Pickup loudspeaker

Abstract

The utility model relates to the technical field of audio, in particular to a pickup loudspeaker. Comprising a shell, a pickup assembly and a loudspeaker, and an accommodating cavity is formed in the shell; the pickup assembly is arranged in the containing cavity and comprises an MIC integrated circuit board and an audio processing circuit board, the MIC integrated circuit board surrounds the inner wall of the shell in the circumferential direction of the shell, at least four MIC patches are arranged on the MIC integrated circuit board and are correspondingly distributed on the periphery of the shell, and pickup holes corresponding to the MIC patches are formed in the side wall of the shell; the audio processing circuit board is located in the MIC integrated circuit board; the loudspeaker is adjacent to the audio processing circuit board, and a loudspeaker hole corresponding to the loudspeaker is formed in the top of the shell. According to the arrangement, the range and quality of sound signals received by the pickup horn can be guaranteed, the use effect of participants is improved, the size of the shell is reduced, and popularization and use of the pickup horn are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of audio technology, in particular to a sound pickup speaker. Background Art

[0002] Audio speakers are widely used in various conferences. They consist of a housing, a microphone integrated circuit board (MIC) and a speaker. The MIC receives and converts audio signals into electrical signals, while the speaker receives and converts these electrical signals into audio signals for output. These help ensure that discussion content is fully recorded and conveyed, improving meeting efficiency and quality.

[0003] The current pickup speakers have a limited range of receiving sound signals, especially for participants in the corners of the meeting, which is not conducive to the promotion and use of pickup speakers. Utility Model Content

[0004] The technical problem to be solved by the embodiment of the present utility model is to provide a sound pickup speaker to solve the problem in the prior art that the sound pickup speaker has a limited range of receiving sound signals, especially the poor ability to receive sound signals from participants in the corners of the meeting, which is not conducive to the promotion and use of the sound pickup speaker.

[0005] The utility model discloses a sound pickup speaker, comprising: a shell, a sound pickup component and a speaker, wherein a housing is formed in the shell; the sound pickup component is arranged in the housing cavity, and comprises a MIC integrated circuit board and an audio processing circuit board, the MIC integrated circuit board is surrounded on the inner wall of the shell along the circumference of the shell, at least four MIC patches are arranged on the MIC integrated circuit board, and are correspondingly distributed on the four sides of the shell, and a sound pickup hole corresponding to each MIC patch is formed on the side wall of the shell; the audio processing circuit board is located in the MIC integrated circuit board; the speaker is arranged in the housing cavity and is adjacent to the audio processing circuit board, and a speaker hole corresponding to the speaker is formed on the top of the shell.

[0006] Optionally, the shell includes a base, an upper shell and an upper cover, the upper shell is arranged above the base, the base and the upper shell together form the accommodating cavity, the MIC integrated circuit board is arranged on the inner wall of the base, and the sound pickup hole is formed on the side wall of the base; the audio processing circuit board is arranged in the upper shell, and the speaker is arranged between the base and the upper shell; a mounting groove with a through hole is formed on the side of the upper shell away from the base, the upper cover is arranged in the mounting groove, and the speaker hole and the first heat dissipation hole are formed on the upper cover.

[0007] Optionally, a first accommodating area and a second accommodating area are formed adjacent to each other in the upper shell; a speaker rack is provided between the first accommodating area and the base, an installation cavity is formed on the speaker rack, the speaker is provided in the installation cavity, and the installation cavity is connected to the speaker hole through the through hole; a first positioning column is formed in the second accommodating area, and the audio processing circuit board is fixed in the second accommodating area by the first positioning column.

[0008] Optionally, a protective cover is provided on the side of the upper cover facing away from the upper shell, and the protective cover is located in the mounting groove; annular reinforcement ribs distributed in an array are provided on the side of the upper cover close to the upper shell, and the first heat dissipation holes and the speaker holes are correspondingly distributed in part of the annular reinforcement ribs.

[0009] Optionally, an adhesive plate is provided between the upper cover and the mounting groove.

[0010] Optionally, the speaker stand includes a first bracket and a second bracket that are connected, the first bracket is fixed on the base, the second bracket is arranged above the first bracket, the second bracket is provided with an auxiliary positioning ring, and the auxiliary positioning ring is provided with a positioning ring; a second positioning column is provided on the upper shell, and the second positioning column is inserted into the positioning ring.

[0011] Optionally, a button is provided on the outer side of the upper shell, and a button sensor board is provided in the second accommodating area. The button is connected to the button sensor board, and the button sensor board is electrically connected to the MIC integrated circuit board, the audio processing circuit board and the speaker.

[0012] Optionally, a non-slip pad and heat dissipation holes are provided on a side of the base facing away from the upper shell.

[0013] Optionally, a reinforcing convex plate is provided on the inner wall of the base, a positioning protrusion is provided on the reinforcing convex plate, a positioning hole is formed on the MIC integrated circuit board, and the positioning protrusion is located in the positioning hole; a third positioning column is provided in the base, a top plate is provided on the third positioning column, and the MIC integrated circuit board is supported between the top plate and the reinforcing convex plate.

[0014] Optionally, a protection pad is further provided between the MIC integrated circuit board and the abutting plate, an avoidance hole is formed on the protection pad, and the MIC patch is located in the avoidance hole.

[0015] Compared with the prior art, the microphone speaker provided by the embodiment of the present invention has the following advantages: a MIC integrated circuit board and an audio processing circuit board are simultaneously arranged in the housing cavity of the housing, wherein the MIC integrated circuit board surrounds the inner wall of the housing along the circumference of the housing, and at least four MIC patches are arranged on the MIC integrated circuit board, which are distributed on the four sides of the housing and cooperate with the corresponding pickup holes, so that the MIC integrated circuit board can receive the sound signals of the participants located around the conference. At the same time, an audio processing circuit board is arranged in the housing cavity, and the audio processing circuit board is electrically connected to the MIC integrated circuit board for processing the sound signals. , enhancing the quality of the sound signal; under the joint action of the MIC integrated circuit board and the audio processing circuit board, the range and quality of the sound signal received by the pickup speaker are improved, and the pickup component converts the received sound signal into an electrical signal; by setting a speaker, the above electrical signal is converted into an amplified sound signal and output through the speaker hole, and the speaker hole is located at the top of the shell, thereby improving the output effect of the amplified sound signal; the above MIC integrated circuit board, audio processing circuit board and speaker are all arranged in the accommodating cavity, and the audio processing circuit board is arranged in the MIC integrated circuit board. The audio processing circuit board is arranged adjacent to the speaker, which improves the integration of the pickup component and the speaker and reduces the volume of the shell. The above setting can ensure the range and quality of the sound signal received by the pickup speaker, improve the use effect of the participants, and at the same time reduce the volume of the shell, which is conducive to the promotion and use of the pickup speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 This is one of the three-dimensional schematic diagrams of the sound pickup speaker provided by the embodiment of the present utility model;

[0018] Figure 2 This is the second three-dimensional schematic diagram of the sound pickup speaker provided by the embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of the distribution structure of the speaker and the audio processing circuit board provided in an embodiment of the present utility model on the base;

[0020] Figure 4 This is a schematic diagram of the structure of the MIC integrated circuit board provided by the embodiment of the utility model on the base;

[0021] Figure 5 yes Figure 4 A partial enlarged schematic diagram of position A in the middle;

[0022] Figure 6 This is a schematic structural diagram of a base provided by an embodiment of the present utility model;

[0023] Figure 7 This is a schematic diagram of the structure of the MIC integrated circuit board provided by an embodiment of the present utility model;

[0024] Figure 8 This is a schematic structural diagram of the upper shell and the base provided by an embodiment of the present utility model;

[0025] Figure 9 This is a schematic structural diagram of the upper housing provided by an embodiment of the present utility model;

[0026] Figure 10 This is a bottom view of the upper cover provided by an embodiment of the utility model;

[0027] Figure 11 It is a structural schematic diagram of a speaker bracket provided by an embodiment of the utility model.

[0028] The reference numerals in the figures are:

[0029] 10. Housing; 101. Sound pickup hole; 102. First heat dissipation hole; 103. Speaker hole; 110. Base; 111. Second heat dissipation hole; 113. Reinforcement convex plate; 114. Positioning protrusion; 115. Third positioning column; 116. Top plate; 117. Protective pad; 120. Upper housing; 1201. Mounting groove; 1202. Through hole; 121. First accommodating area; 122. Second accommodating area; 1221. First positioning column; 124. Two positioning columns; 125, button; 126, button sensor board; 130, upper cover; 131, protective cover; 132, annular reinforcement rib; 20, MIC integrated circuit board; 210, MIC patch; 201, positioning hole; 30, audio processing circuit board; 40, speaker; 50, speaker rack; 501, mounting cavity; 510, first bracket; 520, second bracket; 521, auxiliary positioning ring; 522, positioning ring; 710, main control circuit board. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, a detailed description of the preferred embodiments of the present utility model will be given.

[0031] The present invention provides a sound pickup speaker. Figures 1 to 7As shown, it includes a shell 10, a pickup assembly and a speaker 40. A accommodating cavity is formed in the shell 10; the pickup assembly is arranged in the accommodating cavity, including a MIC integrated circuit board 20 and an audio processing circuit board 30. The MIC integrated circuit board 20 surrounds the inner wall of the shell 10 along the circumference of the shell 10. At least four MIC patches 210 are provided on the MIC integrated circuit board 20, which are correspondingly distributed on the four sides of the shell 10, and a pickup hole 101 corresponding to each MIC patch 210 is formed on the side wall of the shell 10; the audio processing circuit board 30 is located in the MIC integrated circuit board 20; the speaker 40 is arranged in the accommodating cavity and is adjacent to the audio processing circuit board 30. A speaker hole 103 corresponding to the speaker 40 is formed on the top of the shell 10.

[0032] In this embodiment, a MIC integrated circuit board 20 and an audio processing circuit board 30 are disposed within the housing cavity of the housing 10. The MIC integrated circuit board 20 surrounds the inner wall of the housing 10 along its circumference. The MIC integrated circuit board 20 is provided with at least four MIC patches 210. The MIC patches 210 distributed around the four sides of the housing 10 cooperate with corresponding sound pickup holes 101, so that the MIC integrated circuit board 20 can receive voice signals from participants located around the conference. At the same time, the audio processing circuit board 30 disposed within the housing cavity is electrically connected to the MIC integrated circuit board 20 and is used to process the voice signals to enhance the quality of the voice signals. The combined effects of the MIC integrated circuit board 20 and the audio processing circuit board 30 improve the range and quality of the sound signal received by the pickup speaker. The pickup assembly converts the received sound signal into an electrical signal. The speaker 40 is provided to convert the electrical signal into an amplified sound signal and output it through the speaker hole 103. The speaker hole 103 is located at the top of the housing, thereby improving the output effect of the amplified sound signal. The MIC integrated circuit board 20, the audio processing circuit board 30, and the speaker 40 are all disposed within the accommodating cavity. The audio processing circuit board 30 is disposed within the MIC integrated circuit board 20. The audio processing circuit board 30 and the speaker 40 are disposed adjacent to each other, thereby improving the integration of the pickup assembly and the speaker 40 and reducing the volume of the housing 10. The above arrangement ensures the range and quality of the sound signal received by the pickup speaker, improving the user experience for participants, while also reducing the volume of the housing 10, which is conducive to the promotion and use of the pickup speaker.

[0033] As a preferred solution of this embodiment, refer to Figure 1 and Figure 8The outer shell 10 includes a base 110, an upper shell 120 and an upper cover 130. The upper shell 120 is arranged above the base 110. The base 110 and the upper shell 120 together form a accommodating cavity. The MIC integrated circuit board 20 is arranged on the inner wall of the base 110, and a pickup hole 101 is formed on the side wall of the base 110; the audio processing circuit board 30 is arranged in the upper shell 120, and the speaker 40 is arranged between the base 110 and the upper shell 120; a mounting groove 1201 with a through hole 1202 is formed on the side of the upper shell 120 away from the base 110, and the upper cover 130 is arranged in the mounting groove 1201. A first heat dissipation hole 102 and a speaker hole 103 are formed on the upper cover 130.

[0034] Here, a structural example of the housing 10 is given. Specifically, the housing 10 includes a base 110, an upper shell 120 and an upper cover 130. The upper shell 120 is arranged above the base 110 so that the upper shell 120 and the base 110 are enclosed to form a accommodating cavity, providing a stable installation environment for the pickup component. The MIC integrated circuit board 20 is arranged on the inner wall of the base 110, and a pickup hole 101 is formed on the side wall of the base 110 to achieve the purpose of receiving sound signals through the MIC integrated circuit board 20. The audio processing circuit board 30 is arranged in the upper shell 120, and the speaker 40 is arranged between the base 110 and the upper shell 120, so as to improve the integration of the audio processing circuit board 30 and the speaker 40 in the shell 10; a mounting groove 1201 with a through hole 1202 is formed on the side of the upper shell 120 away from the base 110, and the mounting groove 1201 is provided to provide a setting environment for the upper cover 130, and the through hole 1202 is provided to connect the first heat dissipation hole 102 and the audio processing circuit board 30 to dissipate the heat in the shell in time, and to connect the speaker hole 103 and the speaker 40 to ensure the reception of sound signals and the output of amplified sound signals.

[0035] As a preferred solution of this embodiment, refer to Figure 3 、 Figure 8 and Figure 9 A first accommodating area 121 and a second accommodating area 122 are formed adjacent to each other in the upper shell 120; a speaker rack 50 is arranged between the first accommodating area 121 and the base 110, and a mounting cavity 501 is formed on the speaker rack 50. The speaker 40 is arranged in the mounting cavity 501, and the mounting cavity 501 is connected to the speaker hole 103 through the through hole 1202; a first positioning column 1221 is formed in the second accommodating area 122, and the audio processing circuit board 30 is fixed in the second accommodating area 122 through the first positioning column 1221.

[0036] Among them, a structural example of the upper shell 120 is given here. Specifically, in order to ensure the compactness of the arrangement of each component in the accommodating space, the space in the upper shell 120 is divided in an orderly manner so that the upper shell 120 forms a first accommodating area 121 and a second accommodating area 122 that are adjacent to each other. A speaker rack 50 is arranged between the first accommodating area 121 and the base 110. The purpose of setting the speaker rack 50 is to provide a stable installation environment for the speaker 40. More specifically, an installation cavity 501 is formed on the speaker rack 50, and the speaker 40 is arranged in the installation cavity 501 to improve the setting stability of the speaker 40; a first positioning column 1221 is formed in the second accommodating area 122, and the audio processing circuit board 30 is fixed in the second accommodating area 122 by the first positioning column 1221 to improve the setting stability of the audio processing circuit board 30.

[0037] In this embodiment, the number of speakers 40 can be set according to actual needs. Here are two examples of setting the number of speakers 40. Figure 3 , there are two mounting cavities 501 formed on the speaker frame 50, for easy viewing and understanding, Figure 3 A speaker 40 is disposed in one of the mounting cavities 501 , while no speaker 40 is disposed in the other mounting cavity 501 .

[0038] As a preferred solution of this embodiment, refer to Figure 2 、 Figure 8 and Figure 10 A protective cover 131 is provided on the side of the upper cover 130 facing away from the upper shell 120, and the protective cover 131 is located in the mounting groove 1201; an array of annular reinforcement ribs 132 are provided on the side of the upper cover 130 close to the upper shell 120, and the first heat dissipation holes 102 and the speaker holes 103 are correspondingly distributed in part of the annular reinforcement ribs 132.

[0039] The protection cover 131 has a dustproof effect, serves to protect the components in the housing 10 , and increases the service life of the microphone speaker, while also having an aesthetic effect.

[0040] The protective cover 131 is arranged in the installation groove 1201 to improve the installation stability of the protective cover 131. The purpose of setting the annular reinforcement rib 132 on the upper cover 130 is to improve the structural strength of the upper cover 130 itself, so that the upper cover 130 is not easily deformed, and the purpose of protecting the upper cover 130 is achieved. The above-mentioned annular reinforcement rib 132 can be a regular hexagon; the first heat dissipation hole 102 and the speaker hole 103 are correspondingly distributed in part of the annular reinforcement rib 132, which does not affect the supporting strength of the upper cover 130 while also achieving the purpose of transmitting sound signals and amplifying sound signals.

[0041] As a preferred solution of this embodiment, an adhesive plate (not shown in the figure) is provided between the upper cover 130 and the mounting groove 1201 .

[0042] The adhesive plate is provided to enhance the stability of the upper cover 130 on the mounting groove 1201 , thereby further improving the overall stability of the pickup speaker.

[0043] As a preferred solution of this embodiment, refer to Figure 9 and Figure 11 The speaker stand 50 includes a first bracket 510 and a second bracket 520 connected to each other. The first bracket 510 is fixed on the base 110, and the second bracket 520 is arranged above the first bracket 510. The second bracket 520 is provided with an auxiliary positioning ring 521, and the auxiliary positioning ring 521 is provided with a positioning ring 522; a second positioning column 124 is provided on the upper shell 120, and the second positioning column 124 is inserted into the positioning ring 522.

[0044] Among them, a structural example of the speaker stand 50 is given here. Specifically, the speaker stand 50 includes a first bracket 510 and a second bracket 520 that are connected. The first bracket 510 is arranged on the base 110 and fixedly connected to the base 110. At the same time, an auxiliary positioning ring 521 is provided on the second bracket 520, and a positioning ring 522 is provided on the auxiliary positioning ring 521. Through the second positioning column 124 provided on the upper shell 120, the second positioning column 124 is inserted into the positioning ring 522 to achieve a fixed connection between the second bracket 520 and the upper shell 120, so as to firmly fix the speaker stand 50 in the shell 10, thereby ensuring the setting stability of the speaker 40 and improving the working stability of the pickup speaker, so as to facilitate the use and promotion of the pickup speaker.

[0045] In order to ensure the connection strength between the upper shell 120 and the second bracket 520, multiple auxiliary positioning rings 521 and positioning rings 522 may be provided. Figure 11 , an example is given in which two auxiliary positioning rings 521 and two positioning rings 522 are respectively provided on opposite sides of the second bracket 520.

[0046] As a preferred solution of this embodiment, refer to Figure 2 and Figure 3 A button 125 is provided on the outer side of the upper shell 120, and a button sensor board 126 is provided in the second accommodating area 122. The button 125 is connected to the button sensor board 126, and the button sensor board 126 is electrically connected to the MIC integrated circuit board 20, the audio processing circuit board 30 and the speaker 40.

[0047] Among them, the setting of button 125 is used to realize human-computer interaction. In actual application, refer to Figure 3A main control circuit board 710 is required to be installed within the housing 10. The main control circuit board 710 is electrically connected to the key sensor board 126, the MIC integrated circuit board 20, the audio processing circuit board 30, and the speaker 40. When a user operates the key 125, the main control circuit board 710 controls the pickup speaker. The above principle of control via the main control circuit board 710 is conventional technology and is not specifically limited here.

[0048] As a preferred solution of this embodiment, refer to Figure 6 A non-slip pad (not shown) and a second heat dissipation hole 111 are provided on the side of the base 110 facing away from the upper shell 120 .

[0049] Among them, the setting of the second heat dissipation hole 111 can timely diffuse the heat generated during the operation of the microphone speaker, and can prevent the microphone speaker from being affected by excessive temperature. The anti-slip pad is used to improve the setting stability of the microphone speaker and the work platform, and prevent the microphone speaker from slipping from the work platform.

[0050] As a preferred solution of this embodiment, refer to Figures 4 to 7 A reinforcing convex plate 113 is provided on the inner wall of the base 110, a positioning protrusion 114 is provided on the reinforcing convex plate 113, a positioning hole 201 is formed on the MIC integrated circuit board 20, and the positioning protrusion 114 is located in the positioning hole 201; a third positioning column 115 is provided in the base 110, and a top plate 116 is provided on the third positioning column 115, and the MIC integrated circuit board 20 is supported between the top plate 116 and the reinforcing convex plate 113.

[0051] Here, a method for arranging the MIC integrated circuit board 20 on the inner wall of the base 110 is provided. Specifically, a reinforcing protrusion 113 is provided on the inner wall of the base 110, and a positioning protrusion 114 is provided on the reinforcing protrusion 113. The positioning protrusion 114 is disposed in a positioning hole 201 formed on the MIC integrated circuit board 20 to pre-fix the MIC integrated circuit board 20 on the inner wall of the base 110. Then, a third positioning column 115 is provided in the base 110, and a top plate 116 is provided on the third positioning column 115. The top plate 116 and the reinforcing protrusion 113 cooperate with each other to support the MIC integrated circuit board 20 therebetween, thereby stably arranging the MIC integrated circuit board 20 on the inner wall of the base 110.

[0052] Reference Figure 6 and Figure 7 Eight MIC patches 210 are provided on the MIC integrated circuit board 20, two MIC patches 210 are provided on the side wall of each base 110, and two reinforcing protrusions 113 are provided on each side wall of the corresponding base 110, and a corresponding pickup hole 101 is formed at the position of each reinforcing protrusion 113.

[0053] As a preferred solution of this embodiment, refer to Figure 5 A protection pad 117 is further provided between the MIC integrated circuit board 20 and the top plate 116 . An avoidance hole (not shown in the figure) is formed on the protection pad 117 , and the MIC patch 210 is located in the avoidance hole.

[0054] The protection pad 117 is provided to buffer and protect the MIC integrated circuit board 20 . The protection pad 117 can be made of elastic material. The avoidance hole formed on the protection pad 117 provides an installation environment for the MIC patch 210 and also protects the MIC patch 210 .

[0055] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Those skilled in the art may modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A pickup speaker, characterized in that: include: a housing, wherein a receiving cavity is formed in the housing; a sound pickup assembly disposed in the accommodating cavity, comprising an electrically connected MIC integrated circuit board and an audio processing circuit board, wherein the MIC integrated circuit board surrounds the inner wall of the housing along the circumference of the housing, and is provided with at least four MIC patches distributed correspondingly on the four sides of the housing, and a sound pickup hole corresponding to each MIC patch is formed on the side wall of the housing; the audio processing circuit board is located within the MIC integrated circuit board; A speaker is arranged in the accommodating cavity and adjacent to the audio processing circuit board. A speaker hole corresponding to the speaker is formed on the top of the shell.

2. The pickup speaker according to claim 1, characterized in that The housing includes a base, an upper shell and an upper cover, wherein the upper shell is arranged above the base, the base and the upper shell together form the accommodating cavity, the MIC integrated circuit board is arranged on the inner wall of the base, and the sound pickup hole is formed on the side wall of the base; The audio processing circuit board is arranged in the upper housing, and the speaker is arranged between the base and the upper housing; A mounting groove with a through hole is formed on a side of the upper shell away from the base, the upper cover is arranged in the mounting groove, and the speaker hole and the first heat dissipation hole are formed on the upper cover.

3. The pickup speaker according to claim 2, characterized in that: A first accommodating area and a second accommodating area are formed in the upper shell; A speaker rack is provided between the first accommodating area and the base, and a mounting cavity is formed on the speaker rack. The speaker is arranged in the mounting cavity, and the mounting cavity is connected to the speaker hole through the through hole; A first positioning column is formed in the second accommodating area, and the audio processing circuit board is fixed in the second accommodating area by the first positioning column.

4. The pickup speaker according to claim 3, characterized in that: A protective cover is provided on a side of the upper cover facing away from the upper shell, and the protective cover is located in the mounting groove; An array of annular reinforcement ribs is provided on one side of the upper cover close to the upper shell, and the first heat dissipation holes and the speaker holes are correspondingly distributed in part of the annular reinforcement ribs.

5. The pickup speaker according to claim 3, characterized in that: An adhesive plate is provided between the upper cover and the mounting groove.

6. The pickup speaker according to claim 3, characterized in that: The speaker stand includes a first bracket and a second bracket connected to each other, the first bracket is fixed on the base, the second bracket is arranged above the first bracket, the second bracket is provided with an auxiliary positioning ring, and the auxiliary positioning ring is provided with a positioning ring; A second positioning column is provided on the upper shell, and the second positioning column is inserted into the positioning ring.

7. The pickup speaker according to claim 3, characterized in that: A button is provided on the outer side of the upper shell, and a button sensor board is provided in the second accommodating area. The button is connected to the button sensor board, and the button sensor board is electrically connected to the MIC integrated circuit board, the audio processing circuit board and the speaker.

8. The pickup speaker according to claim 3, characterized in that: An anti-slip pad and a second heat dissipation hole are provided on a side of the base away from the upper shell.

9. The pickup speaker according to claim 2, characterized in that: A reinforcing convex plate is provided on the inner wall of the base, a positioning protrusion is provided on the reinforcing convex plate, a positioning hole is formed on the MIC integrated circuit board, and the positioning protrusion is located in the positioning hole; A third positioning column is provided in the base, and a top plate is provided on the third positioning column. The MIC integrated circuit board is supported between the top plate and the reinforcing convex plate.

10. The pickup speaker according to claim 9, characterized in that: A protection pad is further provided between the MIC integrated circuit board and the abutting plate. A avoidance hole is formed on the protection pad, and the MIC patch is located in the avoidance hole.

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