Optical sensing module and electronic equipment

Abstract

The utility model discloses an optical sensing module and electronic equipment. The optical sensing module comprises a substrate, a light shielding layer, an optical sensing chip, a light transmitting layer and a light transmitting conductive shielding layer, the first surface of the optical sensing chip is attached to the first surface of the substrate, and the optical sensing chip is electrically connected with the substrate through a first bonding wire; the sensing area on the second surface of the optical sensing chip is attached to the first surface of the light-transmitting layer; the shading layer wraps the part, not attached to the substrate and the light transmitting layer, of the sensing chip, and the shading layer wraps the part, except the second surface and not attached to the optical sensing chip, of the light transmitting layer; the light-transmitting conductive shielding layer is attached to the second surface of the light shielding layer and the second surface of the light-transmitting layer, and the light-transmitting conductive shielding layer is electrically connected with a ground wire in the substrate. And the light-transmitting conductive shielding layer is used for shielding interference signals of the optical sensing chip. The precision of the electric signal generated by the optical sensing module can be improved by arranging the light-transmitting conductive shielding layer.

Description

[0001] This application is a divisional application of Chinese patent application 202420136479.0, entitled “Optical sensing module and electronic device”, filed on January 19, 2024. Technical Field

[0002] The present application relates to the technical field of electrical components, and in particular to an optical sensing module and an electronic device. Background Art

[0003] The increasing thinness, full-screen nature, and narrow-frame nature of mobile phones and other electronic products have become the mainstream development direction of electronic products. Under this mainstream design environment, the space left for optical sensing modules is getting smaller and smaller. Therefore, the demand for system-integrated products of under-screen ambient optical sensing modules and proximity optical sensing modules is becoming more and more urgent.

[0004] However, the increasing integration of products will also cause signal interference problems between subsystems. For example, the coupling of the electrical signal of the screen module and the optical sensing module will generate interference signals. Utility Model Content

[0005] In view of this, the present application provides an optical sensing module and an electronic device to solve the technical problem that the coupling of the electrical signal of the screen module and the optical sensing module in the traditional solution will generate interference signals.

[0006] According to a first aspect of the present application, there is provided an optical sensing module, comprising: a substrate, a light-shielding layer, an optical sensing chip, a light-transmitting layer, and a light-transmitting conductive shielding layer; the first surface of the optical sensing chip is bonded to the first surface of the substrate, and the optical sensing chip is electrically connected to the substrate via a first welding wire, wherein the first surface of the optical sensing chip is opposite to the second surface; the sensing area on the second surface of the optical sensing chip is bonded to the first surface of the light-transmitting layer; the light-shielding layer covers the portion of the optical sensing chip that is not bonded to the substrate and the light-transmitting layer, and the light-shielding layer covers the portion of the light-transmitting layer that is not bonded to the optical sensing chip except the second surface, wherein the first surface of the light-transmitting layer is opposite to the second surface; the light-transmitting conductive shielding layer is bonded to the light-shielding layer and the second surface of the light-transmitting layer, and the light-transmitting conductive shielding layer is electrically connected to the ground wire in the substrate; the light-transmitting conductive shielding layer is used to shield interference signals of the optical sensing chip; the optical sensing chip is used to generate a corresponding electrical signal according to the optical signal that reaches the sensing area through the light-transmitting conductive shielding layer and the light-transmitting layer.

[0007] Optionally, the optical sensing module also includes: a first chip, the first surface of the first chip is bonded to the first surface of the substrate, the first chip is electrically connected to the substrate through a second welding wire, the light-shielding layer covers the portion of the first chip that is not bonded to the substrate and the light-transmitting layer, and the first chip includes at least one of a control chip, a light intensity sensing chip, or a color temperature sensing chip.

[0008] Optionally, the light-shielding layer is opaque black EMC.

[0009] Optionally, the light-transmitting conductive shielding layer is electrically connected to a ground line in the substrate through a circuit board, a third welding wire or a conductive column.

[0010] Optionally, the surface where the light-shielding layer is in contact with the light-transmitting conductive shielding layer is flush with the second surface of the light-transmitting layer.

[0011] Optionally, the side surface of the substrate is bonded to the light-transmitting conductive shielding layer, the surface of the light-shielding layer that is not bonded to the optical sensing chip, the light-transmitting layer or the substrate is bonded to the light-transmitting conductive shielding layer, the first surface of the substrate is opposite to the second surface, and the side surface of the substrate is perpendicular to the first surface and the second surface of the substrate.

[0012] Optionally, the light-transmitting conductive shielding layer is provided with a through hole for a second connection terminal located on a side surface of the substrate to pass through.

[0013] Optionally, the first surface of the light-transmitting layer is bonded to the sensing area via a first chip bonding film; the light transmittance of the first chip bonding film is greater than or equal to the light transmittance of the light-transmitting layer.

[0014] Optionally, the light transmittance of the light-transmitting conductive shielding layer is greater than 90%.

[0015] Optionally, the first surface of the optical sensor chip is bonded to the first surface of the substrate via a second chip bonding film or silver glue, and the second chip bonding film and the silver glue are non-conductive.

[0016] A second aspect of the present application provides an electronic device, comprising: an optical sensing module and a screen module as described in any one of the first aspects above.

[0017] The optical sensing module provided in the present application provides a light-transmitting conductive shielding layer in the optical sensing module. When the optical sensing module is integrated with other modules, the light-transmitting conductive shielding layer can be used to shield interference signals, thereby avoiding signal interference between the optical sensing module and other modules and improving the accuracy of the electrical signal generated by the optical sensing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0019] Figure 1 is a structural cross-sectional view of an optical sensing module according to an embodiment of the present application;

[0020] Figure 2 is a structural cross-sectional view of an optical sensing module according to another embodiment of the present application;

[0021] Figure 3 is a structural diagram of an optical sensing module according to an embodiment of the present application;

[0022] Figure 4 is a structural cross-sectional view of an optical sensing module according to another embodiment of the present application;

[0023] Figure 5 is a structural diagram of an optical sensing module according to another embodiment of the present application;

[0024] Figure 6 is a structural cross-sectional view of an optical sensing module according to yet another embodiment of the present application;

[0025] Figure 7 is a structural cross-sectional view of an optical sensing module including a first chip bonding film according to an embodiment of the present application;

[0026] Figure 8 is a cross-sectional view of the structure of an optical sensing module including an adhesive layer according to an embodiment of the present application;

[0027] Figure 9 is a schematic diagram of an electronic device according to an embodiment of the present application.

[0028] List of reference numerals:

[0029] 100: Optical sensing module 101: Substrate 102: Light shielding layer

[0030] 103: Optical sensor chip 104: Light-transmitting layer 105: Light-transmitting conductive shielding layer

[0031] 106: First bonding wire 107: Conductor 108: First chip bonding film

[0032] 109: Adhesive layer 110: First chip 111: Second bonding wire

[0033] 1011: Ground wire 1012: First terminal 1013: Second terminal

[0034] 200: Electronic equipment 201: Screen module DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0036] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0037] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0038] Figure 1 is a cross-sectional view of the structure of an optical sensing module according to an embodiment of the present application. Figure 1 As shown, the optical sensing module 100 includes: a substrate 101 , a light shielding layer 102 , an optical sensing chip 103 , a light transmitting layer 104 and a light transmitting conductive shielding layer 105 .

[0039] The first surface of the optical sensing chip 103 is bonded to the first surface of the substrate 101. The optical sensing chip 103 is electrically connected to the substrate 101 via a first bonding wire 106, wherein the first surface of the optical sensing chip 103 is opposite to the second surface. The sensing area on the second surface of the optical sensing chip 103 is bonded to the first surface of the light-transmitting layer 104. The light-shielding layer 102 covers the portion of the optical sensing chip 103 that is not bonded to the substrate 101 and the light-transmitting layer 104. The light-shielding layer 102 also covers the portion of the light-transmitting layer 104 that is not bonded to the optical sensing chip 103 except for the second surface. The first surface of the light-transmitting layer 104 is opposite to the second surface. The light-transmitting conductive shielding layer 105 is bonded to the light-shielding layer 102 and the second surface of the light-transmitting layer 104, and is electrically connected to the ground line in the substrate 101.

[0040] The light-transmitting conductive shielding layer 105 is used to shield interference signals from the optical sensing chip 103. The optical sensing chip 103 is used to generate corresponding electrical signals according to the optical signals that pass through the light-transmitting conductive shielding layer 105 and the light-transmitting layer 104 and reach the sensing area.

[0041] The optical sensor chip 103 uses flow-on-wire (FOW) technology and is electrically connected to the substrate 101 via a first bonding wire 106. For example, one end of the first bonding wire 106 can be electrically connected to a terminal on the optical sensor chip 103, and the other end of the first bonding wire 106 can be electrically connected to a terminal on the first surface of the substrate 101, thereby electrically connecting the optical sensor chip 103 to the substrate 101. The substrate 101 can be a printed circuit board used for packaging, and the substrate 101 has circuits. The optical sensor chip 103 transmits the electrical signal generated by the sensing light signal to the substrate 101 via the first bonding wire 106. The substrate 101 is then interconnected with external signals via terminals or solder balls.

[0042] It should be noted that, in the embodiment of the present application, the sensing area on the second surface of the optical sensing chip 103 is bonded to the first surface of the light-transmitting layer 104, but the bonding between the second surface of the optical sensing chip 103 and the first surface of the light-transmitting layer 104 is not limited to the sensing area on the second surface of the optical sensing chip 103. Since one or more light sources may be present in the use scenario of the optical sensing module 100, to prevent excessive light signals other than those intended to reach the optical sensing chip 103 from passing through the light-transmitting layer 104 and reaching the optical sensing chip 103, the area of ​​the first surface of the light-transmitting layer 104 cannot be set too large. Consequently, when the optical sensing module 100 includes multiple optical sensing chips 103, due to the limited area of ​​the first surface of the light-transmitting layer 104, the second surfaces of the multiple optical sensing chips 103 may not all be bonded to the first surface of the light-transmitting layer 104. Therefore, it is sufficient that the sensing areas on the second surfaces of the multiple optical sensing chips 103 are bonded to the first surface of the light-transmitting layer 104. However, if the optical sensing module 100 includes a small number of optical sensing chips 103 or only one optical sensing chip 103 and the area of ​​the second surface of the optical sensing chip 103 is small, the second surface of the optical sensing chip 103 can be completely adhered to the first surface of the light-transmitting layer 104 .

[0043] In order to solve the signal interference problem caused by the increasing integration between the optical sensing module 100 and other modules, such as the screen module, a light-transmitting conductive shielding layer 105 is provided in the optical sensing module 100. The light-transmitting conductive shielding layer 105 can be composed of an organic or inorganic conductive coating or printed material, such as silver tin oxide. Taking the scenario where the optical sensing module 100 and the screen module are coupled to generate an interference signal as an example, at a certain moment, the screen module generates an electrical signal, and the optical sensing module 100 also generates a corresponding electrical signal based on the light signal that reaches the sensing area through the light-transmitting conductive shielding layer 105 and the light-transmitting layer 104. Due to the high integration of the optical sensing module 100 and the screen module, the optical sensing module 100 and the screen module are coupled, and both the electrical signal generated by the optical sensing module 100 and the electrical signal generated by the screen module may be affected, resulting in reduced accuracy of the electrical signals. At this time, since a transparent conductive shielding layer 105 is provided in the optical sensing module 100, the transparent conductive shielding layer 105 is provided between the optical sensing module 100 and the screen module, and the transparent conductive shielding layer 105 is electrically connected to the ground wire in the substrate 101, the transparent conductive shielding layer 105 will introduce the interference signal caused by the screen module to the optical sensing module 100 when generating an electrical signal into the ground wire in the substrate 101 and flow it out. At the same time, the transparent conductive shielding layer 105 will also introduce the interference signal caused by the optical sensing module 100 to the screen module when generating an electrical signal into the ground wire in the substrate 101.

[0044] In an embodiment of the present application, a light-transmitting conductive shielding layer 105 is provided in the optical sensing module 100. When the optical sensing module 100 is integrated with other modules, interference signals can be shielded by the light-transmitting conductive shielding layer 105, thereby avoiding signal interference between the optical sensing module 100 and other modules, thereby improving the accuracy of the electrical signal generated by the optical sensing module 100.

[0045] Figure 2 is a structural cross-sectional view of an optical sensing module according to another embodiment of the present application. Figure 2 As shown, the optical sensing module 100 further includes a first chip 110. The first surface of the first chip 110 is bonded to the first surface of the substrate 101. The light shielding layer 102 covers the portion of the first chip 110 that is not bonded to the substrate 101 and the light-transmitting layer 104. The first chip 110 is electrically connected to the substrate 101 via second bonding wires 111. The first chip 110 includes at least one of a control chip, a light intensity sensing chip, or a color temperature sensing chip.

[0046] In the embodiment of the present application, by adding the first chip 110 to the optical sensing module 100, a control chip, a light intensity sensing chip, a color temperature sensing chip, or other chips can be selected according to different scenarios to meet different needs, thereby improving the applicability of the optical sensing module 100.

[0047] In a possible implementation, the light shielding layer 102 is an opaque black EMC (Epoxy Molding Compound).

[0048] In some scenarios, the light shielding layer 102 can transmit optical signals. When the optical signals pass through the light shielding layer 102 and reach the sensing area on the second surface of the optical sensing chip 103, the optical sensing chip 103 may mistakenly sense and generate electrical signals. To avoid this, the light shielding layer 102 can be made of an epoxy molding compound (EMC) using an epoxy resin as a matrix and adding a variety of additives, including black dye and materials that increase structural strength. When the light shielding layer 102 is opaque black, the optical signals can only pass through the transparent conductive shielding layer 105 and the transparent layer 104 to reach the sensing area of ​​the optical sensing chip 103.

[0049] In the embodiment of the present application, by setting light-shielding layer 102 to an opaque black color, it is possible to prevent unnecessary light signals from passing through light-shielding layer 102 and reaching the sensing area on the second surface of optical sensor chip 103, thereby ensuring the accuracy of the electrical signal generated by optical sensor chip 103 based on the light signal. Furthermore, because the epoxy resin molding compound includes a material that increases structural strength, it can reduce the effects of deformation such as warping caused by stress, as well as the effects of heat generated by optical sensor chip 103 on the structure of light-shielding layer 102, thereby improving the structural strength of optical sensor module 100.

[0050] In a possible implementation, the surface where the light shielding layer 102 and the light-transmitting conductive shielding layer 105 are in contact is flush with the second surface of the light-transmitting layer 104 .

[0051] When the surface where the light-shielding layer 102 and the light-transmitting conductive shielding layer 105 are bonded is not flush with the second surface of the light-transmitting layer 104, the surface where the light-transmitting conductive shielding layer 105 is bonded to both the light-shielding layer 102 and the light-transmitting layer 104 will be in a "convex" or "concave" shape, which will bring difficulty to assembly when the optical sensing module 100 is integrated with other modules. Therefore, the surface where the light-shielding layer 102 and the light-transmitting conductive shielding layer 105 are bonded is flush with the second surface of the light-transmitting layer 104, so that the surface where the light-transmitting conductive shielding layer 105 is bonded to both the light-shielding layer 102 and the light-transmitting layer 104 can be flat.

[0052] In an embodiment of the present application, by setting the surface where the light-shielding layer 102 and the light-transmitting conductive shielding layer 105 are bonded to be flush with the second surface of the light-transmitting layer 104, the surface where the light-transmitting conductive shielding layer 105 is bonded to both the light-shielding layer 102 and the light-transmitting layer 104 is smooth, which facilitates the integration of the optical sensing module 100 with other modules.

[0053] In a possible implementation, the light transmittance of the light-transmitting conductive shielding layer 105 is greater than 90%.

[0054] In the embodiment of the present application, by setting the transmittance of the light-transmitting conductive shielding layer 105 to be greater than 90%, the loss of the optical signal when passing through the light-transmitting conductive shielding layer 105 can be reduced, and when the transmittance of the light-transmitting conductive shielding layer 105 is required to be only greater than 90%, the cost of manufacturing the light-transmitting conductive shielding layer 105 will not be too high.

[0055] Figure 3 is a structural diagram of an optical sensing module according to an embodiment of the present application. Figure 4 is a structural cross-sectional view of an optical sensing module according to another embodiment of the present application. Figure 4 As shown, in the optical sensing module 100 , the light-transmitting conductive shielding layer 105 is electrically connected to the ground line 1011 in the substrate 101 through a conductor 107 , such as a circuit board, a third bonding wire, or a conductive column.

[0056] exist Figure 3 and Figure 4 In the illustrated optical sensing module 100, the light-transmitting conductive shielding layer 105 is not bonded to the side of the substrate 101. Therefore, in order for the light-transmitting conductive shielding layer 105 to direct interference signals into the substrate 101, a circuit board, a third bonding wire, or a conductive pillar can be provided through the light-shielding layer 102. One end of the circuit board, the third bonding wire, or the conductive pillar is connected to the light-transmitting conductive shielding layer 105, and the other end of the circuit board, the third bonding wire, or the conductive pillar is electrically connected to the ground line 1011 in the substrate 101. The circuit board can be a printed circuit board (PCB), specifically a single-sided circuit board, a double-sided circuit board, a multi-layer circuit board, etc. The conductive pillar can be a copper pillar.

[0057] In the embodiment of the present application, when the light-transmitting conductive shielding layer 105 is electrically connected to the ground line 1011 in the substrate 101 via a third bonding wire, the manufacturing cost of the optical sensing module 100 can be reduced due to the low cost of the third bonding wire. When the light-transmitting conductive shielding layer 105 is electrically connected to the ground line 1011 in the substrate 101 via a conductive post, the conductive post's high conductivity can improve the anti-interference capability of the light-transmitting conductive shielding layer 105. When the light-transmitting conductive shielding layer 105 is electrically connected to the ground line 1011 in the substrate 101 via a circuit board, the structural strength of the circuit board can be further improved, thereby further improving the structural strength of the optical sensing module 100.

[0058] Figure 5 is a structural diagram of an optical sensing module according to another embodiment of the present application. Figure 6 This is a structural cross-sectional view of an optical sensing module according to another embodiment of the present application. Figure 5-6 As shown, in the optical sensing module 100, the side surface of the substrate 101 is bonded to the transparent conductive shielding layer 105, and the surface of the light-shielding layer 102 that is not bonded to the optical sensing chip 103, the transparent layer 104 or the substrate 101 is bonded to the transparent conductive shielding layer 105, wherein the first surface of the substrate 101 is opposite to the second surface, and the side surface of the substrate 101 is perpendicular to the first surface and the second surface of the substrate 101.

[0059] In the optical sensing module 100 , the transparent conductive shielding layer 105 is attached to the side of the substrate 101 . For example, there may be a plurality of first connection terminals 1012 on the side of the substrate 101 , so that the transparent conductive shielding layer 105 is directly electrically connected to the substrate 101 .

[0060] In an embodiment of the present application, by setting the side surface of the substrate 101 to be in contact with the light-transmitting conductive shielding layer 105, the portion of the light-shielding layer 102 that is not in contact with the optical sensing chip 103 or the light-transmitting layer 104 or the substrate 101 is in contact with the light-transmitting conductive shielding layer 105, thereby expanding the area covered by the light-transmitting conductive shielding layer 105, thereby improving the anti-interference ability of the optical sensing module 100.

[0061] like Figure 6 As shown, the light-transmitting conductive shielding layer 105 is provided with a through hole for the second connection terminal 1013 located on the side surface of the substrate 101 to pass through.

[0062] A plurality of second connection terminals 1013 are provided on the side surface of the substrate 101 . The second connection terminals 1013 may be copper pillars. The substrate 101 may communicate with the outside through the second connection terminals 1013 passing through the light-transmitting conductive shielding layer 105 .

[0063] In the embodiment of the present application, a through hole is provided in the light-transmitting conductive shielding layer 105 to allow the second connection terminal 1013 to pass through, thereby enabling the substrate 101 to communicate with the outside.

[0064] Figure 7 FIG. 1 is a structural diagram of an optical sensing module including a first chip bonding film according to an embodiment of the present application. Figure 7 As shown, in the optical sensing module 100 , the first surface of the light-transmitting layer 104 is bonded to the sensing area via a first chip-bonding film 108 . The light transmittance of the first chip-bonding film 108 is greater than or equal to the light transmittance of the light-transmitting layer 104 .

[0065] The first die attach film 108 (Die Attach Film, DAF) can be a film made of epoxy resin with high light transmittance and has adhesiveness at room temperature or high temperature. When the light-transmitting layer 104 and the optical sensing chip 103 are attached to each other, the first chip attach film 108 is smeared or sprayed between the light-transmitting layer 104 and the optical sensing chip 103, and the first chip attach film 108 is baked to cause a chemical reaction in the first chip attach film 108 to solidify.

[0066] In the embodiment of the present application, the light-transmitting layer 104 is bonded to the sensing area on the second surface of the optical sensor chip 103 via the first chip-bonding film 108, thereby improving bonding strength and preventing detachment. Furthermore, because the transmittance of the first chip-bonding film 108 is greater than or equal to the transmittance of the light-transmitting layer 104, the first chip-bonding film 108 does not affect the optical signal from reaching the sensing area on the second surface of the optical sensor chip 103.

[0067] In one possible implementation, the first bonding wire 106 includes a first portion and a second portion that are electrically connected. The first portion of the first bonding wire 106 is connected to a terminal located on the second surface of the optical sensor chip 103 and passes through the interior of the first chip bonding film 108. The second portion of the first bonding wire 106 passes through the light shielding layer 102 and is connected to a terminal on the substrate 101.

[0068] In the embodiment of the present application, by setting the first bonding wire 106 to pass through the interior of the first chip bonding film 108 and then through the light shielding layer 102, the first bonding wire 106 can be fixed by the first chip bonding film 108 and the light shielding layer 102 respectively, thereby improving the safety of the optical sensing module 100.

[0069] Figure 8 This is a schematic diagram of the structure of the optical sensing module of the present application including the second chip bonding adhesive film or silver glue, such as Figure 8 As shown, in the optical sensing module 100 , the first surface of the optical sensing chip 103 is bonded to the first surface of the substrate 101 via an adhesive layer 109 , such as a second chip bonding film or silver glue, and the second chip bonding film and silver glue are non-conductive.

[0070] The second die attach film (DAF) can be a film made of epoxy resin and has adhesive properties at room temperature or high temperature. The silver glue can be a viscous colloid formed by bonding silver materials together through the bonding effect of a matrix resin.

[0071] In the embodiment of the present application, the optical sensor chip 103 is bonded to the first surface of the substrate 101 via a non-conductive second chip bonding film or silver glue, which can improve the bonding strength and prevent it from falling off.

[0072] Figure 9 is a schematic diagram of an electronic device according to an embodiment of the present application. Figure 9 As shown, the electronic device 200 includes the optical sensing module 100 and the screen module 201 as described in any of the aforementioned embodiments.

[0073] It should be noted that the electronic device 200 in the embodiment of the present application is a specific application of the optical sensing module 100 in the aforementioned embodiment in various electronic products (such as smart phones and tablet computers, etc.). The optical sensing module 100 in the specific electronic device can be found in the description in the aforementioned optical sensing module embodiment, and will not be repeated here.

[0074] In an embodiment of the present application, a light-transmitting conductive shielding layer is provided in the optical sensing module 100. When the optical sensing module 100 is integrated with the screen module 201, the light-transmitting conductive shielding layer can be used to shield the interference signal generated when the screen module 201 and the optical sensing module 100 are coupled. This avoids signal interference between the optical sensing module 100 and the screen module 201, thereby improving the accuracy of the electrical signals generated by the optical sensing module 100 and the screen module 201.

[0075] Although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and the accompanying drawings. The present application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (e.g., which is functionally equivalent), even if the structure is not identical to the disclosed structure that performs the function in the exemplary implementation of this specification shown herein.

[0076] That is, the above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural or equivalent process transformations made using the contents of the description and drawings of this application, such as the mutual combination of technical features between the various embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

[0077] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0078] The present application provides the above description in order to enable any person skilled in the art to implement and use the present application. In the above description, various details are listed for the purpose of explanation. It should be understood that those of ordinary skill in the art will recognize that the present application can also be implemented when these specific details are not used. In other embodiments, well-known processes will not be elaborated in detail to avoid making the description of the present application obscure with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest range of principles and features disclosed in the present application.

[0079] It should be noted that, under the premise of no conflict, the various embodiments and / or the technical features in each embodiment described in this application can be arbitrarily combined with each other, and the technical solution obtained after the combination should also fall within the scope of protection of this application.

[0080] It should be understood that the specific examples in the embodiments of the present application are only to help those skilled in the art to better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and these improvements or modifications all fall within the scope of protection of the present application.

[0081] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An optical sensing module, characterized in that: include: Substrate, light-shielding layer, optical sensing chip and light-transmitting layer; The first surface of the optical sensor chip is attached to the first surface of the substrate, and the optical sensor chip is electrically connected to the substrate via a first bonding wire; The sensing area on the second surface of the optical sensing chip is bonded to the first surface of the light-transmitting layer; The light shielding layer covers a portion of the optical sensor chip that is not bonded to the substrate and the light-transmitting layer, and the light shielding layer covers a portion of the light-transmitting layer other than the second surface that is not bonded to the optical sensor chip, wherein the first surface and the second surface of the light-transmitting layer are opposite to each other; The optical sensing chip is configured to generate a corresponding electrical signal according to the optical signal that passes through the light-transmitting layer and reaches the sensing area; The light-shielding layer is a light-proof black EMC; The optical sensing module further includes: a first chip, a first surface of the first chip being bonded to the first surface of the substrate, and the first chip being electrically connected to the substrate via a second bonding wire; The first chip includes at least one of a control chip, a light intensity sensing chip or a color temperature sensing chip.

2. The optical sensing module according to claim 1, wherein: The optical sensing module further comprises: a light-transmitting conductive shielding layer; The light-transmitting conductive shielding layer is adhered to the light-shielding layer and the second surface of the light-transmitting layer, and the light-transmitting conductive shielding layer is electrically connected to the ground line in the substrate; The light-transmitting conductive shielding layer is used to shield interference signals from the optical sensing chip; The optical sensing chip is used to generate a corresponding electrical signal according to the optical signal that passes through the light-transmitting conductive shielding layer and the light-transmitting layer and reaches the sensing area.

3. The optical sensing module according to claim 2, wherein: The light-transmitting conductive shielding layer is electrically connected to the ground wire in the substrate through a circuit board, a third welding wire or a conductive column.

4. The optical sensing module according to claim 2, wherein: The surface where the light-shielding layer and the light-transmitting conductive shielding layer are attached is flush with the second surface of the light-transmitting layer.

5. The optical sensing module according to claim 4, wherein: The side surface of the substrate is bonded to the light-transmitting conductive shielding layer, and the surface of the light-shielding layer that is not bonded to the optical sensing chip, the light-transmitting layer or the substrate is bonded to the light-transmitting conductive shielding layer, wherein the first surface of the substrate is opposite to the second surface, and the side surface of the substrate is perpendicular to the first surface and the second surface of the substrate.

6. The optical sensing module according to claim 5, characterized in that: The light-transmitting conductive shielding layer is provided with a through hole for the second connection terminal located on the side surface of the substrate to pass through.

7. The optical sensing module according to claim 1, wherein: The first surface of the light-transmitting layer is bonded to the sensing area via a first chip bonding film; The light transmittance of the first chip bonding film is greater than or equal to the light transmittance of the light transmitting layer.

8. The optical sensing module according to claim 2, wherein: The light transmittance of the light-transmitting conductive shielding layer is greater than 90%.

9. The optical sensing module according to claim 1, wherein: The first surface of the optical sensor chip is bonded to the first surface of the substrate via a second chip bonding film or silver glue, and the second chip bonding film and the silver glue are non-conductive.

10. An electronic device, characterized in that: It comprises the optical sensing module and screen module as described in any one of claims 1-8.

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