Sheet shaking machine

Abstract

The utility model provides a wafer shaking machine, and relates to the technical field of wafer processing. The utility model relates to a wafer shaking machine, which comprises a base provided with a top surface and a bottom surface which are oppositely arranged, and a wafer box is placed on the top surface; the frame body at least comprises two oppositely-arranged side walls and a bottom plate connected with the two side walls, and the base is contained in a cavity formed by the side walls and the bottom plate; the rolling shaft is rotatably connected to the two side walls; and the lifting device is mounted at one end, close to the side wall, of the base so as to lift the frame body and drive the rolling shaft mounted in the frame body to lift. The lifting device can lift up the rolling shaft so as to lift up the wafer, so that an operator can observe the condition of the bottom of the wafer more conveniently; the base is made of materials and matched with the wafer box in size and specification. Therefore, the device can be better matched with wafer cassettes of different specifications, and small particles generated by friction or improper contact can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer shaking machine. Background Art

[0002] During the wafer manufacturing process, in order to avoid wafer slicing and damage, the exact position and orientation of the wafer needs to be determined. Before the silicon wafer is cut, one or more flat edges are cut on the silicon ingot, and the orientation of the wafer is determined based on the position of the flat edge. However, traditional wafer shakers have certain limitations. First, they lack flexibility, making it difficult for operators to easily observe and adjust the position of the wafer, especially when it is necessary to carefully observe the details of the flat edge at the bottom of the wafer. The operation is cumbersome and inefficient. Secondly, the traditional lifting and rolling axis method can no longer meet the fast-paced demands of modern production lines in terms of speed and efficiency, resulting in extended calibration time and affecting overall production efficiency.

[0003] Furthermore, most common wafer shakers currently on the market use Teflon as their primary construction material. This material is widely used in wafer processing due to its excellent corrosion resistance, high temperature resistance, and low friction properties. However, with the rapid development of semiconductor manufacturing technology and the upgrading of equipment, new production equipment such as Endura has placed higher demands on wafer shakers. Endura equipment must use a matching iron wafer rack with specific specifications to hold wafers, and most existing wafer shakers are incompatible with it. More importantly, the high temperature environment generated by Endura equipment during operation poses even more stringent challenges to the material selection of the wafer shaker. Although traditional Teflon materials are heat-resistant, long-term contact with specific iron wafer racks during wafer shaking can produce tiny particles due to friction, contaminating the wafer surface, affecting the wafer's purity and electrical performance, and in severe cases, even rendering the wafer scrapped, increasing production costs.

[0004] Therefore, for new production equipment such as Endura, it is urgent to develop a wafer shaker that can perfectly match the wafer placement table, maintain stable performance in high-temperature environments, and reduce particle generation. Utility Model Content

[0005] In view of the problems existing in the prior art shaking machine described above, the present application provides a shaking machine, which includes:

[0006] A base having a top surface and a bottom surface arranged opposite to each other, wherein the top surface is used for placing the wafer box;

[0007] The frame comprises at least two oppositely disposed side walls and a bottom plate connected to the side walls, wherein the base is accommodated in a cavity formed by the side walls and the bottom plate;

[0008] a rolling shaft, located in the middle of the base and rotatably connected to the two side walls;

[0009] A lifting device is installed at one end of the base close to the side wall to lift the frame and drive the rolling shaft installed in the frame to lift.

[0010] Optionally, the lifting device is configured as a lever structure, and the lifting device includes a fulcrum portion, a pressing end, and a load connection end; the fulcrum portion is hinged to the base, the pressing end is located above the base, and the load connection end is hinged to the base plate.

[0011] Optionally, the shaking machine further comprises:

[0012] a rocker, the rocker being fixedly mounted on one side of the side wall and passing through the side wall and being coaxially connected to the rolling axis;

[0013] Positioning pins, the positioning pins are relatively arranged on both sides of the rolling shaft to support the wafer;

[0014] A positioning bolt is inverted at the bottom of the base plate and passes through the base plate to connect and fix the base plate and the base.

[0015] Optionally, the shaking machine further comprises a bracket, wherein the bracket is fixedly mounted below the base, and the bracket passes through the bottom plate, and the bottom plate can slide up and down along the bracket.

[0016] Optionally, the length of the frame is greater than or equal to the length of the wafer box; the width of the frame is greater than or equal to the width of the wafer box.

[0017] Optionally, the length of the frame is between 18 cm and 22 cm, and the width of the frame is between 14 cm and 18 cm.

[0018] Optionally, the base is made of the same material as the wafer box.

[0019] Optionally, the length of the base is less than or equal to the length of the frame, and the length of the base is between 16 cm and 20 cm.

[0020] Optionally, the length of the positioning pin is less than or equal to the length of the base.

[0021] Optionally, the length of the positioning pin is between 16 cm and 20 cm, and the height of the positioning pin is between 1.3 cm and 1.5 cm.

[0022] As described above, the shaking machine provided by the present invention has at least the following beneficial technical effects:

[0023] The flexibility of the wafer shaker has been significantly improved by setting a lifting device in structure. The operator can easily lift the rolling axis by pressing the lifting device, making it easier to observe the flat edge details on the bottom of the wafer, thereby shortening the calibration time. In addition, the wafer shaker retains the traditional mechanical lifting and lowering method of the rolling axis, which enables the wafer shaker to adapt to different operating environments and needs, greatly improving the practicality of the wafer shaker. Furthermore, the material and size of the wafer shaker have been adjusted to enable it to better adapt to wafer boxes of different specifications. The versatility and practicality of the device have been improved to meet the use requirements of different wafer boxes. Reduce the generation of tiny particles: During the wafer edging process, it can effectively reduce tiny particles generated by friction or improper contact. Maintain the integrity and cleanliness of the wafer and improve product quality.

[0024] In summary, the wafer shaker provided by the present invention exhibits significant beneficial effects in many aspects. It not only improves work efficiency and accuracy, but also enhances the flexibility and adaptability of the device, while reducing damage to the wafer and maintaining the integrity and cleanliness of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Shown is a structural schematic diagram of the shaking machine provided by the utility model.

[0026] Figure 2 Shown is a schematic diagram of the structure of a wafer box.

[0027] Figure 3 The diagram shows the structure of the wafer box placed on the wafer shaker.

[0028] Figure 4 A schematic diagram showing the side view of the shaker when the lifting device is not pressed.

[0029] Figure 5 A schematic structural diagram showing a side view of the film shaker after pressing the lifting device.

[0030] Reference numerals

[0031] 00. Shaker; 01. Base; 02. Side wall; 03. Bottom plate; 04. Rolling shaft; 05. Positioning pin; 06. Lifting device; 07. Fulcrum; 08. Pressing end; 09. Load connection end; 10. Rocker; 11. Wafer; 12. Wafer box; 13. Fixing bolt; 14. Bracket; 15. Rebound device. DETAILED DESCRIPTION

[0032] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0033] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation, the form, quantity, positional relationship and proportion of each component in actual implementation can be changed at will under the premise of realizing the technical solution of this party, and the component layout form may also be more complicated.

[0034] This embodiment provides a shaking machine, such as Figure 1 As shown, it is a structural diagram of the shaking machine 00. Figure 1 It can be seen that the shaking machine 00 includes a base 01, a frame, a rolling shaft 04, and a lifting device 06. Among them, the base 01 is relatively arranged with a top surface and a bottom surface. The frame includes at least two oppositely arranged side walls 02, and a bottom plate 03 connected to the side walls 02, and the side walls 02 and the bottom plate 03 form a cavity, and the base 01 is located in the cavity. The rolling shaft 04 is arranged at the center position of the base 01 and is rotatably connected to the side wall 02. The lifting device 06 is installed on one side of the base 01 close to the side wall 02, and is used to lift the frame and the rolling shaft 04 installed in the frame. Generally, two, three or four side walls 02 can be provided. Specifically, in this embodiment, two side walls 02 are provided.

[0035] like Figure 2 As shown, it is a schematic diagram of the structure of the wafer box 12. Figure 3 As shown, it is a schematic diagram showing the structure of the wafer box 12 placed on the shaking machine 00. Figure 3 As can be seen, the top surface of the base 01 is in contact with the wafer cassette 12 holding the wafers 11. The rolling shaft 04 is in contact with the side edges of the wafers 11. Due to the friction between the rolling shaft 04 and the wafers 11, the wafers 11 rotate as the rolling shaft 04 rotates until the flat edges of all wafers 11 in the wafer cassette 12 are oriented in the same direction.

[0036] Please continue reading Figure 1The lifting device 06 is installed on the side of the base 01. By pressing the lifting device 06, the rolling shaft 04 is lifted upward, and then the wafer 11 is lifted, so that the operator can check the bottom flat edge of the wafer 11 more clearly. Generally, the lifting device 06 can adopt different types of mechanical structures. For example, the lifting device 06 can be: a spring return mechanism, a cylinder and guide rod structure, a press-and-pop mechanism, or other structures that can realize the lifting and lowering of the rolling shaft 04 installed on the frame. Specifically, in this embodiment, the lifting device 06 is a lever structure, and the lifting device 06 includes a fulcrum portion 07, a pressing end 08, and a load connection end 09. The fulcrum portion 07 is hinged to the base 01, the pressing end 08 is located above the base 01, and the load connection end 09 is hinged to the bottom plate 03. By pressing the pressing end 08 of the shaking machine downward, the bottom plate 03 can be moved upward relative to the base 01, and the position of the side wall 02 fixedly connected to the bottom plate 03 relative to the base 01 is also raised, and the rolling shaft 04 connected to the side wall 02 is also lifted.

[0037] Specifically, if Figure 4 As shown, it is a schematic diagram of a side view of the shaking machine 00 when the lifting device 06 is not pressed. Figure 4 It can be seen that when the lifting device 06 is not pressed, that is, when the shaking machine 00 is shaking or in a static state, there is a certain height difference between the base 01 and the bottom plate 03. Figure 5 As shown, it is a schematic diagram of a side view of the shaking machine 00 after pressing the lifting device 06. Figure 5 As can be seen, pressing down on pressing end 08 of lifting mechanism 06 causes it to rotate about its connection point with base 01, driving the frame upward and, consequently, the rolling shaft 04 connected to the frame. The upward movement of rolling shaft 04 correspondingly raises the position of wafer 11 in wafer cassette 12, allowing the operator to easily and clearly observe the flat bottom edge details of wafer 11.

[0038] Please continue reading Figure 1 Generally, the shaking machine 00 also includes a rocker 10. The rocker 10 is arranged on one side of the base 01, and the rocker 10 is coaxially connected to the rolling shaft 04 by passing through the side wall 02. By rotating the rocker 10, the rolling shaft 04 is driven to rotate. Generally, the shaking machine 00 also includes a positioning pin 05. The positioning pin 05 is located on the top surface of the base 01 and is relatively arranged on both sides of the rolling shaft 04 for fixing the wafer 11. Generally, the positioning pins 05 can be provided in one or more groups, and the number of positioning pins 05 in each group can be set according to actual conditions. Specifically, in this embodiment, the shaking machine includes a group of positioning pins 05, and each group has two positioning pins 05 arranged relatively.

[0039] Generally, rolling shaft 04 can be made of materials with high friction, such as ceramic, surface-treated steel, synthetic resin, composite material, rubber, etc. Specifically, in this embodiment, rolling shaft 04 is made of nylon. Positioning pin 05 is generally made of materials such as nylon, ceramic, stainless steel, polytetrafluoroethylene, and other materials with supporting properties. Specifically, in this embodiment, positioning pin 05 is made of nylon, which has a low coefficient of friction and good self-lubricating properties, and thus provides excellent support.

[0040] Generally, the shaking machine 00 is also provided with a positioning bolt 13. The positioning bolt 13 is inverted at the bottom of the base plate 03 and passes through the base plate 03, connecting and fixing the base plate 03 and the base 01. Specifically, the main function of the positioning bolt 13 in the shaking machine 00 is to fix. In this embodiment, the fixing function mainly includes: fixing the base plate 03 to prevent the base plate 03 from detaching from the main body of the shaking machine 00; fixing the distance between the base plate 03 and the base 01. After pressing the lifting device 06 to raise the rolling shaft 04, the positioning bolt 13 can be used to fix the height of the frame and the base 01, and then fix the relative height of the rolling shaft 04 from the base 01, which is convenient for the operator to observe; in addition, the fixing bolt 13 also has the function of adjusting the height of the frame and the rolling shaft 04, which is consistent with the technical effect of the lifting device 06. The difference is that the lifting device 06 is a labor-saving lever, and the rolling shaft 04 can be raised only by pressing the pressing end 08, while the fixing bolt 13 is a more traditional mechanical adjustment method, which is a labor-intensive lever, but the adjustment method of the fixing bolt 13 is more precise and more convenient for the operator to observe the state of the wafer 11 when it is lifted. Therefore, the shaking machine 00 provided in this embodiment adopts the combination of the lifting device 06 and the fixing bolt 13 to adjust the lifting and lowering of the rolling shaft 04. The device is more practical and more efficient.

[0041] Generally, if Figure 1As shown, the shaking machine 00 also includes a bracket 14, which is fixedly mounted below the base 01 and passes through the bottom plate 03, so that the bottom plate 03 can slide up and down along the bracket 14. Generally, the number of brackets 14 can be set according to the actual size of the shaking machine 00, the weight of the device, and other characteristics. In this embodiment, the number of brackets 14 is set to four. Generally, the fixed installation method includes: bonding, welding, riveting or other connection methods such as threaded connection. Generally, the shaking machine 00 also includes a rebound device 15. The rebound device 15 is arranged on the top surface of the base 01, directly below the pressing end 08 of the lifting device 06, so that the pressing end 08 automatically rebounds after being pressed down, thereby improving the automation of the shaking machine 00. In addition, this rebound device 15 is also provided with a scale value, so that it can be pressed according to the situation of the wafer 11 to achieve the lifting and lowering of the rolling shaft 04 to a certain height. Generally, the rebound device 15 can be a spring rebound device, a rebound hammer, or other devices that can achieve the rebound of the lifting device 06. Specifically, in this embodiment, a spring rebound device is used. The spring can be selected according to the actual application scene, working environment, etc. of the lifting device 06.

[0042] Specifically, the material of the wafer shaker 00 is the same as that of the wafer box 12. During the edge trimming process of the wafer 11, the risk of particle contamination can be effectively reduced, ensuring the cleanliness and integrity of the wafer 11. Generally, if the wafer box 12 is made of metal, the corresponding wafer shaker 00 is made of metal; if the wafer box 12 is made of plastic, such as high-purity polyimide / polytetrafluoroethylene, the corresponding wafer shaker 00 is made of a correspondingly adapted plastic material; if the wafer box 12 is made of stainless steel, the corresponding wafer shaker 00 is made of a metal alloy; if the wafer box 12 is made of ceramic, the corresponding wafer shaker 00 is made of ceramic. Specifically, in this embodiment, for the Endura device, the wafer box 12 is made of iron, and therefore the wafer shaker 00 is made of iron.

[0043] Generally, the size of the wafer shaker 00 can be adjusted according to the actual size of the wafer box 12, and the size of the wafer box 12 can be set according to the size of the wafer 11 and the size of the production equipment. Specifically, the size of the wafer shaker 00 matches the size of the wafer box 12. Generally, as Figure 3 As shown, the length of the shaking machine 00 is greater than or equal to the length h of the wafer box 12. Here, the length of the shaking machine 00 specifically refers to the length of the frame of the shaking machine 00, and the width of the shaking machine 00 specifically refers to the width of the frame. The width of the shaking machine 00 is greater than or equal to the width l of the wafer box 12. Generally, the length of the shaking machine 00 is between 18cm and 22cm, and the width of the shaking machine 00 is between 14cm and 18cm. Specifically, in this embodiment, the length h of the wafer box 12 is 18cm, and the width is 15cm. The length of the shaking machine 00 is 20cm, and the width of the shaking machine 00 is 16cm. Generally, as Figure 3As shown, the length of the base 01 is less than or equal to the length of the shaking machine 00, and the width of the base 01 is less than or equal to the width of the shaking machine 00. Generally, the length of the base 01 is between 16 cm and 20 cm, and the width of the base 01 is between 12 cm and 16 cm. Specifically, in this embodiment, the length of the base 01 is 18 cm, and the width of the base 01 is 14 cm. Generally, the length of the positioning pin 05 is less than or equal to the length of the base 01. Generally, the length of the positioning pin 05 is between 16 cm and 18 cm. Specifically, in this embodiment, the length of the positioning pin 05 is 18 cm. Generally, the height of the positioning pin 05 is between 1.3 cm and 1.5 cm. Specifically, in this embodiment, the height of the positioning pin 05 is 1.5 cm.

[0044] The wafer shaker 00 provided by the present invention has been optimized and innovated in design and function, thereby improving the efficiency and accuracy of the flat edge calibration of the wafer 11. By cooperating with the wafer box 12, the calibration process is simplified, making the operation more intuitive and convenient. By providing a lifting device 06, the flexibility of the wafer shaker 00 is improved. By pressing the lifting device 06, the rolling shaft 04 is lifted upward, and the operator can more conveniently observe the flat edge details of the bottom of the wafer 11, greatly shortening the calibration time and improving work efficiency. Furthermore, a fixing bolt 13 is provided, which can not only maintain the lifting height of the rolling shaft 04, but also adjust the lifting height of the rolling shaft 04, thereby adding a way to adjust the height of the rolling shaft 04 and increasing the practicality of the wafer shaker 00. Furthermore, the shaker 00 provided by the present invention is adjusted in material and size, which not only enhances the adaptability of the shaker 00 to wafer boxes 12 of different specifications, but also more effectively reduces the tiny particles generated by friction or improper contact during the wafer trimming process, effectively reduces damage to the wafer 11, and maintains the integrity and cleanliness of the wafer 11.

[0045] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A shaking machine, characterized in that: include: A base having a top surface and a bottom surface arranged opposite to each other, wherein the top surface is used for placing the wafer box; The frame comprises at least two oppositely disposed side walls and a bottom plate connected to the side walls, wherein the base is accommodated in a cavity formed by the side walls and the bottom plate; a rolling shaft, located in the middle of the base and rotatably connected to the two side walls; A lifting device is installed at one end of the base close to the side wall to lift the frame and drive the rolling shaft installed in the frame to lift.

2. The shaking machine according to claim 1, characterized in that The lifting device is configured as a lever structure, comprising a fulcrum, a pressing end, and a load connection end; the fulcrum is hinged to the base, the pressing end is located above the base, and the load connection end is hinged to the base plate.

3. The shaking machine according to claim 2, characterized in that: The shaking machine also includes: a rocker, the rocker being fixedly mounted on one side of the side wall and passing through the side wall and being coaxially connected to the rolling axis; Positioning pins, the positioning pins are relatively arranged on both sides of the rolling shaft to support the wafer; A positioning bolt is inverted at the bottom of the base plate and passes through the base plate to connect and fix the base plate and the base.

4. The shaking machine according to claim 3, characterized in that: The shaking machine also includes: A rebound device is provided above the base and below the pressing end to achieve automatic rebound of the lifting device; The bracket is fixedly installed below the base, and the bracket passes through the bottom plate, and the bottom plate can slide up and down along the bracket.

5. The shaking machine according to claim 1, characterized in that: The length of the frame is greater than or equal to the length of the wafer box; the width of the frame is greater than or equal to the width of the wafer box.

6. The shaking machine according to claim 5, characterized in that: The length of the frame is between 18 cm and 22 cm, and the width of the frame is between 14 cm and 18 cm.

7. The shaking machine according to claim 1, characterized in that: The material of the base is the same as that of the wafer box.

8. The shaking machine according to claim 1, characterized in that: The length of the base is less than or equal to the length of the frame, and the length of the base is between 16 cm and 20 cm.

9. The shaking machine according to claim 1, characterized in that: The length of the positioning pin is less than or equal to the length of the base.

10. The shaking machine according to claim 8, characterized in that: The length of the positioning pin is between 16 cm and 20 cm, and the height of the positioning pin is between 1.3 cm and 1.5 cm.

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