LED lamp panel

Abstract

The embodiment of the utility model provides an LED lamp panel. The LED lamp panel comprises a PCB, a plurality of LED lamp beads and a mask. The plurality of LED lamp beads are arranged above the PCB in a dot matrix manner; the mask is arranged above the PCB and is provided with a plurality of through holes, and the LED lamp beads are contained in the through holes respectively; wherein at the position of the through hole, sealant is arranged between the face cover and the LED lamp bead, and the face cover is connected with the LED lamp bead through the sealant. According to the LED lamp panel provided by the embodiment of the utility model, not only can the manufacturing of small-spacing LED lamp panels be realized, but also the separation of the adhesive layer when the LED lamp panel is bent can be avoided, the manufacturing of the arc-shaped LED lamp panel is realized, and the display quality of the LED lamp panel is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to an LED lamp board. Background Art

[0002] LED panels are typically manufactured by arranging multiple LEDs in a matrix on a PCB. Glue is then poured onto the front of the PCB, sealed with a sealant around the perimeter of the bottom shell. Finally, a mask with multiple through-holes corresponding to the LEDs is secured to the PCB. This manufacturing process makes it difficult to produce panels with fine pitches. The adhesive layer is also prone to separation when the panel is bent. Furthermore, repairing individual LEDs requires removing the entire mask, making repairs more complex. Utility Model Content

[0003] In view of the above problems, embodiments of the present invention are proposed to provide an LED light board that solves the above problems or at least partially solves the above problems.

[0004] The present invention provides an LED light panel, which includes:

[0005] PCB board;

[0006] A plurality of LED lamp beads are arranged in a dot matrix above the PCB board;

[0007] A mask is provided above the PCB board and has a plurality of through holes, each of which accommodates the LED lamp beads;

[0008] Wherein, at the through hole, a sealant is provided between the mask and the LED lamp bead, and the mask and the LED lamp bead are connected via the sealant.

[0009] Furthermore, the thickness of the sealant in the through hole is not greater than the thickness of the mask.

[0010] Furthermore, the thickness of the sealant in the through hole is not greater than the thickness of the mask.

[0011] Furthermore, the height of the LED lamp beads on the PCB board is higher than the height of the mask.

[0012] Furthermore, the color of the sealant is black.

[0013] Furthermore, the mask is made of black material.

[0014] Furthermore, the mask has a plurality of rectangular through holes, and the two LED lamp beads are respectively arranged at two ends of the rectangular through holes in the length direction.

[0015] Furthermore, each of the through holes accommodates at least three LED lamp beads, and the at least three LED lamp beads are distributed at equal intervals in the through holes.

[0016] Furthermore, the mask has a plurality of square through holes, and the four LED lamp beads are respectively arranged at the four corners of the square through holes.

[0017] In the technical solution provided by the embodiment of the present utility model, multiple LED lamp beads are arranged in a dot matrix on the PCB board, and a mask with multiple through holes is placed on the PCB board so that each through hole accommodates an LED lamp bead, and sealant is poured into the through holes so that the sealant in each through hole surrounds the outer periphery of the LED lamp bead, thereby realizing the production of a small-pitch LED light board, and also avoiding the separation of the glue layer when the LED light board is bent, realizing the production of an arc-shaped LED light board, and improving the display quality of the LED light board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is an exploded schematic diagram of a three-dimensional structure of an LED light panel provided by the first embodiment of the present utility model;

[0020] Figure 2 A schematic diagram of a partial cross-sectional structure of an LED light panel provided in the first embodiment of the present utility model;

[0021] Figure 3 A schematic diagram of a planar structure of an LED light board provided in the first embodiment of the present utility model;

[0022] Figure 4 This is another schematic planar structural diagram of an LED light board provided in the first embodiment of the present utility model;

[0023] Figure 5 A flowchart of a method for manufacturing an LED light panel provided in the second embodiment of the present invention;

[0024] Figure 6 Another method flow chart of a method for manufacturing an LED light board provided in the second embodiment of the present utility model

[0025] Figure 7 This is another method flow chart of a method for manufacturing an LED light board provided in the second embodiment of the present invention. DETAILED DESCRIPTION

[0026] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the embodiments of the present invention.

[0027] It should be noted that, in the description of the present invention, if the terms "first", "second", etc. appear, "first" and "second" are only used to facilitate the description of different components or names, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" appears in the full text, its meaning is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that meet both A and B.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0029] Example 1

[0030] Please refer to Figure 1 , is a schematic exploded view of a three-dimensional structure of an LED lamp board provided by the first embodiment of the present invention, wherein the LED lamp board includes a PCB board 10, a plurality of LED lamp beads 20 and a mask 30.

[0031] Please combine Figure 2-4 The plurality of LED lamp beads 20 are arranged in a dot matrix above the PCB board 10; the mask 30 is provided above the PCB board 10 and has a plurality of through holes 310, each of which accommodates the LED lamp beads 20; wherein, at the through holes 310, a sealant 40 is provided between the mask 30 and the LED lamp beads 20, and the mask 30 and the LED lamp beads 20 are connected via the sealant 40.

[0032] Here, the PCB board 10 is the substrate of the LED light board, and the LED lamp beads 20 and the mask 30 are both arranged on the PCB board 10. Specifically, the multiple LED lamp beads 20 are arranged in a dot matrix on one side of the PCB board 10, and the multiple LED lamp beads 20 can be illuminated by the circuit in the PCB board 10 to form a display surface; the mask 30 is arranged on the side of the PCB board 10 where the LED lamp beads 20 are provided, and a plurality of through holes 310 are provided on the mask 30. When the mask 30 is placed above the PCB board 10, each of the through holes 310 accommodates the LED lamp beads 20, and the through holes 310 and the LED lamp beads 20 can be one-to-one. Matching, that is, one of the through holes 310 accommodates one of the LED lamp beads 20, and the through holes 310 and the LED lamp beads 20 can also be a one-to-many match, that is, a plurality of the LED lamp beads 20 are accommodated in one of the through holes 310; the sealant 40 is set in the range of each of the through holes 310 by glue filling, so that the mask 30 and the LED lamp beads 20 are connected through the sealant 40, that is, the mask 30 is connected to the PCB board 10 through the sealant 40 to form the LED lamp board.

[0033] In the first embodiment of the present invention, the mask 30 is connected to the LED lamp beads 20 by pouring the sealant 40 into the through hole 310, so that the production of a small-pitch LED light board can be realized; at the same time, connecting the mask 30 to the PCB board 10 through the sealant 40 can avoid the separation of the glue layer when the LED light board is bent, thereby realizing the production of a curved LED light board and improving the display quality of the LED light board.

[0034] Furthermore, in other preferred embodiments of the present invention, the thickness of the sealant 40 in the through hole 310 is not greater than the thickness of the mask 30 .

[0035] Specifically, the thickness of the sealant 40 in the through hole 310 is equal to or lower than the thickness of the mask 30, that is, the sealant 40 above the PCB board 10 is not connected into one piece, but is divided into multiple small pieces by the mask 30. This design can avoid the separation of the glue layer when the PCB board is bent, thereby realizing the production of a curved LED light board and improving the display quality of the LED light board.

[0036] In addition, in other preferred embodiments of the present invention, the height of the LED lamp beads 20 on the PCB board 10 is higher than the height of the mask 30 .

[0037] Specifically, on the PCB board 10, the top of the LED lamp bead 20 protrudes from the plane where the mask 30 is located. Such a design can ensure that when the LED lamp bead 20 is lit, the light can be completely projected outside the mask 30, thereby improving the brightness of the LED lamp bead 20 and further improving the display effect of the LED light board.

[0038] Furthermore, in other preferred embodiments of the present invention, the color of the sealant 40 is black, and / or the mask 30 is made of black material.

[0039] Specifically, the mask 30 is generally made of plastic material, and here it is made of black plastic material, which not only ensures that it has certain deformation and bending properties to realize the production of an arc-shaped LED light board, but also allows the LED light board to form a black background with a strong contrast, thereby improving the display effect of the LED light board; at the same time, by using the black sealant 40 to fill the through hole 310 and connect the LED lamp beads 20 and the mask 30, the LED light board can also have a black background with a strong contrast, thereby improving the display effect of the LED light board.

[0040] Furthermore, in a feasible embodiment of the present utility model, the mask 30 has a plurality of rectangular through holes 311, and the two LED lamp beads 20 are respectively arranged at the two ends of the length direction of the rectangular through holes 311, such as Figure 1 shown.

[0041] Here, the through hole 310 and the LED lamp bead 20 are in a one-to-two form, that is, two LED lamp beads 20 are arranged in one rectangular through hole 311. In this configuration, the two LED lamp beads 20 are respectively arranged at the two end positions of the rectangular through hole 311 along its length direction.

[0042] Furthermore, in a feasible implementation of the embodiment of the present invention, each of the through holes 310 accommodates at least three of the LED lamp beads 20 , and the at least three LED lamp beads 20 are distributed at equal intervals in the through holes 310 .

[0043] Here, the through hole 310 and the LED lamp beads 20 are in the form of one with at least three. The shape of the through hole 310 can be a rectangle or a regular N-gon. If the through hole 310 is a rectangle, the at least three LED lamp beads 20 are evenly spaced along the length direction of the through hole 310. If the through hole 310 is a regular N-gon, the number of the at least three LED lamp beads 20 is N, that is, the N LED lamp beads 20 are also distributed in a smaller regular N-gon in the through hole 310, so that the distance between two adjacent LED lamp beads 20 of the N LED lamp beads 20 is equal.

[0044] Furthermore, in a feasible embodiment of the present utility model, the mask 30 has a plurality of square through holes 312, and the four LED lamp beads 20 are respectively arranged at the four corners of the square through holes. Figure 3 shown.

[0045] Here, the through hole 310 and the LED lamp beads 20 are in a one-to-four form, that is, four LED lamp beads 20 are arranged in one square through hole 312. In this configuration, the four LED lamp beads 20 are respectively arranged at the four corners of the square through hole 312, so that a smaller square structure can also be formed between the four LED lamp beads 20.

[0046] Furthermore, in a feasible embodiment of the present invention, the mask 30 has a plurality of square through holes 313, and the center position of each square through hole 313 is provided with an LED lamp bead 20, such as Figure 4 shown.

[0047] The through hole 310 and the LED lamp bead 20 are in a one-to-one configuration, that is, one LED lamp bead 20 is disposed in one of the square through holes 313 . In this configuration, one LED lamp bead 20 is disposed at the center of the square through hole 313 .

[0048] Example 2

[0049] Please refer to Figure 5 , is a flow chart of a method for manufacturing an LED light board provided by the second embodiment of the present invention, the LED light board manufacturing method comprising:

[0050] S100, multiple LED lamp beads are arranged in a dot matrix on the PCB board;

[0051] S200, placing a mask having a plurality of through holes on the PCB board, so that each of the through holes accommodates the LED lamp bead;

[0052] S300, pouring glue into the through holes so that the sealant in each through hole surrounds the outer circumference of the LED lamp bead.

[0053] Specifically, in step S100, the method of arranging the plurality of LED lamp beads in a matrix on the PCB board includes but is not limited to a surface mount method or a welding method, so as to form a display surface on the PCB board.

[0054] Following step S100, in step S200, the mask is placed on the PCB board, and it needs to be pre-fixed here, including but not limited to by local bonding. A plurality of through holes are provided on the mask, so that each of the through holes accommodates the LED lamp beads. Here, the through holes and the LED lamp beads can be matched one-to-one, that is, one LED lamp bead is accommodated in one through hole, and the through holes and the LED lamp beads can also be matched one-to-many, that is, one through hole accommodates multiple LED lamp beads.

[0055] It should be pointed out here that before placing the mask on the PCB board, the mask with corresponding multiple through holes is also made according to the arrangement of the multiple LED lamp beads on the PCB board. It can be an integrated injection molding form according to a preset model, or it can be a form of making the complete mask and then performing corresponding punching.

[0056] Following step S200, in step S300, sealant is poured into the multiple through holes by a gluing machine, so that the sealant colloid in each of the through holes is respectively arranged around the outer circumference of the LED lamp bead, so that the mask and the LED lamp bead are connected through the sealant, that is, the mask is connected to the PCB board through the sealant to form the LED lamp board.

[0057] In the second embodiment of the present invention, the mask is first placed on the PCB board, and then the mask is connected to the LED lamp beads by pouring the sealant into the through holes of the mask, so that the production of a small-pitch LED light board can be realized; at the same time, connecting the mask to the PCB board through the sealant can avoid the separation of the glue layer when the LED light board is bent, thereby realizing the production of a curved LED light board and improving the display quality of the LED light board.

[0058] For further information, please refer to Figure 6 In another preferred embodiment of the present invention, step S300, filling the through holes with glue so that the sealant in each through hole surrounds the outer circumference of the LED lamp bead, includes:

[0059] S310, pouring glue into the plurality of through holes along the center of the through holes toward the edges, so that the sealant surrounds the periphery of the LED lamp beads in the through holes and the thickness of the sealant is no greater than the thickness of the mask.

[0060] Specifically, when a through hole contains multiple LED lamp beads and the multiple LED lamp beads are arranged along the edge of the through hole, the center position of the through hole is relatively empty. Therefore, by pouring glue from the center of the through hole to its edge, it can be ensured that the sealant colloid is arranged around the periphery of the LED lamp bead, and the uniformity of the sealant pouring can be ensured. It is easy to obtain sealant of uniform thickness in the through hole, so that the thickness of the sealant is not greater than the thickness of the mask, and then the sealant above the PCB board is divided into multiple small pieces through the mask. Such a design can avoid the separation of the glue layer when the PCB board is bent, thereby realizing the production of curved LED light boards and improving the display quality of LED light boards.

[0061] Also, please refer to Figure 7 In another preferred embodiment of the present invention, step S300, filling the through hole with glue so that the sealant in each through hole surrounds the outer circumference of the LED lamp bead, includes:

[0062] S320: pouring glue into the plurality of through holes along the edges of the through holes toward the center, so that the sealant surrounds the periphery of the LED lamp beads in the through holes and the thickness of the sealant is no greater than the thickness of the mask.

[0063] Specifically, when only one LED lamp bead is accommodated in a through hole, the LED lamp bead is generally located in the center of the through hole. Therefore, by pouring glue along the edge of the through hole toward its center, it can be ensured that the sealant colloid is arranged around the periphery of the LED lamp bead, and the uniformity of the sealant pouring can be ensured. It is easy to obtain sealant of uniform thickness in the through hole, so that the thickness of the sealant is not greater than the thickness of the mask, and then the sealant above the PCB board is divided into multiple small pieces through the mask. Such a design can avoid the separation of the glue layer when the PCB board is bent, thereby realizing the production of an arc-shaped LED light board and improving the display quality of the LED light board.

[0064] Furthermore, in a feasible implementation manner of the embodiment of the present utility model, each of the through holes accommodates one LED lamp bead, and the LED lamp beads are all located at the center of the through holes.

[0065] Here, the through hole and the LED lamp bead are in a one-to-one form, that is, there is and only one LED lamp bead in one through hole, and the shape of the through hole includes but is not limited to a square through hole, that is, one LED lamp bead is arranged in one square through hole. In this configuration, one LED lamp bead is arranged at the center position of the square through hole.

[0066] Furthermore, in another feasible implementation of the embodiment of the present invention, each of the through holes accommodates at least three of the LED lamp beads, and the at least three LED lamp beads are distributed at equal intervals in the through holes.

[0067] Here, the through hole and the LED lamp beads are in the form of one with at least three. The shape of the through hole can be a rectangle or a regular N-gon. If the through hole is a rectangle, the at least three LED lamp beads are evenly spaced along the length direction of the through hole. If the through hole is a regular N-gon, the number of the at least three LED lamp beads is N, that is, the N LED lamp beads are also distributed in a smaller regular N-gon in the through hole, so that the distance between two adjacent LED lamp beads of the N LED lamp beads is equal.

[0068] In addition, in another feasible implementation of the embodiment of the utility model, the through hole and the LED lamp beads can also be in the form of one with two. The through hole here is generally a rectangular through hole, that is, two LED lamp beads are arranged in one rectangular through hole. In this configuration, the two LED lamp beads are respectively arranged at the two end positions of the rectangular through hole along its length direction.

[0069] In addition, it should be pointed out that the LED light board manufacturing method of the second embodiment can be used to manufacture an LED light board as in the first embodiment, so if there are any unclear points between the first and second embodiments, the two can be used for reference.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, rather than to limit them. Although the embodiments of the present invention have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An LED light board, characterized in that: include: PCB board; A plurality of LED lamp beads are arranged in a dot matrix above the PCB board; A mask is provided above the PCB board and has a plurality of through holes, each of which accommodates the LED lamp beads; Wherein, at the through hole, a sealant is provided between the mask and the LED lamp bead, and the mask and the LED lamp bead are connected via the sealant.

2. The LED light board according to claim 1, characterized in that: The thickness of the sealant in the through hole is no greater than the thickness of the mask.

3. The LED light board according to claim 1, characterized in that: The height of the LED lamp beads on the PCB board is higher than the height of the mask.

4. The LED light board according to claim 1, characterized in that: The color of the sealant is black.

5. The LED light board according to claim 1, characterized in that: The mask is made of black material.

6. The LED light board according to any one of claims 1 to 5, characterized in that: The mask has a plurality of rectangular through holes, and the two LED lamp beads are respectively arranged at two ends of the rectangular through holes in the length direction.

7. The LED light board according to any one of claims 1 to 5, characterized in that: Each of the through holes accommodates at least three LED lamp beads, and the at least three LED lamp beads are distributed at equal intervals in the through holes.

8. The LED light board according to any one of claims 1 to 5, characterized in that: The mask has a plurality of square through holes, and the four LED lamp beads are respectively arranged at the four corners of the square through holes.

9. The LED light board according to any one of claims 1 to 5, characterized in that: The mask has a plurality of square through holes, and an LED lamp bead is arranged at the center of each of the square through holes.

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