Micro-display device with optical collimation hole

Abstract

The utility model discloses a micro display device with an optical collimation hole, which belongs to the technical field of semiconductors and comprises a supporting substrate and a display module arranged on the supporting substrate. The display module comprises a light emitting unit and a first optical collimation hole structure. A first opening is formed in the first optical collimation hole structure, the orthographic projection of the light emitting surface of the light emitting unit on the supporting substrate is located in the orthographic projection of the first opening on the supporting substrate, and the bottom of the first optical collimation hole structure is not higher than the top of the light emitting unit. Based on the above technical scheme, optical collimation is realized through compressed vertical spatial distribution, and the method adapts to the development trend of pixel reduction.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a micro display device with an optical collimation hole. Background Art

[0002] In the field of micro-display and micro-projection, the light emitted from the screen is projected from the lens, enters the waveguide or is projected onto the target area. Due to the utilization rate from the screen to the lens, the smaller the luminous angle of the light emitted from the screen pixel, the better. The smaller the luminous angle, the higher the utilization rate of the light emitted from the lens, that is, there is a need for optical collimation.

[0003] In related technologies, solutions for optical collimation mainly include microlenses, reflective cups, optical cavities, or a combination of these.

[0004] However, the above technical solutions generally have the disadvantages of complex preparation, high cost and requirements. At the same time, structures such as microlenses, reflective cups, and optical cavities generally require larger sizes to implement, which has limitations on further compressing pixel sizes in the micro-display and micro-projection fields and is not suitable for the development trend of pixel miniaturization. Utility Model Content

[0005] The purpose of the present invention is to provide a micro display device, which achieves the effect of optical alignment through a simpler process and is not limited by the limitations brought about by the reduction of pixel size, thereby achieving efficient and low-cost optical alignment.

[0006] In order to achieve the above-mentioned purpose of the utility model, the utility model proposes the following technical solutions:

[0007] The present application provides a micro display device with an optical collimation hole, the micro display device comprising a supporting substrate and a display module arranged on the supporting substrate;

[0008] The display module includes: a light-emitting unit and a first optical collimating hole structure, wherein the first optical collimating hole structure is located on the light-emitting side of the light-emitting unit;

[0009] A first opening is provided in the first optical collimating hole structure, the orthographic projection of the light-emitting surface of the light-emitting unit on the supporting substrate is within the orthographic projection of the first opening on the supporting substrate, and the bottom of the first optical collimating hole structure is not higher than the top of the light-emitting unit.

[0010] In a possible implementation, a top of the first optical collimating hole structure is not lower than a top of the light-emitting unit.

[0011] In a possible implementation, an insulating medium is filled around the outer periphery of the light-emitting unit to form a first insulating layer, and the first optical collimating hole structure is embedded in the first insulating layer.

[0012] In one possible implementation, a second insulating layer is stacked on the first insulating layer, the second insulating layer includes a second optical collimating hole structure, a second opening is provided in the second optical collimating hole structure, and the second opening at least partially overlaps with the orthographic projection of the first opening on the supporting substrate.

[0013] In a possible implementation, the central axis of the second opening is the same as that of the first opening.

[0014] In a possible implementation, the thickness of the first optical collimating hole structure is in a range from 50 nm to 2 um.

[0015] In a possible implementation, the bottom of the first optical collimating hole structure is higher than the bottom of the light-emitting unit and is spaced from the light-emitting unit by a preset distance.

[0016] In a possible implementation, a width of the first opening is no greater than twice a width of the light emitting unit.

[0017] In a possible implementation, the first optical collimating hole structure is made of an opaque inorganic material.

[0018] In a possible implementation manner, the first optical collimating hole structure forms a partition between the multiple light-emitting units.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] Provided is a micro-display device having optical collimation holes. The micro-display device includes a supporting substrate and a display module disposed on the supporting substrate. The display module includes: a light-emitting unit and a first optical collimation hole structure. The first optical collimation hole structure is provided with a first opening. The orthographic projection of the light-emitting surface of the light-emitting unit on the supporting substrate is within the orthographic projection of the first opening on the supporting substrate. The bottom of the first optical collimation hole structure is no higher than the top of the light-emitting unit, thereby achieving optical collimation through compressed vertical spatial distribution, which can adapt to the development trend of pixel miniaturization.

[0021] Furthermore, more optical collimating hole structures can be stacked on top of the first optical collimating hole structure, and the optical collimating effect can be further enhanced through the multi-layer collimating light hole design.

[0022] It should be noted that the present invention only needs to achieve at least one of the above technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the structure of a micro display device provided in an embodiment of the present application;

[0024] Figure 2 Schematic diagram of the structure of a micro display device provided in an embodiment of the present application;

[0025] Figure 3 Schematic diagram of the light emitting distribution of a different micro-display device provided in an embodiment of the present application.

[0026] Markings in the figure: 100 - supporting substrate, 200 - light emitting unit, 300 - first optical collimating hole structure, 400 - first insulating layer, 500 - second optical collimating hole structure, 600 - second insulating layer. DETAILED DESCRIPTION

[0027] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "vertical", "upper", "lower", "top", "side", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0030] In the embodiments of the present application, the shortcomings of existing optical collimation solutions are mainly optimized, the optical collimation effect is achieved through a simpler process, and it is not limited by the limitations of pixel size reduction in existing solutions, thereby achieving efficient and low-cost optical collimation.

[0031] Combined with reference Figures 1 to 2 An embodiment of the present application provides a micro display device, which includes a supporting substrate 100 and a display module arranged on the supporting substrate 100.

[0032] Among them, the display module includes: a light-emitting unit 200 and a first optical collimating hole structure 300, the first optical collimating hole structure 300 is located on the light-emitting side of the light-emitting unit 200; a first opening is provided in the first optical collimating hole structure 300, the orthographic projection of the light-emitting surface of the light-emitting unit 200 on the supporting substrate 100 is within the orthographic projection of the first opening on the supporting substrate 100, and the bottom of the first optical collimating hole structure 300 is not higher than the top of the light-emitting unit 200.

[0033] In an embodiment of the present application, a microdisplay device having an optical collimation hole structure is provided. A first optical collimation hole structure 300 is provided on the light-emitting side of the light-emitting unit 200. The bottom of this first optical collimation hole structure 300 is no higher than the top of the light-emitting unit 200, and a first opening is provided for light emission from the light-emitting unit 200. This reduces the space occupied in the overall vertical direction and eliminates the need for excessive horizontal space. Optical collimation is achieved through a compressed vertical spatial distribution, which can adapt to the trend of pixel miniaturization. Furthermore, the bottom of this first optical collimation hole structure 300 can be lower than the top of the light-emitting unit 200, thereby further compressing the vertical spatial distribution.

[0034] The compound materials corresponding to the light-emitting unit 200 can be as follows:

[0035] Taking the Micro-LED field as an example, some compound materials involved in the embodiments of this application are shown in the following table. In some practical applications, the compound film layers will be more complex, or there will be cross-use of materials. Typically, it mainly includes a P contact layer, an N release layer, and an active region and other functional layers sandwiched between the two:

[0036]

[0037]

[0038] Among them, the contact of the compound is divided into P-type contact and N-type contact, which are in contact with the P contact layer and the N contact layer respectively. In the embodiment, the P-type contact material used includes a single layer or a stack of transparent metal oxides such as ITO, IZO, and ZnO, or a single layer or a stack of metals such as Ni, Cr, Au, Ag, Zn, Be, and Al, or an alloy, or a stack of transparent metal oxides and metals; the N-type contact material used includes a single layer or a stack of transparent metal oxides such as ITO, IZO, and ZnO, or a single layer or a stack of metals such as Ni, Cr, Ti, Au, Ge, and Al, or an alloy, or a stack of transparent metal oxides and metals. The deposition method of the contact layer can be CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), ALD (Atomic Layer Deposition), etc.

[0039] Among them, the supporting substrate 100 can be the substrate described in the above table and include the corresponding remaining film layers, such as GaAs, Si substrate and its buffer layer or cut-off layer, or it can be a temporary or permanent supporting substrate 100 and its bonding structure after bonding transfer, such as Si, CMOS backplane and its bonding structure. The bonding structure may include organic materials, such as PI, etc., or metal materials, such as AuSn, NiSn, Al, Cu, Au and other metal alloys or elements and their constituent film layers, etc., or dielectric materials, such as silicon oxide, aluminum oxide, SiCN, etc., or a mixed structure of dielectric layer and metal, such as mixed bonding of Cu columns arranged in silicon oxide, etc.

[0040] Among them, the light-emitting unit 200 is a patterned compound material with complete electrical connections. The diameter or side length of the light-emitting unit 200 is recorded as d2, and the height of the light-emitting unit 200 is recorded as h2. The size specifications meet 0.5um≤d2≤50um, 0.3um≤h2≤5um.

[0041] In a possible implementation, the top of the first optical collimating hole structure 300 is not lower than the top of the light emitting unit 200 .

[0042] In this implementation, the top of the first optical collimating hole structure 300 is designed to be no lower than the top of the light-emitting unit 200, so that the first optical collimating hole structure 300 has at least a partial structure that is higher than the light-emitting unit 200. On the premise that the top of the light-emitting unit 200 is the light-emitting side, the light emission condition of the light-emitting side of the light-emitting unit 200 can be controlled by the first optical collimating hole structure 300.

[0043] In a possible implementation, the bottom of the first optical collimating hole structure 300 is higher than the bottom of the light emitting unit 200 and is spaced apart from the light emitting unit 200 by a preset distance.

[0044] In this implementation, the bottom of the first optical collimating hole structure 300 is designed to be higher than the bottom of the light-emitting unit 200, so that the first optical collimating hole structure 300 has at least a partial structure that is higher than the light-emitting unit 200. On the premise that the top of the light-emitting unit 200 is the light-emitting side, the light emission condition of the light-emitting side of the light-emitting unit 200 can be controlled.

[0045] Furthermore, the thickness h1 of the first optical collimating hole structure 300 is in the range of 50 nm to 2 um.

[0046] In a possible implementation, the outer periphery of the light emitting unit 200 is filled with an insulating medium to form a first insulating layer 400 , and the first optical collimating hole structure 300 is embedded in the first insulating layer 400 .

[0047] In this implementation, the outer periphery of the light emitting unit 200 is filled with an insulating medium to provide insulation protection for the light emitting unit 200 , and the first optical collimating hole structure 300 is embedded in the first insulating layer 400 .

[0048] Among them, the first insulating layer 400 can be one or more transparent dielectric layers such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, etc. The silicon oxide can include USG, PSG, BPSG, FSG, TEOS, SRO and other types of silicon oxide. In particular, SRO, as a silicon-rich silicon oxide, has a refractive index of up to 1.52. A higher refractive index is more conducive to the emission of light.

[0049] In one possible implementation, Figure 2 As shown, a second insulating layer 600 is stacked on the first insulating layer 400 , and the second insulating layer 600 includes a second optical collimating hole structure 500 . The second optical collimating hole structure 500 is provided with a second opening, and the second opening at least partially overlaps with the orthographic projection of the first opening on the supporting substrate 100 .

[0050] In this implementation, another insulating layer is provided on top of the first insulating layer 400, which is recorded as the second insulating layer 600. An optical collimating hole structure is also provided in the second insulating layer 600, which is recorded as the second optical collimating hole structure 500. Similarly, a second opening is provided in the second optical collimating hole structure 500, and the second opening at least partially overlaps with the first opening, so that the light-emitting unit 200 can emit light normally through the first opening and the second opening. The optical collimation effect is further enhanced by the multi-layer collimating light hole design.

[0051] Among them, the second insulating layer 600 can be one or more transparent dielectric layers such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, etc. The silicon oxide can include USG, PSG, BPSG, FSG, TEOS, SRO and other types of silicon oxide. In particular, SRO, as a silicon-rich silicon oxide, has a refractive index of up to 1.52. A higher refractive index is more conducive to the emission of light.

[0052] It is understood that the number of the second insulating layer 600 may be one or more layers. For example, the number of stacked insulating layers does not exceed 5 layers, and accordingly, the number of stacked optical collimating hole structures does not exceed 5 layers.

[0053] Furthermore, the central axis of the second opening is the same as that of the first opening. By aligning the central axis of the second opening with that of the first opening, the second opening above the first opening can better collimate the light emitted after passing through the first opening.

[0054] It can be understood that the present application does not limit the size relationship between the first opening and the second opening. The first opening can be the same size as the second opening, or the first opening can be larger than the second opening, or the first opening can be smaller than the second opening.

[0055] Furthermore, the width of the first opening is not greater than twice the width of the light emitting unit 200. The width of the first opening is limited, and the width d1 of the first opening is not greater than twice the width d2 of the light emitting unit 200, thereby avoiding the situation where the opening is too large and affects the optical collimation effect.

[0056] In a possible implementation, the first optical collimating hole structure 300 is made of an opaque inorganic material.

[0057] In this embodiment, the first optical collimating hole structure 300 is made of an opaque inorganic material, which may include a metal, a dielectric layer, or a stack of the two. In the first optical collimating hole structure 300, a reflective structure composed of metal, a metal-dielectric mixture, or a dielectric layer is used so that only the collimating through-hole area corresponding to the first opening can emit light. Furthermore, the opaque inorganic material may include a single layer or a stack of metals such as Cr, Pt, Rh, Au, Ti, Ni, Al, Ag, Cu, W, or Sn; the opaque inorganic material may include a single layer or a stack of dielectric layers such as SiO2, Si3N4, TiOx, Nb2O5, or Al2O3.

[0058] Among them, the first opening in the first optical collimation hole structure 300 can be realized by patterning etching after coating, patterning and then coating liftoff, or patterning etching of the dielectric layer followed by metal filling. By patterning on the planar structure, the process complexity and difficulty challenges brought by the optical collimation solution are reduced, thereby achieving cost reduction.

[0059] In a possible implementation, the first optical collimating hole structure 300 forms a partition between the plurality of light-emitting units 200 .

[0060] In this implementation, when a microdisplay device is provided with a plurality of light-emitting units 200, a plurality of first openings are initially provided in the first optical collimation structure, and each first opening corresponds to a light-emitting unit 200, thereby utilizing the first optical collimation hole structure 300 to form a partition between the plurality of light-emitting units 200, thereby achieving the effect of restricting the light output of each pixel unit and avoiding crosstalk.

[0061] It is understandable that when a second optical collimating hole structure 500 is provided, the second optical collimating hole structure 500 can be similarly designed with reference to the above. The second optical collimating hole structure 500 can be made of the same or different material as the first optical collimating hole structure 300, and this application does not impose any restrictions on this.

[0062] Exemplary, with reference to Figure 3 The effect of a microdisplay device with optical collimating holes is explained below: for the light distribution without collimating holes (i.e., the basic light pattern), the light angle is approximately ±55°; for the light distribution with a single-layer collimating hole structure (i.e., the single-layer collimated light pattern), the light angle is approximately ±35°; and for the light distribution with a double-layer collimating hole structure (i.e., the double-layer collimated light pattern), the light angle is approximately ±25°. Therefore, the optical collimating hole structure can achieve an optical collimation effect.

[0063] In summary, the embodiments of the present application provide a microdisplay device, and provide a microdisplay device with an optical collimation hole. The microdisplay device includes a supporting substrate and a display module arranged on the supporting substrate. The display module includes: a light-emitting unit and a first optical collimation hole structure; a first opening is provided in the first optical collimation hole structure, and the orthographic projection of the light-emitting surface of the light-emitting unit on the supporting substrate is within the orthographic projection of the first opening on the supporting substrate. The bottom of the first optical collimation hole structure is not higher than the top of the light-emitting unit, thereby achieving optical collimation through compressed vertical spatial distribution, which can adapt to the development trend of pixel miniaturization.

[0064] Furthermore, more optical collimating hole structures can be stacked on top of the first optical collimating hole structure, and the optical collimating effect can be further enhanced through the multi-layer collimating light hole design.

[0065] All of the above optional technical solutions can be combined in any way to form optional embodiments of the present invention, that is, any multiple embodiments can be combined to meet the needs of different application scenarios. They are all within the scope of protection of this application and will not be described in detail here.

[0066] It should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A micro display device having an optical collimation hole, characterized in that: The micro display device includes a supporting substrate and a display module arranged on the supporting substrate; The display module includes: a light-emitting unit and a first optical collimating hole structure, wherein the first optical collimating hole structure is located on the light-emitting side of the light-emitting unit; A first opening is provided in the first optical collimating hole structure, the orthographic projection of the light-emitting surface of the light-emitting unit on the supporting substrate is within the orthographic projection of the first opening on the supporting substrate, and the bottom of the first optical collimating hole structure is not higher than the top of the light-emitting unit.

2. The micro display device according to claim 1, characterized in that The top of the first optical collimating hole structure is not lower than the top of the light emitting unit.

3. The micro display device according to claim 1, wherein: The outer periphery of the light-emitting unit is filled with an insulating medium to form a first insulating layer, and the first optical collimating hole structure is embedded in the first insulating layer.

4. The micro display device according to claim 3, characterized in that A second insulating layer is stacked on the first insulating layer. The second insulating layer includes a second optical collimating hole structure. A second opening is provided in the second optical collimating hole structure. The second opening at least partially overlaps with an orthographic projection of the first opening on the supporting substrate.

5. The micro display device according to claim 4, characterized in that: The second opening has the same central axis as the first opening.

6. The micro display device according to claim 1, wherein: The thickness of the first optical collimating hole structure is in the range of 50 nm to 2 um.

7. The micro display device according to claim 1, characterized in that The bottom of the first optical collimating hole structure is higher than the bottom of the light emitting unit and is spaced apart from the light emitting unit by a preset distance.

8. The micro display device according to claim 1, wherein: The width of the first opening is no greater than twice the width of the light emitting unit.

9. The micro display device according to claim 1, characterized in that: The first optical collimating hole structure is made of opaque inorganic material.

10. The micro display device according to claim 1, characterized in that The first optical collimating hole structure forms a partition between the plurality of light-emitting units.

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