Crystal holder assembly, gluing equipment and slicing equipment

Abstract

The utility model relates to a crystal support assembly, gluing equipment and slicing device.The crystal support assembly mainly comprises a crystal support body and at least two glue limiting structures, and one face of the crystal support body is a placement plane used for pasting a plastic plate; each glue limiting structure comprises a first glue limiting face and a second glue limiting face which are perpendicular to each other, and a gluing space is defined by the two adjacent first glue limiting faces, the two adjacent second glue limiting faces and the containing plane. A single-opening space can be defined by the formed gluing space, limiting of five faces can be conveniently formed after glue liquid is guided in, the thickness of the glue liquid can be directly controlled through the amount of the glue liquid, the glue liquid cannot overflow, the thickness of the glue liquid is controllable after bonding is completed, and the crystal bar gluing quality is high and reliable. The problems that in the prior art, due to the fact that adhesive of the crystal bar is influenced by manual adhesive layer smearing, the precision and stability of the fixed crystal bar are poor, and the slicing requirement cannot be met can be effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of crystal rod fixing, and in particular to a crystal support assembly, a gluing device, and a slicing device. Background Art

[0002] Before slicing, the ingot needs to be secured to a specific-sized wafer tray before being transferred to a slicer. This process typically involves gluing the ingot to a plastic sheet, which is then glued to the wafer tray. This ensures a secure bond and prevents slicing from penetrating the ingot and damaging the wafer tray, potentially causing safety issues.

[0003] The existing ingot gluing process typically involves manually mixing glue to bond the plastic sheet and ingot. Glue is a fluid, and its bonding quality varies depending on temperature and humidity. Since both gluing steps are performed manually, the quality of the mixed glue, the amount of glue used, and its fluidity during curing can all affect the positioning accuracy of the ingot relative to the wafer tray. Since the wafer tray works in conjunction with the slicer, the bonding quality of the plastic sheet and ingot directly impacts the efficiency and quality of slicing. Manual operation can easily lead to uneven glue application, resulting in large variations in glue layer thickness. This results in ingot positioning accuracy failing to meet the requirements for precise slicing, often requiring rework of the gluing process, severely impacting slicing efficiency and progress. Utility Model Content

[0004] The present application provides a crystal support assembly, a gluing device and a slicing device to solve the problem in the prior art that the gluing of the crystal rod is affected by the artificial application of the glue layer, resulting in poor precision and stability after the crystal rod is fixed and cannot meet the slicing requirements.

[0005] On the first aspect, in some exemplary embodiments of the present application, a crystal support assembly is provided, which mainly includes a crystal support body and at least two glue limiting structures, wherein one side of the crystal support body is a placement plane for pasting a plastic plate; each of the glue limiting structures includes a first glue limiting surface and a second glue limiting surface arranged perpendicular to each other, and the two adjacent first glue limiting surfaces, two second glue limiting surfaces and the placement plane form a glue coating space.

[0006] In an exemplary embodiment of the present application, the glue limiting structure includes a first sliding rod and a second sliding rod that are slidably connected, the first glue limiting surface is provided on the first sliding rod, and the second glue limiting surface is provided on the second sliding rod.

[0007] In an exemplary embodiment of the present application, the glue limiting structure includes a sliding seat, the first sliding rod is fixedly connected to the sliding seat, and the sliding seat is slidably connected to the crystal support body.

[0008] In an exemplary embodiment of the present application, the sliding seat is provided with a sliding block, and sliding rails adapted to the sliding block are respectively provided on both sides of the crystal support body.

[0009] In an exemplary embodiment of the present application, the first sliding rod is provided with a slideway, and one end of the second sliding rod is provided with a sliding block, and the sliding block is slidably connected to the slideway.

[0010] In an exemplary embodiment of the present application, a clamping groove is provided at one end of the second sliding rod away from the sliding block, and the sliding block can be clamped and fixed to the clamping groove.

[0011] In an exemplary embodiment of the present application, the second sliding rod is telescopic along its length.

[0012] In an exemplary embodiment of the present application, the second sliding rod includes a first telescopic shell, a second telescopic shell and a third telescopic shell which are sequentially mounted, and the bottom surfaces of the first telescopic shell, the second telescopic shell and the third telescopic shell are all in contact with the placement plane.

[0013] In a second aspect, some exemplary embodiments of the present application provide a gluing device, which includes the above-mentioned crystal support assembly.

[0014] In a third aspect, some exemplary embodiments of the present application provide a slicing device, which includes the wafer support assembly as described above.

[0015] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0016] The embodiments of the present application provide a crystal support assembly, a gluing device, and a slicing device, wherein the crystal support assembly mainly includes: a crystal support body and at least two glue limiting structures, one side of the crystal support body is a placement plane for pasting a plastic plate; each glue limiting structure includes a first glue limiting surface and a second glue limiting surface arranged perpendicular to each other, and the two adjacent first glue limiting surfaces, the two second glue limiting surfaces, and the placement plane form a glue coating space. The glue coating space can be formed into a single-opening space, which is convenient for forming five-sided limits after the glue is introduced. The glue thickness can be directly controlled by the amount of glue, and the glue will not overflow. It can be adjusted according to the circumferential size of the plastic plate and the crystal rod, so that the glue and its contact surface have the greatest effective contact, thereby increasing the bonding degree after bonding. At the same time, the glue is restricted by the five surfaces and will not overflow, that is, the amount of glue is sufficient to form a certain thickness of glue layer. The thickness and uniformity of the colloid within a limited area can be effectively controlled, thereby avoiding the situation where the thickness of the glue layer is uneven and affects the bonding effect. At the same time, the thickness accuracy of the glue layer in the thickness direction after the plastic plate is bonded is controllable, so that the position accuracy of the plastic plate is reliable and has a high flatness, providing position accuracy after the crystal rod is bonded, reducing the leveling work required due to glue thickness error before slicing, and is conducive to improving slicing efficiency. The present application effectively solves the problem in the prior art that the glue of the crystal rod is affected by the artificial application of the glue layer, resulting in poor accuracy and stability after the crystal rod is fixed, which cannot meet the slicing requirements.

[0017] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a crystal support assembly provided in an embodiment of the present application is shown;

[0022] Figure 2Shown Figure 1 A schematic diagram of the left side of the wafer support assembly;

[0023] Figure 3 Shown Figure 1 A schematic left side view of the crystal tray main body of the crystal tray assembly;

[0024] Figure 4 Shown Figure 1 A schematic diagram of the three-dimensional structure of the second sliding rod of the crystal support assembly;

[0025] Figure 5 Shown Figure 1 Schematic diagram of the three-dimensional structure of the crystal support assembly after the first sliding rod and the sliding seat are assembled.

[0026] The above drawings contain the following reference numerals:

[0027] 10. Crystal holder body; 11. Placement plane; 12. Sliding track; 13. Limit block; 20. Glue limiting structure; 21. First glue limiting surface; 22. Second glue limiting surface; 23. First sliding rod; 231. Slideway; 24. Second sliding rod; 241. Sliding block; 242. Clamping groove; 243. First telescopic shell; 244. Second telescopic shell; 245. Third telescopic shell; 25. Sliding seat; 251. Sliding block; 252. Inner slide groove; 30. Glue application space. DETAILED DESCRIPTION

[0028] The specific embodiments of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application and not all embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0031] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] In the present invention, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0034] In this utility model, the concept of "generally" describes the main characteristics of an overall structure or shape. When describing the shape of an object, this means that the object primarily exhibits a specific shape, but may vary in non-functional details. These detailed differences do not affect the overall characteristics and can therefore be classified as "generally" a certain shape. For example, when describing a round object, the expression "generally round" means that the object's overall shape is round, but there are differences in certain non-functional details. Similarly, when describing a cube, the expression "generally cubic" means that the object's overall shape is cubic, but there are differences in certain non-functional details.

[0035] First, as Figure 1 and Figure 2 As shown, an embodiment of the present application provides a crystal support assembly, which mainly includes a crystal support body 10 and at least two glue limiting structures 20. One side of the crystal support body 10 is a placement plane 11 for pasting a plastic plate; each glue limiting structure 20 includes a first glue limiting surface 21 and a second glue limiting surface 22 arranged perpendicular to each other, and the two adjacent first glue limiting surfaces 21, the two second glue limiting surfaces 22 and the placement plane 11 form a glue coating space 30.

[0036] The glue coating space 30 can be formed into a single-opening space, which is convenient for forming five-sided limits after the glue is introduced. The thickness of the glue can be directly controlled by the amount of glue, and the glue will not overflow. It can be adjusted according to the circumferential size of the plastic plate and the crystal rod, so that the glue and its contact surface have the greatest effective contact, thereby increasing the bonding degree after bonding. At the same time, the glue is restricted by the five surfaces and will not overflow, that is, the amount of glue is sufficient to form a certain thickness of glue layer. The thickness and uniformity of the colloid within a limited area can be effectively controlled, thereby avoiding the situation where the thickness of the glue layer is uneven and affects the bonding effect. At the same time, the thickness accuracy of the glue layer in the thickness direction after the plastic plate is bonded is controllable, so that the position accuracy of the plastic plate is reliable and has a high flatness, providing position accuracy after the crystal rod is bonded, reducing the leveling work required due to glue thickness error before slicing, and is conducive to improving slicing efficiency. The present application effectively solves the problem in the prior art that the glue of the crystal rod is affected by the artificial application of the glue layer, resulting in poor accuracy and stability after the crystal rod is fixed, which cannot meet the slicing requirements.

[0037] It should be noted that the first adhesive limiting surface 21 and the second adhesive limiting surface 22 are both planes. After a fixed adhesive layer is formed, the first adhesive limiting surface 21 and the second adhesive limiting surface 22 can be removed to avoid interference with slicing. At the same time, the setting of the plane makes the peripheral side of the adhesive layer perpendicular to the placement plane 11. When slicing, there will be no sudden change in resistance when the diamond wire cuts into the adhesive layer, which can effectively protect the diamond wire and reduce the risk of wire breakage.

[0038] In an optional embodiment, the depth of the glue coating space 30 is greater than the thickness of the plastic plate, so that after the plastic plate is installed, a second glue coating can be performed without removing the glue limiting structure 20 .

[0039] In an optional embodiment, the glue limiting structure 20 is provided with a lifting structure, and the first glue limiting surface 21 and the second glue limiting surface 22 can slide in a direction perpendicular to the placement plane 11, so that the first glue limiting surface 21 and the second glue limiting surface 22 can be aligned with the plastic plate, and a glue coating space for crystal rod bonding is formed on the plastic plate, which can adapt to the situation where the plane of the plastic plate is larger than the surface of the crystal rod.

[0040] like Figures 1 to 5 As shown, in one embodiment, the adhesive limiting structure 20 includes a first sliding rod 23 and a second sliding rod 24 that are slidably connected. The first adhesive limiting surface 21 is disposed on the first sliding rod 23, and the second adhesive limiting surface 22 is disposed on the second sliding rod 24. The first and second sliding rods 23 and 24 that can slide relative to each other achieve the coordination between the first adhesive limiting surface 21 and the second adhesive limiting surface 22. Taking the example of the first adhesive limiting surface 21 being adapted to the width of the crystal ingot and the second adhesive limiting surface 22 being adapted to the length of the crystal ingot, the above arrangement can adjust the actual effective area of ​​the first adhesive limiting surface 21 to adapt to crystal ingots of different widths. This arrangement has high adaptability and can meet the requirements for slicing crystal ingots of different sizes.

[0041] like Figures 1 to 4 as well as Figure 5 As shown, in one embodiment, the adhesive limiting structure 20 includes a sliding seat 25, a first sliding rod 23 is fixedly connected to the sliding seat 25, and the sliding seat 25 is slidably connected to the crystal support body 10. This arrangement is used to adjust the position of the second adhesive limiting surface 22 to accommodate crystal ingots of different lengths.

[0042] In the above embodiment, the sliding seat 25 and the crystal support body 10 are slidably connected to each other in a structure other than a slide rail or a slide groove, and may also be a transmission structure such as a lead screw or a threaded pair.

[0043] like Figures 1 to 4 as well as Figure 5 As shown, in one embodiment, the sliding seat 25 is provided with a sliding block 251 , and both sides of the crystal holder body 10 are respectively provided with sliding rails 12 adapted to the sliding block 251 .

[0044] This arrangement allows the sliding seat 25 to slide relative to the wafer support body 10, creating a relatively stable and highly precise sliding direction arrangement, which is beneficial to the stability of the sliding seat 25. The sliding seat 25 can be connected to one end of the sliding track 12, so that the sliding block 251 slides with the sliding track 12. This facilitates the disassembly of the sliding seat 25. After gluing is completed, the wafer support body 10 and the sliding seat 25 can be directly separated, which can prevent interference and wear on the diamond wire used in the slicing process.

[0045] like Figure 3 As shown, in one embodiment, a through slot is provided on the sliding block 251, and the cross section of the sliding track 12 is adapted to the cross section of the through slot. The sliding is performed on the sliding track 12 by utilizing the through slot.

[0046] like Figure 3 As shown, in one embodiment, along the cross section of the sliding track 12, the crystal support body 10 extends outward a connecting arm with a rod-shaped cross section, and different blocks extend from both sides of the connecting arm and at one end away from the crystal support body 10 in the upward and downward directions respectively, and the lengths in the direction away from the crystal support body 10 are different.

[0047] The above-mentioned setting enables two limiting structures to be formed on the sliding track 12. The limiting structure cooperates with the connecting arm to form the sliding track 12, and the through groove of the sliding block 251 can be roughly divided into two cavities. The upper cavity is adapted to the block extending upward, and the lower cavity is adapted to the block extending downward. Since the lengths of the blocks in the direction away from the crystal support body 10 are different, the upper and lower cavities are respectively connected with the corresponding blocks. This setting increases the degree of combination between the sliding track 12 and the sliding block 251, and lateral falling off will not occur.

[0048] It should be noted that the opening of the through slot facing the crystal holder body is adapted to the thickness of the connecting arm, so that a complete engagement can be formed, so that the sliding block 251 and the sliding rail 12 have only a degree of freedom along their length direction.

[0049] In an optional embodiment, the edges of the blocks at both ends of the sliding track 12 are provided with chamfers, and the chamfers facilitate guiding the installation of the sliding blocks 251 .

[0050] In an optional embodiment, the length of the card block located above the connecting arm is greater than that of the card block below. The card block located above can provide a larger span and mating surface for the upper cavity of the through slot. The snap-fit ​​fit between the two can increase the connection strength. The card block located below and the lower cavity of the through slot only serve as a limit, and no connection strength is required.

[0051] It can be understood that the arrangement of the through groove makes the structural strength and stability of the lower part higher than that of the upper part, which is more suitable for this scenario.

[0052] like Figure 1 、 Figure 4 and Figure 5 As shown, in one embodiment, the first sliding rod 23 is provided with a slide 231, and one end of the second sliding rod 24 is provided with a sliding block 241, which is slidably connected to the slide 231. The sliding block 241 is provided to adapt to the slide 231 to enable the first sliding rod 23 to slide relative to the second sliding rod 24.

[0053] In an optional embodiment, the sliding block 241 is a block on a connecting arm extending outward from one end of the second sliding rod 24, and the slide 231 is adapted to the connecting arm and the block, so that a limit perpendicular to the slide 231 can be formed, so that the second sliding rod 24 can slide accurately along the slide 231.

[0054] like Figure 1 、 Figure 4 and Figure 5 As shown, in one embodiment, a snap-in slot 242 is provided at one end of the second sliding rod 24 away from the sliding block 241, and the sliding block 241 can be snap-fitted into the snap-in slot 242. The combination of the sliding block 241 and the snap-in slot 242 allows one or more second sliding rods 24 to be added in the longitudinal direction to accommodate crystal ingots of different lengths.

[0055] It is understandable that in the preparatory work of slicing, that is, the crystal pulling work, there are crystal rods whose pulled length does not meet the standard length. Therefore, the corresponding gluing process may need to adapt to crystal rods of different lengths.

[0056] Specifically, the number of second sliding rods 24 is first adjusted to match the length of the plastic sheet before bonding the plastic sheet. The positions of the second sliding rods 24 are then adjusted to accommodate crystal ingots of different lengths, and the adhesive is applied and bonded to the ingots in sequence. This approach results in better bonding, higher quality adhesive bonding, and reduced glue usage.

[0057] like Figure 4 As shown, in one embodiment, the second sliding rod 24 can be extended and retracted along its length. Such an arrangement can adjust the length of the second sliding rod 24 in a small range, and a large range of adjustment can be achieved by adding a second sliding rod 24.

[0058] In some optional embodiments, the ratio between the adjustment range of the second sliding rod 24 and the maximum length of the second sliding rod 24 is less than 50%. Such a facility makes the minimum adjustment range after the two second sliding rods 24 are connected less than the maximum length direction of the second sliding rod 24. That is, such a setting makes the adjustment range of multiple second sliding rods 24 can meet a length greater than the maximum length of the second sliding rod 24, that is, it can meet any length greater than the maximum length of the second sliding rod 24, and the adjustment is more convenient.

[0059] like Figure 4 As shown, in one embodiment, the second sliding rod 24 includes a first telescopic shell 243, a second telescopic shell 244, and a third telescopic shell 245, which are sequentially mounted. The bottom surfaces of the first telescopic shell 243, the second telescopic shell 244, and the third telescopic shell 245 all conform to the placement plane 11. This arrangement allows the second sliding rod 24 to be telescopic along its length, with its adjustment range limited to the longest telescopic shell section.

[0060] It can be understood that the side surfaces of the telescopic shells are all second adhesive limiting surfaces 22, and the adhesive limiting surfaces between adjacent telescopic shells are distributed in a stepped manner. When in use, the second adhesive limiting surface 22 on the third telescopic shell 245 can be matched with the plastic plate or crystal rod.

[0061] The bottom surfaces of the first telescopic shell 243, the second telescopic shell 244 and the third telescopic shell 245 are all in contact with the placement plane 11 to prevent the glue from overflowing. This is equivalent to the first telescopic shell 243, the second telescopic shell 244 and the third telescopic shell 245 being U-shaped shells, whose opening directions coincide with the placement plane 11.

[0062] Elastic connecting parts are provided between the first telescopic shell 243 and the second telescopic shell 244, as well as between the second telescopic shell 244 and the third telescopic shell 245, which apply thrust to the adjacent two respectively, so that the first telescopic shell 243, the second telescopic shell 244 and the third telescopic shell 245 are more tightly combined. Through the provision of the elastic connecting parts, the first telescopic shell 243, the second telescopic shell 244 and the third telescopic shell 245 are kept in an extended style, so that the cooperation on both sides of the second sliding rod 24 can be tighter to avoid overflow of glue.

[0063] In a second aspect, some embodiments of the present application further provide a gluing device, the gluing device including a wafer support assembly as described in any of the above embodiments. The beneficial effects of the wafer support assembly are described in the above embodiments and will not be repeated here.

[0064] It should be noted that the first glue limiting surface 21 and the second glue limiting surface 22 on the crystal support assembly can be combined with the output structure of the gluing device to automatically adjust the positions of the first glue limiting surface 21 and the second glue limiting surface 22, thereby meeting the functions of automatic positioning and gluing.

[0065] In a third aspect, some embodiments of the present application further provide a slicing device, comprising a wafer support assembly as described in any of the above embodiments. The beneficial effects of the wafer support assembly are described in the above embodiments and will not be repeated here.

[0066] It should be noted that one or more limit blocks 13 are provided on the side of the pedestal body 10 away from the placement plane 11 . The limit blocks 13 are used to adapt to the positioning structure in the slicing device to provide position accuracy after the crystal rod enters the slicing device.

[0067] The above are merely optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application. Although the embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and cannot be understood as limiting the present invention. Those skilled in the art may make changes, modifications, replacements, and variations to the above embodiments within the scope of the present invention.

Claims

1. A crystal support assembly, characterized in that: include: A crystal support body (10), one side of the crystal support body (10) being a placement plane (11) for attaching a plastic plate; At least two glue limiting structures (20), each of the glue limiting structures (20) comprises a first glue limiting surface (21) and a second glue limiting surface (22) arranged perpendicular to each other, and the two adjacent first glue limiting surfaces (21), the two second glue limiting surfaces (22) and the placement plane (11) enclose a glue coating space (30).

2. The crystal support assembly according to claim 1, wherein: The adhesive limiting structure (20) comprises a first sliding rod (23) and a second sliding rod (24) that are slidably connected, the first adhesive limiting surface (21) is arranged on the first sliding rod (23), and the second adhesive limiting surface (22) is arranged on the second sliding rod (24).

3. The crystal support assembly according to claim 2, wherein: The glue limiting structure (20) comprises a sliding seat (25), the first sliding rod (23) is fixedly connected to the sliding seat (25), and the sliding seat (25) is slidably connected to the crystal support body (10).

4. The crystal support assembly according to claim 3, characterized in that: The sliding seat (25) is provided with a sliding block (251), and both sides of the crystal support body (10) are respectively provided with sliding rails (12) adapted to the sliding block (251).

5. The crystal support assembly according to claim 2, wherein: The first sliding rod (23) is provided with a slideway (231), and one end of the second sliding rod (24) is provided with a sliding block (241), and the sliding block (241) is slidably connected to the slideway (231).

6. The crystal support assembly according to claim 5, characterized in that: A clamping groove (242) is provided at one end of the second sliding rod (24) away from the sliding block (241), and the sliding block (241) and the clamping groove (242) can be clamped and fixed.

7. The crystal support assembly according to claim 2, characterized in that: The second sliding rod (24) is retractable along its length.

8. The crystal support assembly according to claim 7, characterized in that: The second sliding rod (24) includes a first telescopic shell (243), a second telescopic shell (244) and a third telescopic shell (245) which are sequentially mounted, and the bottom surfaces of the first telescopic shell (243), the second telescopic shell (244) and the third telescopic shell (245) are all in contact with the placement plane (11).

9. A gluing device, characterized in that: The gluing device includes the crystal support assembly according to any one of claims 1 to 8.

10. A slicing device, characterized in that: The slicing device includes the wafer support assembly according to any one of claims 1 to 8.

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