Time-frequency optical processing module

Abstract

The utility model relates to a time-frequency optical processing module comprising a housing, a printed board and an optical processing radio frequency module are installed in the housing, four groups of optical receiving modules are arranged on the printed board, and the optical receiving modules are provided with optical signal interfaces and radio frequency signal interfaces. The radio frequency signal interface and the optical processing radio frequency module are connected through a radio frequency cable, and the optical processing radio frequency module and the printed board are electrically connected through a flexible connecting board. According to the utility model, through the arrangement of the printed board and the optical processing radio frequency module, interconnection of optical signals and radio frequency signals can be realized, the printed board and the optical processing radio frequency module are structurally connected through the flexible connecting board, the printed board is enabled to be adjacent to the optical processing radio frequency module, and the internal space is fully utilized while the stability is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of photoelectric conversion, and particularly relates to a time-frequency light processing module. Background Art

[0002] With the advancement of optical module transmission modes, modules are now needed to convert RF signals into optical signals. This requires optical fibers to transmit multiple time-frequency signals. However, the current challenge is the inability to ensure stable RF signal transmission, necessitating internal signal sealing. This also requires minimizing overall space while still meeting operational requirements. Utility Model Content

[0003] The present invention addresses the problems of the prior art and provides a time-frequency optical processing module. The specific technical solutions are as follows:

[0004] The present application provides a time-frequency optical processing module, including a shell, in which a printed circuit board and an optical processing radio frequency module are installed. Four groups of optical receiving modules are arranged on the printed circuit board. The optical receiving module has an optical signal interface and a radio frequency signal interface. The radio frequency signal interface and the optical processing radio frequency module are connected by an radio frequency cable, and the optical processing radio frequency module and the printed circuit board are electrically connected by a flexible connection board.

[0005] As a further technical solution of the present invention, a directly modulated laser is further mounted on the printed circuit board by screws, and the optical processing radio frequency module is directly connected to the directly modulated laser via a radio frequency cable.

[0006] As a further technical solution of the present invention, a photoelectric detector is further installed on the printed circuit board, and the photoelectric detector is used to convert the optical signal into an electrical signal.

[0007] As a further technical solution of the present invention, an FC interface, a first connector and a second connector are further installed on the housing. The FC interface is externally connected to an optical fiber, and the first connector and the second connector are both electrically connected to a printed circuit board.

[0008] As a further technical solution of the present invention, one end of the shell is open, the shell opening is covered with a cover, and the shell and the cover are detachably connected.

[0009] As a further technical solution of the present invention, the opening of the shell has a stepped surface, and the cover is mounted on the stepped surface.

[0010] The beneficial effects of the utility model are as follows:

[0011] In this application, through the setting of the printed circuit board and the optical processing RF module, the interconnection of optical signals and RF signals can be achieved. Structurally, the printed circuit board and the optical processing RF module are connected through a flexible connecting board, so that the printed circuit board is close to the optical processing RF module, ensuring stability while making full use of the internal space. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 Shows a schematic diagram of the time-frequency optical processing module structure;

[0013] Figure 2 A schematic structural diagram of the housing is shown.

[0014] Legend:

[0015] 100, housing; 110, FC interface; 120, connector 1; 130, connector 2; 200, cover; 300, printed circuit board; 310, optical receiving module; 311, optical signal interface; 312, RF signal interface; 320, directly modulated laser; 330, photodetector; 400, optical processing RF module; 500, flexible connection board. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0017] Figure 1 An exploded diagram of the time-frequency optical processing module is shown; Figure 1 In the embodiment, the time-frequency optical processing module includes a shell 100 with an opening at one end and a cover 200 covering the opening of the shell 100. The shell 100 and the cover 200 are detachably connected. The detachable connection here is generally achieved by bolt connection, snap connection, etc. in actual use; for example, in actual operation, the bolt passes through the cover 200 and is screwed to the shell 100, so that the cover 200 is pressed against the opening of the shell 100 by the bolt head; the opening of the shell 100 has a stepped surface, and the cover 200 is mounted on the stepped surface; the cover 200 is positioned by using the stepped surface to achieve hole alignment, and the upper edge of the cover 200 is aligned with the upper edge of the shell 100 after being snapped into the stepped surface, so as to ensure the beauty of the shell 100 and the cover 200 after installation.

[0018] Continue to see Figure 1The housing 100 is provided with a printed circuit board 300 and an optical processing radio frequency module 400. Four groups of optical receiving modules 310 are provided on the printed circuit board 300. The optical receiving modules 310 have an optical signal interface 311 and a radio frequency signal interface 312. The radio frequency signal interface 312 and the optical processing radio frequency module 400 are connected through a radio frequency cable. The optical processing radio frequency module 400 and the printed circuit board 300 are connected through a flexible connection board 500. The four groups of optical receiving modules 310 are used to realize the conversion between optical signals and radio frequency signals. The block 400 is directly connected to the RF signal interface 312 of the optical receiving module 310 through an RF cable. That is to say, the optical signal enters from the optical signal interface 311, is converted into an RF signal through the optical receiving module 310, and is transmitted to the optical processing RF module 400. Then, the optical processing RF module 400 can be used to perform subsequent filtering and other operations; the conversion of optical signals to RF signals is realized, and the setting of the flexible connecting board 500 electrically connects the printed circuit board 300 and the optical processing RF module 400. Its own lightness and deformability ensure stability. At the same time, the internal space is fully utilized; a direct-modulated laser 320 is also installed on the printed circuit board 300 by screws, and the optical processing RF module 400 is directly connected to the direct-modulated laser 320 through an RF cable; that is, an RF signal is input to the direct-modulated laser 320, and the RF signal indirectly modulates the optical signal by changing the current of the laser; that is, the RF signal and the optical signal can be converted into each other; a photodetector 330 is also installed on the printed circuit board 300, and the photodetector 330 is used to convert the optical signal into an electrical signal; when the optical receiving module 310 is turned During conversion, the optical signal is converted into an electrical signal by the photodetector 330. After amplification, filtering and other processing, the processed signal is output as a radio frequency signal. The housing 100 is also equipped with an FC interface 110, a connector 120 and a connector 2 130. The FC interface 110 is externally connected to an optical fiber, and the connector 1 120 and the connector 2 130 are both electrically connected to the printed circuit board 300. The connector 120 and the connector 2 130 are used to power the printed circuit board 300. The FC interface 110 serves as an optical fiber connector, which is externally connected to an optical fiber for transmitting optical signals.

[0019] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same.

Claims

1. A time-frequency optical processing module, comprising a housing (100), characterized in that: A printed circuit board (300) and an optical processing radio frequency module (400) are installed in the housing (100); four groups of optical receiving modules (310) are arranged on the printed circuit board (300); the optical receiving modules (310) have an optical signal interface (311) and a radio frequency signal interface (312); the radio frequency signal interface (312) and the optical processing radio frequency module (400) are connected via a radio frequency cable; and the optical processing radio frequency module (400) and the printed circuit board (300) are electrically connected via a flexible connection board (500).

2. The time-frequency optical processing module according to claim 1, characterized in that: A directly modulated laser (320) is also mounted on the printed circuit board (300) via screws, and the optical processing radio frequency module (400) is directly connected to the directly modulated laser (320) via a radio frequency cable.

3. The time-frequency optical processing module according to claim 1, characterized in that: A photodetector (330) is also mounted on the printed circuit board (300), and the photodetector (330) is used to convert an optical signal into an electrical signal.

4. The time-frequency optical processing module according to claim 1, characterized in that: The housing (100) is also equipped with an FC interface (110), a first connector (120), and a second connector (130). The FC interface (110) is externally connected to an optical fiber, and the first connector (120) and the second connector (130) are both electrically connected to a printed circuit board (300).

5. The time-frequency optical processing module according to claim 1, characterized in that: One end of the shell (100) is open, and a cover body (200) is covered on the opening of the shell (100), and the shell (100) and the cover body (200) are detachably connected.

6. The time-frequency optical processing module according to claim 5, characterized in that: The opening of the shell (100) has a stepped surface, and the cover (200) is mounted on the stepped surface.

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