Grinding head machining device and method for separating grinding head from workpiece

Abstract

The present application relates to the technical field of optical processing, and particularly relates to a small grinding head processing device and a grinding head and workpiece separation method. An external power source inputs power through a pressing mechanism and processes through a driving grinding head part. When the processing is finished, a linear motion part drives a grinding head limiting plate to tightly contact the grinding head to limit the overturning of the grinding head, and air is supplied to the contact surface of the grinding head and the workpiece through an air inlet joint to accelerate the separation speed. During the air supply process, the driving pressing mechanism is controlled and the value of a force sensor is constantly monitored until the value is less than a certain threshold value, which indicates that the grinding head has been separated from the workpiece. At this time, the grinding head can be quickly lifted. The device and method provided by the present application can realize the automatic separation of the grinding head and the optical element and improve the reliability of the processing.

Description

Technical Field

[0001] This invention belongs to the field of optical processing technology, and particularly relates to a small grinding head processing device and a method for separating the grinding head from the workpiece. Background Technology

[0002] In the field of optical processing, pitch grinding heads are an important grinding tool with wide applications and in-depth research. Their excellent grinding performance and stability make them the preferred tool for processing high-precision optical components. Researchers have continuously improved the grinding efficiency and processing quality of pitch grinding heads by modifying pitch materials, optimizing grinding head structures, and improving grinding processes. Currently, pitch grinding heads are widely used in the rough grinding, fine grinding, and polishing processes of optical components such as lenses, prisms, and mirrors.

[0003] However, after processing with an asphalt grinding head, the surface of the asphalt grinding head has a certain adsorption force. This adsorption force mainly comes from the material properties of the asphalt grinding head and the physical and chemical effects generated during the grinding process. Specifically, during the grinding process, a certain friction and contact pressure are formed between the asphalt grinding head and the workpiece surface, which causes asphalt particles or tiny fragments to adhere to the workpiece surface. In addition, the heat generated during the grinding process may also exacerbate this adsorption phenomenon.

[0004] Currently, grinding head-workpiece separation is done manually, a process that requires skill and experience. Operators must proceed with care and caution to avoid causing unnecessary damage or scratches to the workpiece surface. This typically involves gently tapping or twisting the grinding head to gradually separate it from the workpiece. However, this manual separation method is not only inefficient but also carries inherent risks, such as the workpiece falling or breaking. Summary of the Invention

[0005] In view of this, the present invention aims to provide a small grinding head processing device and a method for separating the grinding head from the workpiece, so that the small grinding head can be automatically separated after processing, reducing the risks caused by human operation, improving the reliability of the processing link, and enabling the entire processing process to be executed automatically.

[0006] To achieve the above objectives, the technical solution created by this invention is implemented as follows:

[0007] A small grinding head processing device includes: a grinding head for processing optical elements; a grinding head limiting plate for limiting the rotation of the grinding head; a linear motion mechanism connected to the grinding head limiting plate for driving the grinding head limiting plate to contact the grinding head; a pressure applying mechanism connected to an external power source and the grinding head for buffering the movement of the external power source and transmitting it to the grinding head; and a force sensor, the sensing end of which is connected to the pressure applying mechanism for sensing the force applied by the grinding head to the force sensor.

[0008] Furthermore, it also includes an air inlet connector; the air inlet connector is located on the grinding head limiting plate and on the same side of the grinding head limiting plate, and is used to supply air to the contact point between the grinding head and the optical element.

[0009] Furthermore, it also includes a linear motion fixing plate, a force sensor top plate, a force sensor bottom plate, and a linear motion fixing plate connected together, wherein: the force sensor top plate is connected to the fixed end of the force sensor and the output end of the pressure applying mechanism; the force sensor bottom plate is connected to the sensing end of the force sensor, the output end of the pressure applying mechanism controls the movement of the force sensor top plate, and the force sensor senses the force from the force sensor top plate and the force sensor bottom plate; the linear motion fixing plate is connected to the force sensor bottom plate, and the linear motion mechanism is mounted on the linear motion fixing plate.

[0010] Furthermore, it also includes a sensing auxiliary guide post, and a guide hole matching the sensing auxiliary guide post is opened on the bottom plate of the force sensor; one end of the sensing auxiliary guide post extends into the guide hole, the other end of the sensing auxiliary guide post is connected to the top plate of the force sensor, and the direction of the sensing auxiliary guide post is parallel to the force direction of the force sensor.

[0011] Furthermore, it also includes a sensing auxiliary guide post, and a guide hole matching the sensing auxiliary guide post is opened on the force sensor base plate. One end of the sensing auxiliary guide post extends into the guide hole, passes through the force sensor base plate, and is connected to the output end of the pressure application mechanism. The other end of the sensing auxiliary guide post is connected to the top plate of the force sensor, so that the direction of the sensing auxiliary guide post is parallel to the force direction of the force sensor.

[0012] Furthermore, rolling steel balls are provided on the side wall of the guide hole. The sensing auxiliary guide post cooperates with the rolling steel balls to guide the force from the top plate and bottom plate of the force sensor to the force direction of the force sensor.

[0013] Furthermore, it also includes a linear motion guide post, which is fixed on the grinding head limiting plate and passes through the linear motion fixing plate to provide auxiliary motion guidance for the linear motion mechanism.

[0014] Furthermore, the grinding head is connected to the pressure application mechanism via a universal joint.

[0015] A method for separating a grinding head from a workpiece, according to the small grinding head processing apparatus provided by the present invention, is characterized by comprising:

[0016] S1: When the processing of the optical element is finished, the external power source stops driving the pressure mechanism, and the grinding head stops moving; control the external power source to drive the grinding head to maintain a contactless relationship between the grinding head and the optical element;

[0017] S2: The linear motion mechanism drives the grinding head limiting plate to move toward the grinding head, and makes the grinding head limiting plate and the grinding head in close contact;

[0018] S3: Control the external power source to drive the grinding head away from the optical element in a preset step size, and record the force on the force sensor in real time;

[0019] S4: If the value collected by the current force sensor is greater than or equal to the set force threshold, then wait for a preset time and repeat step S3; otherwise, repeat step S3 directly.

[0020] S5: Repeat step S4 until the grinding head is completely separated from the optical element.

[0021] Furthermore, the preset step size in step S3 is no greater than [missing value]. ,in This indicates the distance the grinding head moves along the normal direction of the current contact point of the optical element in step S1; step S3 also includes: the air inlet connector supplies air to the contact position between the optical element and the grinding head.

[0022] Compared with the prior art, the present invention can achieve the following beneficial effects:

[0023] This invention provides a novel small grinding head processing device and a method for separating the grinding head from the workpiece. This allows for automatic separation of the grinding head from the workpiece after processing, reducing the risks associated with manual operation, improving the reliability of the processing steps, and automating the entire process. Furthermore, by incorporating sensor-assisted guide posts and linear motion guide posts, this invention ensures the stability of the small grinding head retraction and force measurement direction, preventing deviations in the small grinding head retraction caused by shifts in motion and force measurement direction. Attached Figure Description

[0024] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0025] Figure 1 This is a schematic diagram of the overall structure of the small grinding head processing device described in Example 1;

[0026] Figure 2 This is a schematic diagram of the relevant parts of the pressure application mechanism in the small grinding head processing device described in Example 1;

[0027] Figure 3 This is a schematic diagram of the relevant parts of the linear motion mechanism in the small grinding head processing device described in Example 1;

[0028] Figure 4This is a schematic diagram of the relevant parts of the grinding head limiting plate in the small grinding head processing device described in Example 1;

[0029] Figure 5 This is a schematic diagram of the relevant parts of the grinding head in the small grinding head processing device described in Example 1;

[0030] Figure 6 This is a schematic diagram of the pressure application mechanism described in Example 1;

[0031] Figure 7 This is a schematic diagram of the overall structure of the small grinding head processing device described in Example 2 from one perspective;

[0032] Figure 8 This is a schematic diagram of the overall structure of the small grinding head processing device described in Example 2 from another perspective;

[0033] Figure 9 A schematic flowchart illustrating the method for separating the grinding head from the workpiece as described in an embodiment of the present invention;

[0034] Figure 10 The flowchart illustrates the method for separating the grinding head from the workpiece as described in the embodiments of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Grinding head; 2. Grinding head limiting plate; 3. Linear motion mechanism; 4. Pressure application mechanism; 5. Force sensor; 6. Air inlet connector; 7. Linear motion fixing plate; 8. Force sensor top plate; 9. Force sensor bottom plate; 10. Linear motion connecting column; 11. Linear motion fixing plate; 12. Sensor auxiliary guide column; 13. Linear motion guide column; 14. Universal joint; 15. Grinding head fixing component; 16. Displacement sensor. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not constitute a limitation thereof.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] Example 1:

[0043] like Figures 1 to 6 As shown, the small grinding head processing device described in this embodiment includes a grinding head 1, a grinding head limiting plate 2, a linear motion mechanism 3, a pressure applying mechanism 4, and a force sensor 5. The grinding head 1 is used to process optical components; the grinding head limiting plate 2 is used to restrict the rotation of the grinding head 1; the linear motion mechanism 3 is connected to the grinding head limiting plate 2 and is used to drive the grinding head limiting plate 2 to contact the grinding head 1; the pressure applying mechanism 4 is connected to an external power source and the grinding head 1, and is used to buffer the movement of the external power source and transmit it to the grinding head 1; the sensing end of the force sensor 5 is connected to the pressure applying mechanism 4 and is used to sense the force applied by the grinding head 1 to the force sensor 5.

[0044] The pressure applying mechanism 4 is connected to an external power source via screws or other means. The pressure applying mechanism 4 can be an elastic mechanism with a displacement sensor 16, or a motion conversion mechanism such as an eccentric shaft with a displacement sensor 16. In this embodiment, an elastic structure is used, and a displacement sensor 16 is provided between the fixed end and the output end of the pressure applying mechanism 4. The elastic mechanism can be a cylinder, electric cylinder, spring, etc., and the displacement sensor 16 can be a linear measurement sensor such as a resistance ruler or an LVDT sensor. The linear motion mechanism 3 can be a cylinder, electric cylinder, or other types of motion mechanism.

[0045] In this embodiment, the small grinding head processing device also includes an air inlet connector 6. The air inlet connector 6 is disposed on the grinding head limiting plate 2 and is located on the same side of the grinding head limiting plate 2 as the grinding head 1, and is used to supply air to the contact point between the grinding head 1 and the optical element.

[0046] In this embodiment, the small grinding head processing device further includes a linear motion fixing plate 7, a force sensor top plate 8, and a force sensor bottom plate 9. The force sensor top plate 8 is connected to the fixed end of the force sensor 5 and the output end of the pressure applying mechanism 4; the force sensor bottom plate 9 is connected to the sensing end of the force sensor 5, and the output end of the pressure applying mechanism 4 controls the movement of the force sensor top plate 8, allowing the force sensor 5 to sense the force from the force sensor top plate 8 and the force sensor bottom plate 9; the linear motion fixing plate 7 is connected to the force sensor bottom plate 9, and the linear motion mechanism 3 is mounted on the linear motion fixing plate 7.

[0047] Specifically, the linear motion fixing plate 7 is fixedly connected to the force sensor base plate 9 by screws; there are three linear motion mechanisms 3, which are arranged circumferentially on the linear motion fixing plate 7, and the movement direction of the three linear motion mechanisms 3 is consistent with the force direction of the force sensor 5. Furthermore, three motion holes adapted to the linear motion mechanisms 3 are uniformly provided on the circumference of the linear motion fixing plate 7. The fixed end of each linear motion mechanism 3 is installed at the corresponding motion hole by screws. The moving end of each linear motion mechanism 3 drives the grinding head limiting plate 2 to move through the corresponding motion hole. Specifically, a linear motion connecting post 10 and a linear motion fixing plate 11 are provided at the moving end of each linear motion mechanism 3. The linear motion connecting post 10 passes through the motion hole, and the linear motion fixing plate 11 is connected to the grinding head limiting plate 2, so that the moving end of each linear motion mechanism 3 drives the linear motion connecting post 10 to move in the corresponding motion hole, and then drives the grinding head limiting plate 2 to move through the linear motion fixing plate 11.

[0048] In this embodiment, the small grinding head processing device further includes a sensing auxiliary guide post 12, and a guide hole matching the sensing auxiliary guide post 12 is provided on the force sensor base plate 9; one end of the sensing auxiliary guide post 12 extends into the guide hole, and the other end of the sensing auxiliary guide post 12 is connected to the force sensor top plate 8, and the direction of the sensing auxiliary guide post 12 is parallel to the force direction of the force sensor 5. At this time, there is no constraint between the force sensor base plate 9 and the sensing auxiliary guide post 12 in the force direction of the force sensor 5.

[0049] In this embodiment, rolling steel balls are provided on the sidewall of the guide hole. The sensing auxiliary guide post 12 cooperates with the rolling steel balls to guide the force from the top plate 8 and the bottom plate 9 of the force sensor to the direction of force applied to the force sensor 5. At this time, the rolling steel balls and the sensing auxiliary guide post 12 cooperate to form a guide structure that approximates a linear bearing. The rolling steel balls restrict the auxiliary guide post, so that the sensing auxiliary guide post 12 can only move in the direction of force applied to the force sensor 5, avoiding the generation of forces in other directions.

[0050] In this embodiment, the small grinding head processing device also includes linear motion guide posts 13. The linear motion guide posts 13 are fixed to the grinding head limiting plate 2 and pass through the linear motion fixing plate 7, providing auxiliary motion guidance for the linear motion mechanism 3. Specifically, there are three linear motion guide posts 13 placed near the corresponding linear motion mechanism 3, and the direction of the linear motion guide posts 13 is consistent with the movement direction of the linear motion mechanism 3. Furthermore, the linear motion guide posts 13 and the air inlet connector 6 are fixed to the grinding head limiting plate 2 with screws, and the linear motion guide posts 13 and the air inlet connector 6 are respectively fixed to both sides of the grinding head limiting plate 2 with screws and threads.

[0051] In this embodiment, the grinding head 1 is connected to the pressure applying mechanism 4 via a universal joint 14. Specifically, the grinding head 1 is mounted on the grinding head fixing member 15 via the universal joint 14. The grinding head fixing member 15 is connected to the linear motion fixing plate 7, which is connected to the force sensor base plate 9. The force sensor base plate 9 is connected to the force sensor top plate 8, which is connected to the output end of the pressure applying mechanism 4. This completes the connection between the grinding head 1 and the pressure applying mechanism 4 via the universal joint 14. Specifically, one end of the universal joint 14 is fixed to the grinding head fixing member 15 with screws, and the other end of the universal joint 14 has external threads. The opposite surface of the grinding surface in the grinding head 1 has a circular hole with internal threads, and the universal joint 14 and the grinding head 1 are fixed by these threads. The universal joint 14 is used to enable the grinding head 1 to fit with the optical element in multiple directions during the processing, making the grinding head 1 fit more tightly with the optical element and improving the processing effect.

[0052] Furthermore, in this embodiment, a through hole matching the grinding head fixing member 15 is provided on the grinding head limiting plate 2, so that the grinding head limiting plate 2 will only contact the grinding head 1 during the movement. To elaborate further, the grinding head limiting plate 2 has a through hole, so that when the linear motion mechanism 3 drives the grinding head limiting plate 2 to move, the grinding head fixing member 15 passes through the through hole, so that the grinding head limiting plate 2 only contacts the grinding head 1 and will not interfere with other devices. At the same time, it restricts the rotation of the grinding head 1 in other directions and prevents scratching of optical components.

[0053] The operation of the small grinding head processing device provided in this embodiment includes: during processing, an external power source drives the grinding head 1 to process through a pressure applying mechanism 4. When processing is completed, the external power source controls the grinding head 1 to stop processing and lifts the grinding head 1, so that the grinding head 1 is in contact with the surface of the optical element but without force. At this time, the linear motion mechanism 3 drives the grinding head limiting plate 2 to move towards the grinding head 1, so that the grinding head limiting plate 2 restricts the rotation of the grinding head 1. Then, air is introduced to the contact surface between the grinding head 1 and the optical element through the air inlet connector 6 to accelerate the separation speed. At the same time, the external power source further lifts the grinding head 1 through the pressure applying mechanism 4, and continuously monitors the value of the force sensor 5 until the value is less than a certain threshold, which indicates that the grinding head 1 has been separated from the optical element.

[0054] Example 2:

[0055] like Figures 6 to 7 As shown, the small grinding head processing device described in this embodiment is simplified from the small grinding head processing device provided in Embodiment 1, and specifically includes:

[0056] The pressure applying mechanism 4 is connected to an external power source by screws or other means. The linear motion fixing plate 7 is fixed to the fixing part of the pressure applying mechanism 4. The grinding head 1 is connected to the output end of the pressure applying mechanism 4 through a universal joint 14.

[0057] There are two linear motion mechanisms 3, which are placed on both sides of the pressure applying mechanism 4. The fixed part of the linear motion mechanism 3 is connected to the linear motion fixed plate 7, so that the motion direction of the linear motion mechanism 3 is consistent with the output direction of the pressure applying mechanism 4.

[0058] The grinding head limiting plate 2 is connected to the output end of the linear motion mechanism 3, so that the linear motion mechanism 3 drives the grinding head limiting plate 2 to move. In this embodiment, a through hole is provided in the grinding head limiting plate 2 to allow the universal joint 14 to pass through. When the linear motion mechanism 3 drives the grinding head limiting plate 2 to approach the grinding head 1, it avoids the grinding head limiting plate 2 from contacting other devices and interfering with it.

[0059] The fixing part of the force sensor 5 is connected to the top plate 8 of the force sensor, and the sensing part of the force sensor 5 is connected to the bottom plate 9 of the force sensor. In this specific embodiment, two sensing auxiliary guide columns 12 are used. One end of one sensing auxiliary guide column 12 is fixedly connected to the top plate 8 of the force sensor, and the other end passes through the bottom plate 9 of the force sensor, the linear motion fixing plate 7 and the pressure applying mechanism 4 in sequence, and then connects to the output end of the pressure applying mechanism 4. This allows the sensing auxiliary guide column 12 to transmit the movement of the output end of the pressure applying mechanism 4 to the top plate 8 of the force sensor, and the force sensor 5 senses the force exerted on the force sensor 5 by both the top plate 8 and the bottom plate 9 of the force sensor. The other sensing auxiliary guide column 12 only passes through the bottom plate 9 of the force sensor, the linear motion fixing plate 7 and the pressure applying mechanism 4 in sequence, and is connected to the output end of the pressure applying mechanism 4. It does not need to be connected to the top plate 8 of the force sensor. The function of this sensing auxiliary guide column 12 is only to transmit the movement direction of the output end of the pressure applying mechanism 4 to the direction of the force sensor 5 that can sense the force.

[0060] The operation of the small grinding head processing device provided in this embodiment includes: during processing, an external power source drives the grinding head 1 to process through a pressure applying mechanism 4. When processing is completed, the external power source controls the grinding head 1 to stop processing and lifts the grinding head 1, so that the grinding head 1 is in contact with the surface of the optical element but without force. At this time, the linear motion mechanism 3 drives the grinding head limiting plate 2 to move towards the grinding head 1, so that the grinding head limiting plate 2 restricts the rotation of the grinding head 1. At the same time, the external power source further lifts the grinding head 1 through the pressure applying mechanism 4, while continuously monitoring the value of the force sensor 5 until the value is less than a certain threshold, which indicates that the grinding head 1 has been separated from the optical element.

[0061] The present invention also provides a method for separating the grinding head from the workpiece, wherein the small grinding head processing device provided by the present invention is combined with Figures 1-9 ,include:

[0062] S1: When the processing of the optical element is finished, the external power source stops driving the pressure mechanism 4, and the grinding head 1 stops moving; control the external power source to drive the grinding head 1 to move, so that the grinding head 1 and the optical element maintain contact without force.

[0063] In this embodiment of the invention, since the pressure applying mechanism 4 includes an elastic mechanism and a displacement sensor for measuring the length change of the elastic mechanism, the reading of the displacement sensor is defined as L when the elastic mechanism in the pressure applying mechanism 4 is at its maximum displacement. When the force sensor 5 detects that the force applied by the force sensor base plate 9 to the force sensor 5 is a tensile force, the reading of the displacement sensor is positive; when the force applied by the force sensor base plate 9 to the force sensor 5 is a compressive force, the reading of the displacement sensor is negative. The distance that the pressure applying part moves when it drives the grinding head 1 is... At this time, the reading obtained by the displacement sensor is And read the value of force sensor 5 as P0 at this time.

[0064] S2: The linear motion mechanism 3 drives the grinding head limiting plate 2 to move toward the grinding head 1, and makes the grinding head limiting plate 2 and the grinding head 1 in close contact.

[0065] For the small grinding head processing device in Embodiment 1, the air inlet connector 6 can also be controlled to ventilate to the contact position between the optical element and the grinding head 1, thereby accelerating the separation of the grinding head 1 from the optical element.

[0066] S3: Drive the grinding head 1 to move along the normal direction of the current contact point of the optical element with a preset step size, and record the value collected by the force sensor 5.

[0067] In some embodiments, the preset step size L in step S3 step Not greater than ,in This indicates the distance that the grinding head 1 moves along the normal direction of the current contact point of the optical element in step S1.

[0068] S4: If the value collected by the current force sensor 5 is greater than or equal to the set force threshold, then wait for the preset time and repeat step S3; otherwise, repeat step S3 directly.

[0069] During the polishing process of the optical mirror, the grinding head 1 may sometimes adhere to the surface of the mirror. If the grinding head 1 is lifted directly at this time, it may pull the mirror up or damage it. Therefore, when the force sensor 5 detects a large suction force, it should be stabilized for a while before continuing to lift, or a period of time should be waited for air to enter between the grinding head 1 and the mirror before lifting. It should not be lifted too quickly at once. In this embodiment of the invention, the preset time is 1 second.

[0070] S5: Repeat step S4 until the grinding head 1 is completely separated from the optical element.

[0071] In this embodiment of the invention, after completing step S5, the external power source is quickly raised to the initial position of the program, and the linear motion mechanism 3 is controlled to drive the grinding head limiting plate 2 to separate from the grinding head 1 until the grinding head limiting plate 2 returns to the initial position.

[0072] It should be understood that the various forms of processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this invention disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this invention can be achieved, and this is not limited herein.

[0073] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A small grinding head processing device, characterized in that, include: Grinding heads are used to process optical components; Grinding head limiting plate, used to restrict the rotation of the grinding head; The linear motion mechanism is connected to the grinding head limiting plate and is used to drive the grinding head limiting plate to contact the grinding head; The pressure application mechanism, connected to the external power source and the grinding head, is used to buffer the movement of the external power source and transmit it to the grinding head; The force sensor, whose sensing end is connected to the pressure application mechanism, is used to sense the force applied by the grinding head to the force sensor. When the value of the force sensor is less than a certain threshold, it indicates that the grinding head has been separated from the optical element. It also includes a linear motion fixing plate, a force sensor top plate, and a force sensor bottom plate, wherein: the force sensor top plate is connected to the fixed end of the force sensor and the output end of the pressure applying mechanism; the force sensor bottom plate is connected to the sensing end of the force sensor, the output end of the pressure applying mechanism controls the movement of the force sensor top plate, and the force sensor senses the force from the force sensor top plate and the force sensor bottom plate; the linear motion fixing plate is connected to the force sensor bottom plate, and the linear motion mechanism is mounted on the linear motion fixing plate; It also includes a sensing auxiliary guide post, and a guide hole matching the sensing auxiliary guide post is opened on the bottom plate of the force sensor; one end of the sensing auxiliary guide post extends into the guide hole, the other end of the sensing auxiliary guide post is connected to the top plate of the force sensor, and the direction of the sensing auxiliary guide post is parallel to the force direction of the force sensor.

2. The small grinding head processing device according to claim 1, characterized in that, It also includes an air inlet connector; the air inlet connector is located on the grinding head limiting plate and on the same side of the grinding head limiting plate, and is used to supply air to the contact point between the grinding head and the optical element.

3. The small grinding head processing device according to claim 1, characterized in that, Rolling steel balls are provided on the side wall of the guide hole. The sensing auxiliary guide post cooperates with the rolling steel balls to guide the force from the top plate and the bottom plate of the force sensor to the force direction of the force sensor.

4. The small grinding head processing device according to claim 1, characterized in that, It also includes a linear motion guide post, which is fixed on the grinding head limiting plate and passes through the linear motion fixing plate to provide auxiliary motion guidance for the linear motion mechanism.

5. The small grinding head processing device according to claim 1, characterized in that, The grinding head is connected to the pressure application mechanism via a universal joint.

6. A small grinding head processing device, characterized in that, include: Grinding heads are used to process optical components; Grinding head limiting plate, used to restrict the rotation of the grinding head; The linear motion mechanism is connected to the grinding head limiting plate and is used to drive the grinding head limiting plate to contact the grinding head; The pressure application mechanism, connected to the external power source and the grinding head, is used to buffer the movement of the external power source and transmit it to the grinding head; The force sensor, whose sensing end is connected to the pressure application mechanism, is used to sense the force applied by the grinding head to the force sensor. When the value of the force sensor is less than a certain threshold, it indicates that the grinding head has been separated from the optical element. It also includes a linear motion fixing plate, a force sensor top plate, and a force sensor bottom plate, wherein: the force sensor top plate is connected to the fixed end of the force sensor and the output end of the pressure applying mechanism; the force sensor bottom plate is connected to the sensing end of the force sensor, the output end of the pressure applying mechanism controls the movement of the force sensor top plate, and the force sensor senses the force from the force sensor top plate and the force sensor bottom plate; the linear motion fixing plate is connected to the force sensor bottom plate, and the linear motion mechanism is mounted on the linear motion fixing plate; It also includes a sensing auxiliary guide post, and a guide hole matching the sensing auxiliary guide post is opened on the force sensor base plate. One end of the sensing auxiliary guide post extends into the guide hole, passes through the force sensor base plate and is connected to the output end of the pressure application mechanism. The other end of the sensing auxiliary guide post is connected to the top plate of the force sensor, so that the direction of the sensing auxiliary guide post is parallel to the force direction of the force sensor.

7. The small grinding head processing device according to claim 6, characterized in that, It also includes an air inlet connector; the air inlet connector is located on the grinding head limiting plate and on the same side of the grinding head limiting plate, and is used to supply air to the contact point between the grinding head and the optical element.

8. The small grinding head processing device according to claim 6, characterized in that, Rolling steel balls are provided on the side wall of the guide hole. The sensing auxiliary guide post cooperates with the rolling steel balls to guide the force from the top plate and the bottom plate of the force sensor to the force direction of the force sensor.

9. The small grinding head processing device according to claim 6, characterized in that, It also includes a linear motion guide post, which is fixed on the grinding head limiting plate and passes through the linear motion fixing plate to provide auxiliary motion guidance for the linear motion mechanism.

10. The small grinding head processing device according to claim 6, characterized in that, The grinding head is connected to the pressure application mechanism via a universal joint.

11. A method for separating a grinding head from a workpiece, comprising the small grinding head processing apparatus according to any one of claims 1 to 5, or the small grinding head processing apparatus according to any one of claims 6 to 10, characterized in that, include: S1: When the processing of the optical element is finished, the external power source stops driving the pressure mechanism, and the grinding head stops moving; control the external power source to drive the grinding head to maintain a contactless relationship between the grinding head and the optical element; S2: The linear motion mechanism drives the grinding head limiting plate to move toward the grinding head, and makes the grinding head limiting plate and the grinding head in close contact; S3: Control the external power source to drive the grinding head away from the optical element in a preset step size, and record the force on the force sensor in real time; S4: If the value collected by the current force sensor is greater than or equal to the set force threshold, then wait for a preset time and repeat step S3; otherwise, repeat step S3 directly. S5: Repeat step S4 until the grinding head is completely separated from the optical element.

12. The method for separating the grinding head from the workpiece according to claim 11, characterized in that, The preset step size in step S3 is no greater than ,in This indicates the distance the grinding head moves along the normal direction of the current contact point of the optical element in step S1; Step S3 also includes: an air inlet connector is installed on the grinding head limiting plate, and the air inlet connector supplies air to the contact position between the optical element and the grinding head.

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