Alignment mechanism for semiconductor wafer feeding

Abstract

The utility model discloses a feeding alignment mechanism for semiconductor wafers, and relates to the technical field of wafer processing. The alignment mechanism for semiconductor wafer feeding comprises an alignment unit arranged on a feeding support, the feeding support comprises a bottom plate, standing plates and a bearing plate, the standing plates are located between the bottom plate and the bearing plate, and the alignment unit comprises a first guide rail rod fixedly connected between the two standing plates and a push table slidably connected to the first guide rail rod. A buffer assembly is arranged between the push table and the push rod. According to the feeding alignment mechanism for the semiconductor wafer, the alignment unit is arranged on the feeding support, so that after the mechanical arm places the semiconductor wafer on the feeding platform, automatic positioning alignment is achieved, the alignment unit is simple in overall structure and convenient to operate, it is guaranteed that the position of the semiconductor wafer is stable, and therefore the follow-up machining detection effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a loading and alignment mechanism for semiconductor wafers. Background Art

[0002] During wafer production, each processing step requires a unified benchmark to ensure processing accuracy. Alignment ensures that all wafers have the same benchmark during processing, thus avoiding processing errors.

[0003] At present, in the process of semiconductor wafer loading and alignment, the existing technology usually adopts a robotic arm or a clamping device to accurately grasp the wafer and place it on a preset platform. A suction cup is usually set on the platform for adsorption. After long-term use, there may be deviations in the positioning process of the robotic arm. Therefore, the wafer placed on the platform will have a slight position offset, thereby reducing the processing and detection effect of the wafer. In view of the shortcomings of the existing technology, the utility model provides a semiconductor wafer loading and alignment mechanism to solve the above problems. Utility Model Content

[0004] In response to the deficiencies in the prior art, the utility model provides a mechanism for loading and aligning semiconductor wafers. An alignment unit is provided on the loading bracket to enable the robotic arm to automatically position and align the semiconductor wafer after placing it on the loading platform. The overall structure of the alignment unit is simple and easy to operate. At the same time, the design of the buffer component in the alignment unit can provide elastic buffering when the push rod pushes the wafer to move and align, thereby preventing the wafer from being damaged by excessive force. The mechanism has good stability, ensuring the stable position of the semiconductor wafer, thereby achieving good subsequent processing and detection effects.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor wafer loading and alignment mechanism, comprising an alignment unit arranged on a loading bracket, the loading bracket comprising a base plate, a station plate and a carrier plate, the station plate being located between the base plate and the carrier plate, the alignment unit comprising a first guide rail fixedly connected between two sets of station plates and a push platform slidably connected to the first guide rail;

[0006] The station plate is fixedly connected to a driving motor, an output end of the driving motor is provided with a double-threaded screw, and the double-threaded screw is threadedly connected to the push platform;

[0007] A push rod is provided on the push platform, and a buffer component is provided between the push platform and the push rod.

[0008] Preferably, a mounting groove is provided on the top of the push platform, the buffer assembly includes a buffer seat slidably connected to the inside of the mounting groove and a spring fixedly connected between the buffer seat and the mounting groove, and the push rod is fixedly connected to the buffer seat.

[0009] Preferably, a second guide rail rod is fixedly connected to the interior of the mounting groove, and the buffer seat is slidably connected to the second guide rail rod.

[0010] Preferably, a rubber sleeve is provided on the push rod.

[0011] Preferably, a carrying platform is provided on the carrying plate, and a plurality of vacuum suction cups are provided on the carrying platform.

[0012] Preferably, a sliding groove corresponding to the position of the push rod is provided on the supporting plate.

[0013] The utility model discloses a semiconductor wafer loading and alignment mechanism, which has the following beneficial effects:

[0014] The semiconductor wafer loading and alignment mechanism is provided with an alignment unit on the loading bracket to realize automatic positioning and alignment after the robotic arm places the semiconductor wafer on the loading platform. The overall structure of the alignment unit is simple and easy to operate. At the same time, the buffer component design adopted in the alignment unit can provide elastic buffering when the push rod pushes the wafer to move and align, thereby preventing the wafer from being damaged by excessive force, having good stability, and ensuring the stable position of the semiconductor wafer, thereby achieving good subsequent processing and detection effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a structural diagram of the load-bearing platform of the utility model;

[0018] Figure 3 This is a structural diagram of the load-bearing plate of the utility model;

[0019] Figure 4 This is a structural diagram of the buffer component of the utility model.

[0020] In the figure: 1. Loading bracket; 101. Base plate; 102. Standing plate; 103. Loading plate; 1031. Slide groove; 2. Alignment unit; 201. First guide rail; 202. Push platform; 2021. Mounting groove; 203. Drive motor; 204. Double-threaded screw; 3. Push rod; 301. Rubber sleeve; 4. Loading platform; 401. Vacuum suction cup; 5. Buffer assembly; 501. Second guide rail; 502. Buffer seat; 503. Spring. DETAILED DESCRIPTION

[0021] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0022] The embodiment of the present application solves the problem that in the prior art, a robotic arm or clamping device is usually used to accurately grasp the wafer and place it on a preset platform during the semiconductor wafer loading and alignment process, by providing a mechanism for semiconductor wafer loading and alignment. The platform is usually provided with a suction cup for adsorption. After long-term use, the robotic arm positioning process may have deviations, so the wafer placed on the platform will have a slight position offset, thereby reducing the processing and detection effect of the wafer.

[0023] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0024] The embodiment of the utility model discloses a semiconductor wafer loading and alignment mechanism. Figure 1-4 As shown, it includes an alignment unit 2 arranged on a loading bracket 1, and the loading bracket 1 includes a base plate 101, a station plate 102 and a carrying plate 103. The station plate 102 is located between the base plate 101 and the carrying plate 103. A carrying platform 4 is provided on the carrying plate 103, and a plurality of vacuum suction cups 401 are provided on the carrying platform 4.

[0025] When semiconductor wafer loading, processing and testing are required, the semiconductor wafer is placed on the carrier 4, quickly aligned and positioned by the alignment unit 2, and then adsorbed and positioned by the vacuum suction cup 401 to ensure the stability of the semiconductor wafer position, thereby achieving good subsequent processing and testing effects.

[0026] The alignment unit 2 includes a first guide rail rod 201 fixedly connected between the two sets of station plates 102 and a push platform 202 slidably connected to the first guide rail rod 201;

[0027] The semiconductor wafer loading and alignment mechanism, through the design of the alignment unit 2, facilitates the rapid positioning and alignment of the semiconductor wafer when it is placed on the carrier plate 103, thereby ensuring the accurate position of the semiconductor wafer and facilitating subsequent processing;

[0028] A driving motor 203 is fixedly connected to the station plate 102, and a double-threaded screw 204 is provided at the output end of the driving motor 203. The double-threaded screw 204 is threadedly connected to the push platform 202. A push rod 3 is provided on the push platform 202, and a buffer component 5 is provided between the push platform 202 and the push rod 3;

[0029] The alignment unit 2 has a simple overall structure and is powered by a drive motor 203. When the drive motor 203 is working, it drives the double-threaded screw 204 to rotate. The double-threaded screw 204 drives the two sets of pushers 202 to move toward each other. The pushers 202 drive the push rods 3 to move. The multiple sets of push rods 3 limit the position of the semiconductor wafer, so that the semiconductor wafer is pushed onto the carrier 4 for position alignment, ensuring the alignment of the semiconductor wafer position.

[0030] A mounting groove 2021 is formed on the top of the push platform 202. The buffer assembly 5 includes a buffer seat 502 slidably connected to the interior of the mounting groove 2021 and a spring 503 fixedly connected between the buffer seat 502 and the mounting groove 2021. The push rod 3 is fixedly connected to the buffer seat 502.

[0031] The buffer assembly 5 is designed in the alignment unit 2 to provide elastic buffering when the push rod 3 pushes the wafer to move and align, thus preventing the wafer from being damaged by excessive force.

[0032] The interior of the mounting groove 2021 is fixedly connected to a second guide rail rod 501, and the buffer seat 502 is slidably connected to the second guide rail rod 501. When the push rod 3 squeezes the wafer to align the limit, the push rod 3 will be subjected to force and will drive the buffer seat 502 to slide along the second guide rail rod 501 and squeeze the spring 503, thereby reducing the pressure on the wafer, providing a buffer, and protecting the wafer from damage.

[0033] A rubber sleeve 301 is provided on the push rod 3 , and the rubber sleeve 301 provides protection for the wafer contact position and provides secondary buffering.

[0034] A sliding groove 1031 corresponding to the position of the push rod 3 is formed on the supporting plate 103 . When the push rod 3 moves, it moves along the sliding groove 1031 , and the sliding groove 1031 limits the push rod 3 .

[0035] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer loading and alignment mechanism, comprising an alignment unit (2) arranged on a loading support (1), wherein the loading support (1) comprises a base plate (101), a station plate (102) and a carrier plate (103), wherein the station plate (102) is located between the base plate (101) and the carrier plate (103), and is characterized in that: The alignment unit (2) comprises a first guide rail rod (201) fixedly connected between two sets of station plates (102) and a push platform (202) slidably connected to the first guide rail rod (201); A driving motor (203) is fixedly connected to the station plate (102), and a double-threaded screw rod (204) is provided at the output end of the driving motor (203), and the double-threaded screw rod (204) is threadedly connected to the push platform (202); A push rod (3) is provided on the push platform (202), and a buffer assembly (5) is provided between the push platform (202) and the push rod (3).

2. A semiconductor wafer loading and alignment mechanism according to claim 1, characterized in that: A mounting groove (2021) is provided on the top of the push platform (202), the buffer assembly (5) comprises a buffer seat (502) slidably connected to the interior of the mounting groove (2021) and a spring (503) fixedly connected between the buffer seat (502) and the mounting groove (2021), and the push rod (3) is fixedly connected to the buffer seat (502).

3. A semiconductor wafer loading and alignment mechanism according to claim 2, characterized in that: A second guide rail rod (501) is fixedly connected to the interior of the installation groove (2021), and the buffer seat (502) is slidably connected to the second guide rail rod (501).

4. The semiconductor wafer loading and alignment mechanism according to claim 1, wherein: The push rod (3) is provided with a rubber sleeve (301).

5. The semiconductor wafer loading and alignment mechanism according to claim 1, characterized in that: A bearing platform (4) is provided on the bearing plate (103), and a plurality of groups of vacuum suction cups (401) are provided on the bearing platform (4).

6. The semiconductor wafer loading and alignment mechanism according to claim 1, characterized in that: The bearing plate (103) is provided with a sliding groove (1031) corresponding to the position of the push rod (3).

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