Server

Abstract

The utility model discloses a server which comprises a case, the case is provided with a first area and a second area which are arranged up and down, the first area is located above the second area, the first area is provided with a first sub-area and a second sub-area which are arranged up and down, and the first sub-area is located above the second sub-area; the storage module is arranged in the second area; the mainboard module is arranged in the second sub-area; and the extension module is arranged in the first sub-region. The problem of unreasonable layout of the rear window part of the server in the related technology is solved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a server. Background Art

[0002] The rear window design of existing server chassis mostly adopts an integrated layout, where the motherboard, network interface card, GPU, mechanical hard drive, solid-state drive and other components are mixed and arranged in the rear window area. This layout is generally messy and limits the server's performance upgrade and resource expansion capabilities in actual operation. When storage capacity needs to be increased or computing performance needs to be upgraded, the existing design often requires downtime for maintenance, or even replacement of the entire server unit. This not only increases operation and maintenance costs, but may also cause service interruptions and affect user experience. In addition, the addition of components leads to insufficient heat dissipation, resulting in reduced system stability and affecting thermal management and energy consumption control. It also causes inconvenience during hardware maintenance and troubleshooting. Once a problem occurs in a certain part, the entire server often needs to be inspected and repaired, which further increases the operation and maintenance burden and the risk of downtime.

[0003] In summary, the existing server back windows have obvious limitations in terms of rationality of space layout, resource scalability and maintenance convenience. Utility Model Content

[0004] The present application provides a server to at least solve the problem of unreasonable layout of the back window part of the server in the related art.

[0005] The present application provides a server, comprising: a chassis, the chassis having a first area and a second area arranged vertically, the first area being located above the second area, the first area having a first sub-area and a second sub-area arranged vertically, the first sub-area being located above the second sub-area; a storage module, the storage module being disposed in the second area; a mainboard module, the mainboard module being disposed in the second sub-area; and an expansion module, the expansion module being disposed in the first sub-area.

[0006] Through the present application, the cavity in the chassis is divided into a first area and a second area arranged in an upper and lower manner, so that the two areas can be used to install different components respectively, wherein the storage module is installed in the lower second area, and the motherboard module and the expansion module can be installed in the upper first area. At the same time, for the first area, this embodiment is further divided into a first sub-area and a second sub-area, the motherboard module is set in the lower second sub-area, and the expansion module is set in the upper first sub-area, so that the spatial division of the chassis is more reasonable, and it can ensure that each module device is installed in its own area, realizing the separation of computing resources and storage resources, and the expansion flexibility is extremely large, thereby improving the performance and scalability of the server. At the same time, the upper and lower layered design can support independent cooling and wiring, and can improve the airflow guide design and thermal management efficiency. The server of this embodiment can be flexibly configured according to different computing and storage requirements, improving resource utilization. Its application scenarios include data centers, cloud computing, high-performance computing, etc., and is particularly suitable for scenarios requiring large-scale data processing and storage. It can be deployed as an accelerator, storage server, expansion node, etc. on the same chassis platform, reducing the overall number of models and improving deployment flexibility. This embodiment uses the above-mentioned modular form to achieve the commonality of modules among various devices, reducing overall manufacturing and R&D costs. Manufacturing, testing and quality inspection can all be carried out modularly and independently, effectively improving production line efficiency and supporting on-demand assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0008] Figure 1 A schematic diagram of the server structure provided for this application;

[0009] Figure 2 for Figure 1 A schematic structural diagram of the first area;

[0010] Figure 3 for Figure 1 A top view of

[0011] Figure 4 This is a schematic diagram of a structure in which the first sub-area of ​​the server of the present application adopts a four-partition form;

[0012] Figure 5 This is a schematic diagram of a structure in which the first sub-area of ​​the server of the present application adopts a three-partition form;

[0013] Figure 6This is a schematic diagram of the structure of the server interface of this application when it fluctuates up and down;

[0014] Figure 7 This is a structural diagram of the server of the present application when the interface is a flat surface and there is only one first sub-area;

[0015] Figure 8 This is a structural diagram of the server of this application when the interface is a flat surface and there are multiple first sub-areas.

[0016] The above drawings include the following reference numerals:

[0017] 10. Chassis; 11. First area; 111. First sub-area; 112. Second sub-area; 113. Interface; 12. Second area; 13. Casing; 14. Partition; 15. Front window; 16. Rear window; 20. Storage module; 30. Motherboard module; 40. Expansion module; 41. Mechanical hard disk module; 42. High-speed expansion interface module; 43. Solid-state drive module; 44. Graphics card module. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0019] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0020] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0021] In order to solve the problem of unreasonable layout of the back window part of the server in the related art, the present application provides a server.

[0022] like Figures 1 to 8 A server shown includes a chassis 10, a storage module 20, a motherboard module 30 and an expansion module 40. The chassis 10 has a first area 11 and a second area 12 arranged vertically, with the first area 11 located above the second area 12. The first area 11 has a first sub-area 111 and a second sub-area 112 arranged vertically, with the first sub-area 111 located above the second sub-area 112; the storage module 20 is arranged in the second area 12; the motherboard module 30 is arranged in the second sub-area 112; and the expansion module 40 is arranged in the first sub-area 111.

[0023] This embodiment divides the cavity within the chassis 10 into a first area 11 and a second area 12 arranged vertically, allowing the two areas to be used to install different components. The storage module 20 is installed in the lower second area 12, while the motherboard module 30 and the expansion module 40 can be installed in the upper first area 11. Furthermore, the first area 11 is further divided into a first sub-area 111 and a second sub-area 112. The motherboard module 30 is located in the lower second sub-area 112, while the expansion module 40 is located in the upper first sub-area 111. This makes the spatial division of the chassis 10 more reasonable, ensuring that each module component is installed in its respective area, achieving separation of computing resources and storage resources, and providing great expansion flexibility, thereby improving the performance and scalability of the server. Furthermore, the upper and lower layered design supports independent cooling and wiring, improving airflow design and thermal management efficiency. The server of this embodiment can be flexibly configured according to different computing and storage requirements, improving resource utilization. Its application scenarios include data centers, cloud computing, high-performance computing, etc., and is particularly suitable for scenarios requiring large-scale data processing and storage. It can be deployed as an accelerator, storage server, expansion node, etc. on the same chassis platform, reducing the overall number of models and improving deployment flexibility. This embodiment uses the above-mentioned modular form to achieve universal module sharing across various devices, reducing overall manufacturing and R&D costs. Manufacturing, testing, and quality inspection can all be carried out modularly and independently, effectively improving production line efficiency and supporting on-demand assembly.

[0024] like Figure 6 As shown, in this embodiment, the chassis 10 includes a shell 13 and a partition 14. The shell 13 is a shell-like structure with a cavity inside for mounting various device modules. The partition 14 is disposed within the shell 13 and divides the space inside the shell 13 into a first area 11 and a second area 12. Since the first area 11 and the second area 12 in this embodiment are arranged in an up-and-down manner, the partition 14 is disposed in a horizontal manner. It should be noted that the horizontal direction in this embodiment refers to a direction that is approximately perpendicular to the vertical height direction of the chassis 10, that is, approximately along the horizontal direction. It can be completely parallel to the horizontal direction or form a small angle with the horizontal direction. The horizontal partition 14 is arranged so that the space inside the shell 13 is divided into two parts, upper and lower, so that the upper and lower areas do not affect each other. When wiring and arranging components such as cooling pipes, they can be arranged independently. Heat dissipation optimization, cooling water pipes or wires can be inserted according to the needs of the motherboard and modules, ensuring the independence of each area, reducing interference between different modules, improving the stability and maintainability of the server, facilitating thermal management, and reducing failure rates.

[0025] It should be noted that if Figure 3As shown, the chassis 10 has a front window 15 and a rear window 16. The front and back mentioned in this embodiment refer to the direction in which a person normally faces the server. Of the two ends of the server, the end closer to the person is the front window part, and the part away from the person is the rear window part. The rear window part can usually be provided with interfaces, air cooling and heat dissipation modules or components. The partition 14 of this embodiment extends from the rear window 16 to the front window 15, that is, the end of the partition 14 is located at the rear window 16, and extends from the back to the front. In this way, the partition 14 separates the area of ​​the rear window part of the chassis 10, so that the first area 11 and the second area 12 are both located at the rear window 16, and the first area 11 and the second area 12 can be extended forward a distance as needed. Based on the above form, the partition layout of this embodiment is mainly aimed at the design of the rear window part of the server, which improves the scalability and convenience of the rear window part, and is also convenient for maintenance and upgrading from the rear window 16, reducing downtime. Of course, the partition setting method of this embodiment can also be applied to other positions such as the front window 15 as needed.

[0026] In this embodiment, one end of the partition 14 is located at the rear window 16, while the other end, while extending toward the front window 15, does not extend to the front window 15. Instead, a gap is created between the partition 14 and the front window 15, creating a space between the edge of the partition 14 and the front window 15 for installing and accommodating other components, thereby reducing the impact of the rear window 16 layout on the installation of components on the front window 15. Furthermore, in this embodiment, the orthographic projection of the mainboard module 30 on the plane where the partition 14 is located is located within the range of the partition 14, allowing the partition 14 to cover the entire range of the mainboard module 30. This not only allows the partition 14 to secure, connect, and support the installation of the mainboard module 30, but also allows the partition 14 to separate the first area 11 and the second area 12 where the mainboard module 30 is located as completely as possible, ensuring a separation effect between the two areas.

[0027] Considering that the expansion module 40 is the main part that is replaced, multiple expansion modules 40 are provided in this embodiment, and they can be divided into multiple types. The expansion module 40 and the chassis 10 are connected in a detachable manner, so that each expansion module 40 can be disassembled and replaced as needed. Different expansion modules 40 can be matched to meet different usage requirements, so that the resulting server can meet the corresponding usage requirements.

[0028] The expansion module 40 of this embodiment includes a mechanical hard disk module 41, a high-speed expansion interface module 42, a solid-state hard disk module 43, and a graphics card module 44. Of course, the specific types of the above-mentioned expansion modules 40 can be increased or decreased as needed. When only one type of expansion module 40 is provided, the adjustment is mainly in quantity. When multiple types are provided, the adjustment can be made in both quantity and type.

[0029] Optionally, the specific number of the first sub-areas 111 can be set as needed, and one or more can be set.

[0030] like Figure 7 As shown, when only one first sub-area 111 is provided, the first sub-area 111 can cover both ends of the left and right directions perpendicular to the up and down and front and back directions, so that the first sub-area 111 can extend to the left and right sides of the chassis 10, making the first sub-area 111 a larger area. Under this setting, there can be one or more expansion modules 40. Since the first sub-area 111 is an area, multiple expansion modules 40 of the same type can be installed in the first sub-area 111, thereby increasing the number of expansion modules 40 that can be installed, such as installing four graphics card modules 44 or ten mechanical hard disk modules 41, etc.

[0031] like Figure 6 and Figure 8 As shown, in this embodiment, preferably, multiple first sub-areas 111 are provided, and each first sub-area 111 is arranged in a horizontal direction, and the arrangement direction of each first sub-area 111 is perpendicular to the front-to-back direction and the up-to-down direction. That is, the first sub-areas 111 are arranged along the aforementioned left-to-right direction. Accordingly, since there are multiple expansion modules 40, the same or different expansion modules 40 can be installed in each first sub-area 111 as needed to meet different usage requirements.

[0032] In this embodiment, the same type of expansion modules 40 are preferably installed in the same or laterally adjacent first sub-areas 111. More specifically, the same type of expansion modules 40 are installed in each first sub-area 111, while the types of expansion modules 40 in different first sub-areas 111 can be the same or different. This allows the quantity and type of various expansion modules 40 to be adjusted as needed to meet different usage requirements and improve adaptability to the installation and expansion of different modules.

[0033] In this embodiment, a dividing interface 113 is formed between the first sub-area 111 and the second sub-area 112, and the dividing interface 113 includes the first sub-interface and the second sub-interface, and the distance between the first sub-interface and the bottom surface of the second sub-area 112 is smaller than the distance between the second sub-interface and the bottom surface of the second sub-area 112, so that the dividing interface 113 as a whole forms an ups and downs form, wherein the height of the first sub-interface is lower than the height of the second sub-interface, so that a larger module can be set above the first sub-interface, and a smaller module can be set above the second sub-interface, so that the required modules can be configured more flexibly and more matching functions can be provided.

[0034] Accordingly, in order to adapt to the setting mode of the height of the first sub-interface and the second sub-interface, the embodiment optimizes the specific form of the mainboard module 30. Figure 1 and Figure 6 As shown, the height of the top surface of the motherboard module 30 in this embodiment is not identical at all locations, that is, the top surface of the motherboard module 30 is also arranged in an undulating manner. In this way, the lower height position of the motherboard module 30 can avoid the lower height of the first sub-interface, so that this position can be aligned vertically with the first sub-interface, thereby achieving the effect of installing a large-sized module above the first sub-interface. Meanwhile, the higher height position of the motherboard module 30 can be aligned vertically with the second sub-interface, thereby allowing a small-sized module to be installed above the second sub-interface. This arrangement ensures that the form of the motherboard module 30 corresponds to the configuration of the first sub-area 111, resulting in different heights of the first sub-area 111. This allows modules of different types and sizes to be installed as needed, improving module adaptability, thereby increasing expansion flexibility and versatility, and maximizing space utilization.

[0035] The mechanical hard disk module 41 of this embodiment includes a large-size hard disk and a small-size hard disk. The large-size hard disk is larger than the small-size hard disk. The large-size hard disk takes a 3.5-inch hard disk as an example, and the small-size hard disk takes a 2.5-inch hard disk as an example. When the expansion module 40 includes the mechanical hard disk module 41 and the mechanical hard disk module 41 is installed in the chassis 10, the large-size hard disk is set above the first sub-interface and / or the second sub-interface, and the small-size hard disk is set above the second sub-interface. The high-speed expansion interface module 42 includes a full-height expansion interface and a half-height expansion interface. The full height means that the height of the expansion interface is the standard height, and the half height means that the height of the expansion interface is half of the standard height. When the expansion module 40 includes the high-speed expansion interface module 42 and the high-speed expansion interface module 42 is installed in the chassis 10, the full-height expansion interface is set above the first sub-interface, and the half-height expansion interface is set above the second sub-interface. Similarly, when the expansion module 40 includes a solid-state drive module 43 and the solid-state drive module 43 is installed in the chassis 10, the solid-state drive module 43 is located above the second sub-interface; when the expansion module 40 includes a graphics card module 44 and the graphics card module 44 is installed in the chassis 10, the graphics card module 44 is located above the first sub-interface. In addition to the aforementioned modules, the expansion module 40 may also include a network card, a data security control module, etc. These modules may be located in the lower first sub-area 111, preferably at the edge of the first sub-area 111.

[0036] The first sub-area 111 of this embodiment can be configured in the following ways:

[0037] Five-partition format: There are five first sub-areas 111, with three first sub-areas 111 above the first sub-interface and two first sub-areas 111 above the second sub-interface, forming three higher first sub-areas 111 and two lower first sub-areas 111. High-speed expansion interface modules 42 and the like can all be placed in the first sub-areas 111.

[0038] Four-partition format: There are four first sub-areas 111, and two first sub-areas 111 are respectively provided above the first sub-interface and above the second sub-interface, thereby forming two first sub-areas 111 with higher heights and two first sub-areas 111 with lower heights. There are many combinations of expansion modules 40, for example, two 2.5-inch hard drives, six full-height expansion interfaces, and two half-height expansion interfaces can be used; or Figure 4 The two 3.5-inch hard drives, five full-height expansion interfaces and two solid-state hard drive modules 43 shown are as follows; or two 3.5-inch hard drives, five full-height expansion interfaces and two 2.5-inch hard drives; or four 3.5-inch hard drives, two half-height expansion interfaces and two solid-state hard drive modules 43; or eight high-speed expansion interface modules 42 and two solid-state hard drive modules 43; or two graphics card modules 44, two full-height expansion interfaces and two solid-state hard drive modules 43, etc.

[0039] In the three-partition form, there are three first sub-areas 111 in total, and two first sub-areas 111 are set above the first sub-interface, and one first sub-area 111 is set above the second sub-interface, thereby forming two first sub-areas 111 with higher heights and one first sub-area 111 with lower heights. There are many combinations of expansion modules 40, for example, four 2.5-inch hard drives and six full-height expansion interfaces; or two 3.5-inch hard drives, five full-height expansion interfaces and two 2.5-inch hard drives; or two 3.5-inch hard drives, three full-height expansion interfaces and four 2.5-inch hard drives; or four 3.5-inch hard drives, two half-height expansion interfaces and two 2.5-inch hard drives; or six full-height expansion interfaces and four half-height expansion interfaces; or as Figure 5 The two graphics card modules 44, two full-height expansion interfaces and four 2.5-inch hard drives shown; or two graphics card modules 44, two full-height expansion interfaces and two solid-state drive modules 43, etc.

[0040] It should be noted that the specific form of the above partitions and the specific collocation of modules are not limited to the above settings in this embodiment, and can also be adjusted as needed.

[0041] like Figure 7 and Figure 8As shown, in addition to the above-mentioned arrangement, the boundary surface 113 can also be arranged to be at equal distances from the bottom surface of the second sub-region 112, so that the boundary surface 113 forms a flat surface extending laterally without ups and downs. In this case, the first sub-region 111 can be set as a larger area extending laterally without ups and downs, that is, Figure 7 The form shown; of course, it can also be set to multiple areas, that is, Figure 8 In the form shown. Figure 7 Taking the first sub-area 111 as an example, which is a larger area extending laterally to the inner wall of the chassis 10 , four graphics card modules 44 or ten 2.5-inch hard drives, etc. can be arranged in the first sub-area 111 .

[0042] like Figure 1 and Figure 2 As shown, unlike the setting of the above-mentioned first sub-area 111, since the second sub-area 112 is mainly used to install the mainboard module 30 and the second area 12 is mainly used to install the storage module 20, the second sub-area 112 and the second area 12 do not need to be additionally partitioned. They can be extended horizontally to the inner wall of the chassis 10 to directly form a larger area, so that the mainboard module 30 and the storage module 20 can be directly, conveniently and quickly installed in the second sub-area 112 and the second area 12.

[0043] It should be noted that the storage module 20 of this embodiment can be in the form of a hard disk. Although both the storage module 20 and the expansion module 40 use hard disks, the hard disk of the storage module 20 is generally not disassembled and replaced, and it plays the main role of storage, while the hard disk of the expansion module 40 is suitable for expanding the storage function to meet large-capacity storage needs.

[0044] In this embodiment, mounting holes can be provided on the mainboard module 30 and the partition 14, and screws and other fasteners can be passed through the mounting holes to achieve the installation of the mainboard module 30 on the partition 14. Similarly, mounting holes can also be provided on the storage module 20 and the expansion module 40 as needed, and each module can be installed and fastened to the chassis 10 or other components such as the bracket by passing bolts through the mounting holes.

[0045] In this embodiment, the server further includes an interface bracket, which can be a fixed interface baffle or other component. The interface bracket is disposed on the rear window 16 of the chassis 10 and is located at least within the second sub-region 112. The interface bracket can extend upward into the first sub-region 111. The interfaces on the mainboard module 30 and the expansion module 40 can all be docked with the interface bracket, thereby achieving docking at the interfaces. The interface bracket can also be provided with mounting holes or other structures. The interface bracket can be installed on the chassis 10 or connected to modules such as the mainboard module 30 and the expansion module 40 by passing bolts through the mounting holes.

[0046] Optionally, the number of interface brackets can be set as needed, with one or more being provided, and in the case where multiple interface brackets are provided, the forms of at least two interface brackets can be different. The interface bracket is detachably and replaceably provided relative to the chassis 10, so that the specific installation of the interface bracket can be adjusted accordingly according to actual needs, so that the form of the interface bracket installed on the chassis 10 corresponds to the specific type of expansion module 40, forming a replaceable design form, which is more conducive to extending the application of various modules. The mounting holes can be designed on the chassis 10 with a unified interface or screw hole position, so that different interface brackets, expansion modules 40, etc. can be quickly installed and replaced, improving the efficiency of maintenance and modification.

[0047] It should be noted that, in the above embodiments, a plurality refers to at least two.

[0048] This embodiment divides the cavity within the chassis 10 into a first area 11 and a second area 12 arranged vertically, allowing the two areas to be used to install different components. The storage module 20 is installed in the lower second area 12, while the motherboard module 30 and the expansion module 40 can be installed in the upper first area 11. Furthermore, the first area 11 is further divided into a first sub-area 111 and a second sub-area 112. The motherboard module 30 is located in the lower second sub-area 112, while the expansion module 40 is located in the upper first sub-area 111. This makes the spatial division of the chassis 10 more reasonable, ensuring that each module component is installed in its respective area, achieving separation of computing resources and storage resources, and providing great expansion flexibility, thereby improving the performance and scalability of the server. Furthermore, the upper and lower layered design supports independent cooling and wiring, improving airflow design and thermal management efficiency. The server of this embodiment can be flexibly configured according to different computing and storage requirements, improving resource utilization. Its application scenarios include data centers, cloud computing, high-performance computing, etc., and is particularly suitable for scenarios requiring large-scale data processing and storage. It can be deployed as an accelerator, storage server, expansion node, etc. on the same chassis platform, reducing the overall number of models and improving deployment flexibility. This embodiment uses the above-mentioned modular form to achieve universal module sharing across various devices, reducing overall manufacturing and R&D costs. Manufacturing, testing, and quality inspection can all be carried out modularly and independently, effectively improving production line efficiency and supporting on-demand assembly.

[0049] The above is a detailed introduction to a server provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core ideas of the present application. It should be noted that, for those skilled in the art, without departing from the principles of the present application, several improvements and modifications may be made to the present application, and such improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server, characterized in that: include: A chassis (10), the chassis (10) having a first area (11) and a second area (12) arranged vertically, the first area (11) being located above the second area (12), the first area (11) having a first sub-area (111) and a second sub-area (112) arranged vertically, the first sub-area (111) being located above the second sub-area (112); a storage module (20), the storage module (20) being arranged in the second area (12); a mainboard module (30), the mainboard module (30) being arranged in the second sub-area (112); An expansion module (40), wherein the expansion module (40) is arranged in the first sub-area (111).

2. The server according to claim 1, wherein: The chassis (10) comprises an outer shell (13) and a partition (14); the partition (14) is arranged in the outer shell (13) and divides the space inside the outer shell (13) into the first area (11) and the second area (12).

3. The server according to claim 2, wherein: The chassis (10) has a front window (15) and a rear window (16), the partition (14) extends from the rear window (16) toward the front window (15), and the first area (11) and the second area (12) are both located at the rear window (16).

4. The server according to claim 3, wherein: There is a gap between the partition (14) and the front window (15), and the orthographic projection of the mainboard module (30) on the plane where the partition (14) is located is located within the range of the partition (14).

5. The server according to claim 1, wherein: There are a plurality of first sub-areas (111), each of which is arranged horizontally; there are a plurality of expansion modules (40), each of which is provided with the expansion module (40); the chassis (10) has a front window (15) and a rear window (16) arranged front to back; and the arrangement direction of each first sub-area (111) is perpendicular to both the front-to-back direction and the up-down direction.

6. The server according to claim 5, wherein: The expansion modules (40) are divided into multiple types, and the same type of expansion modules (40) are arranged in the same or multiple laterally adjacent first sub-areas (111).

7. The server according to claim 1, wherein: A boundary surface (113) is formed between the first sub-region (111) and the second sub-region (112), and the distance between each point of the boundary surface (113) and the bottom surface of the second sub-region (112) is equal.

8. The server according to claim 1, wherein: An interface (113) is formed between the first sub-region (111) and the second sub-region (112), and the interface (113) includes a first sub-interface and a second sub-interface, and a distance between the first sub-interface and the bottom surface of the second sub-region (112) is smaller than a distance between the second sub-interface and the bottom surface of the second sub-region (112).

9. The server according to claim 8, wherein: The heights of the mainboard module (30) are not completely the same at all locations; a lower location in the mainboard module (30) is arranged in correspondence with the first sub-interface, and a higher location in the mainboard module (30) is arranged in correspondence with the second sub-interface.

10. The server according to claim 8, wherein: The expansion module (40) includes at least one of a mechanical hard disk module (41), a high-speed expansion interface module (42), a solid-state hard disk module (43), and a graphics card module (44). The expansion module (40) is detachably and replaceably arranged in the first sub-area (111).

11. The server according to claim 10, wherein: The mechanical hard disk module (41) includes a large-size hard disk and a small-size hard disk, the large-size hard disk is larger than the small-size hard disk, and when the expansion module (40) includes the mechanical hard disk module (41), the large-size hard disk is arranged above the first sub-interface, and the small-size hard disk is arranged above the second sub-interface; and / or, The high-speed extension interface module (42) includes a full-height extension interface and a half-height extension interface; when the extension module (40) includes the high-speed extension interface module (42), the full-height extension interface is arranged above the first sub-interface and / or the second sub-interface, and the half-height extension interface is arranged above the second sub-interface; and / or, When the expansion module (40) includes the solid-state hard disk module (43), the solid-state hard disk module (43) is arranged above the second sub-interface; and / or, When the expansion module (40) includes the graphics card module (44), the graphics card module (44) is arranged above the first sub-interface.

12. The server according to claim 1, wherein: The server further comprises an interface bracket, which is arranged on the rear window (16) of the chassis (10) and is located at least within the second sub-area (112), and the interface on the mainboard module (30) is docked with the interface bracket.

13. The server according to claim 12, wherein: There are a plurality of interface brackets, and the interface brackets are detachably and replaceably arranged relative to the chassis (10), and at least two of the interface brackets are in different forms.

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