Photoelectric integrated LED lamp bead packaging structure

Abstract

The utility model relates to the technical field of LED lamp bead packaging, in particular to a photoelectric integrated LED lamp bead packaging structure, which comprises a substrate, a liquid cooling sheet is fixedly arranged on the bottom surface of the substrate, two ends of the substrate are communicated with a plurality of pins in a symmetrical structure, a packaging frame is fixedly arranged on the top surface of the substrate, a sealing assembly is mounted on the top surface of the packaging frame, and the liquid cooling sheet is fixedly arranged on the bottom surface of the substrate. A sealing cover plate is arranged on the sealing assembly, an installation groove is formed in the middle of the packaging frame, a plurality of LED chip bodies are installed in the middle of the top face of the substrate, the LED chip bodies are connected in parallel, the LED chip bodies are located in the installation groove, and an anti-disengaging block is fixedly arranged on the groove wall of the installation groove. According to the LED lamp bead, the situation that the whole LED lamp bead is scrapped due to the fact that a single chip is damaged is avoided, the packaging cost and the maintenance cost are reduced, the overall reliability of a product is further improved, the overall heat dissipation efficiency is improved, the probability that packaging glue is damaged or falls off due to high temperature is reduced, and the stability and reliability of the LED lamp bead are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp bead packaging, in particular to a photoelectric integrated LED lamp bead packaging structure. Background Art

[0002] Photoelectric integrated LED lamp bead packaging refers to the process of integrating multiple components such as LED chips, luminescent materials, drive circuits and necessary packaging materials to form an overall photoelectric conversion unit, which protects the LED chips and realizes efficient conversion of electrical energy to light energy, and has certain environmental adaptability and heat dissipation performance.

[0003] A search revealed a Chinese patent with publication number CN213583783U, which provides a photoelectric integrated LED lamp bead packaging structure. The electrodes of the control chip are fixed to the lower conductive layer via a conductive material. The LED light-emitting chip is electrically connected via the lower conductive layer, a first connecting column, and an upper conductive layer. The electrodes of the control chip are simultaneously pulled to the outside of the entire packaging structure through the transition of the lower conductive layer, ensuring a secure and stable electrical connection. The control chip and light-emitting chip are packaged together to form an integrated structure, making installation and use more convenient and the overall volume smaller.

[0004] However, it was found during use that LED lamp beads are usually packaged into individual LED light-emitting chips. In this way, when a single chip is damaged, it is difficult to separate and replace the components individually. The entire package body needs to be replaced, which can easily lead to failure of the entire package structure, thereby causing waste of resources, increasing the packaging cost and maintenance cost of the LED lamp beads, and is not conducive to the packaging and use of LED lamp beads. Utility Model Content

[0005] In response to the shortcomings of the existing technology, the utility model provides a photoelectric integrated LED lamp bead packaging structure, which solves the technical problem that LED lamp beads are usually packaged into a single LED light-emitting chip. When a single chip is damaged, the components are difficult to separate and replace individually, and the entire package body needs to be replaced, which can easily lead to failure of the entire packaging structure, thereby causing waste of resources, increasing the packaging cost and maintenance cost of the LED lamp beads, and being unfavorable for the packaging and use of LED lamp beads.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: an optoelectronic integrated LED lamp bead packaging structure, comprising a substrate, a liquid cooling plate fixedly provided on the bottom surface of the substrate, a symmetrical structure connecting multiple pins at both ends of the substrate, a packaging frame fixedly provided on the top surface of the substrate, a sealing component installed on the top surface of the packaging frame, a sealing cover plate provided on the sealing component, a mounting groove provided in the middle of the packaging frame, a plurality of LED chip bodies installed in the middle of the top surface of the substrate, the connection between the multiple LED chip bodies is in parallel, and the LED chip body is located inside the mounting groove.

[0007] Preferably, an anti-slip block is fixedly provided on the wall of the installation groove, and the cross section of the anti-slip block is triangular.

[0008] Preferably, an overflow groove is provided on the top surface of the packaging frame, and the top surface of the anti-fall-off block and the bottom surface of the overflow groove wall are in the same horizontal plane.

[0009] Through the above technical solution, the anti-fall-off block is used to reduce the occurrence of packaging glue falling off after packaging, enhance the overall packaging stability of the LED chip body, and disperse the heat of the ventilation pipe through the ventilation groove, facilitating the heat dissipation of the coolant.

[0010] Preferably, a liquid cooling tank is provided inside the liquid cooling plate, the liquid cooling tank is filled with coolant, a plurality of ventilation pipes are fixed inside the liquid cooling tank, a plurality of ventilation slots are provided on the outer walls at both ends of the liquid cooling plate, and both ends of the ventilation pipes are connected to the ventilation slots.

[0011] Through the above technical solution, the LED chip body is cooled by the coolant and the ventilation pipe, and the heat of the ventilation pipe is dispersed by the ventilation groove, which facilitates the heat dissipation of the coolant.

[0012] Preferably, the sealing assembly includes an insert block, a slot is provided on the top surface of the packaging frame, the insert block is plugged into the slot, a semicircular block is fixed on the insert block, and the outer peripheral wall of the semicircular block is plugged into the wall of the overflow groove.

[0013] Through the above technical solution, the outer wall of the semicircular block abuts against the wall of the overflow groove, thereby sealing the overflow groove.

[0014] Preferably, a plurality of elastic clamps are fixedly provided on the outer wall of the packaging frame, the bottom surface of the sealing cover plate abuts against the top surface of the packaging frame, and a plurality of clamping grooves are opened on the side wall of the sealing cover plate, and the elastic clamps are clamped and matched with the clamping grooves.

[0015] With the above technical solution, the sealing cover is fixed by the elastic clamping head being engaged with the clamping groove.

[0016] Preferably, a transparent convex mirror is fixedly provided in the middle of the sealing cover plate, the transparent convex mirror is located at the upper end of the mounting groove, and a plurality of heat dissipation copper sheets are fixedly provided on the top surface of the sealing cover plate.

[0017] Through the above technical solution, the sealing cover plate is cooled by the heat dissipation copper sheet, thereby reducing the failure rate caused by high temperature or external factors.

[0018] Beneficial effects of the utility model:

[0019] 1. Install an appropriate number of LED chip bodies in the middle of the top surface of the substrate. At this time, multiple LED chip bodies are all located inside the installation groove. At this time, multiple LED chip bodies are connected in parallel, and then the packaging glue used for packaging is filled into the installation groove. The top surface of the packaging glue liquid level is lower than the top surface of the anti-dropping block, and the packaging glue is in contact with the inner wall of the anti-dropping block. Excess packaging glue is discharged to the outside through the overflow groove, ensuring the uniformity and consistency of the packaging quality. After static cooling, the packaging of multiple LED chip bodies can be completed. The anti-dropping block reduces the occurrence of packaging glue falling off after packaging, enhances the overall packaging stability of the LED chip body, and extends the service life of the product. When a single LED chip body is damaged, the remaining LED chip bodies can still be used, avoiding the situation where the entire LED lamp bead is scrapped due to damage to a single chip, reducing packaging costs and maintenance costs, and further improving the overall reliability of the product.

[0020] 2. Install the sealing component on the top surface of the packaging frame, and use the pins to facilitate the installation and use of the packaged LED chip body. The liquid cooling plate absorbs the heat generated by the substrate and the LED chip body during use, and the LED chip body is dissipated by the coolant and the ventilation pipe. The ventilation pipe is a copper pipe, and the heat of the coolant is conducted through the copper pipe, and the heat of the ventilation pipe is dispersed through the ventilation groove, which facilitates the heat dissipation of the coolant, thereby reducing the temperature of the liquid cooling plate, facilitating the heat dissipation of the substrate and the LED chip body, reducing the operating temperature of the LED lamp beads, extending their service life, improving working stability, promoting natural convection and radiation of heat, and improving the overall heat dissipation efficiency.

[0021] 3. Insert the plug of the sealing cover into the slot of the packaging frame, and the outer wall of the semicircular block abuts against the wall of the overflow groove. At this time, the bottom surface of the sealing cover abuts against the top surface of the packaging frame, and the sealing cover is fixed by the elastic clamp and the card slot. After the fixation is completed, the LED chip body and the packaging glue are protected by the transparent convex mirror and the sealing cover to prevent the invasion of external impurities and moisture. During use, the heat of the packaging frame is transferred to the sealing cover, and the sealing cover is dissipated by the heat dissipation copper sheet, which reduces the failure rate caused by high temperature or external factors, reduces the influence of temperature on the LED chip body and packaging glue, and reduces the occurrence of packaging glue being damaged or falling off due to high temperature, thereby ensuring the stability and reliability of the LED lamp beads and facilitating the use of the packaged LED lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 This is a top perspective view of the packaging frame structure of the present utility model;

[0024] Figure 3 This is a schematic diagram of the internal structure of the liquid cooling plate of the present invention;

[0025] Figure 4 This is a schematic diagram of the LED chip body structure of the present utility model;

[0026] Figure 5 This is a schematic diagram of the assembly of the semicircular block structure of the present invention;

[0027] Figure 6 This is a schematic diagram of the heat dissipation copper sheet structure of the present utility model;

[0028] Figure 7 This is a schematic diagram of the assembly of the elastic clamp structure of the present invention.

[0029] In the figure: 1. Base plate; 2. Liquid cooling plate; 3. Pin; 4. Packaging frame; 5. Sealing assembly; 501. Sealing cover; 502. Insert block; 503. Slot; 504. Semicircular block; 505. Elastic clamp; 506. Card slot; 507. Transparent convex mirror; 508. Heat dissipation copper sheet; 6. Mounting slot; 7. LED chip body; 8. Anti-slip block; 9. Overflow slot; 10. Liquid cooling slot; 11. Ventilation pipe; 12. Ventilation slot. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0031] Example 1

[0032] like Figure 1-4 As shown, this embodiment provides a photoelectric integrated LED lamp bead packaging structure, including a substrate 1, a liquid cooling plate 2 is fixedly provided on the bottom surface of the substrate 1, a plurality of pins 3 are connected at both ends of the substrate 1 in a symmetrical structure, a packaging frame 4 is fixedly provided on the top surface of the substrate 1, a sealing component 5 is installed on the top surface of the packaging frame 4, a sealing cover 501 is provided on the sealing component 5, a mounting groove 6 is opened in the middle of the packaging frame 4, a plurality of LED chip bodies 7 are installed in the middle of the top surface of the substrate 1, the plurality of LED chip bodies 7 are connected in parallel, and the LED chip bodies 7 are located inside the mounting groove 6.

[0033] An anti-slip block 8 is fixedly provided on the wall of the mounting groove 6, and the cross section of the anti-slip block 8 is triangular. An overflow groove 9 is provided on the top surface of the packaging frame 4, and the top surface of the anti-slip block 8 and the bottom surface of the wall of the overflow groove 9 are at the same horizontal plane; the anti-slip block 8 reduces the occurrence of the packaging glue falling off after packaging, enhances the overall packaging stability of the LED chip body 7, and disperses the heat of the ventilation pipe 11 through the ventilation groove 12, which facilitates the heat dissipation of the coolant.

[0034] A liquid cooling tank 10 is provided inside the liquid cooling plate 2, and the liquid cooling tank 10 is filled with coolant. A plurality of ventilation pipes 11 are fixedly provided inside the liquid cooling plate 2. A plurality of ventilation grooves 12 are provided on the outer walls at both ends of the liquid cooling plate 2, and both ends of the ventilation pipes 11 are connected to the ventilation grooves 12. The LED chip body 7 is cooled by the coolant and the ventilation pipes 11, and the heat of the ventilation pipes 11 is dispersed by the ventilation grooves 12, which facilitates the use of the coolant for heat dissipation.

[0035] When in use, an appropriate number of LED chip bodies 7 are installed in the middle of the top surface of the substrate 1. At this time, the multiple LED chip bodies 7 are all located inside the mounting grooves 6. At this time, the multiple LED chip bodies 7 are connected in parallel, and then the packaging glue for packaging is filled into the mounting grooves 6, so that the top surface of the packaging glue liquid level is lower than the top surface of the anti-falling block 8, and the packaging glue contacts the inner wall of the anti-falling block 8, and the excess packaging glue is discharged to the outside through the overflow groove 9, thereby ensuring the uniformity and consistency of the packaging quality. After static cooling, the packaging of multiple LED chip bodies 7 can be completed, and the anti-falling block 8 reduces the occurrence of the packaging glue falling off after packaging, thereby enhancing the overall packaging stability of the LED chip bodies 7 and extending the service life of the product. When a single LED chip body 7 is damaged, the remaining LED chip bodies 7 can still be used, thereby avoiding the situation where the entire LED lamp bead is scrapped due to damage to a single chip, reducing the packaging cost and maintenance cost, and further improving the overall reliability of the product.

[0036] After the packaging is completed, the sealing component 5 is installed on the top surface of the packaging frame 4, and the pins 3 are used to facilitate the installation and use of the packaged LED chip body 7. The heat generated by the substrate 1 and the LED chip body 7 during use is absorbed by the liquid cooling plate 2, and the LED chip body 7 is dissipated by the coolant and the ventilation pipe 11. The ventilation pipe 11 is a copper pipe, and the heat of the coolant is conducted through the copper pipe, and the heat of the ventilation pipe 11 is dispersed through the ventilation groove 12, which facilitates the heat dissipation of the coolant, thereby reducing the temperature of the liquid cooling plate 2, facilitating the heat dissipation of the substrate 1 and the LED chip body 7, reducing the operating temperature of the LED lamp bead, extending its service life, improving working stability, promoting natural convection and radiation of heat, and improving the overall heat dissipation efficiency.

[0037] Example 2

[0038] like Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, based on the first embodiment, the sealing assembly 5 includes an insert block 502, a slot 503 is provided on the top surface of the packaging frame 4, the insert block 502 is plugged into the slot 503, a semicircular block 504 is fixed on the insert block 502, and the outer peripheral wall of the semicircular block 504 is plugged into the wall of the overflow groove 9; the outer wall of the semicircular block 504 abuts against the wall of the overflow groove 9 to seal the overflow groove 9.

[0039] A plurality of elastic clamps 505 are fixedly provided on the outer wall of the packaging frame 4, the bottom surface of the sealing cover plate 501 abuts against the top surface of the packaging frame 4, and a plurality of slots 506 are provided on the side wall of the sealing cover plate 501, and the elastic clamps 505 are engaged with the slots 506; the sealing cover plate 501 is fixed by engaging the elastic clamps 505 with the slots 506.

[0040] A transparent convex mirror 507 is fixedly provided in the middle of the sealing cover plate 501, and the transparent convex mirror 507 is located at the upper end of the mounting groove 6. A plurality of heat dissipation copper sheets 508 are fixedly provided on the top surface of the sealing cover plate 501; the heat dissipation copper sheets 508 are used to dissipate heat from the sealing cover plate 501, thereby reducing the failure rate caused by high temperature or external factors.

[0041] During use, after the packaging is completed, the plug-in block 502 of the sealing cover 501 is inserted into the slot 503 of the packaging frame 4, and the outer wall of the semicircular block 504 abuts against the wall of the overflow groove 9. At this time, the bottom surface of the sealing cover 501 abuts against the top surface of the packaging frame 4, and the elastic clamp 505 is clamped with the clamping slot 506 to fix the sealing cover 501. After the fixation is completed, the transparent convex mirror 507 and the sealing cover 501 are used to protect the LED chip body 7 and the packaging glue to prevent the invasion of external impurities and moisture. During use, the heat of the packaging frame 4 is conducted to the sealing cover 501, and the sealing cover 501 is dissipated by the heat dissipation copper sheet 508, thereby reducing the failure rate caused by high temperature or external factors, reducing the influence of temperature on the LED chip body 7 and the packaging glue, and reducing the occurrence of damage or falling off of the packaging glue due to high temperature, ensuring the stability and reliability of the LED lamp beads, and facilitating the use of the packaged LED lamp beads.

[0042] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A photoelectric integrated LED lamp bead packaging structure, comprising a substrate (1), characterized in that: The bottom surface of the substrate (1) is fixedly provided with a liquid cooling plate (2), the two ends of the substrate (1) are symmetrically connected with a plurality of pins (3), the top surface of the substrate (1) is fixedly provided with a packaging frame (4), the top surface of the packaging frame (4) is installed with a sealing component (5), the sealing component (5) is provided with a sealing cover (501), the middle part of the packaging frame (4) is provided with a mounting groove (6), the middle part of the top surface of the substrate (1) is installed with a plurality of LED chip bodies (7), the connection mode between the plurality of LED chip bodies (7) is parallel, and the LED chip bodies (7) are located inside the mounting groove (6).

2. The optoelectronic integrated LED lamp bead packaging structure according to claim 1, characterized in that: An anti-slip block (8) is fixedly provided on the wall of the installation groove (6), and the cross section of the anti-slip block (8) is triangular.

3. The optoelectronic integrated LED lamp bead packaging structure according to claim 2, characterized in that: An overflow groove (9) is provided on the top surface of the packaging frame (4), and the top surface of the anti-fall-off block (8) and the bottom surface of the overflow groove (9) are on the same horizontal plane.

4. The optoelectronic integrated LED lamp bead packaging structure according to claim 3, characterized in that: A liquid cooling groove (10) is provided inside the liquid cooling plate (2), the liquid cooling groove (10) is filled with cooling liquid, a plurality of ventilation pipes (11) are fixedly provided inside the liquid cooling groove (10), a plurality of ventilation grooves (12) are provided on the outer walls at both ends of the liquid cooling plate (2), and both ends of the ventilation pipes (11) are connected to the ventilation grooves (12).

5. The optoelectronic integrated LED lamp bead packaging structure according to claim 4, characterized in that: The sealing assembly (5) comprises an insert block (502), a slot (503) is provided on the top surface of the packaging frame (4), the insert block (502) is plugged into and matched with the slot (503), a semicircular block (504) is fixedly provided on the insert block (502), and the outer peripheral wall of the semicircular block (504) is plugged into and matched with the groove wall of the overflow groove (9).

6. The optoelectronic integrated LED lamp bead packaging structure according to claim 5, characterized in that: The outer wall of the packaging frame (4) is fixedly provided with a plurality of elastic clamping heads (505), the bottom surface of the sealing cover plate (501) is in contact with the top surface of the packaging frame (4), the side wall of the sealing cover plate (501) is provided with a plurality of clamping grooves (506), and the elastic clamping heads (505) are clamped and matched with the clamping grooves (506).

7. The optoelectronic integrated LED lamp bead packaging structure according to claim 6, characterized in that: A transparent convex mirror (507) is fixedly provided in the middle of the sealing cover plate (501), and the transparent convex mirror (507) is located at the upper end of the mounting groove (6). A plurality of heat dissipation copper sheets (508) are fixedly provided on the top surface of the sealing cover plate (501).

Images