Light wave sensor chip

Abstract

The utility model discloses a light wave sensor chip, which relates to the field of sensors and comprises a shell, a window is arranged at the top of the shell, a first base material and a second base material are arranged below the window, a first reflecting layer is arranged on the lower surface of the first base material, and a second reflecting layer is arranged on the upper surface of the second base material. A middle layer is arranged between the first reflecting layer and the second reflecting layer; light waves enter the base material through the window and form resonance in the middle layer under the reflection of the first reflecting layer and the second reflecting layer, and the light waves are filtered; according to the utility model, the F-P cavity structure is constructed in a film coating manner, and the filtering function is realized, so that the detection precision of the optical sensor is improved; the realization technology is mature and reliable, and further research and popularization in the optical communication field are facilitated.

Description

Technical Field

[0001] The utility model belongs to the field of sensors, and more specifically, relates to a light wave sensor chip. Background Art

[0002] Lightwave sensors are primarily used to detect changes in lightwave signals, thereby sensing and measuring changes in various physical, chemical, and biological quantities. Lightwave sensors analyze various parameters of the external environment by detecting changes in characteristic lightwave parameters (such as intensity, wavelength, frequency, phase, and polarization state).

[0003] Common light wave sensors on the market usually include a substrate and related reflective layers. When the light wave sensor needs to have a wider adjustable range, a thinner substrate is required. As the substrate becomes thinner, it is prone to deformation during processing. When the adjustable range is required to increase further to only tens of microns or even a few microns, the difficulty of substrate processing increases sharply and may even become impossible to process.

[0004] Therefore, it is urgent to design new light wave sensors to solve the above problems. Utility Model Content

[0005] The purpose of the present invention is to provide a light wave sensor chip to overcome the defects in the above-mentioned prior art.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A housing, wherein a window is formed on the top of the housing, a first substrate and a second substrate are disposed below the window, a first reflective layer is disposed on the lower surface of the first substrate, a second reflective layer is disposed on the upper surface of the second substrate, and an intermediate layer is disposed between the first reflective layer and the second reflective layer;

[0008] The light waves enter the substrate through the window, and after being reflected by the first reflecting layer and the second reflecting layer, the light waves resonate in the middle layer, thereby filtering the light waves.

[0009] As an improvement of the optical wave sensor chip described in the present invention, the intermediate layer is made of a heat-sensitive material. By changing the ambient temperature of the intermediate layer, the thickness of the intermediate layer can be adjusted to adjust the filtering range of the optical wave passing through the substrate.

[0010] As an improvement of the optical wave sensor chip described in the present invention, it further includes a temperature regulating device, which is arranged on the middle layer, and the thickness of the middle layer can change with temperature.

[0011] As an improvement of the optical wave sensor chip described in the present invention, the temperature regulating device includes an electric heating device or a semiconductor cooling plate device.

[0012] As an improvement of the optical wave sensor chip described in the present invention, the first reflection layer and the second reflection layer are Al, Au or Ag metal films plated with MgF2 or CaF2.

[0013] As an improvement of the optical wave sensor chip described in the present invention, the first reflection layer and the second reflection layer are Bragg reflection layers composed of MgO, Ta2O5 or Al2O3 thin films.

[0014] As an improvement of the optical wave sensor chip described in the present invention, the housing is a cylindrical barrel.

[0015] A method for manufacturing a lightwave sensor chip, characterized by comprising the following steps:

[0016] Substrate pretreatment: polishing the lower surface of the first substrate and the upper surface of the second substrate;

[0017] A first coating is performed on the polished surface of the first substrate to form a first reflective layer; the first reflective layer is an anti-reflective layer relative to the first substrate;

[0018] A second coating is performed on the polished surface of the second substrate to form a second reflective layer; the second reflective layer is a reflective layer relative to the first reflective layer;

[0019] A heat-sensitive material is filled in the gap between the first reflective layer and the second reflective layer as an intermediate layer.

[0020] Compared with the prior art, the advantages of the present invention are:

[0021] This utility model utilizes a housing with a window at the top. Below the window, a first substrate and a second substrate are disposed. A first reflective layer is disposed on the lower surface of the first substrate, and a second reflective layer is disposed on the upper surface of the second substrate. An intermediate layer is disposed between the first and second reflective layers. Light waves enter the substrate through the window and, upon reflection from the first and second reflective layers, resonate in the intermediate layer, filtering the light waves. This utility model utilizes a coating method to construct an FP cavity structure, achieving filtering and thus improving the detection accuracy of the optical sensor. This utility model is ingeniously designed and features a mature and reliable process, facilitating further research and advancement in the field of optical communications.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the description, the following preferred embodiments of the present invention are described in detail with reference to the accompanying drawings. The specific implementation methods of the present invention are given in detail by the following embodiments and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic structural diagram of a light wave sensor chip according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic cross-sectional view of the optical wave sensor chip according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic flow chart of a method for manufacturing a light wave sensor chip according to an embodiment of the present invention;

[0027] Among them, 1. shell; 2. window; 3. first substrate; 31. first reflective layer; 4. second substrate; 41. second reflective layer; 5. middle layer; 6. temperature control device. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Example 1

[0030] See also Figure 1-2 The utility model provides a technical solution: a light wave sensor chip, comprising: a housing 1, a window 2 is opened on the top of the housing, a first substrate 3 and a second substrate 4 are arranged below the window 2, a first reflection layer 31 is arranged on the lower surface of the first substrate 3, a second reflection layer 41 is arranged on the upper surface of the second substrate 4, and an intermediate layer 5 is arranged between the first reflection layer 3 and the second reflection layer 4.

[0031] In this embodiment, the first substrate 3 and the second substrate 4 serve as the basis for structural support and can be made of transparent materials, such as glass. Light waves enter the substrate through the window and are reflected by the first reflective layer 31 and the second reflective layer 41, whereupon the light waves resonate in the intermediate layer 5, thereby filtering the light waves. It should be noted that the first reflective layer 31, the second reflective layer 41, and the intermediate layer 5 form a Fabry-Perot interference filter cavity. In this embodiment, the intermediate layer 5 is a heat-sensitive material. By changing the ambient temperature of the intermediate layer 5, the thickness of the intermediate layer 5 can be adjusted to adjust the filtering range of the light waves passing through the substrate.

[0032] The housing 1 also includes a temperature control device 6 disposed within the intermediate layer 5. The thickness of the intermediate layer 5 can vary with temperature. The temperature control device 6 may include an electric heating device or a semiconductor refrigeration device. The first and second reflective layers 31 and 32 are aluminum, Au, or Ag metal films coated with MgF2 or CaF2. The first and second reflective layers 31 and 32 are Bragg reflectors composed of MgO, Ta2O5, or Al2O3 films. The housing 1 is cylindrical.

[0033] Example 2

[0034] like Figure 3 As shown, a method for manufacturing a light wave sensor chip is characterized by comprising the following steps:

[0035] S1, substrate pretreatment, polishing the lower surface of the first substrate 3 and the upper surface of the second substrate 4;

[0036] S2, a first coating is performed on the polished surface of the first substrate 3 to form a first reflective layer 31; the first reflective layer 31 is an anti-reflective layer relative to the first substrate 3;

[0037] S3, a second coating is performed on the polished surface of the second substrate 4 to form a second reflective layer 41; the second reflective layer 41 is a reflective layer relative to the first reflective layer 31;

[0038] S4 , filling the gap between the first reflective layer 31 and the second reflective layer 41 with a heat-sensitive material as the intermediate layer 5 .

[0039] It should be noted that the first coating and the second coating belong to optical coating processes, which include but are not limited to vacuum coating methods and chemical coating; the coating materials include elemental coating (such as metal elements, silicon) and compound coating (such as metal oxides, fluorides); therefore, there should be no misunderstanding of the technical methods or unclear scope of protection of the coating process.

[0040] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A light wave sensor chip, characterized in that: include: A housing, wherein a window is formed on the top of the housing, a first substrate and a second substrate are disposed below the window, a first reflective layer is disposed on the lower surface of the first substrate, a second reflective layer is disposed on the upper surface of the second substrate, and an intermediate layer is disposed between the first reflective layer and the second reflective layer; The light waves enter the substrate through the window, and after being reflected by the first reflective layer and the second reflective layer, the light waves resonate in the intermediate layer, thereby filtering the light waves.

2. The optical wave sensor chip according to claim 1, characterized in that: The intermediate layer is a heat-sensitive material. By changing the ambient temperature of the intermediate layer, the thickness of the intermediate layer can be adjusted to adjust the filtering range of the light waves passing through the substrate.

3. The optical wave sensor chip according to claim 2, characterized in that: It also includes a temperature regulating device, which is arranged on the middle layer, and the thickness of the middle layer can change with temperature.

4. The optical wave sensor chip according to claim 3, characterized in that: The temperature regulating device includes an electric heating device or a semiconductor refrigeration device.

5. The optical wave sensor chip according to claim 1, characterized in that: The first reflective layer and the second reflective layer are Al, Au or Ag metal films plated with MgF2 or CaF2.

6. The optical wave sensor chip according to claim 1, characterized in that: The first reflection layer and the second reflection layer are Bragg reflection layers composed of MgO, Ta2O5 or Al2O3 thin films.

7. The optical wave sensor chip according to claim 1, characterized in that: The shell is a cylindrical barrel.

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