Packaging structure and digital loudspeaker

Abstract

The utility model discloses a packaging structure and a digital loudspeaker, and relates to the technical field of loudspeakers, the packaging structure provided by the utility model comprises a packaging shell body, the packaging shell body comprises an anti-reflection surface deviating from one side of a substrate, the anti-reflection surface extends to a digital sounding chip, the anti-reflection surface is a continuous and smooth arc-shaped surface, and the anti-reflection surface is arranged on the substrate. The arc center of the anti-reflection surface is located on one side of the substrate, and the distance between the anti-reflection surface and the substrate is gradually reduced in the extending direction from the anti-reflection surface to the digital sounding chip. According to the packaging structure provided by the utility model, after the digital sounding chip generates sound waves, the sound waves can be diffused outwards along the continuous and smooth anti-reflection surface, so that mutual interference and superposition after the sound waves are reflected back are reduced, random high-frequency signals are obviously reduced, and the sound quality of the digital sounding chip is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of loudspeakers, in particular to a packaging structure and a digital loudspeaker. Background Art

[0002] A digital sound chip consists of a number of sound-generating units, which radiate sound pulses outward. Depending on the desired sound waveform, different numbers of sound-generating units are driven so that the generated sound waves are superimposed on each other, thereby forming a sound signal of the desired amplitude. To ensure the accuracy of the amplitude of the superimposed sound waves, the sound pulse signal radiated in a single cycle cannot interfere with the sound pulses in subsequent cycles. Therefore, the oscillation duration and amplitude of the pulse signal need to be minimized. However, in existing packaging structures, since the walls reflect sound signals, the radiated sound pulses interfere with and superimpose on the sound pulses reflected from the previous cycle, generating random high-frequency sound signals, which in turn affects the sound quality of the digital sound chip.

[0003] Therefore, how to improve the sound quality of digital sound chips is a technical problem that those skilled in the art currently need to solve. Utility Model Content

[0004] The purpose of the present invention is to provide a packaging structure and a digital speaker. The packaging structure provided by the present invention is used to improve the sound quality of a digital sound chip.

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] A packaging structure, comprising:

[0007] The packaging shell body includes an anti-reflection surface on the side facing away from the substrate, and the anti-reflection surface extends to the digital sound chip. The anti-reflection surface is a continuous and smooth arc surface, and the arc center of the anti-reflection surface is located on one side of the substrate. The distance between the anti-reflection surface and the substrate gradually decreases along the extension direction of the anti-reflection surface toward the digital sound chip.

[0008] Optionally, in the above packaging structure, an angle α is set between a tangent line at the intersection of the anti-reflection surface and the digital sound chip and a horizontal plane, and a value range of the angle α is 10°<α<60°.

[0009] Optionally, in the above packaging structure, the curve forming the continuous and smooth arc-shaped surface of the anti-reflection surface may be a polynomial interpolation curve, a cubic spline curve or a Bezier curve.

[0010] Optionally, in the above-mentioned packaging structure, a plurality of anti-reflection surfaces are provided, and the plurality of anti-reflection surfaces are arranged around the digital sound chip, and the anti-reflection surfaces are connected in sequence along the surrounding direction.

[0011] Optionally, in the above packaging structure, the anti-reflection surface extends along the circumferential direction of the digital sound chip to form a smooth and continuous circular surface.

[0012] Optionally, in the above-mentioned packaging structure, the packaging shell body also includes a supporting portion and a connecting portion, the supporting portion is connected to the anti-reflection surface through the connecting portion, and one end of the supporting portion is connected to the substrate, and the other end of the supporting portion extends away from the substrate, so that the packaging shell body and the substrate form a accommodating cavity.

[0013] Optionally, in the above-mentioned packaging structure, the surface of the connecting portion located on the same side as the anti-reflection surface extends away from the anti-reflection surface to form an extended boss, and the extended boss and the anti-reflection surface surround to form a sound-transmitting membrane mounting groove.

[0014] Optionally, in the above packaging structure, the diameter of the digital sound chip is L1, the maximum distance between the anti-reflection surface and the substrate is L2, and the value range of L2 is 0.1×L1 <L2<L1;

[0015] The distance between the end of the anti-reflection surface away from the digital sound chip and the digital sound chip is L3, and the value range of L3 is L1 <L3<5×L1。

[0016] Optionally, in the above packaging structure, the packaging shell body is an integrated structure.

[0017] The packaging structure provided by the present invention includes an anti-reflection surface facing away from the substrate. The anti-reflection surface extends to the digital sound chip and aligns with the side of the digital sound chip. The anti-reflection surface is a continuous, smooth, arc-shaped surface with the center of the arc located on one side of the substrate, that is, the anti-reflection surface is raised in the direction away from the substrate. Simultaneously, as the anti-reflection surface extends toward the digital sound chip, the distance between the anti-reflection surface and the substrate gradually decreases, forming a smooth, concave, horn-shaped structure toward the digital sound chip. Therefore, after the digital sound chip generates sound waves, the sound waves can diffuse outward along the continuous, smooth anti-reflection surface, thereby reducing the interference and superposition of the sound waves after they are reflected back, significantly reducing the generation of random high-frequency signals, and thus improving the sound quality of the digital sound chip.

[0018] A digital speaker comprises a sound-transmitting membrane, a substrate, an ASIC chip, a digital sound chip, and a packaging structure as described in any one of the above items.

[0019] The digital speaker provided by the present invention has all the technical effects of the above-mentioned packaging structure due to its packaging structure, which will not be described in detail herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 A schematic diagram of the packaging structure disclosed in an embodiment of the present utility model;

[0022] Figure 2 A schematic diagram of the dimensions of the packaging structure disclosed in an embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of a structure in which multiple anti-reflection surfaces are arranged in a packaging structure disclosed in an embodiment of the present utility model;

[0024] Figure 4 A schematic diagram of the anti-reflection surface structure of a packaging structure disclosed in another embodiment of the present utility model;

[0025] Figure 5 A sound pressure-time comparison diagram of an anti-reflection structure with an anti-reflection surface disclosed in an embodiment of the present utility model and a structure without an anti-reflection surface;

[0026] Figure 6 This is a cloud diagram comparing the sound pressures of the anti-reflection structure with an anti-reflection surface disclosed in an embodiment of the present invention and the structure without an anti-reflection surface at a certain moment when a pulse is emitted.

[0027] Reference numerals:

[0028] 100 is the package body, 110 is the anti-reflection surface, 120 is the supporting portion, and 130 is the connecting portion;

[0029] 200 is a digital sound chip;

[0030] 300 is ASIC chip;

[0031] 400 is the substrate;

[0032] 500 is the sound-permeable membrane;

[0033] 600 is the earphone housing;

[0034] 700 for earmuffs;

[0035] 800 is the speaker housing. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more, unless otherwise specifically defined.

[0039] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0040] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0041] The core of this utility model is to provide a packaging structure for improving the sound quality of a digital sound chip;

[0042] Another core of the present invention is to provide a digital speaker having the above packaging structure.

[0043] like Figure 1As shown, an embodiment of the present utility model discloses a packaging structure, including a packaging shell body 100. An anti-reflection surface 110 is provided on the side of the packaging shell body 100 away from the substrate 400. The anti-reflection surface 110 extends toward the digital sound chip 200 and fits the side of the digital sound chip 200. The anti-reflection surface 110 is a continuous and smooth arc-shaped surface, and the arc center of the arc-shaped surface is located on one side of the substrate 400, that is, the anti-reflection surface 110 protrudes away from the substrate 400. At the same time, the distance between the anti-reflection surface 110 and the substrate 400 gradually decreases in the extension direction of the anti-reflection surface 110 toward the digital sound chip 200, forming a smooth concave horn-shaped structure toward the digital sound chip 200. Therefore, after the digital sound chip 200 generates sound waves, the sound waves can diffuse outward along the continuous and smooth anti-reflection surface 110, thereby reducing the mutual interference and superposition of the sound waves after being reflected back, and significantly reducing the generation of random high-frequency signals, such as Figure 5 In the sound pressure-time comparison diagram of the anti-reflection structure with an anti-reflection surface and the structure without an anti-reflection surface, the curve with the anti-reflection surface of this embodiment has relatively less fluctuation and better linearity, while Figure 6 In the sound pressure comparison cloud diagram of the anti-reflection structure with an anti-reflection surface and the structure without an anti-reflection surface at a certain moment when the pulse is emitted, the sound pressure in the anti-reflection structure provided in this embodiment presents a relatively flat peak and is relatively mild. From the above comparison results, it can be seen that the packaging structure provided in this embodiment significantly improves the sound quality of the digital sound chip 200.

[0044] At the same time, an angle α is set between the tangent line at the intersection of the anti-reflection surface 110 and the digital sound chip 200 and the horizontal plane, and the value range of the angle α is 10°<α<60°. In a specific embodiment, the angle α can be set to 12°, 15°, 30° or 50°, so that the sound waves can smoothly spread along the anti-reflection surface 110. If α is set to a small value, such as the value of α is less than 10°, the guiding effect of the anti-reflection surface 110 on the sound waves emitted by the digital sound chip 200 will be significantly reduced, and the sound waves cannot spread well along the anti-reflection surface 110. When α is set to a large value, such as the value of α is greater than 60°, the anti-reflection surface 110 may block the sound waves, causing more sound waves to be repeatedly reflected, generating more random high-frequency sound signals, and being more detrimental to the sound quality of the digital sound chip 200.

[0045] In a specific embodiment, the curve forming the anti-reflection surface 110 can be a polynomial interpolation curve, a cubic spline curve, a Bezier curve, or a B-spline curve, etc., to form a continuous and smooth curved surface. The polynomial interpolation curve has the characteristics of simplicity, continuity, smoothness, and low computational cost, while the cubic spline curve has the characteristics of continuity, smoothness, and good local controllability. Alternatively, those skilled in the art may design the anti-reflection surface 110 in other ways according to actual needs, which will not be described in detail herein.

[0046] In a specific embodiment, the package shell body 100 is provided with multiple anti-reflection surfaces 110, and the multiple anti-reflection surfaces 110 are sequentially arranged along the circumference of the digital sound chip 200, surrounding the edge of the digital sound chip 200 and connected in sequence along the surrounding direction. Thus, the emitted sound waves are guided in multiple directions, improving the uniformity of the sound wave diffusion along the anti-reflection surfaces 110, and further ensuring that the digital sound chip 200 has good sound quality. Figure 3 As shown, four anti-reflection surfaces 110 provided in this embodiment are arranged in the earphones around the digital sound chip 200. The anti-reflection surfaces 110 are integrally injection-molded with the earphone shell 600. The waterproof and dustproof sound-permeable membrane 500 is located in the earphone hole of the earmuff 700. When the earmuff 700 is attached to the earphone shell 600, the sound-permeable membrane 500 covers and protects the digital sound chip 200. In another specific embodiment, the anti-reflection surface 110 extends along the circumferential direction of the digital sound chip 200 to form an overall smooth and continuous circular surface. The overall structure is simple, which not only improves the overall structural strength, but also facilitates the production and processing of the packaging shell body 100, which is beneficial to improving production efficiency and reducing production costs. Figure 4 As shown, the audio device is provided with an anti-reflection surface 110 provided in this embodiment as an integral smooth continuous circular surface. The anti-reflection surface 110 and the audio housing 800 can also be integrally formed using an injection molding process, so that the overall structural strength is high and the stability is good.

[0047] like Figure 1As shown, the encapsulation shell body 100 further includes a support portion 120 and a connecting portion 130. The support portion 120 is connected to the anti-reflection surface 110 through the connecting portion 130. One end of the support portion 120 can be fixedly connected to the substrate 400 by bonding. The other end of the support portion 120 extends away from the substrate 400 and is connected to the connecting portion 130. The connecting portion 130 extends along the extension direction of the substrate 400 towards the digital sound generation chip 200 and is connected to the anti-reflection surface 110, so that a receiving cavity is formed between the encapsulation shell body 100 and the substrate 400, and the ASIC chip 300 (Application Specific Integrated Circuit) fixed on the substrate 400 can be accommodated to protect the ASIC chip 300.

[0048] As Figure 1 shown, the surface of the connecting portion 130 and the anti-reflection surface 110 on the same side extends away from the anti-reflection surface 110, forming an extended boss higher than the anti-reflection surface 110, so that a stepped structure is formed between the connecting portion 130 and the anti-reflection surface. A sound transmission film mounting groove is formed around between the protruding boss and the anti-reflection surface 110, and the sound transmission film 500 of the digital speaker is installed in the sound transmission film mounting groove, which plays a good role in protecting the sound transmission film 500.

[0049] As Figure 2 shown, the diameter size of the digital sound generation chip 200 is L1, along the direction perpendicular to the plane where the substrate 400 is located. The maximum distance between the anti-reflection surface 110 and the substrate 400 is L2. At this time, the value range of L2 is 0.1×L1 < L2 < L1. The distance from the end of the anti-reflection surface 110 far from the digital sound generation chip 200 to the digital sound generation chip 200 is L3, and the value range of L3 is L1 < L3 < 5×L1. Thus, while meeting the requirement of a compact overall structure, the anti-reflection surface 110 maintains an optimal arc length, which is beneficial for sound waves to spread along the anti-reflection surface 110, reducing the mutual interference superposition caused by sound wave reflection, and improving the sound quality of the digital sound generation chip 200.

[0050] In a specific embodiment, the encapsulation shell body 100 can be integrally formed by an injection molding process, making the encapsulation shell body 100 an integral structure. This not only improves the overall structural strength, but also facilitates production and processing, increases the production and processing efficiency, and is also beneficial for improving the surface smoothness of the encapsulation shell body 100, enhancing the outward diffusion of sound waves along the anti-reflection surface 110.

[0051] The present invention also discloses a digital speaker comprising a dustproof and waterproof acoustic membrane 500, a substrate 400, an ASIC chip 300, a digital sound chip 200, and the aforementioned packaging structure. The digital sound chip 200 and the ASIC chip 300 are both fixed to the substrate 400, the ASIC chip 300 is located in a housing formed by the package body 100 and the substrate 400, the dustproof and waterproof acoustic membrane 500 is mounted in the acoustic membrane mounting groove, and the substrate 400 can be a PCB (Printed Circuit Board) or a structural plate. Because the digital speaker has the aforementioned packaging structure, it possesses all the technical effects of the aforementioned packaging structure, which will not be further elaborated herein.

[0052] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0053] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A packaging structure, characterized in that: include: The packaging shell body includes an anti-reflection surface on the side facing away from the substrate, and the anti-reflection surface extends to the digital sound chip. The anti-reflection surface is a continuous and smooth arc surface, and the arc center of the anti-reflection surface is located on one side of the substrate. The distance between the anti-reflection surface and the substrate gradually decreases along the extension direction of the anti-reflection surface toward the digital sound chip.

2. The packaging structure according to claim 1, wherein: An angle α is formed between a tangent line at the intersection of the anti-reflection surface and the digital sound chip and a horizontal plane, and a value range of the angle α is 10°<α<60°.

3. The packaging structure according to claim 1, wherein: The curve forming the continuous and smooth arc-shaped surface of the anti-reflection surface may be a polynomial interpolation curve, a cubic spline curve or a Bezier curve.

4. The packaging structure according to claim 1, wherein: There are multiple anti-reflection surfaces, which are arranged around the digital sound chip, and the anti-reflection surfaces are connected in sequence along the surrounding direction.

5. The packaging structure according to claim 1, wherein: The anti-reflection surface extends along the circumferential direction of the digital sound chip to form a smooth and continuous circular surface.

6. The packaging structure according to claim 1, wherein: The packaging shell body also includes a supporting portion and a connecting portion, the supporting portion is connected to the anti-reflection surface through the connecting portion, and one end of the supporting portion is connected to the substrate, and the other end of the supporting portion extends away from the substrate, so that the packaging shell body and the substrate form a accommodating cavity.

7. The packaging structure according to claim 6, wherein: The surface of the connecting portion located on the same side as the anti-reflection surface extends away from the anti-reflection surface to form an extended boss, and the extended boss and the anti-reflection surface surround each other to form a sound-transmitting membrane installation groove.

8. The packaging structure according to claim 1, wherein: The diameter of the digital sound chip is L1, the maximum distance between the anti-reflection surface and the substrate is L2, and the value range of L2 is 0.1×L1 <L2<L1; The distance between the end of the anti-reflection surface away from the digital sound chip and the digital sound chip is L3, and the value range of L3 is L1 <L3<5×L1。 9. The packaging structure according to any one of claims 1 to 8, wherein: The packaging shell body is an integrated structure.

10. A digital speaker, characterized in that: The device comprises a sound-transmitting membrane, a substrate, an ASIC chip, a digital sound chip, and a packaging structure as described in any one of claims 1 to 9.

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