Radiation detector module, radiation detector, and imaging apparatus

Abstract

The embodiment of the utility model provides a radiation detector module, a radiation detector and imaging equipment. The radiation detector module comprises a radiation detector element which receives rays emitted by a radiation source and converts the rays into electric signals; a circuit substrate, a first side of which is provided with the radiation detector element; and a processing circuit chip disposed on a second side of the substrate and in communication with the radiation detector element. In the radiation detector module, the radiation detector element and the processing circuit chip are respectively arranged on different sides of the circuit substrate, so that the packaging density of the radiation detector module is improved, the number of channels of the radiation detector module is further improved, the number of the radiation detector modules in the radiation detector is reduced, and the cost is reduced. And the interconnection complexity between the radiation detector modules and the overall cost of the radiation detector are reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of imaging devices, and in particular to a radiation detector module, a radiation detector, and an imaging device. Background Art

[0002] Imaging equipment is used to scan an examination object (such as a patient or a workpiece) in a non-invasive or non-destructive manner, thereby obtaining images of the internal structure of the anatomical tissue or part of interest of the examination object to assist in diagnosis.

[0003] An imaging device typically includes a circular scanning aperture for a subject to be scanned and examined to enter or exit, and a detector subsystem mounted along the entire circumference or a portion of the circular aperture. The detector subsystem includes multiple detector modules mounted on a gantry. For example, a computed tomography (CT) device is commonly used as a medical imaging device to scan a patient and obtain tomographic medical images of the patient's area of ​​interest to assist doctors in diagnosis.

[0004] The CT device includes a plurality of detector modules that receive X-rays emitted from the X-ray tube and passing through the patient. The shape and number of each detector module depend on clinical needs and the design of the CT system, and communication connections are established between each detector module. Each detector module of the CT device generally includes a pixelated scintillator and a photoelectric conversion device arranged in sequence along the direction of ray transmission. The scintillator is used to receive the X-rays passing through the patient and generate light, and the photoelectric conversion device (such as a photodiode) converts the light generated by the scintillator into an electrical signal. Each detector module also includes a collimator for collimating the X-rays passing through the patient to a specific direction to avoid or reduce interference between the pixels of the scintillator. Each detector module also includes a signal processing circuit for processing the electrical signal generated by the photoelectric conversion device, and a frame for supporting the collimator, scintillator, photoelectric conversion device, circuit board and heat dissipation device.

[0005] The CT device also includes a computer subsystem that reconstructs the processed electrical signals to generate medical tomographic images for auxiliary diagnosis.

[0006] It should be noted that the above introduction to the technical background is only intended to provide a clear and complete description of the technical solution of the present application and to facilitate understanding by those skilled in the art. Utility Model Content

[0007] The inventors found that traditional radiation detectors (e.g., CT detectors) include a large number of small detector modules, and the integration of the detector modules is low, resulting in a large number of interconnected lines between the detector modules. The alignment and integration of the detector modules require a long time, and the overall cost of the detector is high.

[0008] To address at least one of the above technical issues or other similar issues, embodiments of the present application provide a radiation detector module, a radiation detector, and an imaging device. In the radiation detector module, the radiation detector element and the processing circuit chip are disposed on different sides of a circuit substrate, thereby increasing the packaging density of the radiation detector module, thereby increasing the number of channels in the radiation detector module, reducing the number of radiation detector modules in the radiation detector, and reducing the complexity of interconnection between the radiation detector modules and the overall cost of the radiation detector.

[0009] According to one aspect of an embodiment of the present application, a radiation detector module is provided, comprising:

[0010] a radiation detector element that receives radiation emitted by a radiation source and converts the radiation into an electrical signal;

[0011] a circuit substrate having the radiation detector element mounted on a first side of the circuit substrate; and

[0012] A processing circuit chip is disposed on the second side of the substrate and communicates with the radiation detector element.

[0013] Therefore, in the radiation detector module, the radiation detector element and the processing circuit chip are respectively arranged on different sides of the circuit substrate, thereby improving the packaging density of the radiation detector module, thereby increasing the number of channels of the radiation detector module and reducing the number of radiation detector modules in the radiation detector.

[0014] In some embodiments, one or more processing circuit chips are disposed within the area of ​​the circuit substrate covered by each of the radiation detector elements.

[0015] In some embodiments, each of the radiation detector elements includes 16 ray transmission channels arranged in the first direction.

[0016] In some embodiments, the radiation detector module includes an even number of the radiation detector elements arranged in a first direction.

[0017] In some embodiments, the radiation detector element is electrically connected to the processing circuit chip via a conductive path passing through the circuit substrate.

[0018] In some embodiments, the radiation detector element includes a scintillator and a photoelectric conversion element. The scintillator receives radiation and generates light. The photoelectric conversion element converts the light generated by the scintillator into an electrical signal. The photoelectric conversion element includes a backlit photodiode.

[0019] In some embodiments, the radiation detector module has a flat panel form factor.

[0020] In some embodiments, the radiation detector module further comprises:

[0021] A radiation shielding member disposed at at least one of the following locations:

[0022] the interior of the circuit substrate;

[0023] the interior of the processing circuit chip;

[0024] between the processing circuit chip and the circuit substrate.

[0025] In some embodiments, the radiation shielding component is provided between the processing circuit chip and the circuit substrate:

[0026] The lead terminals of the processing circuit chip are electrically connected to the circuit substrate via leads; or,

[0027] The shielding component has a plurality of through holes, and the processing circuit chip is electrically connected to the circuit substrate through the through holes.

[0028] In some embodiments, the processing circuit chip has a radiation-hardened circuit.

[0029] In some embodiments, the radiation detector module further comprises:

[0030] The data collection circuit board is electrically connected to the circuit substrate through a wire and receives the data processed by the processing circuit chip.

[0031] In some embodiments, the conductive wires are connected to an edge of the circuit substrate.

[0032] In some embodiments, the radiation detector module further comprises:

[0033] A heat dissipation component is at least partially disposed between the processing circuit chip and the data collection circuit board, and is thermally coupled to both the processing circuit chip and the data collection circuit board.

[0034] In some embodiments, the radiation detector module further comprises:

[0035] A collimator assembly is arranged on the surface of the radiation detector element, and the collimator assembly collimates the radiation emitted from the radiation source to the radiation detector element.

[0036] In some embodiments, the material of the circuit substrate includes at least one of the following materials:

[0037] Flame retardant Class 4 (FR4) material, Ajinomoto laminate film (ABF), bismaleimide triazine (BT).

[0038] According to another aspect of the embodiments of the present application, a radiation detector is further provided, comprising:

[0039] A guide rail and two or more radiation detector modules according to any one of the above embodiments supported on the guide rail.

[0040] In some embodiments, in the radiation detector, two or more radiation detector modules are arranged along the first direction in which the guide rail extends, wherein the number of the radiation detector modules is 3 to 15.

[0041] According to another aspect of an embodiment of the present application, an imaging device is provided, which has the radiation detector described in the above embodiment and an image reconstruction device, and the image reconstruction device performs image reconstruction based on the electrical signal generated by the radiation detector element in the radiation detector module of the radiation detector to generate a tomographic imaging of the inspection object.

[0042] With reference to the following description and drawings, specific implementations of the embodiments of the present application are disclosed in detail, indicating how the principles of the embodiments of the present application can be employed. It should be understood that the embodiments of the present application are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present application include many variations, modifications, and equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other implementation methods can be obtained based on these drawings without inventive work. In the drawings:

[0044] Figure 1 is a schematic diagram of a CT device according to an embodiment of the present application;

[0045] Figure 2 is a schematic diagram of a CT imaging system according to an embodiment of the present application;

[0046] Figure 3 is a schematic diagram of a cross section of a radiation detector module observed along the Z direction;

[0047] Figure 4 is a schematic diagram of the distribution of radiation detector elements in a radiation detector module;

[0048] Figure 5 is a schematic diagram of the distribution of processing circuit chips in a radiation detector module;

[0049] Figure 6 is another schematic diagram of a cross section of a radiation detector module viewed along the Z direction;

[0050] Figure 7 is another schematic diagram of a cross section of a radiation detector module viewed along the Z direction;

[0051] Figure 8 is another schematic diagram of a cross section of a radiation detector module viewed along the Z direction;

[0052] Figure 9 is a three-dimensional assembly diagram of a radiation detector module according to an embodiment of the present application;

[0053] Figure 10 is a three-dimensional schematic diagram of a radiation detector module according to an embodiment of the present application;

[0054] Figure 11 is another perspective schematic diagram of a radiation detector module according to an embodiment of the present application;

[0055] Figure 12 is a three-dimensional schematic diagram of a radiation detector according to an embodiment of the present application;

[0056] Figure 13 It is a schematic diagram of a component of an imaging device. DETAILED DESCRIPTION

[0057] The foregoing and other features of the embodiments of the present application will become apparent through the following description with reference to the accompanying drawings. In the description and drawings, specific embodiments of the present application are disclosed in detail, which illustrate some embodiments in which the principles of the embodiments of the present application can be adopted. It should be understood that the present application is not limited to the described embodiments. On the contrary, the embodiments of the present application include all modifications, variations and equivalents that fall within the scope of the appended claims.

[0058] In the embodiments of the present application, the terms "first", "second", etc. are used to distinguish different elements from the name, but do not indicate the spatial arrangement or temporal order of these elements, and these elements should not be limited by these terms. The term "and / or" includes any one and all combinations of one or more of the associated listed terms. The terms "comprising", "including", "having", etc. refer to the presence of the stated features, elements, components or components, but do not exclude the presence or addition of one or more other features, elements, components or components.

[0059] In the embodiments of this application, the singular forms "a," "the," etc. include plural forms and should be broadly understood to mean "a" or "a type" rather than being limited to "one." Furthermore, the term "said" should be understood to include both singular and plural forms, unless the context clearly indicates otherwise. Furthermore, the term "according to" should be understood to mean "at least in part based on...", and the term "based on" should be understood to mean "at least in part based on...", unless the context clearly indicates otherwise.

[0060] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments. The term "include / comprise" as used herein refers to the presence of a feature, an integral part, a step, or a component, but does not exclude the presence or addition of one or more other features, integral parts, steps, or components.

[0061] In each embodiment of the present application, "above" and "below" include the number itself. For example, "above two" includes two and more than two, and "below two" includes two and less than two.

[0062] The medical imaging device described in this application can be applicable to various medical imaging modalities, including but not limited to CT (computed tomography) imaging equipment, PET (positron emission tomography)-CT, or any other suitable medical imaging equipment.

[0063] The system for obtaining medical imaging data may include the aforementioned medical imaging device, a separate computer device connected to the medical imaging device, or a computer device connected to an internet cloud, wherein the computer device is connected to the medical imaging device or a storage device storing medical images via the internet. The imaging method may be performed independently or in combination by the aforementioned medical imaging device, the computer device connected to the medical imaging device, or the computer device connected to the internet cloud. For example, the system for obtaining medical imaging data may be a CT imaging system, etc.

[0064] For example, the following describes the embodiments of the present application in conjunction with an X-ray computed tomography (CT) imaging device. Those skilled in the art will appreciate that the embodiments of the present application may also be applicable to other medical imaging devices.

[0065] Figure 1 FIG. 1 is a schematic diagram of a CT device according to an embodiment of the present application, schematically illustrating the CT device 100. Figure 1As shown, CT apparatus 100 includes a scanning gantry 101 and a patient table 102. The scanning gantry 101 has an X-ray source 103 that projects an X-ray beam toward a detector assembly or collimator 104 on the opposite side of the scanning gantry 101. A subject 105 can lie flat on the patient table 102 and move into a scanning gantry opening 106 along with the patient table 102. Medical imaging data of the subject 105 can be obtained through scanning by the X-ray source 103.

[0066] Figure 2 FIG is a schematic diagram of a CT imaging system according to an embodiment of the present application, schematically showing a block diagram of a CT imaging system 200. Figure 2 As shown, the detector assembly 104 includes a plurality of detector units 104 a and a data acquisition system (DAS) 104 b . The plurality of detector units 104 a sense the projected X-rays that pass through the inspection object 105 .

[0067] The DAS 104b converts the collected information into projection data for subsequent processing based on the sensing of the detector unit 104a. During a scan to acquire X-ray projection data, the scanning gantry 101 and the components mounted thereon rotate around the rotation center 101c.

[0068] The rotation of the gantry 101 and the operation of the X-ray source 103 are controlled by a control mechanism 203 of the CT imaging system 200. The control mechanism 203 includes an X-ray controller 203a, which provides power and timing signals to the X-ray source 103, and a gantry motor controller 203b, which controls the rotational speed and position of the gantry 101. An image reconstruction device 204 receives projection data from the DAS 104b and performs image reconstruction. The reconstructed image is transmitted as input to a computer 205, which stores the image in a mass storage device 206.

[0069] The computer 205 also receives commands and scan parameters from an operator via a console 207. The console 207 has some form of operator interface, such as a keyboard, mouse, voice activated controller, or any other suitable input device. An associated display 208 allows the operator to observe the reconstructed image and other data from the computer 205. The commands and parameters provided by the operator are used by the computer 205 to provide control signals and information to the DAS 104b, the x-ray controller 203a, and the scan gantry motor controller 203b. In addition, the computer 205 operates the patient table motor controller 209, which controls the patient table 102 to position the subject 105 and the scan gantry 101. In particular, the patient table 102 moves the subject 105, in whole or in part, through the scan gantry 101. Figure 1 The scanning gantry opening 106 is provided.

[0070] The above schematically illustrates the device and system for acquiring medical imaging data (or medical images or medical image data) according to an embodiment of the present application, but the present application is not limited thereto. The medical imaging device may be a CT device, a PET-CT device, or any other suitable imaging device. The storage device may be located within the medical imaging device, within a server external to the medical imaging device, within an independent medical imaging storage system (e.g., PACS, Picture Archiving and Communication System), and / or within a remote cloud storage system.

[0071] Furthermore, the medical imaging workstation can be located locally on the medical imaging device, meaning it can be located near the device. Both can be co-located in the examination room, the imaging department, or within the same hospital. The medical image cloud platform analysis system can be located remotely from the medical imaging device, for example, in a cloud-based environment that communicates with the device.

[0072] For example, after a medical institution completes an imaging scan using medical imaging equipment, the scanned data is stored in a storage device; a medical imaging workstation can directly read the scanned data and perform image processing through its processor. As another example, a medical image cloud platform analysis system can read medical images in a storage device via remote communication to provide "Software as a Service" (SaaS). SaaS can exist between hospitals, between hospitals and imaging centers, or between hospitals and third-party online diagnosis and treatment service providers.

[0073] The above schematically illustrates medical image scanning, and the following specifically describes the embodiments of the present application in conjunction with the accompanying drawings. In the following embodiments, the imaging device is described as a CT device, and the description is also applicable to other medical imaging devices.

[0074] In each embodiment of the present application: the X direction is, for example, Figure 1 Each point of the arc shown above points to the direction of the X-ray source 103, that is, the X direction Figure 1 The scanning gantry 101 or the patient table 102 shown is in the horizontal or left-right direction; the Y direction is, for example, Figure 1 The tangent direction of the arc centered on the X-ray source 103 shown in FIG. 1 may represent the extension trajectory of the guide rail 1201 described later. The Y direction is Figure 1 The vertical direction of the scanning gantry 101 or the patient table 102 shown; the Z direction is, for example, Figure 1 The direction in which the patient table 102 moves in or out relative to the scanning gantry opening 106 is shown, i.e., the Z direction. Figure 1The front-to-back direction of the scanning gantry 101 and the scanning gantry opening 106 , the Z direction, may also be referred to as a first direction.

[0075] Figure 3 This is a schematic diagram of the cross section of the radiation detector module observed along the Z direction. Figure 3 As shown, radiation detector module 300 includes a radiation detector element 301, a processing circuit chip 302, and a circuit substrate 303. Radiation detector module 300 may have a flat panel form factor. The flat panel form factor of a radiation detector module refers to a radiation receiving plane of the radiation detector module that receives radiation or faces a radiation source and is significantly larger than, or several times larger than, the dimension of the radiation detector module parallel to the radiation propagation path. For example, if the radiation receiving plane is rectangular, the length or width of the radiation detector module is significantly larger than its thickness.

[0076] The radiation detector element 301 receives radiation emitted by the radiation source and converts the radiation into an electrical signal.

[0077] In some examples, the radiation detector element 301 includes a scintillator 3011 and a photoelectric conversion element 3012. The scintillator 3011 and the photoelectric conversion element 3012 can be arranged correspondingly in the X-direction or the radiation direction of the X-rays. For example, the scintillator 3011 is closer to the radiation source than the photoelectric conversion element 3012. The scintillator 3011 receives the X-rays emitted by the X-ray source and generates light, such as visible light. The photoelectric conversion element 3012 receives the light generated by the scintillator 3011 and converts the received light into an electrical signal. The photoelectric conversion element 3012 can be a photodiode, such as a backlit photodiode.

[0078] In other examples, the radiation detector element 301 may not have the scintillator 3011. Thus, the radiation detector element 301 may directly receive radiation emitted by the radiation source and generate an electrical signal. The radiation detector element 301 may be a photon counting detector or a direct conversion detector.

[0079] In the present application, the electrical signal generated by the radiation detector element 301 (e.g., the electrical signal generated by the photoelectric conversion element 3012) is transmitted to the processing circuit chip 302 via the circuit substrate 303. The processing circuit chip 302 processes the received electrical signal. For example, if the electrical signal received by the processing circuit chip 302 is an analog signal, the processing circuit chip 302 converts the analog signal into a digital signal, that is, performs analog-to-digital conversion.

[0080] like Figure 3As shown, a radiation detector element 301 is mounted on a first side of the circuit substrate 303 (eg, the side facing the radiation source in the X direction), and a processing circuit chip 302 is mounted on a second side of the circuit substrate 303 (eg, the side away from the radiation source in the X direction).

[0081] The present application arranges the radiation detector element 301 and the processing circuit chip 302 on different sides of the circuit substrate 303, thereby improving the packaging density of the radiation detector module 300, thereby increasing the number of channels of the radiation detector module, and reducing the number of radiation detector modules in the radiation detector and the cost of the radiation detector.

[0082] like Figure 3 As shown, the radiation detector element 301 is electrically connected to the processing circuit chip 302 via a conductive via 3031 that penetrates the circuit substrate 303. For example, a through-hole can be formed in the circuit substrate 303 using technologies such as through-glass via (TGV) or through-ceramic via (TCV), and then filled with a conductive material to form the conductive via 3031. The conductive via 3031 that penetrates the circuit substrate 303 enables high-density interconnection between the photoelectric conversion element 3012 and the processing circuit chip 302. Furthermore, the conductive via 3031 shortens the electrical connection path between the photoelectric conversion element 3012 and the processing circuit chip 302, reducing radiation interference with the electrical signal transmitted in the electrical connection path, thereby improving the detection accuracy of the radiation detector module.

[0083] In at least one embodiment, the material of the circuit substrate 303 includes at least one of the following materials: flame retardant Class 4 (FR4) material, Ajinomoto laminated film (ABF), bismaleimide triazine (BT). Among them, the cost of flame retardant Class 4 (FR4) is lower; Ajinomoto laminated film (ABF) and bismaleimide triazine (BT) have better thermal expansion coefficients, which can achieve smaller warping and higher interconnection density. In the present application, the circuit substrate 303 uses materials such as FR4, ABF, and BT, which can achieve good flatness and interconnection reliability. In addition, the present application is not limited to this, and the circuit substrate 303 can also use other materials.

[0084] Figure 4 FIG. 1 is a schematic diagram of the distribution of radiation detector elements in a radiation detector module. Figure 4As shown, a plurality of radiation detector elements 301 are mounted on the first side of a circuit substrate 303. These radiation detector elements 301 may be arranged in an array. The radiation detector module 300 includes a plurality of radiation detector elements 301 arranged in columns in a first direction (i.e., the Z direction). Each radiation detector element 301 includes 16 rows or another even number of rows of radiation detector cells or pixels. For example, in the first direction, the radiation detector module 300 may include one, two, three, four, five, eight, or 16 radiation detector elements 301 per column. Accordingly, the radiation detector module 300 includes 16, 32, 48, 64, 80, 128, or 256 rows of radiation detector cells, respectively.

[0085] Figure 5 FIG. 1 is a schematic diagram of the distribution of processing circuit chips in a radiation detector module. Figure 5 As shown, on the second side of the circuit substrate 303, one or more processing circuit chips 302 are provided in the area covered by each radiation detector element 301. For example, two processing circuit chips 302 may be provided on the other side of the circuit substrate 303 area covered by each radiation detector element 301. The radiation detector element 301 may be connected to the circuit substrate 303 through a conductive path 3031 (e.g., Figure 3 ) is electrically connected to the corresponding processing circuit chip 302.

[0086] The present application sets the processing circuit chip 302 in the area covered by the corresponding radiation detector element 301, which can shorten the length of the electrical connection path between the radiation detector element 301 and the processing circuit chip 302, reduce the interference of the rays emitted by the radiation source on the electrical signal transmitted in the electrical connection path, and thus improve the detection accuracy of the radiation detector module 300.

[0087] like Figure 4 、 Figure 5 As shown, the circuit substrate 303 of the radiation detector module 300 has a relatively large flat plate shape. Three columns of radiation detector elements 301 and corresponding columns of processing circuit chips 302 are arranged on the circuit substrate 303 in the Y direction. Consequently, the radiation detector module 300 includes a greater number of radiation detector elements 301 and processing circuit chips 302 on a relatively large flat plate-shaped circuit substrate 303, thereby increasing the integration density of the radiation detector module 300 and correspondingly reducing the cost of the radiation detector module 300. In other embodiments, the circuit substrate 303 may include one, two, or more than three columns of radiation detector elements 301 and corresponding columns of processing circuit chips 302 in the Y direction, thereby providing greater flexibility in manufacturing and cost.

[0088] like Figure 3 As shown, in some embodiments, the radiation detector module 300 may further include a data collection circuit board 304. The data collection circuit board 304 is electrically connected to the circuit substrate 303 via a wire 305, which is connected to an edge of the circuit substrate 303. The signal (e.g., a digital signal) processed by the processing circuit chip 302 is transmitted to the data collection circuit board 304 via the wire 305.

[0089] like Figure 3 As shown, in some embodiments, the radiation detector module 300 may further include a heat sink 308, which is at least partially disposed between the processing circuit chip 302 and the data collection circuit board 304 and is thermally coupled to (e.g., in contact with) both the processing circuit chip 302 and the data collection circuit board 304. Thus, the heat sink 308 dissipates heat for the processing circuit chip 302 and the data collection circuit board 304, thereby improving reliability.

[0090] The heat dissipation component 308 may be made of a material with high thermal conductivity, such as a metal material (eg, aluminum or stainless steel).

[0091] like Figure 3 As shown, in some embodiments, the radiation detector module 300 may further include a collimator assembly 307. The collimator assembly 307 may be disposed on a surface of the radiation detector element 301. The collimator assembly 307 may collimate the radiation emitted from the radiation source to the radiation detector element 301.

[0092] In some embodiments of the present application, an anti-radiation circuit may be provided in the processing circuit chip 302 and / or a shielding component may be provided in the radiation detector module 300 to prevent the radiation emitted by the radiation source from affecting the reliability and service life of the processing circuit chip 302 .

[0093] For example, the radiation-resistant circuit may be an analog-to-digital converter with radiation-resistant function, etc.

[0094] For another example, a shielding component may be provided at at least one of the following locations: inside the circuit substrate 303, inside the processing circuit chip 302, and between the processing circuit chip 302 and the circuit substrate 303. Thus, the shielding component can block radiation (e.g., X-rays) directed toward the processing circuit chip 302, thereby improving the reliability and service life of the processing circuit chip 302.

[0095] Figure 6 is another schematic diagram of the cross section of the radiation detector module observed along the Z direction. Figure 6 As shown, the shielding component 601 of the radiation detector module 300 can be disposed inside the circuit substrate 303 .

[0096] Figure 7is another schematic diagram of the cross section of the radiation detector module observed along the Z direction. Figure 7 As shown, the shielding component 701 is disposed inside the processing circuit chip 302 .

[0097] Figure 8 FIG is another schematic diagram of the cross section of the radiation detector module observed along the Z direction. Figure 8 As shown, the shielding member 801 is disposed between the processing circuit chip 302 and the circuit substrate 303. For example, the lead terminals of the processing circuit chip 302 are electrically connected to the circuit substrate 303 via leads (not shown), thereby enabling data transmission between the processing circuit chip 302 and the circuit substrate 303; or, the shielding member 801 may have a plurality of through holes (not shown), through which the processing circuit chip 302 is electrically connected to the circuit substrate 303, thereby enabling data transmission between the processing circuit chip 302 and the circuit substrate 303.

[0098] Figure 9 FIG is a schematic diagram of a three-dimensional assembly of a radiation detector module according to an embodiment of the present application. Figure 9 As shown, the radiation detector module 300 includes: a collimator assembly 307 , a circuit substrate 303 , a heat dissipation component 308 and a data collection circuit board 304 .

[0099] The collimator assembly 307 is disposed on the radiation detector element 301 ( Figure 9 The collimator assembly 307 is configured to collimate the radiation emitted by the radiation source toward the radiation detector element 301. In some examples, the radiation detector element 301 includes a scintillator 3011 for receiving radiation and a photoelectric conversion element 3012 for converting light generated by the scintillator 3011 after being irradiated by the radiation into an electrical signal. The radiation (e.g., X-rays) emitted by the radiation source are collimated by the collimator assembly 307 and then irradiated by the scintillator. The light generated by the scintillator after being irradiated by the radiation is converted by the photoelectric conversion element into an electrical signal. The electrical signal generated by the photoelectric conversion element is used to perform tomographic imaging of the object. Furthermore, as previously described, in some embodiments, the radiation detector element 301 may not include the scintillator 3011. Thus, the radiation (e.g., X-rays) emitted by the radiation source are collimated by the collimator assembly 307 and then irradiated by the photon counting or direct conversion radiation detector element 301, which generates an electrical signal.

[0100] Heat sink 308 is at least partially disposed between processing circuit chip 302 and data collection circuit board 304, and is thermally coupled to both processing circuit chip 302 and data collection circuit board 304. Heat sink 308 may be a metal frame structure or a large flat plate structure, and has a central contact portion 3081 and fin portions 3082 located on either side of contact portion 3081.

[0101] also, Figure 9 Also shown is the housing component 901 ( Figure 3 (Not shown) The housing component 901 is mounted to the heat dissipation component 308 and covers the data collection circuit board 304. The housing component 901 is made of metal material to shield electromagnetic radiation and thus improve the performance of the data collection circuit board 304, such as signal-to-noise ratio. Figure 9 The data collection circuit board 304 is also shown with a heat sink 3041 mounted thereon for thermal management. The housing component 901 is provided with an opening 3042 corresponding to the shape of the heat sink 3041, through which the heat sink 3041 extends. In some embodiments, the housing component 901 is also thermally coupled to the data collection circuit board 304 to increase the heat dissipation area of ​​the data collection circuit board 304. The housing component 901 can further be thermally coupled to the heat sink 3041. Thus, the housing component 901 is thermally coupled to the heat dissipation component 308, the data collection circuit board 304, and its heat sink 3041, thereby improving the thermal management of the radiation detector module 300.

[0102] Figure 10 3 is a schematic perspective view of the radiation detector module according to an embodiment of the present application, showing a schematic perspective view of the radiation detector module 300 as viewed from the ray incident surface of the collimator assembly 307 . Figure 11 is another perspective schematic diagram of the radiation detector module according to an embodiment of the present application, showing the Figure 10 Schematic diagram of the collimator assembly 307.

[0103] like Figure 10 and 11 As shown, the collimator assembly 307 is mounted on the circuit substrate 303 along the X direction, the radiation detector element 301 is mounted on the side of the circuit substrate 303 facing the X direction, the circuit substrate 303 is arranged on the side of the heat dissipation component 308 facing the X direction, and the data collection circuit board 304 is arranged on the side of the heat dissipation component 308 opposite to the X direction.

[0104] An embodiment of the present application also provides a radiation detector.

[0105] Figure 12 FIG is a three-dimensional schematic diagram of a radiation detector according to an embodiment of the present application. Figure 12 As shown, the radiation detector 400 includes: Figure 3The radiation detector modules 300 and the guide rail 1201 are arranged along the Y direction of the guide rail 1201. The number of the radiation detector modules 300 ranges from 3 to 15. For example, the radiation detector 400 includes 9 radiation detector modules 300, and the scanning field of view (FOV) of the radiation detector 400 is 50 centimeters (cm); the radiation detector 400 includes 11 radiation detector modules 300, and the scanning field of view (FOV) of the radiation detector 400 is 60 centimeters (cm).

[0106] In the radiation detector 400 of the present application, the radiation detector module 300 can have a larger area. Thus, while ensuring that the radiation detector 600 reaches a predetermined scanning field of view, the number of radiation detector modules 300 can be reduced, the complexity of interconnection between the radiation detector modules is reduced, and the cost of the radiation detector 400 is reduced.

[0107] An embodiment of the present application further provides an imaging device, which is, for example, a medical imaging device.

[0108] Figure 13 It is a schematic diagram of a component of an imaging device. Figure 13 As shown, the imaging device 500 includes Figure 12 The radiation detector 400 and the image reconstruction device 1301 are shown. The image reconstruction device 1301 is based on the radiation detector module 300 (such as Figure 12 The electrical signals generated by the photoelectric conversion elements in FIG. 1 are used to perform tomographic imaging of the object.

[0109] In some examples, the image reconstruction device 1301 may utilize, for example, Figure 3 The image is reconstructed based on the data collected by the data collection circuit board 304. For detailed description of the image reconstruction device 1301, reference can be made to the relevant art.

[0110] The imaging device 500 of the present application is, for example, a CT (computed tomography) imaging device, a PET-CT or any other suitable imaging device.

[0111] The above embodiments are merely exemplary of the present invention, but the present invention is not limited thereto. Appropriate modifications may be made based on the above embodiments. For example, the above embodiments may be used alone, or one or more of the above embodiments may be combined.

[0112] The present application has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are merely illustrative and are not intended to limit the scope of protection of the present application. Those skilled in the art may make various modifications and variations to the present application based on the principles of the present application, and such modifications and variations are also within the scope of the present application.

Claims

1. A radiation detector module, characterized in that: The radiation detector module comprises: a radiation detector element that receives radiation emitted by a radiation source and converts the radiation into an electrical signal; a circuit substrate having the radiation detector element mounted on a first side of the circuit substrate; and A processing circuit chip is disposed on the second side of the substrate and communicates with the radiation detector element.

2. The radiation detector module according to claim 1, wherein: One or more processing circuit chips are arranged in the area of ​​the circuit substrate covered by each radiation detector element.

3. The radiation detector module according to claim 2, wherein: Each of the radiation detector elements includes 16 ray transmission channels arranged in a first direction.

4. The radiation detector module according to claim 3, characterized in that: The radiation detector module includes an even number of the radiation detector elements arranged in the first direction.

5. The radiation detector module according to claim 2, wherein: The radiation detector element is electrically connected to the processing circuit chip via a conductive path that passes through the circuit substrate.

6. The radiation detector module according to claim 1, wherein: The radiation detector element includes a scintillator and a photoelectric conversion element. The scintillator generates light from received radiation, and the photoelectric conversion element converts the light generated by the scintillator into an electrical signal. The photoelectric conversion element includes a backlight photodiode.

7. The radiation detector module according to claim 1, wherein: The radiation detector module has a flat plate configuration.

8. The radiation detector module according to claim 1, wherein: The radiation detector module further includes: A radiation shielding member disposed at at least one of the following locations: the interior of the circuit substrate; the interior of the processing circuit chip; between the processing circuit chip and the circuit substrate.

9. The radiation detector module according to claim 8, characterized in that: The radiation shielding component is provided between the processing circuit chip and the circuit substrate: The lead terminals of the processing circuit chip are electrically connected to the circuit substrate via leads; or, The shielding component has a plurality of through holes, and the processing circuit chip is electrically connected to the circuit substrate through the through holes.

10. The radiation detector module according to claim 1, wherein: The processing circuit chip has an anti-radiation circuit.

11. The radiation detector module according to claim 1, wherein: The radiation detector module further includes: The data collection circuit board is electrically connected to the circuit substrate through a wire and receives the data processed by the processing circuit chip.

12. The radiation detector module according to claim 11, wherein: The conductive wire is connected to an edge of the circuit substrate.

13. The radiation detector module according to claim 11, wherein: The radiation detector module further includes: A heat dissipation component is at least partially disposed between the processing circuit chip and the data collection circuit board, and is thermally coupled to both the processing circuit chip and the data collection circuit board.

14. The radiation detector module according to claim 1, wherein: The radiation detector module further includes: A collimator assembly is arranged on the surface of the radiation detector element, and the collimator assembly collimates the rays emitted by the radiation source to the radiation detector element.

15. The radiation detector module according to claim 1, wherein: The material of the circuit substrate includes at least one of the following materials: Flame retardant Class 4 (FR4) material, Ajinomoto laminate film (ABF), bismaleimide triazine (BT).

16. A radiation detector, characterized in that: The radiation detector includes a guide rail and two or more radiation detector modules according to any one of claims 1 to 15 supported on the guide rail.

17. The radiation detector according to claim 16, wherein: In the radiation detector, two or more radiation detector modules are arranged along the extending direction of the guide rail, wherein the number of the radiation detector modules is 3 to 15.

18. An imaging device, characterized in that: The imaging device comprises a radiation detector as claimed in any one of claims 16 to 17 and an image reconstruction device, which performs image reconstruction based on electrical signals generated by radiation detector elements in a radiation detector module of the radiation detector to generate a tomographic image of an inspection object.

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