Hemispherical harmonic oscillator quality leveling device

Abstract

The utility model discloses a quality leveling device for a hemispherical harmonic oscillator. The quality leveling device comprises a vacuum cavity, a mounting structure, a quality leveling mechanism and a driving mechanism, the installation structure comprises a rotary table and a plurality of harmonic oscillator installation mechanisms which can be installed on the outer edge of the rotary table in a circumferential rotation mode, the harmonic oscillator installation mechanisms are evenly distributed in the circumferential direction of the rotary table at intervals, the mass leveling mechanism comprises a beam diameter mask cover and an ion source, and the ion source is fixed in a vacuum cavity; the center position of an ion beam outlet of the beam diameter mask cover and the lip edge plane of the hemispherical harmonic oscillator are located on the same horizontal plane, the beam diameter mask cover is movably installed in the vacuum cavity, a beam passing hole is formed in the side wall of the beam diameter mask cover, the beam diameter mask cover can move up and down relative to the vacuum cavity to a mask state, and when the beam diameter mask cover is in the mask state, the beam passing hole passes through the beam passing hole. Each harmonic oscillator installation mechanism and the hemispherical harmonic oscillator on the harmonic oscillator installation mechanism are covered with the harmonic oscillator installation mechanism, and a beam passing hole of the harmonic oscillator installation mechanism is opposite to an ion beam outlet of the ion source. According to the utility model, batch leveling processing of the hemispherical harmonic oscillators can be realized, and the quality leveling efficiency of the hemispherical harmonic oscillators is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of inertial navigation device preparation, in particular to a hemispherical resonator mass leveling device. Background Art

[0002] The hemispherical resonator gyroscope is a new type of solid-state navigation gyroscope, in which the hemispherical resonator for measuring the precession angle is a cup-shaped symmetrical sensitive vibration component made of fused quartz. The hemispherical resonator made of fused quartz has stable physical properties and a high quality factor under high vacuum conditions. However, during the molding process, the influence of mechanical structure, external environmental temperature and humidity, etc. causes a certain deviation in the symmetry size of the hemispherical resonator. The size deviation causes the mass of the bowl-shaped hemispherical resonator to be uneven. When the hemispherical resonator is excited to vibrate at the second-order natural frequency, the mass unevenness will form frequency cracking, and frequency cracking is one of the main factors affecting the measurement accuracy of the gyroscope. Therefore, it is necessary to level the mass of the hemispherical resonator to control its symmetry size deviation.

[0003] Hemispherical resonator mass leveling can generally be divided into laser etching, chemical etching, ion beam etching and other methods to remove mass. Ion beam etching is when directed high-energy ions collide with the surface of the hemispherical resonator, and the energy is transferred from the incident ions to the atoms on the surface of the hemispherical resonator. When the binding energy of the atoms on the surface of the hemispherical resonator formed by fused quartz is lower than the energy of the incident ions, the atoms on the surface of the hemispherical resonator will be moved away and removed. Its advantages are mainly manifested in good directionality, high controllability of etching rate up to nanometer level, strong versatility, and can etch various materials. The process can change the incident angle to control the etching profile and can be used for special structures. Moreover, its etching uniformity, repeatability, and no thermal damage are very suitable for hemispherical resonator mass leveling.

[0004] According to literature reports, ion beam etching currently uses a single hemispherical resonator to remove mass, which is inefficient and not conducive to mass production. Utility Model Content

[0005] In view of the problems in the background technology, the utility model proposes a hemispherical resonator mass leveling device which realizes batch leveling processing of hemispherical resonators and improves the mass leveling efficiency of hemispherical resonators.

[0006] The utility model adopts the following technical solutions:

[0007] A hemispherical resonator mass leveling device comprises a vacuum cavity, a mounting structure, a mass leveling mechanism and a driving mechanism;

[0008] The mounting structure includes a turntable and a plurality of resonator mounting mechanisms, the turntable is horizontally rotatable and mounted in the vacuum chamber, the resonator mounting mechanisms are horizontally rotatable and mounted on the outer edge of the turntable, the plurality of resonator mounting mechanisms are evenly spaced along the circumference of the turntable, the driving mechanism is mounted on the vacuum chamber and is transmission-connected to the turntable and the plurality of resonator mounting mechanisms, and is used to drive the turntable to rotate horizontally and drive the resonator mounting mechanisms to rotate horizontally and circumferentially;

[0009] The mass leveling mechanism includes a beam path mask cover and an ion source. The ion source is fixed in the vacuum chamber, and the center position of its ion beam outlet is on the same horizontal plane as the lip edge plane of the hemispherical resonator. The beam path mask cover is movably installed in the vacuum chamber, and a beam through hole is provided on its side wall. The beam path mask cover can be moved up and down relative to the vacuum chamber to a masking state. When the beam path mask cover is in the masking state, multiple resonator mounting mechanisms and the hemispherical resonator on each resonator mounting mechanism are all covered therein, and the beam through hole is arranged relative to the ion beam outlet of the ion source.

[0010] Optionally, the vacuum chamber is further provided with a self-rotating driving gear and a plurality of self-rotating gears, the self-rotating gear is provided in the center hole of the self-rotating driving gear and meshes with the self-rotating driving gear, and the plurality of self-rotating gears correspond to and are fixedly connected to the plurality of resonator mounting mechanisms one by one;

[0011] The driving mechanism includes an autorotation driving motor, which is connected to the autorotation driving gear for driving the autorotation driving gear to rotate, thereby driving the autorotation gear and its corresponding resonator mounting mechanism to rotate circumferentially.

[0012] Optionally, the driving mechanism further includes a revolving motor, which is transmission-connected to the turntable and is used to drive the turntable to rotate circumferentially.

[0013] Optionally, the driving mechanism also includes a screw drive motor, and a screw nut substructure is also provided in the vacuum chamber, the screw nut substructure includes a nut fixed to the beam diameter mask cover, and a screw connected to the vacuum chamber for rotation, one end of the screw is threadedly connected to the nut, and the other end is transmission-connected to the screw drive motor, and the screw drive motor is used to drive the screw to rotate, so as to drive the nut and the beam diameter mask cover to move up and down.

[0014] Optionally, a three-mode magnetic fluid sealing structure is sealed and penetrated on the vacuum chamber, and the three-mode magnetic fluid sealing structure includes a central shaft, an inner ring sealed and rotatably connected to the central shaft, and an outer ring sealed and rotatably connected to the inner ring. The screw drive motor is connected to the screw transmission through the central shaft, the revolving motor is connected to the turntable transmission through the inner ring, and the autorotation drive motor is connected to the autorotation drive gear transmission through the outer ring.

[0015] Optionally, the mounting structure further includes a revolving cylinder and a rotating ring, which are coaxially arranged, and the revolving cylinder is sleeved outside the screw, and the rotating ring is sleeved outside the revolving cylinder, the revolving cylinder is connected between the inner ring and the turntable, and the rotating ring is connected between the outer ring and the rotating drive gear.

[0016] Optionally, the outer ring and the rotation driving gear are connected via a plurality of linkage support rods, and the plurality of linkage support rods are evenly distributed along the circumference of the rotation driving gear.

[0017] Optionally, a shield is further provided in the vacuum chamber, and the mounting structure cover is provided in the shield.

[0018] Optionally, a plurality of vertically arranged guide rods are further provided in the vacuum chamber, one end of the guide rod is fixed to the chamber wall of the vacuum chamber, and the other end thereof passes through the beam path mask cover.

[0019] Optionally, a piezoelectric ceramic component is fixed to the upper end of the resonator mounting mechanism, and a mounting hole is provided on the top surface of the piezoelectric ceramic component for cooperating with the support column of the hemispherical resonator. A top screw hole is provided on the side wall of the piezoelectric ceramic component and passes through the mounting hole, for passing a top screw so that the top screw can tighten the hemispherical resonator into the mounting hole.

[0020] Compared with the prior art, the advantages of the present invention are:

[0021] The utility model discloses a hemispherical resonator mass leveling device, which is provided with a circumferentially rotatable turntable in a vacuum chamber, and a plurality of circumferentially rotatable resonator mounting mechanisms which are evenly distributed on the edge of the turntable at circumferential intervals, and a beam diameter mask cover which can be moved up and down to cover the hemispherical resonators on each resonator mounting mechanism, and a beam hole is provided at a position where the beam diameter mask cover faces an ion source, so that the hemispherical resonators on the plurality of resonator mounting mechanisms are transferred to the leveling station one by one by rotating the turntable, the resonator mounting mechanisms on the leveling station rotate to a lip position of the hemispherical resonator to be mass leveled facing an ion source outlet, the beam diameter mask cover moves down to cover the plurality of hemispherical resonators, and after the ion source is turned on, the ion beam passes through the beam hole to bombard the lip position of the hemispherical resonator to be mass leveled on the leveling station, thereby removing the surface atoms of the hemispherical resonator at this position, thereby achieving mass leveling. In summary, the utility model can realize batch leveling processing of bare hemispherical resonators and hemispherical resonators after metal film deposition, which greatly improves the mass leveling efficiency of hemispherical resonators. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to make the present invention more easily understood, the present invention will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings only depict typical embodiments of the present invention and should not be considered as limiting the scope of protection of the present invention.

[0023] Figure 1This is a schematic structural diagram of a hemispherical resonator mass leveling device according to an embodiment of the present utility model.

[0024] Figure 2 This is a structural schematic diagram of a partial structure of a hemispherical resonator mass leveling device located in a vacuum cavity according to an embodiment of the utility model.

[0025] Figure 3 for Figure 2 AA cross-section diagram.

[0026] Figure 4 It is a schematic diagram of the three-dimensional structure of the beam diameter mask cover in an embodiment of the present invention.

[0027] Figure 5 Schematic diagram of the cross-sectional structure of a piezoelectric ceramic component.

[0028] Reference numerals:

[0029] 1. Vacuum chamber; 2. Mounting structure; 21. Turntable; 22. Resonator mounting mechanism; 23. Autorotation drive gear; 24. Autorotation gear; 25. Revolution cylinder; 26. Autorotation ring; 27. Linkage support rod; 3. Mass leveling mechanism; 31. Beam diameter mask cover; 311. Beam hole; 32. Ion source; 33. Nut; 34. Screw; 35. Guide rod; 4. Driving mechanism; 41. Autorotation drive motor; 42. Revolution motor; 43. Screw drive motor; 5. Three-mode magnetofluid sealing structure; 51. Center axis; 52. Inner ring; 53. Outer ring; 6. Shield; 7. Piezoelectric ceramic component; 71. Mounting hole; 72. Top screw hole. DETAILED DESCRIPTION

[0030] The following describes the implementation methods of the present invention with reference to the accompanying drawings so that those skilled in the art can better understand the present invention and implement it. However, the enumerated embodiments are not intended to limit the present invention. Unless there is a conflict, the following embodiments and the technical features in the embodiments can be combined with each other, and the same components are represented by the same figure marks.

[0031] like Figure 1-Figure 5 As shown, the hemispherical resonator mass leveling device of this embodiment includes a vacuum cavity 1, a mounting structure 2, a mass leveling mechanism 3 and a driving mechanism 4;

[0032] The mounting structure 2 includes a turntable 21 and a plurality of resonator mounting mechanisms 22. The turntable 21 is horizontally rotatably mounted in the vacuum chamber 1. The resonator mounting mechanisms 22 are horizontally rotatably mounted on the outer edge of the turntable 21. The plurality of resonator mounting mechanisms 22 are evenly spaced along the circumference of the turntable 21. The driving mechanism 4 is mounted on the vacuum chamber 1 and is transmission-connected to the turntable 21 and the plurality of resonator mounting mechanisms 22. The driving mechanism 4 is configured to drive the turntable 21 to rotate horizontally and the resonator mounting mechanisms 22 to rotate horizontally.

[0033] The mass leveling mechanism 3 includes a beam path mask cover 31 and an ion source 32. The ion source 32 is fixed in the vacuum chamber 1. The center position of its ion beam outlet is on the same horizontal plane as the lip edge plane of the hemispherical resonator. The beam path mask cover 31 is movably installed in the vacuum chamber 1. A beam hole 311 is provided on its side wall. The beam path mask cover 31 can move up and down relative to the vacuum chamber 1 to a masking state. When the beam path mask cover 31 is in the masking state, multiple resonator mounting mechanisms 22 and the hemispherical resonators on each resonator mounting mechanism 22 are all covered therein, and the beam hole 311 is arranged relative to the ion beam outlet of the ion source 32.

[0034] Therefore, a circumferentially rotatable turntable 21 and a plurality of circumferentially rotatable resonator mounting mechanisms 22 are arranged in the vacuum chamber 1, and a beam diameter mask cover 31 is arranged which can move up and down to cover the hemispherical resonator 8 on each resonator mounting mechanism 22, and a beam hole 311 is provided at a position where the beam diameter mask cover 31 is facing the ion source, so that the hemispherical resonators 8 on the plurality of resonator mounting mechanisms 22 are transferred to the leveling station one by one by rotating the turntable 21, the resonator mounting mechanisms 22 on the leveling station rotate to a position where the lip edge of the hemispherical resonator 8 to be mass leveled is facing the outlet of the ion source 32, the beam diameter mask cover 31 moves down to cover the plurality of hemispherical resonators 8 therein, and after the ion source 32 is turned on, the ion beam passes through the beam hole 311 to bombard the lip edge of the hemispherical resonator 8 to be mass leveled on the leveling station, thereby removing the surface atoms of the hemispherical resonator 8 at this position, thereby achieving mass leveling. In summary, the utility model can realize batch leveling processing of bare hemispherical resonators and hemispherical resonators after metal film deposition, which greatly improves the mass leveling efficiency of hemispherical resonators.

[0035] In this embodiment, the vacuum chamber 1 is further provided with a self-rotating driving gear 23 and a plurality of self-rotating gears 24. The self-rotating gear 24 is disposed in the center hole of the self-rotating driving gear 23 and meshes with the self-rotating driving gear 23. The plurality of self-rotating gears 24 correspond to and are fixedly connected to the plurality of resonator mounting mechanisms 22 in a one-to-one manner.

[0036] The driving mechanism 4 includes a rotation driving motor 41, which is transmission-connected to the rotation driving gear 23 and is used to drive the rotation driving gear 23 to rotate, thereby driving the rotation gear 24 and its corresponding resonator mounting mechanism 22 to rotate circumferentially.

[0037] Therefore, by providing the self-rotating driving gear 23 and the plurality of self-rotating gears 24 meshing with the self-rotating driving gear 23, only one driving motor is required to realize the circumferential rotation of the plurality of resonator mounting mechanisms 22 and the hemispherical resonators 8 thereon.

[0038] In this embodiment, the driving mechanism 4 further includes a revolving motor 42 , which is transmission-connected to the turntable 21 and is used to drive the turntable 21 to rotate circumferentially.

[0039] In this embodiment, the driving mechanism 4 also includes a screw drive motor 43, and a screw nut substructure is also provided in the vacuum chamber 1. The screw nut substructure includes a nut 33 fixedly connected to the beam diameter mask cover 31, and a screw 34 rotatably connected to the vacuum chamber 1. One end of the screw 34 is threadedly connected to the nut 33, and the other end is transmission-connected to the screw drive motor 43. The screw drive motor 43 is used to drive the screw 34 to rotate, thereby driving the nut 33 and the beam diameter mask cover 31 to move up and down.

[0040] In this embodiment, a three-modal magnetic fluid sealing structure 5 is sealed and penetrated on the vacuum chamber 1. The three-modal magnetic fluid sealing structure 5 includes a central shaft 51, an inner ring 52 sealed and rotatably connected to the central shaft 51, and an outer ring 53 sealed and rotatably connected to the inner ring 52. The screw drive motor 43 is connected to the screw 34 through the central shaft 51, the revolution motor 42 is connected to the turntable 21 through the inner ring 52, and the rotation drive motor 41 is connected to the rotation drive gear 23 through the outer ring 53.

[0041] Thus, the driving mechanism 4 realizes a sealed transmission connection with the internal revolving and rotating structure through the multi-modal magnetic fluid sealing structure 5, and realizes the function of the external driving mechanism driving the internal planetary gear to rotate while ensuring the sealing condition.

[0042] In this embodiment, the mounting structure 2 also includes a rotating cylinder 25 and a rotating ring 26. The rotating cylinder 25 and the rotating ring 26 are coaxially arranged, and the rotating cylinder 25 is sleeved outside the screw, and the rotating ring 26 is sleeved outside the rotating cylinder 25. The rotating cylinder 25 is connected between the inner ring 52 and the turntable 21, and the rotating ring 26 is connected between the outer ring 53 and the rotating drive gear 23.

[0043] In this embodiment, the outer ring 53 and the rotation driving gear 23 are connected via a plurality of linkage support rods 27 , and the plurality of linkage support rods 27 are evenly distributed along the circumference of the rotation driving gear 23 .

[0044] In this embodiment, a blocking cover 6 is further provided in the vacuum chamber 1 , and the mounting structure 2 is covered in the blocking cover 6 .

[0045] In this embodiment, a plurality of vertically arranged guide rods 35 are further provided in the vacuum chamber 1 . One end of the guide rod 35 is fixed to the wall of the vacuum chamber 1 , and the other end thereof passes through the beam path mask cover 31 .

[0046] In this embodiment, Figure 5 As shown, a piezoelectric ceramic component 7 is fixed to the upper end of the resonator mounting mechanism 22. The top surface of the piezoelectric ceramic component 7 is provided with a mounting hole 71 that cooperates with the support column of the hemispherical resonator. The side wall of the piezoelectric ceramic component 7 is provided with a top screw hole 72 that passes through the mounting hole 71 and is used to pass a top screw so that the top screw can tighten the hemispherical resonator into the mounting hole 71.

[0047] In addition, the ion source 32 is mounted on the side wall of the vacuum chamber via a multi-degree-of-freedom robotic arm, which can be adjusted online at multiple angles. This allows for online adjustment of position and angle under high vacuum conditions, allowing the angle and position of the beam spot to be adjusted for etching.

[0048] The beam path mask cover 31 serves as a mask during etching and a limiter for the incidence of glow light. The position of the beam hole 311 is opened according to the height of the equatorial edge of the hemispherical resonator.

[0049] The process of batch etching hemispherical resonators using the hemispherical resonator mass leveling device of this embodiment is as follows:

[0050] 1) Deflate the vacuum chamber 1 to the atmosphere and open the chamber door. Figure 1 As shown, the screw 34 is rotated by the operation of the screw drive motor 43, and the nut 33 drives the beam diameter mask cover 31 to move upward. The beam diameter mask cover 31 is limited by the guide rod 35 and can only move up and down but cannot rotate.

[0051] 2) By controlling the rotation of the externally mounted revolution motor 42, the turntable 21 inside the cavity is driven to rotate, and the resonator mounting mechanism 22 mounted on the turntable 21 and the piezoelectric ceramic component 7 thereon are rotated to face the operator. The anchor rod of the hemispherical resonator 8 is aligned with the top opening of the piezoelectric ceramic component 7 and inserted. The anchor rod of the hemispherical resonator 8 is fixed by the top screw. This action is repeated according to the number of workpiece positions until the hemispherical resonators 8 are installed on all workpiece positions. Preferably, in this embodiment, eight hemispherical resonators 8 are installed.

[0052] 3) Close the door of the vacuum chamber 1 and evacuate the chamber to 1.0E-3Pa;

[0053] 4) By controlling the rotation of the externally mounted revolution motor 42, the turntable 21 inside the cavity is driven to rotate, and the resonator mounting mechanism 22 mounted on the turntable 2 and the piezoelectric ceramic member 7 and hemispherical resonator 8 thereon are rotated to an initial position facing the vacuum cavity window. The frequency of the piezoelectric ceramic member 7 is scanned by a signal generator to drive the hemispherical resonator 8 to resonate. Then, an external laser vibrometer is used for scanning and testing. In FFT mode, its maximum resonance peak and the subharmonics caused by the uneven mass caused by its processing error are found. The rotation drive motor 41 is controlled online to drive the rotation drive gear 23, which in turn drives the rotation gear 24 to rotate, causing the piezoelectric ceramic member 7 and hemispherical resonator 8 mounted on the resonator mounting mechanism 22 to rotate along their own axes. This operation is repeated multiple times until the angle corresponding to their rigid axis is found. The azimuth angle corresponding to the mass defect is calculated by fitting.

[0054] 5) Repeat step 4) to complete the calculated directional angles of ion etching required for eight hemispherical resonators 8, and rotate the hemispherical resonators 8 circumferentially according to the calculated initial azimuth angles required for etching until the position to be etched faces the outermost side in the radial direction of the turntable, so that when the hemispherical resonator 8 is rotated to the leveling position, the position to be etched faces the ion source 32;

[0055] 6) By controlling the operation of the screw drive motor 43 to rotate the screw 34, the nut 33 drives the beam diameter mask cover 31 to move downward, so that the beam direction of the beam diameter mask cover 31 through the beam hole 311 and the ion source 32 is parallel to the equatorial edge of the hemispherical resonator 8;

[0056] 7) Start the ion source 32 for etching. When a single hemispherical resonator 8 needs to be etched at multiple angles, the rotation drive motor 41 can be controlled online to drive the rotation drive gear 23, so that the piezoelectric ceramic component 7 and the hemispherical resonator 8 installed on the resonator mounting mechanism 22 rotate along their own axes.

[0057] 8) Online adjusting the revolution motor 42 to rotate to the initial direction angle calculated corresponding to each hemispherical resonator 8 to be etched, so that the beam hole 311 on the beam path mask cover 31, the beam direction of the ion source 32 and the equatorial edge of the hemispherical resonator 8 are parallel, and repeating steps 7 and 8 until the mass removal of all hemispherical resonators 8 is completed;

[0058] 9) The screw drive motor 43 rotates the screw 34, and the nut 33 drives the beam diameter mask cover 31 upward to the upper limit;

[0059] 10) Break the vacuum to atmosphere and open the door of the vacuum chamber 1 to remove the parts.

[0060] The embodiments described above are merely preferred embodiments of the present invention. The phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments" used in this specification may refer to one or more of the same or different embodiments of the present disclosure. Any common changes and substitutions made by those skilled in the art within the scope of the present invention are intended to be encompassed within the scope of protection of the present invention.

Claims

1. A hemispherical resonator mass leveling device, characterized in that: It comprises a vacuum chamber (1), a mounting structure (2), a mass leveling mechanism (3) and a driving mechanism (4); The mounting structure (2) comprises a turntable (21) and a plurality of resonator mounting mechanisms (22); the turntable (21) is mounted in a horizontal and circumferentially rotatable manner in the vacuum chamber (1); the resonator mounting mechanisms (22) are mounted on the outer edge of the turntable (21) in a horizontal and circumferentially rotatable manner; the plurality of resonator mounting mechanisms (22) are evenly spaced along the circumference of the turntable (21); a driving mechanism (4) is mounted on the vacuum chamber (1) and is transmission-connected to the turntable (21) and the plurality of resonator mounting mechanisms (22) for driving the turntable (21) in a horizontal and circumferentially rotatable manner and for driving the resonator mounting mechanisms (22) in a horizontal and circumferentially rotatable manner; The mass leveling mechanism (3) comprises a beam diameter mask cover (31) and an ion source (32). The ion source (32) is fixed in a vacuum chamber (1), and the center position of the ion beam outlet thereof is on the same horizontal plane as the lip edge plane of the hemispherical resonator. The beam diameter mask cover (31) is movably installed in the vacuum chamber (1), and a beam hole (311) is provided on the side wall thereof. The beam diameter mask cover (31) can be moved up and down relative to the vacuum chamber (1) to a masking state. When the beam diameter mask cover (31) is in the masking state, a plurality of resonator mounting mechanisms (22) and the hemispherical resonator on each resonator mounting mechanism (22) are all covered therein, and the beam hole (311) is arranged relative to the ion beam outlet of the ion source (32).

2. The hemispherical resonator mass leveling device according to claim 1, characterized in that: The vacuum chamber (1) is further provided with a self-rotating driving gear (23) and a plurality of self-rotating gears (24); the self-rotating gear (24) is arranged in a central hole of the self-rotating driving gear (23) and meshes with the self-rotating driving gear (23); the plurality of self-rotating gears (24) correspond to the plurality of resonator mounting mechanisms (22) in a one-to-one manner and are fixedly connected; The driving mechanism (4) includes a self-rotating driving motor (41), which is connected to the self-rotating driving gear (23) for driving the self-rotating driving gear (23) to rotate, thereby driving the self-rotating gear (24) and its corresponding resonator mounting mechanism (22) to rotate circumferentially.

3. The hemispherical resonator mass leveling device according to claim 2, characterized in that: The driving mechanism (4) further comprises a revolving motor (42), which is in transmission connection with the turntable (21) and is used for driving the turntable (21) to rotate in a circumferential direction.

4. The hemispherical resonator mass leveling device according to claim 3, characterized in that: The driving mechanism (4) further comprises a screw drive motor (43). A lead screw nut substructure is further provided in the vacuum chamber (1). The lead screw nut substructure comprises a nut (33) fixedly connected to the beam diameter mask cover (31), and a screw (34) rotatably connected to the vacuum chamber (1). One end of the screw (34) is threadedly connected to the nut (33), and the other end thereof is transmission-connected to the screw drive motor (43). The screw drive motor (43) is used to drive the screw (34) to rotate, thereby driving the nut (33) and the beam diameter mask cover (31) to move up and down.

5. The hemispherical resonator mass leveling device according to claim 4, characterized in that: A three-mode magnetic fluid sealing structure (5) is sealed and penetrated on the vacuum chamber (1). The three-mode magnetic fluid sealing structure (5) comprises a central shaft (51), an inner ring (52) connected to the central shaft (51) in a sealed rotation manner, and an outer ring (53) connected to the inner ring (52) in a sealed rotation manner. The screw drive motor (43) is connected to the screw (34) in a transmission manner through the central shaft (51), the revolution motor (42) is connected to the turntable (21) in a transmission manner through the inner ring (52), and the rotation drive motor (41) is connected to the rotation drive gear (23) in a transmission manner through the outer ring (53).

6. The hemispherical resonator mass leveling device according to claim 5, characterized in that: The mounting structure (2) further comprises a revolution cylinder (25) and a rotation ring (26), wherein the revolution cylinder (25) and the rotation ring (26) are coaxially arranged, and the revolution cylinder (25) is sleeved outside the screw, and the rotation ring (26) is sleeved outside the revolution cylinder (25), the revolution cylinder (25) is connected between the inner ring (52) and the turntable (21), and the rotation ring (26) is connected between the outer ring (53) and the rotation drive gear (23).

7. The hemispherical resonator mass leveling device according to claim 6, characterized in that: The outer ring (53) is connected to the self-rotating driving gear (23) via a plurality of linkage support rods (27), and the plurality of linkage support rods (27) are evenly distributed along the circumference of the self-rotating driving gear (23).

8. The hemispherical resonator mass leveling device according to any one of claims 1 to 7, characterized in that: A shield (6) is further provided in the vacuum chamber (1), and the mounting structure (2) is covered in the shield (6).

9. The hemispherical resonator mass leveling device according to any one of claims 1 to 7, characterized in that: A plurality of vertically arranged guide rods (35) are further provided in the vacuum cavity (1), one end of the guide rod (35) is fixed to the cavity wall of the vacuum cavity (1), and the other end thereof passes through the beam diameter mask cover (31).

10. The hemispherical resonator mass leveling device according to any one of claims 1 to 7, characterized in that: A piezoelectric ceramic component (7) is fixed to the upper end of the resonator mounting mechanism (22); a mounting hole (71) cooperating with a support column of the hemispherical resonator is provided on the top surface of the piezoelectric ceramic component (7); and a top screw hole (72) penetrating the mounting hole (71) is provided on the side wall of the piezoelectric ceramic component (7) for inserting a top screw so that the top screw can press the hemispherical resonator tightly into the mounting hole (71).

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