating device for the reflow soldering machine, by arranging the sealing assembly, a good partition effect can be achieved on different heating areas, and it is guaranteed that the temperature between the areas is stable; by arranging the transmission assembly, the effect of adjusting the sealing plate can be effectively achieved in the using process, the effect of rapid closing can be achieved when it is guaranteed that the pcb passes through, the situation of heat loss is avoided, and energy consumption needed by heating is effectively reduced; the sealing assemblies are arranged among the multiple temperature zones, so that the effect of effectively avoiding heat loss among the temperature zones can be achieved, and harmful waste gas generated by welding can be exhausted in the using process through the smoke exhaust pipe; and by arranging the heating pipe, the effect of adjusting the temperature of different temperature zones can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering machines, in particular to a heating and sealing device for a reflow soldering machine. Background Art

[0002] A reflow oven, also known as a reflow soldering machine, is a key piece of equipment widely used in the electronics manufacturing process. Its primary function is to provide a heated environment that melts the solder paste, allowing the surface mount components and PCB pads to be reliably bonded together through the solder paste alloy.

[0003] The interior of the reflow soldering machine usually has four areas: preheating area, constant temperature area, soldering area and cooling area. The four areas are separated by thermal insulation materials.

[0004] Reflow ovens typically use high-efficiency thermal insulation materials to isolate the temperature between different temperature zones, minimizing heat transfer between them. Appropriate gaps or channels are left between the insulation and the inner walls of the machine, providing a path for the PCB's movement. However, these gaps can still cause hot air from the higher-temperature zones to enter the lower-temperature zones, causing the high-temperature zones to cool. This, in turn, requires frequent heating of the heaters in these zones, increasing energy consumption during operation. Therefore, a heating and sealing device for reflow ovens has been proposed to address this issue. Utility Model Content

[0005] In response to the deficiencies of the existing technology, the utility model provides a heating and sealing device for a reflow soldering machine, which has the advantages of achieving good sealing effect, etc., and solves the problem that traditional insulation boards have poor sealing and cannot maintain stable temperature in various areas.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a heating and sealing device for a reflow soldering machine, comprising a machine platform, a conveyor belt for conveying and a heating platform for heating are provided on the top of the machine platform, a feeding port for feeding is provided on one side of the heating platform, and a sealing assembly for sealing is provided on the feeding port;

[0007] The sealing assembly includes a mounting plate, a feeding channel for feeding is provided in the mounting plate, a slide groove is provided in the feeding channel, a sealing plate is slidably connected in the slide groove, a support spring is provided on the top of the sealing plate for support, two transmission blocks for adjustment are provided on the sealing plate, and two transmission assemblies are also provided on the mounting plate, and the two transmission assemblies are transmission-connected to the transmission blocks.

[0008] Furthermore, the transmission assembly includes an electric push rod and an adjustment frame, the push rod end of the electric push rod is fixedly connected to a connecting frame, the adjustment frame is provided with a connecting column, and the connecting frame is transmission-connected to the connecting column.

[0009] Furthermore, the number of the sealing components is four, and a heating chamber is provided inside the heating platform. The heating chamber is divided into four chambers, namely a preheating chamber, a constant temperature chamber, a welding chamber and a cooling chamber, by three sealing components.

[0010] Furthermore, a discharge port is provided on one side of the cooling chamber.

[0011] Furthermore, a smoke exhaust pipe for exhausting waste gas is provided on the top of the heating platform.

[0012] Furthermore, a plurality of heating tubes for heating are provided on the top of the heating chamber.

[0013] Compared with the existing technology, the technical solution of this application has the following beneficial effects:

[0014] 1. The heating device for the reflow soldering machine is equipped with a sealing component so that it can achieve a good partition effect for different heating areas, ensuring the temperature stability between various areas; it is equipped with a transmission component so that it can effectively adjust the sealing plate during use, and can achieve a quick closing effect when the PCB board passes through, avoiding heat loss and effectively reducing the energy consumption required for heating.

[0015] 2. The heating device for the reflow soldering machine can effectively avoid heat loss between the temperature zones by providing sealing components between the multiple temperature zones, can discharge harmful exhaust gas generated by welding during use by providing a smoke exhaust pipe, and can achieve the effect of temperature regulation of different temperature zones by providing a heating pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the utility model;

[0017] Figure 2 This is a side view of the structure of the utility model;

[0018] Figure 3 A schematic diagram of the structure of the heating table of the utility model;

[0019] Figure 4 This is a schematic diagram of the sealing component structure of the utility model;

[0020] Figure 5 This is an exploded view of the sealing component structure of the utility model;

[0021] Figure 6 For this utility model Figure 4 A magnified view of the structure.

[0022] In the figure: 1. Machine; 11. Conveyor belt; 21. Heating table; 22. Feed port; 23. Discharge port; 24. Exhaust pipe; 25. Heating chamber; 26. Heating tube; 251. Preheating chamber; 252. Constant temperature chamber; 253. Welding chamber; 254. Cooling chamber; 3. Sealing assembly; 31. Mounting plate; 32. Feeding channel; 33. Slide; 34. Sealing plate; 35. Transmission block; 36. Support spring; 4. Transmission assembly; 41. Electric push rod; 42. Adjustment frame; 43. Connecting column; 44. Connecting frame. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example 1:

[0025] See also Figure 1-6 In this embodiment, a heating and sealing device for a reflow soldering machine includes a machine platform 1. A conveyor belt 11 for conveying and a heating platform 21 for heating are provided on the top of the machine platform 1. A feed port 22 for feeding is provided on one side of the heating platform 21. A sealing assembly 3 for sealing is provided on the feed port 22. The sealing assembly 3 includes a mounting plate 31. A feed channel 32 for feeding is provided in the mounting plate 31. A slide 33 is provided in the feed channel 32. A sealing plate 34 is slidably connected in the slide 33. A support spring 36 is provided on the top of the sealing plate 34 for support. Two transmission blocks 35 for adjustment are provided on the sealing plate 34. Two transmission assemblies 4 are also provided on the mounting plate 31. The two transmission assemblies 4 are transmission-connected to the transmission blocks 35. The transmission assembly 4 includes an electric push rod 41 and an adjustment frame 42. The push rod end of the electric push rod 41 is fixedly connected to a connecting frame 44. The adjustment frame 42 is provided with a connecting column 43. The connecting frame 44 is transmission-connected to the connecting column 43.

[0026] As a preferred technical solution in this embodiment: in actual use, the staff can place the PCB board to be welded on the conveyor belt 11, and then control the conveyor belt 11 to drive the PCB board to move it into the heating table 21 to achieve the effect of welding the electronic components on the PCB board. In the process of conveying the PCB board, the staff can control the electric push rod 41 to pull the connecting frame 44 so that the connecting frame 44 can achieve the effect of pulling the connecting column 43. When the connecting frame 44 pulls the connecting column 43, it can drive the adjusting frame 42 to rotate. During the rotation of the adjusting frame 42, the adjusting frame 42 can drive the transmission block 35 to move upward. During the upward displacement of the transmission block 35 The support spring 36 at the top of the sealing plate 34 can be used to compress the support spring 36 on the top of the sealing plate 34, so that the PCB can be transmitted. When the transmission is completed, the staff can control the electric push rod 41 again to push the connecting frame 44 to drive the connecting column 43 to make the adjustment frame 42 rotate in the opposite direction. During the reverse rotation of the adjustment frame 42, the lifting of the transmission block 35 can be cancelled. At this time, the support spring 36 at the top of the sealing plate 34 can achieve a downward thrust on the sealing plate 34, so that the sealing plate 34 can be fitted with the surface of the conveyor belt 11, thereby ensuring its sealing during use.

[0027] The technical effects brought about by the above embodiment are as follows: by providing a sealing component 3, it is possible to achieve a good isolation effect for different heating areas, ensuring the temperature stability between each area; by providing a transmission component 4, it is possible to effectively adjust the sealing plate 34 during use, and achieve a quick closing effect when ensuring that the PCB board passes through, avoiding heat loss and effectively reducing the energy consumption required for heating.

[0028] Example 2:

[0029] See also Figure 1-6 To achieve a seal between the various zones, four sealing assemblies 3 are provided in this embodiment. A heating chamber 25 is provided within the heating platform 21. The heating chamber 25 is divided into four chambers by three sealing assemblies 3: a preheating chamber 251, a constant temperature chamber 252, a welding chamber 253, and a cooling chamber 254. A discharge port 23 is provided on one side of the cooling chamber 254. A smoke exhaust pipe 24 is provided at the top of the heating platform 21 for exhausting exhaust gases. Multiple heating pipes 26 are provided at the top of the heating chamber 25 for heating.

[0030] As a preferred technical solution in this embodiment: during actual use, the staff can first place the PCB board on the conveyor belt 11 to convey the PCB board to the preheating chamber 251 to preheat the PCB board. When the preheating is completed, the staff can control the conveyor belt 11 again to transfer the PCB board to the constant temperature chamber 252, so that the temperature of the larger components on the PCB board catches up with the smaller components, ensuring that the oxides on the pads, solder balls and component pins are removed; after the PCB board is subjected to constant temperature treatment, the PCB board is again transferred to the welding chamber 253 by controlling the conveyor belt 11 to melt the solder paste and thus achieve the welding effect. After the welding is completed, the PCB board can be transported to the cooling chamber 254 by controlling the conveyor belt 11 to achieve the cooling effect of the PCB board, thereby completing the reflow soldering effect of the PCB board.

[0031] As a preferred technical solution in this embodiment: by providing a sealing component 3 between multiple temperature zones, it is possible to effectively avoid the effect of heat loss between the temperature zones; by providing a smoke exhaust pipe 24, it is possible to discharge the harmful exhaust gas generated by welding during use; by providing a heating pipe 26, the effect of temperature regulation of different temperature zones can be achieved.

[0032] The working principle of the above embodiment is:

[0033] 1. In actual use, the staff can place the PCB board to be welded on the conveyor belt 11, and then control the conveyor belt 11 to drive the PCB board to move it into the heating table 21 to achieve the effect of welding the electronic components on the PCB board. In the process of conveying the PCB board, the staff can control the electric push rod 41 to pull the connecting frame 44, so that the connecting frame 44 can achieve the effect of pulling the connecting column 43. When the connecting frame 44 pulls the connecting column 43, the adjusting frame 42 can be driven to rotate. During the rotation of the adjusting frame 42, the adjusting frame 42 can drive the transmission block 35 to produce an upward displacement. During the upward displacement of the transmission block 35, the sealing plate can be driven. 34 produces an upward displacement, thereby leaking a gap that is convenient for the PCB to pass through, and can achieve the compression effect of the support spring 36 on the top of the sealing plate 34, at this time, the PCB can be conveyed, and when the transmission is completed, the staff can control the electric push rod 41 again to push the connecting frame 44 to drive the connecting column 43 to make the adjustment frame 42 rotate in the opposite direction. During the reverse rotation of the adjustment frame 42, the lifting of the transmission block 35 can be cancelled. At this time, the support spring 36 on the top of the sealing plate 34 can achieve a downward thrust on the sealing plate 34, so that the sealing plate 34 can be fitted with the surface of the conveyor belt 11, ensuring its sealing during use.

[0034] 2. In actual use, the staff can first place the PCB board on the conveyor belt 11 to transfer the PCB board to the preheating chamber 251 to preheat the PCB board. When the preheating is completed, the staff can control the conveyor belt 11 again to transfer the PCB board to the constant temperature chamber 252, so that the temperature of the larger components on the PCB board catches up with the smaller components, ensuring that the oxides on the solder pads, solder balls and component pins are removed; after the PCB board is subjected to constant temperature treatment, the conveyor belt 11 is controlled again to transfer the PCB board to the welding chamber 253 to melt the solder paste and achieve the welding effect. After the welding is completed, the conveyor belt 11 can be controlled to transport the PCB board to the cooling chamber 254 to achieve the cooling effect of the PCB board, thereby completing the reflow soldering effect of the PCB board.

[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heating and sealing device for a reflow soldering machine, comprising a machine platform (1), characterized in that: A conveyor belt (11) for conveying and a heating platform (21) for heating are provided on the top of the machine (1); a feeding port (22) for feeding is provided on one side of the heating platform (21); a sealing component (3) for sealing is provided on the feeding port (22); The sealing assembly (3) includes a mounting plate (31), a feeding channel (32) for feeding is provided in the mounting plate (31), a slide groove (33) is provided in the feeding channel (32), a sealing plate (34) is slidably connected in the slide groove (33), a support spring (36) for supporting is provided on the top of the sealing plate (34), two transmission blocks (35) for adjustment are provided on the sealing plate (34), and two transmission assemblies (4) are further provided on the mounting plate (31), and the two transmission assemblies (4) are transmission-connected to the transmission blocks (35).

2. A heating and sealing device for a reflow soldering machine according to claim 1, characterized in that: The transmission assembly (4) includes an electric push rod (41) and an adjustment frame (42), wherein the push rod end of the electric push rod (41) is fixedly connected to a connection frame (44), and the adjustment frame (42) is provided with a connection column (43), and the connection frame (44) is transmission-connected to the connection column (43).

3. The heating and sealing device for a reflow soldering machine according to claim 1, characterized in that: The number of the sealing components (3) is four, and a heating chamber (25) is provided inside the heating platform (21). The heating chamber (25) is divided into four chambers, namely a preheating chamber (251), a constant temperature chamber (252), a welding chamber (253), and a cooling chamber (254), by the three sealing components (3).

4. A heating and sealing device for a reflow soldering machine according to claim 3, characterized in that: A discharge port (23) is provided on one side of the cooling cavity (254).

5. The heating and sealing device for a reflow soldering machine according to claim 1, wherein: A smoke exhaust pipe (24) for exhausting waste gas is provided on the top of the heating platform (21).

6. The heating and sealing device for a reflow soldering machine according to claim 3, characterized in that: A plurality of heating tubes (26) for heating are provided on the top of the heating chamber (25).

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