Device for automatically testing thermal resistance of power module device

Abstract

The utility model relates to a device for automatically testing the thermal resistance of a power module device, a power module is provided with a plurality of test contacts, and the device comprises a clamping part used for clamping the power module; the two left-right translation parts are arranged on the two sides of the clamping part; the pressing part is positioned above the clamping part; the pressing part presses the power module to the clamping part and ensures that the pressure applied to each test contact is the same, and the left-right translation part translates towards the clamping part and forms a plurality of switchable test loops with the plurality of test contacts. Compared with the prior art, the device has the advantages of high test efficiency, high test accuracy and low cost.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal resistance testing, in particular to a device for automatically testing the thermal resistance of a power module device. Background Art

[0002] With the development of the new energy vehicle industry, inverters, as a core component of electric and hybrid vehicles, are facing increasingly stringent performance requirements. With the maturity and widespread adoption of the current mainstream 400V battery voltage system, the automotive industry has begun to explore and apply new 800V battery high-voltage systems built with SiC transistors. While these new technologies offer vehicles longer driving range and faster charging speeds, the higher power density also places significant loads on the switching components in the inverter, leading to overheating, a common problem plaguing the industry.

[0003] Besides optimizing the switch component design to reduce losses, another approach to addressing this problem is to enhance the heat sink's performance and utilize it to dissipate excess heat. Regardless of the approach used, the optimized product ultimately requires thermal resistance testing in the laboratory. The test results provide an understanding of the severity of the heat buildup problem. Due to the linear relationship between voltage and temperature in semiconductor devices at low currents, the industry currently primarily uses the static transient test method specified in the JESD51-1 test standard to test thermal resistance of switch components.

[0004] Each test requires manual assembly and wiring of custom test fixtures. However, this method is inefficient. Each module under test must be secured with screws, and then the components must be individually wired, screwed, and current applied. After the test is complete, the next component must be moved on. This prevents quick thermal resistance test results, increasing testing time and assembly complexity. Utility Model Content

[0005] The purpose of the present invention is to provide a device for automatically testing the thermal resistance of power module components in order to overcome the problems of low test efficiency, low test accuracy and high cost in the above-mentioned prior art.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A device for automatically testing the thermal resistance of a power module device, wherein the power module has multiple test contacts, and the device comprises:

[0008] A clamping portion for clamping the power module;

[0009] Two left and right translation parts are provided on both sides of the clamping part;

[0010] and a pressing portion located above the clamping portion;

[0011] The pressing portion presses the power module down to the clamping portion and ensures that each test contact is subjected to the same pressure. The left and right translation portions translate toward the clamping portion and form multiple switchable test circuits with multiple test contacts.

[0012] Furthermore, the clamping portion includes several signal current copper bars and several load current copper bars connected to the test contacts, and one end of the left and right translation portion facing the clamping portion is provided with several signal current probes and several load current probes respectively matching the signal current copper bar and the load current copper bar.

[0013] Furthermore, the left-right translation portion includes a slide cylinder arranged on one side of the clamping portion, and a connecting plate connected to one end of the slide cylinder, and the signal current probe and the load current probe are installed on the connecting plate.

[0014] Furthermore, the clamping portion further includes:

[0015] a base having a mounting slot;

[0016] A dowel pin mounted on one end of the base;

[0017] a cooling water channel located inside the base and communicating with the interior of the power module;

[0018] and water nozzles installed at both ends of the cooling water channel;

[0019] Wherein, the signal current copper busbar and the load current copper busbar are installed on the base.

[0020] Furthermore, the pressing portion includes a pressing plate for pressing the power module down into the installation groove.

[0021] Furthermore, the pressing portion further includes:

[0022] a support frame located above the clamping portion;

[0023] A thin cylinder mounted on the support frame and connected to the pressure plate;

[0024] A plurality of linear bearings mounted on the support frame and connected to the pressing plate;

[0025] a buffer spring mounted on the linear bearing;

[0026] And a soft rubber strip is connected to the front end of the pressing plate.

[0027] Furthermore, the support frame includes:

[0028] a support plate located above the clamping portion;

[0029] Four guide shafts located around the support plate;

[0030] and a limiting block for fixing the support plate on the guide shaft.

[0031] Furthermore, the device further comprises a test cabinet, and the clamping portion, the left-right translation portion, and the pressing portion are installed inside the test cabinet.

[0032] Furthermore, the test cabinet includes a test end surface and a guide rail installed on the upper surface of the test end surface, and the clamping part is installed on the guide rail.

[0033] Furthermore, a display screen is provided above the test end surface, and the test cabinet further comprises an emergency stop button located on the test end surface and a power button located below the test end surface.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] 1. The test efficiency of the utility model is improved. Through the cooperation of the pressing part and the left and right translation parts, the steps of screw installation and current signal line connection for each power module test are avoided, which greatly improves the test efficiency.

[0036] 2. The utility model has accurate measurement: the power module is positioned and fixed by the clamping part, the pressing part and the left and right translation parts, which avoids the test errors caused by manual screw installation and manual wiring, and improves the requirements for standard test operations.

[0037] 3. The utility model has a wide range of uses. It can be used in all workshop laboratories that need to test the thermal resistance of inverter power modules. It is easy to install and can be replaced as a whole through modular assembly when a fault occurs, which is convenient for maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 Schematic diagram of the structure of the clamping part, left and right translation part, and pressing part of the device in the embodiment.

[0039] Figure 2 Schematic diagram of the structure of the clamping part of the device in the embodiment.

[0040] Figure 3 Schematic diagram of the structure of the test cabinet of the device in the embodiment.

[0041] Figure 4 4 is a circuit logic diagram of the device in the embodiment when it is working.

[0042] Figure 5This is a wiring diagram for thermal resistance testing of switching components of the power module of the device in the embodiment.

[0043] Numbers in the figure:

[0044] 100-clamping part, 110-signal current copper busbar, 120-load current copper busbar, 130-base, 140-locating pin, 150-cooling water channel, 160-water nozzle;

[0045] 200-left and right translation part, 210-signal current probe, 220-load current probe, 230-slide cylinder, 240-connecting plate;

[0046] 300-lower pressure part, 310-pressing plate, 320-support frame, 330-thin cylinder, 340-linear bearing, 350-buffer spring, 360-soft rubber strip, 370-support plate, 380-guide shaft, 390-limit block;

[0047] 400-test cabinet, 410-test end face, 420-guide rail, 430-display screen, 440-emergency stop button, 450-power button;

[0048] 500-gate;

[0049] 600-emitter;

[0050] 700-Collector. DETAILED DESCRIPTION

[0051] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and easy to understand, the specific implementation methods of the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure. However, the embodiments of the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the embodiments of the present disclosure. Therefore, the embodiments of the present disclosure are not limited by the specific embodiments disclosed below. Features such as component models, material names, connection structures, control methods, etc. that are not clearly stated in this technical solution are all regarded as common technical features disclosed in the prior art.

[0052] In the description of the present invention, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0053] In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined. Furthermore, the terms "mounted," "connected," and "connected" should be interpreted broadly, encompassing, for example, fixed, removable, or integral connections; bolted or welded; directly or indirectly through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model on a case-by-case basis.

[0054] Existing test fixtures require manual assembly and wiring for each test. However, this testing method is inefficient. Each module under test must be secured with screws, and then the components must be individually wired, screwed, and current applied. After the test is completed, the fixture can be moved to the next one. This makes it difficult to quickly obtain thermal resistance test results, which undoubtedly increases testing time and assembly difficulty.

[0055] refer to Figures 1 to 5 The present application provides an apparatus for automatically testing the thermal resistance of power module components. The apparatus is configured to test the thermal resistance of a power module. The power module has multiple test contacts. Specifically, the power module includes a gate 500, an emitter 600, and a collector 700. The apparatus includes a clamping portion 100, a left-right translation portion 200, and a pressing portion 300.

[0056] The clamping portion 100 is used to clamp the power module. Two left and right translation portions 200 are provided on both sides of the clamping portion 100. The pressing portion 300 is located above the clamping portion 100. During operation, the pressing portion 300 presses the power module down to the clamping portion 100 and ensures that the pressure on each test contact is the same. At this time, multiple test contacts do not need to be fixed with screws separately. Moreover, since the pressing portion 300 is parallel to the clamping portion 100, it can provide uniform pressure on the surface of the power module when pressing down, avoiding the torque pressure error of the screw installation during manual device testing, and of course, reducing the time cost of installing the screws. After the pressing is completed, the left and right translation portions 200 translate toward the clamping portion 100 and form multiple switchable test circuits with multiple test contacts.

[0057] In one embodiment, if Figure 3 As shown, the clamping portion 100 includes a plurality of signal current copper bars 110 and a plurality of load current copper bars 120 connected to the test contacts, and the left and right translation portion 200 is provided with a plurality of signal current probes 210 and a plurality of load current probes 220 that match the signal current copper bar 110 and the load current copper bar 120 respectively at one end thereof facing the clamping portion 100.

[0058] During the test, a fixed voltage is first applied to the signal current copper bus 110 corresponding to the two switching components through the signal current probe 210 to open the gate 500. Then, a constant high-power load current is passed through the emitter 600 and collector 700 of the two components for a period of time to heat the components. After heating for a period of time, the load current is turned off and quickly switched to a smaller test current signal input through the load current probe 120. At the same time, the voltage acquisition signal line starts to record the voltage change in this cooling stage through the connected signal current probe 210. The cooling curves of the two components are obtained by the characteristic that the voltage and temperature of the semiconductor device have a single linear functional relationship under low current, and the thermal resistance of the two is finally obtained according to the mathematical function relationship.

[0059] In one embodiment, if Figure 2 As shown, the left-right translation part 200 includes a slide cylinder 230 arranged on one side of the clamping part 100 and a connecting plate 240 connected to one end of the slide cylinder 230 , and the signal current probe 210 and the load current probe 220 are installed on the connecting plate 240 .

[0060] Specifically, the slide of the slide cylinder 230 is fixedly connected to the connecting plate 240. When the slide cylinder 230 is working, the slide extends to drive the connecting plate 240 to move, thereby driving the signal current probe 210 and the load current probe 220 on the connecting plate 240 to contact the signal current copper bus 110 and the load current copper bus 120 located on the clamping part 100.

[0061] With this arrangement, there is no need to manually connect the circuit, and only the extension and retraction of the slide of the slide cylinder 230 need to be controlled.

[0062] In one embodiment, if Figure 1 and Figure 2 As shown, the clamping portion 100 further includes:

[0063] a base 130 having a mounting slot;

[0064] a positioning pin 140 mounted on one end of the base 130;

[0065] A cooling water channel 150 located inside the base 130 and communicating with the interior of the power module;

[0066] and water nozzles 160 installed at both ends of the cooling water channel 150;

[0067] The signal current copper busbar 110 and the load current copper busbar 120 are installed on the base 130 .

[0068] Specifically, the power module is mounted on the base 130 , that is, the power module is mounted in the mounting groove. For example, the power module is mounted in the mounting groove using the pressing portion 300 , and the positioning pins 140 are for accurate installation of the power module.

[0069] In one embodiment, if Figure 1 and Figure 2 As shown, the pressing portion 300 includes a pressing plate 310 for pressing the power module into the installation slot. During the pressing, the pressing plate 310 contacts the power module and presses the power module into the installation slot.

[0070] In one embodiment, if Figure 1 and Figure 2 As shown, the pressing portion 300 further includes:

[0071] a support frame 320 located above the clamping portion 100;

[0072] A thin cylinder 330 mounted on the support frame 320 and connected to the pressing plate 310;

[0073] a plurality of linear bearings 340 mounted on the support frame 320 and connected to the pressing plate 310;

[0074] A buffer spring 350 mounted on the linear bearing 340;

[0075] And a soft rubber strip 360 is connected to the front end of the pressing plate 310 .

[0076] The soft rubber strip 360 is used to press down and keep the signal current copper bus 110 and the load current copper bus 120 in contact with the pins of the component under test, and the thin cylinder 330 provides the pressure of the pressing plate.

[0077] In one embodiment, if Figure 1 and Figure 2 As shown, the support frame 320 includes:

[0078] a support plate 370 located above the clamping portion 100;

[0079] Four guide shafts 380 located around the support plate 370;

[0080] and a limiting block 390 for fixing the support plate 370 on the guide shaft 380 .

[0081] In one embodiment, if Figure 1 As shown, the device further includes a test cabinet 400 , and the clamping portion 100 , the left-right translation portion 200 , and the pressing portion 300 are installed inside the test cabinet 400 .

[0082] In one embodiment, if Figure 1 As shown, the test cabinet 400 includes a test end surface 410 and a guide rail 420 installed on the upper surface of the test end surface 410 , and the clamping portion 100 is installed on the guide rail 420 .

[0083] When in use, the clamping portion 100 is pulled out from the guide rail 420 and preliminarily installed using the positioning pin 140 .

[0084] In one embodiment, if Figure 1 As shown, a display screen 430 is further provided above the test end surface 410 , and the test cabinet 400 further includes an emergency stop button 440 located on the test end surface 410 and a power button 450 located below the test end surface 410 .

[0085] The above implementation is described in more detail below with reference to specific examples.

[0086] Example

[0087] This embodiment provides a device for automatically testing the thermal resistance of a power module device. The power module has multiple test contacts. Specifically, the power module has a gate 500, an emitter 600, and a collector 700. Figures 1 to 5 As shown, the device includes a clamping part 100, two left and right translation parts 200 and a pressing part 300. The clamping part 100 is used to clamp the power module. The two left and right translation parts 200 are arranged on both sides of the clamping part 100. The pressing part 300 is located above the clamping part 100. The pressing part 300 presses the power module down to the clamping part 100 and ensures that the pressure on each test contact is the same. The left and right translation parts 200 translate toward the clamping part 100 and form multiple switchable test circuits with multiple test contacts.

[0088] Specifically, the clamping portion 100 includes several signal current copper bars 110 and several load current copper bars 120, which are connected to the test contacts. The left and right translation portions 200 are provided with several signal current probes 210 and several load current probes 220 that match the signal current copper bars 110 and the load current copper bars 120, respectively, at one end thereof facing the clamping portion 100.

[0089] In this embodiment, the left and right translation part 200 includes a slide cylinder 230 and a connecting plate 240. The slide cylinder 230 is arranged on one side of the clamping part 100. The connecting plate 240 is connected to one end of the slide cylinder 230. The signal current probe 210 and the load current probe 220 are installed on the connecting plate 240.

[0090] In this embodiment, the clamping portion 100 also includes a base 130, a positioning pin 140, a cooling water channel 150, and a water nozzle 160. The base 130 has a mounting groove, the positioning pin 140 is installed at one end of the base 130, the cooling water channel 150 is located inside the base 130 and is connected to the interior of the power module, the water nozzle 160 is installed at both ends of the cooling water channel 150, and the signal current copper bus 110 and the load current copper bus 120 are installed on the base 130.

[0091] In this embodiment, the pressing part 300 includes a pressing plate 310, a support frame 320, a thin cylinder 330, a linear bearing 340, a buffer spring 350, and a soft rubber strip 360. The pressing plate 310 presses the power module down into the installation groove. The support frame 320 is located above the clamping part 100. The thin cylinder 330 is installed on the support frame 320 and connected to the pressing plate 310. The linear bearing 340 is installed on the support frame 320 and connected to the pressing plate 310. The buffer spring 350 is installed on the linear bearing 340. The soft rubber strip 360 is connected to the front end of the pressing plate 310. The support frame 320 includes a support plate 370 located above the clamping part 100, four guide shafts 380 located around the support plate 370, and a limit block 390 for fixing the support plate 370 on the guide shaft 380.

[0092] During use, the device also includes a test cabinet 400, within which the clamping portion 100, the left-right translation portion 200, and the pressing portion 300 are mounted. The test cabinet 400 includes a test end surface 410 and a guide rail 420 mounted on the upper surface of the test end surface 410, with the clamping portion 100 mounted on the guide rail 420. A display screen 430 is also provided above the test end surface 410. The test cabinet 400 also includes an emergency stop button 440 located on the test end surface 410 and a power button 450 located below the test end surface 410.

[0093] It should be noted that, see Figure 4 This device is connected between a high-power power supply and the power device under test. Through its built-in relay, it automatically switches circuit signals, supplying high-current signals from the power supply to the power devices under test at different locations. It can test the thermal resistance of two components simultaneously, and after the test is complete, it can continue to test the thermal resistance of multiple power components in sequence without the need for additional assembly, thus achieving the goal of efficiently measuring thermal resistance in batches. Figure 5 , Figure 5 This wiring scheme is embedded in the high-power power supply test equipment wiring scheme for testing the thermal resistance of power components. Figure 1Taking the simultaneous testing of the first and fourth switching components as an example, after placing the power module under test on the clamping portion 100, the high-power current line, test current signal line, and acquisition voltage signal line of the high-power power supply test equipment are first connected to the load current probe 220 and signal current probe 210 in the device. The pressure plate 310 and soft rubber strip 360 press the gate 500, emitter 600, and collector 700 of the component down to contact the corresponding signal current copper bus 110 and load current copper bus 120. The line signal is then transferred to the relay to control the switch.

[0094] The working principle of this embodiment is as follows:

[0095] First, the guide rail 420 is used to pull the clamping part 100 to the test end surface 410, and the power module is placed on the base 130 of the clamping part 100 through the positioning pin 140 and then pushed into the test cabinet 400. Then, the pressing part 300 is used to press the power module down into the installation slot. Specifically, the thin cylinder 330 is used to drive the pressing plate 310 to press down and press the power module into the installation slot. The pressing plate 310 can provide accurate pressure on the surface of the power module, avoiding manual device testing. The torque pressure error of the screw installation is fixed, and the time cost of installing the screw is greatly reduced. After the pressure plate 310 is pressed down, it is ensured that the component pins are in good contact with the signal current copper bus 110 and the load current copper bus 120. Then, the left and right translation parts 200 work, and the slide cylinder 230 drives the connecting plate 240 to move toward the clamping part 100, so that the load current probe 220 and the signal current probe 210 are in good docking contact with the load current copper bus 120 and the signal current copper bus 110. During the test, a fixed voltage is first applied to the signal current copper busbar 110 corresponding to the two switching components through the signal current probe 210, opening the gate 500. A constant high-power load current is then applied to the emitter 600 and collector 700 of the two components, heating the components for a period of time. After the heating period, the load current is turned off and quickly switched to a smaller test current signal input through the load current probe 120. Simultaneously, the voltage acquisition signal line begins recording the voltage changes during this cooling phase through the connected signal current probe 210. The cooling curves of the two components are obtained by using the characteristic that the voltage and temperature of semiconductor devices have a single linear functional relationship under low current. The thermal resistance of the two components is finally obtained through mathematical function conversion. Testing of the remaining components can then be continued.

[0096] The above description of the embodiments is intended to facilitate understanding and use of the utility model by those skilled in the art. Those skilled in the art will readily be able to make various modifications to these embodiments and apply the general principles described herein to other embodiments without requiring inventive effort. Therefore, the utility model is not limited to the above-described embodiments. Improvements and modifications made by those skilled in the art based on the disclosure of this utility model without departing from the scope of this utility model should be within the scope of protection of this utility model.

Claims

1. A device for automatically testing the thermal resistance of a power module device, wherein the power module has multiple test contacts, characterized in that: The device comprises: A clamping portion (100) for clamping the power module; Two left and right translation parts (200) provided on both sides of the clamping part (100); and a pressing portion (300) located above the clamping portion (100); The pressing portion (300) presses the power module downward onto the clamping portion (100) and ensures that the pressure on each test contact is the same, and the left and right translation portion (200) translates toward the clamping portion (100) and forms multiple switchable test circuits with multiple test contacts.

2. The device for automatically testing thermal resistance of power module components according to claim 1, characterized in that: The clamping portion (100) comprises a plurality of signal current copper bars (110) and a plurality of load current copper bars (120) connected to the test contacts, and one end of the left-right translation portion (200) facing the clamping portion (100) is provided with a plurality of signal current probes (210) and a plurality of load current probes (220) respectively matching the signal current copper bar (110) and the load current copper bar (120).

3. The device for automatically testing thermal resistance of power module components according to claim 2, characterized in that: The left-right translation portion (200) comprises a slide cylinder (230) arranged on one side of the clamping portion (100), and a connecting plate (240) connected to one end of the slide cylinder (230), and the signal current probe (210) and the load current probe (220) are mounted on the connecting plate (240).

4. The device for automatically testing thermal resistance of power module components according to claim 2, characterized in that: The clamping portion (100) further comprises: a base (130) having a mounting slot; a positioning pin (140) mounted on one end of the base (130); a cooling water channel (150) located inside the base (130) and communicating with the interior of the power module; and water nozzles (160) installed at both ends of the cooling water channel (150); The signal current copper busbar (110) and the load current copper busbar (120) are mounted on the base (130).

5. The device for automatically testing thermal resistance of power module components according to claim 4, characterized in that: The pressing portion (300) includes a pressing plate (310) for pressing the power module downward into the installation groove.

6. The device for automatically testing thermal resistance of power module components according to claim 5, characterized in that: The pressing portion (300) further includes: a support frame (320) located above the clamping portion (100); a thin cylinder (330) mounted on the support frame (320) and connected to the pressing plate (310); a plurality of linear bearings (340) mounted on the support frame (320) and connected to the pressing plate (310); a buffer spring (350) mounted on the linear bearing (340); And a soft rubber strip (360) is connected to the front end of the pressing plate (310).

7. The device for automatically testing thermal resistance of power module components according to claim 6, characterized in that: The support frame (320) comprises: a support plate (370) located above the clamping portion (100); Four guide shafts (380) located around the support plate (370); and a limiting block (390) for fixing the support plate (370) on the guide shaft (380).

8. The device for automatically testing thermal resistance of power module components according to claim 5, characterized in that: The device further comprises a test cabinet (400), wherein the clamping portion (100), the left-right translation portion (200), and the pressing portion (300) are installed inside the test cabinet (400).

9. The device for automatically testing thermal resistance of power module components according to claim 8, characterized in that: The test cabinet (400) comprises a test end surface (410) and a guide rail (420) installed on the upper surface of the test end surface (410), and the clamping portion (100) is installed on the guide rail (420).

10. The device for automatically testing thermal resistance of power module components according to claim 9, characterized in that: A display screen (430) is also provided above the test end surface (410), and the test cabinet (400) further comprises an emergency stop button (440) located on the test end surface (410) and a power button (450) located below the test end surface (410).

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