Silicon wafer cleaning device with side limiting clamps

Abstract

The utility model discloses a silicon wafer cleaning device provided with a side limiting clamp, which relates to the technical field of silicon wafer cleaning, and comprises a cleaning box body, the bottom end of the right side wall of the cleaning box body is provided with a communicated liquid discharge pipe, the inner cavity of the cleaning box body is provided with a rotatably arranged silicon wafer fixing part, and the silicon wafer fixing part comprises a supporting piece. A front circular plate and a rear circular plate are installed at the two ends of the supporting piece respectively and connected with a driving shaft, a driving motor is installed on the front end face of the cleaning box, multiple sets of side limiting clamps which are oppositely arranged are arranged on the inner side face of the front circular plate and the inner side face of the rear circular plate, and multiple sets of limiting mechanisms for limiting silicon wafers are arranged on the outer side face of the front circular plate and the outer side face of the rear circular plate. The silicon wafer cleaning device is provided with the side limiting clamps, the silicon wafers can be fixed through the adjacent side limiting clamps and limiting mechanisms, meanwhile, subsequent silicon wafer taking-out is facilitated, the driving motor works to drive the multiple sets of fixed silicon wafers in the silicon wafer fixing component to rotate, and the cleaning efficiency and the cleaning effect of the silicon wafers are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning device provided with side limiting clamps. Background Art

[0002] Silicon wafer cleaning is a key step in semiconductor device production, aimed at removing organic, inorganic and other contaminants from the surface of the silicon wafer. Cleaning methods include physical cleaning and chemical cleaning to ensure the cleanliness of the silicon wafer surface to improve the performance and quality of the device. Most existing silicon wafer cleaning devices directly place the silicon wafers into a cleaning tank for immersion cleaning. Silicon wafers placed directly into the cleaning tank will overlap and collide, and the silicon wafers will not be in sufficient contact with the cleaning liquid. It is also inconvenient to remove the silicon wafers after cleaning, which affects the cleaning efficiency and effect of the silicon wafers. To this end, we propose a silicon wafer cleaning device equipped with side limit clamps. Utility Model Content

[0003] The purpose of the present utility model is to provide a silicon wafer cleaning device provided with side limiting clamps, so as to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A silicon wafer cleaning device provided with side limit clamps includes a cleaning box body, a drain pipe is provided at the bottom end of the right side wall of the cleaning box body, and a valve is installed on the drain pipe, the inner cavity of the cleaning box body is provided with a rotatable silicon wafer fixing component, the silicon wafer fixing component includes a support member, the support member is a cylinder, and a front circular plate and a rear circular plate are respectively installed at both ends of the support member, a drive shaft is connected to the front circular plate and the rear circular plate, a drive motor is installed on the front end surface of the cleaning box body, and the output end of the drive motor is connected to the drive shaft, the inner side surfaces of the front circular plate and the rear circular plate are provided with multiple groups of relatively arranged side limit clamps, and the outer side surfaces of the front circular plate and the rear circular plate are provided with multiple groups of limiting mechanisms for limiting silicon wafers.

[0006] Further: the limiting mechanism includes an ear plate, which is rotatably connected to a rotating rod through a bearing, and the top of the rotating rod is connected to a top plate, an operating slide rod is vertically slidably connected in the top plate, and a limiting plate is installed on one end of the operating slide rod close to the support member.

[0007] Furthermore: a compression spring is sleeved on the outer side of the operating slide rod, and the compression spring is located between the top plate and the limit plate.

[0008] Furthermore, the driving shaft on the outer side surface of the rear circular plate is rotatably connected to the rear inner wall of the cleaning box through a bearing.

[0009] Furthermore: the cross section of the side limit clamp is U-shaped, and the inner side surfaces of each set of side limit clamps and the limit plate are provided with protective pads.

[0010] Furthermore: one end of the operating slide rod away from the limiting plate is connected to a pull ring, and the handheld end of the pull ring is covered with an anti-slip rubber sleeve.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] The silicon wafer cleaning device of the present invention is provided with side limit clamps, and the two end positions of the silicon wafer can be limited by adjacent side limit clamps. The limit plate can be limited or moved away from the outside of the silicon wafer by the rotation of the rotating rod on the limit mechanism, the sliding of the operating slide rod and the elasticity of the compression spring. The silicon wafer will not separate from the silicon wafer fixing component during cleaning, and the subsequent removal of the silicon wafer is convenient. The operation of the drive motor drives the rotation of multiple groups of fixed silicon wafers in the silicon wafer fixing component through the drive shaft, so that the silicon wafer is more fully in contact with the cleaning liquid in the cleaning box, thereby improving the cleaning efficiency and cleaning effect of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram of the utility model;

[0014] Figure 2 This is a schematic structural diagram of the silicon wafer fixing component of the present utility model;

[0015] Figure 3 This is a schematic structural diagram of the other side of the silicon wafer fixing component of the present invention;

[0016] Figure 4 For the utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0017] In the figure: 1. Cleaning box; 2. Silicon wafer fixing component; 200. Support member; 201. Front circular plate; 202. Rear circular plate; 203. Side limit clamp; 204. Drive shaft; 205. Ear plate; 206. Rotating rod; 207. Top plate; 208. Operating slide bar; 209. Limit plate; 210. Compression spring; 211. Pull ring; 3. Drain pipe; 4. Drive motor. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] Example 1:

[0020] See also Figure 1-4The utility model provides a technical solution: a silicon wafer cleaning device provided with a side limit clamp, comprising a cleaning box body 1, a drain pipe 3 is provided at the bottom end of the right side wall of the cleaning box body 1, and a valve is installed on the drain pipe 3, the inner cavity of the cleaning box body 1 is provided with a rotatable silicon wafer fixing component 2, the silicon wafer fixing component 2 includes a support member 200, the support member 200 is a cylinder, and the two ends of the support member 200 are respectively provided with a front circular plate 201 and a rear circular plate 202, the front circular plate 201 and the rear circular plate 202 are connected to a drive shaft 204, a drive motor 4 is installed on the front end surface of the cleaning box body 1, and the output end of the drive motor 4 is connected to the drive shaft 204, the inner side surfaces of the front circular plate 201 and the rear circular plate 202 are provided with multiple groups of relatively arranged side limit clamps 203, and the outer side surfaces of the front circular plate 201 and the rear circular plate 202 are provided with multiple groups of limiting mechanisms for limiting the silicon wafer.

[0021] Before use, the electrical ends of all electrical devices are electrically connected to the electrical ends of the external power supply and the controller (installed on the front face of the cleaning box 1) through wires, and a certain amount of cleaning liquid is added to the cleaning box 1. At the same time, an ultrasonic transducer is installed on the rear side of the cleaning box 1, and the silicon wafer is cleaned by ultrasonic waves and cleaning liquid. When the silicon wafer is fixed on the silicon wafer fixing component 2, it is placed between the side limit clamps 203 arranged on the inner sides of the front circular plate 201 and the rear circular plate 202, and then the outer side of the silicon wafer is fixed by the limit mechanism to avoid the silicon wafer fixing part from being damaged. During the rotation of component 2, the silicon wafer detaches from the silicon wafer fixing component 2, and the operation of the drive motor 4 drives the drive shaft 204 to rotate, which drives the multiple groups of silicon wafers fixed in the silicon wafer fixing component 2 to rotate. The silicon wafers are in more complete contact with the cleaning liquid in the cleaning box 1, thereby improving the cleaning efficiency and cleaning effect of the silicon wafers. At the same time, the subsequent limiting mechanism is away from the outside of the silicon wafer, and the silicon wafer located between the adjacent side limiting clamps 203 can be removed. The operation is simple and convenient, which improves work efficiency. After the cleaning liquid has been used for a period of time, the valve is opened and the cleaning liquid can be discharged through the drain pipe 3.

[0022] Among them, preferably, the limiting mechanism includes an ear plate 205, which is rotatably connected to a rotating rod 206 (damping shaft) through a bearing, and the top of the rotating rod 206 is connected to a top plate 207, and an operating slide rod 208 is vertically slidably connected in the top plate 207, and a limiting plate 209 is installed on one end of the operating slide rod 208 close to the support member 200; the support member 200 is fixedly connected to the front circular plate 201 and the rear circular plate 202, the ear plate 205 is fixedly connected to the front circular plate 201, and multiple groups of side limit clips 203 and ear plates 205 are distributed on the circular plate in a circular array.

[0023] Preferably, a compression spring 210 is sleeved on the outer side of the operating slide bar 208, and the compression spring 210 is located between the top plate 207 and the limit plate 209; the operating slide bar 208 is fixedly connected to the limit plate 209, and the elasticity of the compression spring 210 can make the limit plate 209 always close to the outer side of the fixed silicon wafer. When the silicon wafer is fixed, the rotating rod 206 is rotated to make the top plate 207 away from the outer side of the silicon wafer fixing component 2. At this time, the silicon wafer can be smoothly fixed between the adjacent side limit clamps 203, and then, the rotating rod 206 is rotated to make the top plate 207 and the limit plate 209 face the outer side of the fixed silicon wafer, and the outer side of the silicon wafer is limited by the elasticity of the compression spring 210.

[0024] Preferably, the drive shaft 204 on the outer side of the rear circular plate 202 is rotatably connected to the rear inner wall of the cleaning box 1 through a bearing.

[0025] Preferably, the side limiting clamps 203 have a U-shaped cross section, and each set of side limiting clamps 203 and the inner side surfaces of the limiting plates 209 are provided with protective pads; the protective pads play a protective role to avoid damage to the silicon wafer when limiting it.

[0026] Example 2:

[0027] Reference Figure 4 This embodiment is different from the first embodiment in that: the end of the operating slide rod 208 away from the limit plate 209 is connected to a pull ring 211, and the hand-held end of the pull ring 211 is covered with an anti-slip rubber sleeve; the pull ring 211 facilitates the pulling of the operating slide rod 208, and the anti-slip rubber sleeve plays an anti-slip role, preventing the hand from slipping when holding the pull ring 211.

[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cleaning device provided with a side limit clamp, comprising a cleaning box (1), characterized in that: The bottom end of the right side wall of the cleaning box (1) is provided with a drain pipe (3) connected thereto, and a valve is installed on the drain pipe (3). The inner cavity of the cleaning box (1) is provided with a rotatable silicon wafer fixing component (2), and the silicon wafer fixing component (2) includes a support member (200). The support member (200) is a cylinder, and a front circular plate (201) and a rear circular plate (202) are respectively installed at both ends of the support member (200). The front circular plate (201) and the rear circular plate (202) are respectively installed at the front circular plate (201). A driving shaft (204) is connected to the front and rear circular plates (201), a driving motor (4) is installed on the front end surface of the cleaning box (1), and the output end of the driving motor (4) is connected to the driving shaft (204), the inner side surfaces of the front circular plate (201) and the rear circular plate (202) are provided with a plurality of sets of side limiting clamps (203) arranged opposite to each other, and the outer side surfaces of the front circular plate (201) and the rear circular plate (202) are provided with a plurality of sets of limiting mechanisms for limiting silicon wafers.

2. The silicon wafer cleaning device provided with a side limit clamp according to claim 1, characterized in that: The limiting mechanism comprises an ear plate (205), a rotating rod (206) is rotatably connected to the ear plate (205) via a bearing, and a top plate (207) is connected to the top of the rotating rod (206).

3. The silicon wafer cleaning device provided with a side limit clamp according to claim 2, characterized in that: An operating slide rod (208) is vertically slidably connected inside the top plate (207), and a limiting plate (209) is installed at one end of the operating slide rod (208) close to the support member (200).

4. The silicon wafer cleaning device provided with side limit clamps according to claim 3, characterized in that: The outer side of the operating slide bar (208) is covered with a compression spring (210), and the compression spring (210) is located between the top plate (207) and the limiting plate (209).

5. The silicon wafer cleaning device provided with side limit clamps according to claim 1, characterized in that: The driving shaft (204) on the outer side of the rear circular plate (202) is rotatably connected to the rear inner wall of the cleaning box (1) via a bearing.

6. The silicon wafer cleaning device provided with side limit clamps according to claim 3, characterized in that: The side limiting clamps (203) have a U-shaped cross section, and each set of side limiting clamps (203) and the inner side surfaces of the limiting plates (209) are provided with protective pads.

7. The silicon wafer cleaning device provided with side limit clamps according to claim 3, characterized in that: One end of the operating slide rod (208) away from the limiting plate (209) is connected to a pull ring (211), and the handheld end of the pull ring (211) is covered with an anti-slip rubber sleeve.

Images