Surface coating machine for semiconductor parts

Abstract

The utility model discloses a surface coating machine for semiconductor parts, which comprises a working table, a fixed frame fixed at the top of the working table, an opening arranged at the top end of the front side wall of the fixed frame, a fixed structure arranged in the fixed frame, a spraying frame fixed at the top of the fixed frame, and a spraying structure arranged on the top of the spraying frame, the spraying structures are arranged on the two sides of the spraying frame. The baffle is connected to the rear side wall of the spraying frame in a sliding manner; the collecting box is connected to the bottom of the workbench in a sliding mode. The semiconductor parts are flushed through the water spraying pipe and sprayed through the spraying pipe, cleaning equipment does not need to be additionally used for cleaning, use is convenient, in the process that the baffle is pulled out, the top of the spraying frame and the end of the material receiving hopper can scrape off paint attached to the baffle, the paint falls into the material receiving hopper, and the paint is convenient to clean; and the filter screen in the collecting box can filter impurities in the solvent, so that the impurities and the solvent can be classified conveniently.

Description

Technical Field

[0001] The present application relates to a surface coating machine for semiconductor parts. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductor parts refer to components that meet the requirements of semiconductor equipment and technology in terms of materials, structure, process, quality and precision, reliability and stability. There are many types of semiconductor parts, which are mainly divided into metal, non-metal, gas cabinets, instruments, radio frequency power supplies, valves, pumps and pipeline connections. During the processing of semiconductor parts, the surface of the semiconductor parts needs to be sprayed by a coating device.

[0003] Existing patent publication number CN221638497U discloses a surface coating device for semiconductor parts, including a housing, a fixed platform located at the bottom end of the housing, and an adjustment plate located on one side of the housing. The housing includes: a movable groove provided on one side of the housing top, and a support ring provided on the outer side of the bottom of the fixed platform. A rotary motor is provided at the middle position of the housing bottom, and the output end of the rotary motor is connected to a rotating shaft. The utility model uses screw rod 1 to cooperate with the threaded hole at the top of the housing, so that screw rod 1 can drive the clamping plate to adjust up and down, thereby clamping the semiconductor parts on the top of the fixed platform. The fixed platform is driven to rotate by the rotary motor and the rotating shaft, and the clamping plate and screw rod 1 can rotate through the bearing, so that the position of the semiconductor parts can be adjusted, which facilitates the spraying process of the semiconductor parts and improves the working efficiency of the coating device.

[0004] In order to ensure that the coating can be firmly attached to the parts, it is necessary to remove pollutants and self-oxides on the surface of the parts. The semiconductor parts can be rinsed with chemical solvents. However, the existing coating machines only have a spraying function and require additional cleaning equipment for cleaning before spraying. The operation is not very convenient, such as the above-mentioned coating device. Moreover, during spraying, excess paint will be sprayed on the inner wall of the spray frame. Since the spray frame has a fixed structure, it is not easy to clean, and long-term accumulation will affect the spraying of semiconductor parts.

[0005] Therefore, it is desirable to provide a surface coating machine for semiconductor parts. Utility Model Content

[0006] The surface coating machine for semiconductor parts provided in this embodiment solves the problem that the coating machine only has a spraying function, requires additional cleaning equipment for cleaning before spraying, is not convenient to operate, and is inconvenient to clean the paint attached to the inner wall of the spray frame.

[0007] According to one aspect of the present application, a surface coating machine for semiconductor parts is provided, comprising a workbench, a fixing frame fixed on the top of the workbench, an opening provided on the top of the front side wall of the fixing frame, a fixing structure provided inside the fixing frame, a spray frame fixed on the top of the fixing frame, and the surface coating machine for semiconductor parts further comprising:

[0008] A spraying structure, the spraying structure being arranged on both sides of the spraying frame;

[0009] a baffle, the baffle being slidably connected to the rear side wall of the spray frame;

[0010] A collecting box is slidably connected to the bottom of the workbench.

[0011] Furthermore, the fixed structure includes an electric telescopic rod, a U-shaped frame, a motor, a mounting frame, an electric push rod, a first clamp and a second clamp. The bottom end of the electric telescopic rod is fixed to the top of the workbench, and a leakage net is embedded and fixed on the top of the workbench outside the electric telescopic rod.

[0012] Furthermore, a U-shaped frame is fixed to the top of the electric telescopic rod, a motor is fixed to the outside of one side wall of the U-shaped frame, an installation frame is fixed to the output end of the motor through the side wall of the U-shaped frame, and an electric push rod is fixed inside the installation frame.

[0013] Furthermore, a first clamping plate is fixed to the end of the electric push rod, and a second clamping plate is rotatably connected to the other side wall of the U-shaped frame corresponding to the first clamping plate.

[0014] Furthermore, a paint box and a solvent box are fixed on both sides of the top of the workbench on the rear side of the fixed frame. The tops of the paint box and the solvent box are both provided with feed ports, and the feed ports are provided with sealing plugs.

[0015] Furthermore, the spraying structure includes a material extraction pump, a material extraction pipe, a material delivery pipe, a spraying pipe and a water spraying pipe, and the material extraction pump is symmetrically fixed on the top of the fixed frame on both sides of the spraying frame.

[0016] Furthermore, a pumping pipe is fixed to the input end of the pumping pump, and the other end of the pumping pipe passes through the top of the paint box and the solvent box and extends to the bottom inside the top of the paint box and the solvent box.

[0017] Furthermore, a feed pipe is fixed to the output end of the feed pump, and a spray pipe and a water spray pipe are fixed to the other end of the feed pipe respectively through the side wall of the spray frame, and the spray pipe is arranged on the top of the water spray pipe.

[0018] Furthermore, a material receiving hopper is fixed on the top of the spray box corresponding to the baffle, and one end of the material receiving hopper is slidably connected to the side wall of the baffle.

[0019] Furthermore, a filter screen is clamped at the top of the collection box, a discharge pipe is fixed in the middle of the bottom of the collection box, and a valve is fixed on the discharge pipe.

[0020] The benefits of this application are:

[0021] 1. A spray frame is set on the top of the fixed frame, spray pipes and water spray pipes are set on the upper and lower sides of the spray frame, and a fixed structure is set in the fixed frame. The semiconductor parts are fixed on the fixed structure, and the semiconductor parts are driven to move up to the spray frame by an electric telescopic rod so that the semiconductor parts correspond to the position of the water spray pipe. Then, the solvent is extracted through the extraction pump corresponding to the water spray pipe, and the semiconductor parts are rinsed through the water spray pipe to rinse the surface pollutants and self-oxides. Then, the semiconductor parts are moved up to the spray pipe position, and the extraction pump connected to the spray pipe extracts the paint, and the semiconductor parts are sprayed through the spray pipe. No additional cleaning equipment is required for cleaning, and it is easy to use.

[0022] 2. By sliding the baffle connected to the rear wall of the spray box, when spraying semiconductor parts, excess paint will be sprayed on the inner wall of the baffle. After spraying, the baffle can be pulled out. During the baffle withdrawal process, the top of the spray frame and the end of the hopper can scrape the paint attached to the baffle and drop it into the hopper, which is convenient for cleaning the paint and avoids the situation where paint accumulation affects the spraying of semiconductor parts.

[0023] 3. A collection box is connected by sliding at the bottom of the workbench. A filter is clamped on the top of the collection box. The solvent used to rinse the semiconductor parts will leak into the collection box from the filter. The filter can filter impurities in the solvent, making it convenient to classify impurities and solvents and improve the practicality of the coating machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present application;

[0026] Figure 2 This is a front view structural diagram of an embodiment of the present application;

[0027] Figure 3 This is a side structural diagram of an embodiment of the present application;

[0028] Figure 4 This is a schematic diagram of the top structure of an embodiment of the present application.

[0029] In the figure: 1. Workbench; 2. Fixed frame; 3. Opening; 4. Spraying frame; 5. Fixed structure; 501. Electric telescopic rod; 502. U-shaped frame; 503. Motor; 504. Mounting frame; 505. Electric push rod; 506. Clamp one; 507. Clamp two; 6. Spraying structure; 601. Extraction pump; 602. Extraction pipe; 603. Feed pipe; 604. Spraying pipe; 605. Water spray pipe; 7. Paint box; 8. Solvent box; 9. Baffle; 10. Collecting box; 11. Filter screen; 12. Discharge pipe; 13. Valve; 14. Screen; 15. Feed port; 16. Receiving hopper. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0033] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0034] Furthermore, the terms "installed," "disposed," "provided with," "connected," "connected," and "socketed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0035] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0036] See also Figure 1-4 As shown, the surface coating machine for semiconductor parts includes a workbench 1, a fixing frame 2 is fixed on the top of the workbench 1, an opening 3 is provided on the top of the front side wall of the fixing frame 2, a fixing structure 5 is provided in the fixing frame 2, and a spray frame 4 is fixed on the top of the fixing frame 2. The surface coating machine for semiconductor parts also includes:

[0037] A spraying structure 6 is provided on both sides of the spraying frame 4;

[0038] A baffle 9 is slidably connected to the rear side wall of the spray frame 4;

[0039] The collecting box 10 is slidably connected to the bottom of the workbench 1 .

[0040] The fixed structure 5 includes an electric telescopic rod 501, a U-shaped frame 502, a motor 503, a mounting frame 504, an electric push rod 505, a first clamping plate 506 and a second clamping plate 507. The bottom end of the electric telescopic rod 501 is fixed to the top of the workbench 1, and a leakage net 14 is embedded and fixed on the top of the workbench 1 outside the electric telescopic rod 501.

[0041] A U-shaped frame 502 is fixed to the top of the electric telescopic rod 501, a motor 503 is fixed to the outside of one side wall of the U-shaped frame 502, an installation frame 504 is fixed to the output end of the motor 503 through the side wall of the U-shaped frame 502, and an electric push rod 505 is fixed inside the installation frame 504.

[0042] A clamping plate 1 506 is fixed to the end of the electric push rod 505 , and a clamping plate 2 507 is rotatably connected to the other side wall of the U-shaped frame 502 corresponding to the clamping plate 1 506 .

[0043] A paint box 7 and a solvent box 8 are fixed on both sides of the top of the workbench 1 at the rear side of the fixed frame 2. A feed port 15 is provided on the top of each of the paint box 7 and the solvent box 8. A sealing plug is provided on the feed port 15.

[0044] The spraying structure 6 includes a pumping pump 601 , a pumping pipe 602 , a feeding pipe 603 , a spraying pipe 604 and a water spraying pipe 605 . The pumping pump 601 is symmetrically fixed on the top of the fixing frame 2 on both sides of the spraying frame 4 .

[0045] A suction pipe 602 is fixed to the input end of the suction pump 601 , and the other end of the suction pipe 602 passes through the top of the paint box 7 and the solvent box 8 and extends to the bottom of the top of the paint box 7 and the solvent box 8 .

[0046] The output end of the pump 601 is fixed with a feed pipe 603 , and the other end of the feed pipe 603 passes through the side wall of the spray frame 4 and is fixed with a spray pipe 604 and a water spray pipe 605 . The spray pipe 604 is arranged on the top of the water spray pipe 605 .

[0047] A material receiving hopper 16 is fixed to the top of the spray box corresponding to the baffle 9 , and one end of the material receiving hopper 16 is slidably connected to the side wall of the baffle 9 .

[0048] A filter screen 11 is clamped on the top of the collecting box 10 , a discharge pipe 12 is fixed in the middle of the bottom of the collecting box 10 , and a valve 13 is fixed on the discharge pipe 12 .

[0049] Working principle: the electrical components appearing in the application are all connected to the external power supply and control device when in use. First, an appropriate amount of chemical cleaning solvent is loaded into the solvent box 8, and an appropriate amount of paint is loaded into the paint box 7. Then, the semiconductor parts with spraying are placed between the fixed frame 2 plywood and the second plywood 507. The electric push rod 505 drives the plywood 1 506 to move, so that the plywood 1 506 and the second plywood 507 clamp the semiconductor parts. Then, the electric telescopic rod 501 drives the semiconductor parts to move up into the spray frame 4, so that the semiconductor parts correspond to the position of the water spray pipe 605. Then, the extraction pump 601 corresponding to the water spray pipe 605 extracts the solvent through the water spray pipe 605 to rinse the semiconductor parts, which can rinse the surface pollutants and self-oxides. After rinsing, the motor 503 continues to drive the semiconductor parts to rotate, dry the solvent on the surface of the parts, and then move the semiconductor parts up to the spray pipe 60 4 position, so that the extraction pump 601 connected to the spray pipe 604 extracts the paint and sprays it to the semiconductor parts through the spray pipe 604. During the flushing and spraying process, the motor 503 drives the clamping plate 506 to rotate, thereby driving the semiconductor parts to rotate, so that the semiconductor parts are flushed and the nozzles are evenly distributed. There is no need to use additional cleaning equipment for cleaning. It is easy to use. The solvent used to flush the semiconductor parts will leak from the leakage net 14 into the collection box 10. The filter net 11 can filter impurities in the solvent, which is convenient for classifying impurities and solvents and improving the practicality of the coating machine. When spraying the semiconductor parts, excess paint will be sprayed on the inner wall of the baffle 9. After spraying, the baffle 9 can be pulled out. During the withdrawal of the baffle 9, the top of the spray frame 4 and the end of the hopper 16 can scrape off the paint attached to the baffle 9 and drop it into the hopper 16, which is convenient for cleaning the paint and avoids the situation where the paint accumulation affects the spraying of the semiconductor parts.

[0050] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A surface coating machine for semiconductor parts, comprising a workbench (1), a fixing frame (2) fixed on the top of the workbench (1), an opening (3) provided at the top of the front side wall of the fixing frame (2), a fixing structure (5) provided inside the fixing frame (2), and a spraying frame (4) fixed on the top of the fixing frame (2), characterized in that: The surface coating machine for semiconductor parts also includes: A spraying structure (6), wherein the spraying structure (6) is arranged on both sides of the spraying frame (4); A baffle (9), wherein the baffle (9) is slidably connected to the rear side wall of the spray frame (4); A collecting box (10) is slidably connected to the bottom of the workbench (1).

2. The surface coating machine for semiconductor parts according to claim 1, characterized in that: The fixed structure (5) comprises an electric telescopic rod (501), a U-shaped frame (502), a motor (503), a mounting frame (504), an electric push rod (505), a first clamping plate (506) and a second clamping plate (507); the bottom end of the electric telescopic rod (501) is fixed to the top of the workbench (1); and a leakage net (14) is embedded and fixed on the top of the workbench (1) outside the electric telescopic rod (501).

3. The surface coating machine for semiconductor parts according to claim 2, characterized in that: A U-shaped frame (502) is fixed to the top of the electric telescopic rod (501), a motor (503) is fixed to the outside of one side wall of the U-shaped frame (502), an output end of the motor (503) passes through the side wall of the U-shaped frame (502) and is fixed to a mounting frame (504), and an electric push rod (505) is fixed inside the mounting frame (504).

4. The surface coating machine for semiconductor parts according to claim 3, characterized in that: A clamping plate 1 (506) is fixed to the end of the electric push rod (505), and a clamping plate 2 (507) is rotatably connected to the other side wall of the U-shaped frame (502) corresponding to the clamping plate 1 (506).

5. The surface coating machine for semiconductor parts according to claim 1, characterized in that: A paint box (7) and a solvent box (8) are fixed on both sides of the top of the workbench (1) at the rear side of the fixed frame (2), and a feed port (15) is provided on the top of each of the paint box (7) and the solvent box (8), and a sealing plug is provided on the feed port (15).

6. The surface coating machine for semiconductor parts according to claim 1, characterized in that: The spraying structure (6) comprises a pumping pump (601), a pumping pipe (602), a feeding pipe (603), a spraying pipe (604) and a water spraying pipe (605), wherein the pumping pump (601) is symmetrically fixed on the top of the fixing frame (2) on both sides of the spraying frame (4).

7. The surface coating machine for semiconductor parts according to claim 6, characterized in that: A pumping pipe (602) is fixed to the input end of the pumping pump (601), and the other end of the pumping pipe (602) passes through the top of the paint box (7) and the solvent box (8) and extends to the bottom of the top of the paint box (7) and the solvent box (8).

8. The surface coating machine for semiconductor parts according to claim 6, characterized in that: The output end of the material pump (601) is fixed with a material delivery pipe (603), and the other end of the material delivery pipe (603) passes through the side wall of the spray frame (4) and is fixed with a spray pipe (604) and a water spray pipe (605), and the spray pipe (604) is arranged on the top of the water spray pipe (605).

9. The surface coating machine for semiconductor parts according to claim 1, characterized in that: A material receiving hopper (16) is fixed on the top of the spray box corresponding to the baffle (9), and one end of the material receiving hopper (16) is slidably connected to the side wall of the baffle (9).

10. The surface coating machine for semiconductor parts according to claim 1, characterized in that: A filter screen (11) is clamped on the top of the collection box (10), a discharge pipe (12) is fixed in the middle of the bottom of the collection box (10), and a valve (13) is fixed on the discharge pipe (12).

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